Semiconductor cleaning equipment

Abstract

The utility model belongs to the technical field of semiconductor processing, and discloses semiconductor cleaning equipment. Comprising a cleaning pool, a placing plate is arranged in the cleaning pool, a communicating pipeline is arranged at the bottom of the cleaning pool, water in the cleaning pool flows downwards into a storage cavity through the communicating pipeline by opening a valve, then a pump body is started, the pump body generates suction force, a conveying pipe is promoted to convey the water in the storage cavity upwards, and the water in the storage cavity is conveyed through the conveying pipe. Due to the fact that the conveying pipe penetrates through the filter plate, and the inner wall of the conveying pipe is also provided with the filter plate, when water is sucked out of the storage cavity, the water is filtered, then the water in the conveying pipe is conveyed to the top end of the cleaning pool and then sprayed out downwards through the spray head, and the sprayed water can wash the semiconductor. Therefore, impurities adhered to the semiconductors can be flushed, water can be reused, and the problem that the water consumption is large when the semiconductors are cleaned is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and more specifically, to a semiconductor cleaning device. Background Art

[0002] Semiconductor refers to a material with electrical conductivity between conductors and insulators at room temperature. It is the core component of many electronic devices and is widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Among them, silicon has the greatest influence in the application of various semiconductor materials. When processing semiconductors, cleaning equipment is needed to clean the surface of the semiconductor.

[0003] Semiconductor cleaning equipment is a special equipment used to clean and purify semiconductor materials. In the semiconductor manufacturing process, cleaning is a very important step. It can remove impurities and contaminants on the surface of the semiconductor to ensure the quality and performance of semiconductor products. Semiconductor cleaning equipment mainly includes a cleaning tank, a placement plate and a removal mechanism. When the semiconductor needs to be cleaned, the placement plate with the semiconductor can be placed in the cleaning tank, and the cleaning liquid is injected into the cleaning tank. The semiconductor is then cleaned through an ultrasonic cleaning tank.

[0004] In the prior art, after cleaning the semiconductor, the pure water used for cleaning is generally discharged directly as wastewater. However, the semiconductor cleaning process generally consumes a lot of water, and directly discarding it will cause a large waste of water resources. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a semiconductor cleaning device.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor cleaning device, comprising a cleaning pool, a placement plate is arranged inside the cleaning pool, a connecting pipe is opened at the bottom of the cleaning pool, a valve is arranged inside the connecting pipe, a storage cavity is opened inside the cleaning pool, the top of the storage cavity is connected to the inner wall of the connecting pipe, a filter plate is fixedly connected to the inner wall of the storage cavity, a transmission pipe is fixedly connected to one side of the cleaning pool, the bottom of the transmission pipe extends into the storage cavity, the inner wall of the transmission pipe passes through the filter plate, a pump is fixedly connected to one side of the cleaning pool, the pump is connected to the transmission pipe, a collar is fixedly connected to the top of the cleaning pool, the collar is sleeved on the outer wall of the transmission pipe, a nozzle is fixedly connected to the top of the transmission pipe, and multiple groups of the connecting pipe, transmission pipe, pump, collar and nozzle are arranged, and are symmetrically distributed on both sides of the cleaning pool.

[0007] Furthermore, a side plate is fixedly connected to one side of the cleaning pool, a second hydraulic cylinder is fixedly connected to one side of the side plate, an output end of the second hydraulic cylinder is fixedly connected to a top plate, a bottom of the top plate is fixedly connected to a first hydraulic cylinder, an output end of the first hydraulic cylinder is fixedly connected to a push plate, a rotating motor is fixedly connected to the bottom of the push plate, a rotating rod is fixedly connected to the output end of the rotating motor, a gear is fixedly connected to the outer wall of the rotating rod, a rack is meshed on one side of the gear, the top end of the rack passes through the push plate, an L-shaped plate is fixedly connected to the bottom of the rack, and a pull block is provided on one side of the placement plate.

[0008] Furthermore, the gear, rack, pull block and L-shaped plate are each provided in two groups and are symmetrically distributed on the outer wall of the rotating rod.

