Manual-automatic integrated die bonder

Abstract

The utility model relates to the technical field of die bonders, and discloses a manual-automatic integrated die bonder, which comprises a processing table, a placing disc is rotatably arranged at the upper end of the processing table, a plurality of placing grooves are formed in the upper part of the placing disc and are used for placing PCBs and chips, and a rotating rod is rotatably arranged at the bottom end of the processing table and is used for placing the PCBs and the chips. The top end of the rotating rod penetrates through the machining table and is connected with the bottom end of the containing disc, a grooved wheel is arranged at the lower end of the outer side of the rotating rod, and a rotating mechanism is arranged on the right side of the bottom end of the machining table and used for being matched with the grooved wheel to drive the rotating rod to rotate intermittently. The supporting plate is used for adhering a chip and a PCB, and a driving mechanism is arranged at the upper end of the supporting plate; when in use, the chip and the PCB can be adhered synchronously, and the adhered chip and the adhered PCB can be collected, so that the adhesion efficiency of the chip and the PCB is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of film bonding machines, in particular to a manual and automatic film bonding machine. Background Art

[0002] Die bonding machine is a device used for electronic component packaging, usually used in the process of adhering chips to PCB (printed circuit board). It is one of the important links in the electronic component packaging process, ensuring the stability and reliability of the components.

[0003] At present, when bonding a chip to a PCB board, a worker usually places the PCB board in a placement slot on a placement seat, then places the chip on the PCB board, and then uses a pressing plate to tightly bond the chip to the PCB board. When bonding the chip in the placement slot to the PCB board, the worker needs to first take out the previously bonded PCB board from the placement slot, and then place the next PCB board into the placement slot. This means that during the bonding process, the worker needs to wait for the PCB board in the placement slot to bond to the chip before proceeding to the next step. The worker cannot simultaneously bond the chip to the PCB board and collect the bonded PCB board, which results in a waste of time and greatly reduces the bonding efficiency of the chip to the PCB board. Therefore, a person skilled in the art provides a manual-automatic chip bonding machine to solve the problems mentioned in the above background technology.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, therefore, it may include information that does not constitute the prior art known to ordinary technicians in this field. Utility Model Content

[0005] In order to solve the problem that the chip and PCB board cannot be bonded and the bonded PCB board cannot be collected simultaneously, which wastes time and greatly reduces the bonding efficiency of the chip and PCB board, the utility model provides a manual and automatic chip bonding machine.

[0006] The utility model provides a manual-automatic film bonding machine adopts the following technical solution: a manual-automatic film bonding machine, comprising

[0007] A processing table, the upper end of which is rotatably provided with a placement plate, and the upper part of the placement plate is provided with a plurality of placement slots for placing PCB boards and chips;

[0008] A rotating rod is rotatably arranged at the bottom end of the processing table, the top end of which passes through the processing table and is connected to the bottom end of the placing plate, and a groove wheel is arranged at the lower end of the outer side thereof;

[0009] The rotating mechanism is arranged on the right side of the bottom end of the processing table and is used to cooperate with the groove wheel to drive the rotating rod to rotate intermittently;

[0010] A support plate is arranged on the left side of the upper end of the processing table, and a bonding mechanism is arranged on the right side thereof for bonding the chip to the PCB board; and

[0011] The driving mechanism is arranged at the upper end of the supporting plate and is used for driving the film sticking mechanism to work intermittently.

[0012] Preferably, the rotating mechanism comprises

[0013] An L-shaped plate, arranged on the right side of the bottom end of the processing table;

[0014] A disc, rotatably arranged on the inner side of the L-shaped plate;

[0015] A push rod is arranged at the upper end of the disc and cooperates with the disc to drive the groove wheel to rotate intermittently;

[0016] The first motor is arranged at the bottom end of the L-shaped plate, and its output shaft is connected with the bottom end of the disc to drive the disc to rotate.

[0017] Preferably, the sheet bonding mechanism comprises

[0018] A connecting plate, arranged on the front side of the supporting plate;

[0019] The pressing plate is arranged at the bottom end of the connecting plate and is used for adhering the chip to the PCB board.

[0020] Preferably, the driving mechanism comprises

[0021] A mounting plate, arranged on the upper end of the supporting plate;

[0022] A turntable, rotatably arranged on the right side of the mounting plate;

[0023] A connecting rod is hingedly arranged on the right side of the rotating disk, and its bottom end is hingedly connected to the upper end of the connecting plate, and is used to drive the pressing plate to move;

[0024] The second motor is arranged on the left side of the mounting plate, and its output shaft is connected to one side of the turntable for driving the turntable to rotate.

[0025] Preferably, a guide block is provided on one side of the connecting plate, a guide groove for use with the guide block is provided on the right side of the supporting plate, and one end of the guide block penetrates into the guide groove and is slidably connected to the guide groove.

[0026] Compared with the prior art, the beneficial effects of the utility model are:

[0027] Through the above technical scheme, the manual and automatic chip bonding machine disclosed in the utility model is provided with a rotating rod, a groove wheel, a chip bonding mechanism, a driving mechanism, a guide block and a guide groove. The cooperation of the rotating mechanism and the groove wheel can drive the placement plate to rotate intermittently, and then the driving mechanism can drive the chip bonding mechanism to move intermittently, so that the turntable rotates exactly one circle when the placement plate stops intermittently, so that the chip and the PCB board can be bonded synchronously and the bonded chips and PCB boards can be collected, thereby greatly improving the bonding efficiency of the chip and the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the utility model from the first perspective;

[0029] Figure 2 It is a structural schematic diagram of the utility model from a second viewing angle;

[0030] Figure 3 It is a schematic diagram of the connection structure between the rotating mechanism and the groove wheel in the utility model.

[0031] Explanation of the reference numerals in the accompanying drawings: 1. Processing table; 2. Placing plate; 3. Placing groove; 4. Rotating rod; 5. Groove wheel; 6. Rotating mechanism; 601. L-shaped plate; 602. Disc; 603. Push rod; 604. First motor; 7. Support plate; 8. Sticking mechanism; 801. Connecting plate; 802. Pressing plate; 9. Driving mechanism; 901. Mounting plate; 902. Turntable; 903. Connecting rod; 904. Second motor; 10. Guide block; 11. Guide groove. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] The utility model discloses a manual and automatic film bonding machine. Figure 1-3A manual and automatic chip bonding machine comprises a processing table 1, a placing plate 2 is rotatably provided at the upper end of the processing table 1, a plurality of placing grooves 3 are provided on the upper part of the placing plate 2 for placing PCB boards and chips, a rotating rod 4 is rotatably provided at the bottom end of the processing table 1, the top end of the rotating rod 4 passes through the processing table 1 and is connected to the bottom end of the placing plate 2, a groove wheel 5 is provided at the lower end of the outer side of the rotating rod 4, a rotating mechanism 6 is provided on the right side of the bottom end of the processing table 1, which is used to cooperate with the groove wheel 5 to drive the rotating rod 4 to rotate intermittently, a supporting plate 7 is provided on the left side of the upper end of the processing table 1, a chip bonding mechanism 8 is provided on the right side of the supporting plate 7 for bonding the chip to the PCB board, and a driving mechanism 9 is provided on the upper end of the supporting plate 7 for driving the chip bonding mechanism 8 to work intermittently;

[0034] Reference Figure 3 The rotating mechanism 6 includes an L-shaped plate 601, a disc 602, a push rod 603 and a first motor 604. The L-shaped plate 601 is arranged on the right side of the bottom end of the processing table 1. The disc 602 is rotatably arranged on the inner side of the L-shaped plate 601. The push rod 603 is arranged at the upper end of the disc 602. The push rod 603 cooperates with the disc 602 to drive the groove wheel 5 to rotate intermittently. The first motor 604 is arranged at the bottom end of the L-shaped plate 601. The output shaft of the first motor 604 is connected to the bottom end of the disc 602 for driving the disc 602 to rotate.

[0035] By adopting the above technical solution, the first motor 604 drives the disc 602 to rotate, and then the push rod 603 and the disc 602 make the groove wheel 5 rotate ninety degrees intermittently, and the rotating rod 4 can drive the placement plate 2 to rotate ninety degrees intermittently.

[0036] Reference Figure 1 The chip bonding mechanism 8 includes a connecting plate 801 and a pressing plate 802. The connecting plate 801 is arranged on the front side of the supporting plate 7, and the pressing plate 802 is arranged at the bottom end of the connecting plate 801, and is used to adhere the chip to the PCB board; the driving mechanism 9 includes a mounting plate 901, a turntable 902, a connecting rod 903 and a second motor 904. The mounting plate 901 is arranged at the upper end of the supporting plate 7, and the turntable 902 is rotatably arranged on the right side of the mounting plate 901. The connecting rod 903 is hingedly arranged on the right side of the turntable 902. The bottom end of the turntable 902 is hingedly connected to the upper end of the connecting plate 801, and is used to drive the pressing plate 802 to move. The second motor 904 is arranged on the left side of the mounting plate 901, and the output shaft of the second motor 904 is connected to one side of the turntable 902, and is used to drive the turntable 902 to rotate.

[0037] By adopting the above technical solution, the second motor 904 drives the turntable 902 to rotate, the rotation of the turntable 902 drives the connecting rod 903 to rotate, the rotation of the connecting rod 903 drives the connecting plate 801 to move downward, the downward movement of the connecting plate 801 drives the pressure plate 802 to move downward, and the pressure plate 802 contacts the chip so that the chip can be tightly adhered to the PCB board.