[0009] Furthermore, a first bevel tooth is fixedly connected to the outer wall of the rotating rod, a second bevel tooth is meshed at the bottom of the first bevel tooth, a fan blade is fixedly connected to the bottom of the second bevel tooth, a hoop is fixedly connected to the bottom of the push plate, and the hoop is sleeved on the outer wall of the fan blade. The first bevel tooth, the second bevel tooth, the fan blade and the hoop are each provided in three groups and are distributed in parallel on the outer wall of the rotating rod.

[0010] Furthermore, a limiting sleeve is fixedly connected to the top of the push plate, and the limiting sleeve is arranged on the outer wall of the rack. Two groups of limiting sleeves are provided and are symmetrically distributed on the top of the push plate.

[0011] The technical effects and advantages of the semiconductor cleaning equipment of the utility model are as follows:

[0012] (1) By opening the valve, the water in the cleaning pool flows downward into the storage chamber through the connecting pipe, and then the pump body is started to generate suction, and the transmission pipe is prompted to transmit the water in the storage chamber upward. Since the transmission pipe passes through the filter plate and the inner wall of the transmission pipe is also provided with a filter plate, the water can be filtered when it is sucked out of the storage chamber. The water in the transmission pipe is then transmitted to the top of the cleaning pool and then sprayed downward through the nozzle. The sprayed water can rinse the semiconductor, which is beneficial to rinse the impurities adhering to the semiconductor. At the same time, the water can be reused, solving the problem of high water consumption when cleaning the semiconductor.

[0013] (2) By starting the rotary motor to drive the rotating rod and the gear to rotate, the rack and the L-shaped plate set on one side can be driven to move downward until the L-shaped plate moves to one side of the pulling block, and then the second hydraulic cylinder can be started, and the top plate, the first hydraulic cylinder, the push plate, the rack, and the L-shaped plate can be pushed to one side by the second hydraulic cylinder, so that one side of the L-shaped plate moves to the bottom of the pulling block, and then the rotary motor is rotated in the opposite direction, and the rotary motor drives the rotating rod and the gear to rotate in the opposite direction, so that the rack and the L-shaped plate move upward, and the placement plate can be taken out of the cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the utility model.

[0016] Figure 3 for Figure 2 A is an enlarged structural diagram of FIG.

[0017] Figure 4 It is a schematic diagram of the local structure of the push plate in the utility model.

[0018] Figure 5 It is a schematic diagram of the fan blade structure in the utility model.

[0019] In the figure:

[0020] 1. Cleaning tank; 2. Connecting pipe; 3. Storage chamber; 4. Transmission pipe; 5. Pump; 6. Ring; 7. Nozzle; 8. Placement plate; 9. Filter plate; 10. Side plate; 11. Top plate; 12. First hydraulic cylinder; 13. Push plate; 14. Rotating motor; 15. Rotating rod; 16. Gear; 17. Rack; 18. L-shaped plate; 19. Second hydraulic cylinder; 20. First bevel gear; 21. Second bevel gear; 22. Fan blade; 23. Hoop; 24. Limiting sleeve. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1

[0023] Reference Figure 1-5A semiconductor cleaning device comprises a cleaning pool 1, wherein a placement plate 8 is arranged inside the cleaning pool 1, a connecting pipe 2 is provided at the bottom of the cleaning pool 1, a valve is arranged inside the connecting pipe 2, a storage chamber 3 is provided inside the cleaning pool 1, the top of the storage chamber 3 is connected to the inner wall of the connecting pipe 2, a filter plate 9 is fixedly connected to the inner wall of the storage chamber 3, a transmission pipe 4 is fixedly connected to one side of the cleaning pool 1, the bottom of the transmission pipe 4 extends into the storage chamber 3, the inner wall of the transmission pipe 4 passes through the filter plate 9, a pump 5 is fixedly connected to one side of the cleaning pool 1, the pump 5 is connected to the transmission pipe 4, a collar 6 is fixedly connected to the top of the cleaning pool 1, the collar 6 is sleeved on the outer wall of the transmission pipe 4, a nozzle 7 is fixedly connected to the top of the transmission pipe 4, and multiple groups of the connecting pipe 2, the transmission pipe 4, the pump 5, the collar 6 and the nozzle 7 are arranged, and are symmetrically distributed on both sides of the cleaning pool 1.