[0038] Reference Figure 2 A guide block 10 is provided on one side of the connecting plate 801, and a guide groove 11 for use with the guide block 10 is opened on the right side of the supporting plate 7. One end of the guide block 10 penetrates into the guide groove 11 and is slidably connected to the guide groove 11.

[0039] By adopting the above technical solution, when the connecting plate 801 moves downward, the guide block 10 is driven to slide in the guide groove 11, thereby ensuring the stability of the connecting plate 801 when it moves downward.

[0040] Working principle: When the utility model is in use, the electrical components appearing in the present application are all externally connected to the power supply and the control switch. First, the PCB board is placed in the placement slot 3 on the placement disk 2 in turn, and then the chip is placed on the PCB board. At this time, the second motor 904 and the first motor 604 work at the same time. The second motor 904 drives the turntable 902 to rotate, and the rotation of the turntable 902 drives the connecting rod 903 to rotate. The rotation of the connecting rod 903 drives the connecting plate 801 to move downward, and the downward movement of the connecting plate 801 drives the pressing plate 802 to move downward, so that the pressing plate 802 contacts the chip so that the chip can be tightly adhered to the PCB board. Then, during the upward movement of the pressing plate 802, the first motor 604 drives the disc 602 to rotate, and then by pushing The rod 603 and the disc 602 make the groove wheel 5 rotate intermittently by 90 degrees, and the rotating rod 4 can drive the placement plate 2 to rotate intermittently by 90 degrees, and the turntable 902 of the placement plate 2 rotates exactly one circle during the intermittent pause, so that when the pressing plate 802 moves up, the PCB board in another placement slot 3 moves just under the pressing plate 802, and then the pressing plate 802 moves down to continue to adhere the chip and the PCB board. At this time, the staff can take out the adhered chips and PCB boards and place new chips and PCB boards that need to be adhered. By repeating the above steps, the chips and PCB boards can be adhered and the adhered chips and PCB boards can be collected simultaneously, which greatly improves the adhesion efficiency of the chips and PCB boards.

[0041] When the utility model is in use, operations such as chip and PCB board adhesion and collection of adhered chips and PCB board can be performed simultaneously, thus greatly improving the adhesion efficiency of chips and PCB board.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A manual and automatic film bonding machine, characterized in that: include A processing table (1) is rotatably provided with a placement plate (2) at its upper end, and a plurality of placement slots (3) are provided on the upper part of the placement plate (2) for placing PCB boards and chips; A rotating rod (4) is rotatably arranged at the bottom end of the processing table (1), the top end of which passes through the processing table (1) and is connected to the bottom end of the placement plate (2), and a groove wheel (5) is arranged at the lower end of the outer side thereof; A rotating mechanism (6) is arranged on the right side of the bottom end of the processing table (1) and is used to cooperate with the groove wheel (5) to drive the rotating rod (4) to rotate intermittently; A support plate (7) is arranged on the left side of the upper end of the processing table (1), and a chip bonding mechanism (8) is arranged on the right side thereof for bonding the chip to the PCB board; and The driving mechanism (9) is arranged at the upper end of the supporting plate (7) and is used to drive the film sticking mechanism (8) to perform intermittent operation.

2. The manual-automatic die bonding machine according to claim 1, characterized in that: The rotating mechanism (6) comprises An L-shaped plate (601) is arranged on the right side of the bottom end of the processing table (1); A disc (602) is rotatably disposed on the inner side of the L-shaped plate (601); A push rod (603) is arranged at the upper end of the disc (602) and cooperates with the disc (602) to drive the groove wheel (5) to rotate intermittently; The first motor (604) is arranged at the bottom end of the L-shaped plate (601), and its output shaft is connected to the bottom end of the disc (602) for driving the disc (602) to rotate.

3. The manual-automatic die bonding machine according to claim 1, characterized in that: The sheet bonding mechanism (8) comprises A connecting plate (801) is arranged on the front side of the supporting plate (7); The pressing plate (802) is arranged at the bottom end of the connecting plate (801) and is used to adhere the chip to the PCB board.

4. The manual-automatic die bonding machine according to claim 3, characterized in that: The driving mechanism (9) comprises A mounting plate (901) is arranged on the upper end of the supporting plate (7); A turntable (902) is rotatably disposed on the right side of the mounting plate (901); A connecting rod (903) is hingedly arranged on the right side of the rotating disk (902), and its bottom end is hingedly connected to the upper end of the connecting plate (801), and is used to drive the pressing plate (802) to move; The second motor (904) is arranged on the left side of the mounting plate (901), and its output shaft is connected to one side of the turntable (902) for driving the turntable (902) to rotate.

5. The manual-automatic die bonding machine according to claim 3, characterized in that: A guide block (10) is provided on one side of the connecting plate (801), and a guide groove (11) for use with the guide block (10) is provided on the right side of the supporting plate (7), and one end of the guide block (10) penetrates into the guide groove (11) and is slidably connected to the guide groove (11).

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