[0024] In order to solve the problem of high water consumption when cleaning semiconductors, when the semiconductor needs to be cleaned, the semiconductor can be placed on the top of the placement plate 8, and the placement plate 8 can be placed in the cleaning tank 1, and then the multiple groups of connecting pipes 2 can be closed through the valve, and water can be added to the cleaning tank 1, and then the semiconductor on the placement plate 8 can be cleaned under the action of ultrasonic waves, and then the valve can be opened to allow the water in the cleaning tank 1 to flow downward into the storage chamber 3 through the connecting pipe 2, and then the pump body can be started to generate suction and prompt the transmission pipe 4 to transmit the water in the storage chamber 3 upward. Since the transmission pipe 4 passes through the filter plate 9 and the inner wall of the transmission pipe 4 is also provided with a filter plate 9, the water can be filtered when it is sucked out of the storage chamber 3, and then the water in the transmission pipe 4 is transmitted to the top of the cleaning tank 1, and then it will be sprayed downward through the nozzle 7, and the sprayed water can rinse the semiconductor, which is beneficial to rinse the impurities adhering to the semiconductor, and at the same time, the water can be reused.

[0025] Reference Figure 4-5 A side plate 10 is fixedly connected to one side of the cleaning tank 1, a second hydraulic cylinder 19 is fixedly connected to one side of the side plate 10, an output end of the second hydraulic cylinder 19 is fixedly connected to a top plate 11, a first hydraulic cylinder 12 is fixedly connected to the bottom of the top plate 11, an output end of the first hydraulic cylinder 12 is fixedly connected to a push plate 13, a rotating motor 14 is fixedly connected to the bottom of the push plate 13, a rotating rod 15 is fixedly connected to the output end of the rotating motor 14, a gear 16 is fixedly connected to the outer wall of the rotating rod 15, a rack 17 is meshed with one side of the gear 16, a top end of the rack 17 passes through the push plate 13, an L-shaped plate 18 is fixedly connected to the bottom of the rack 17, and a pull block is provided on one side of the placement plate 8.

[0026] After cleaning the semiconductor, the first hydraulic cylinder 12 can be started to push the push plate 13 downward. After the push plate 13 moves to the specified position, the rotating motor 14 can be started, and the rotating rod 15 at the output end can be driven to rotate by the rotating motor 14. When the rotating rod 15 rotates, the gear 16 set on its outer wall will be driven to rotate. When the gear 16 rotates, the rack 17 set on one side will be driven to move downward, and the L-shaped plate 18 at the bottom of the rack 17 will be moved downward. Until the L-shaped plate 18 moves to one side of the pulling block, the second hydraulic cylinder 19 can be started, and the top plate 11, the first hydraulic cylinder 12, the push plate 13, the rack 17, and the L-shaped plate 18 are pushed to one side by the second hydraulic cylinder 19, so that one side of the L-shaped plate 18 moves to the bottom of the pulling block, and then the rotating motor 14 is rotated in the opposite direction, and the rotating motor 14 drives the rotating rod 15 and the gear 16 to rotate in the opposite direction, so that the rack 17 and the L-shaped plate 18 move upward, and the placement plate 8 can be taken out of the cleaning tank 1.

[0027] Reference Figure 4-5 The gear 16 , rack 17 , pull block and L-shaped plate 18 are each provided in two groups and are symmetrically distributed on the outer wall of the rotating rod 15 .

[0028] By providing two sets of gears 16, racks 17, pull blocks and L-shaped plates 18, when it is necessary to take out the semiconductor, the pull blocks on both sides of the placement plate 8 can be pulled up at the same time.

[0029] Reference Figure 5 A first bevel tooth 20 is fixedly connected to the outer wall of the rotating rod 15, a second bevel tooth 21 is meshed at the bottom of the first bevel tooth 20, a fan blade 22 is fixedly connected to the bottom of the second bevel tooth 21, a hoop 23 is fixedly connected to the bottom of the push plate 13, and the hoop 23 is sleeved on the outer wall of the fan blade 22. The first bevel tooth 20, the second bevel tooth 21, the fan blade 22 and the hoop 23 are all provided in three groups and are distributed in parallel on the outer wall of the rotating rod 15.

[0030] When the rotating rod 15 rotates in the opposite direction to drive the placement plate 8 to move upward, the first bevel gear 20 can be driven to rotate, and the first bevel gear 20 will drive the second bevel gear 21 at the bottom to rotate when rotating, and the rotation of the second bevel gear 21 will drive the fan blade 22 at the bottom to rotate, and the fan blade 22 will generate wind force when rotating, so that when taking out the semiconductor, the wind force generated by the fan blade 22 can blow off the residual liquid on the semiconductor.

[0031] Reference Figure 4 The top end of the push plate 13 is fixedly connected with a limiting sleeve 24 , and the limiting sleeve 24 is sleeved on the outer wall of the rack 17 . There are two groups of limiting sleeves 24 , which are symmetrically distributed on the top end of the push plate 13 .

[0032] By arranging two groups of limiting sleeves 24 at the top of the push plate 13 , when the rack 17 moves to the top of the push plate 13 , the limiting sleeves 24 can limit the moving track of the rack 17 .

[0033] Working principle: In order to solve the problem of high water consumption when cleaning semiconductors, when it is necessary to clean the semiconductors, the semiconductors can be placed on the top of the placement plate 8, and the placement plate 8 is placed in the cleaning tank 1, and then the multiple groups of connecting pipes 2 are closed through the valve, and water is added to the cleaning tank 1. Then, under the action of ultrasound, the semiconductors on the placement plate 8 are cleaned, and then the valve can be opened to allow the water in the cleaning tank 1 to flow downward into the storage chamber 3 through the connecting pipe 2, and then the pump body is started to generate suction, and the transmission pipe 4 is prompted to transmit the water in the storage chamber 3 upward. Since the transmission pipe 4 passes through the filter plate 9 and the transmission pipe 4 passes through the filter plate 9, the transmission pipe 4 passes through the filter plate 9 and the transmission pipe 4 passes through the filter plate 9. The inner wall of the tube 4 is also provided with a filter plate 9, so that the water can be filtered when being sucked out of the storage chamber 3, and then the water in the transmission tube 4 is transmitted to the top of the cleaning pool 1, and then it is sprayed downward through the nozzle 7, and the sprayed water can wash the semiconductor, which is conducive to washing the impurities adhering to the semiconductor, and at the same time, the water can be reused. After cleaning the semiconductor, the first hydraulic cylinder 12 can be started to push the push plate 13 downward, and after the push plate 13 moves to the specified position, the rotating motor 14 can be started, and the rotating rod 15 at the output end is driven to rotate by the rotating motor 14. When the rotating rod 15 rotates , which will drive the gear 16 arranged on its outer wall to rotate. When the gear 16 rotates, it will drive the rack 17 arranged on one side to move downward, and at the same time make the L-shaped plate 18 at the bottom of the rack 17 move downward. Until the L-shaped plate 18 moves to one side of the pulling block, the second hydraulic cylinder 19 can be started, and the second hydraulic cylinder 19 pushes the top plate 11, the first hydraulic cylinder 12, the push plate 13, the rack 17, and the L-shaped plate 18 to move to one side, so that one side of the L-shaped plate 18 moves to the bottom of the pulling block, and then the rotating motor 14 is reversed, and the rotating motor 14 drives the rotating rod 15 and the gear 16 to rotate in the opposite direction, so that the rack 17 and the L-shaped plate 18 move to the bottom of the pulling block. The placement plate 8 can be taken out of the cleaning tank 1 by moving upward. By setting two sets of gears 16, racks 17, pull blocks and L-shaped plates 18, when the semiconductor needs to be taken out, the pull blocks on both sides of the placement plate 8 can be pulled up at the same time. When the rotating rod 15 rotates in the opposite direction to drive the placement plate 8 to move upward, the first bevel gear 20 can be driven to rotate. The first bevel gear 20 will drive the second bevel gear 21 at the bottom to rotate when rotating. The rotation of the second bevel gear 21 will drive the fan blade 22 at the bottom to rotate. The fan blade 22 will generate wind force when rotating, so that when the semiconductor is taken out, the wind force generated by the fan blade 22 can blow off the residual liquid on the semiconductor.

[0034] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor cleaning device, characterized in that: The invention comprises a cleaning pool (1), wherein a placement plate (8) is arranged inside the cleaning pool (1), a connecting pipe (2) is provided at the bottom of the cleaning pool (1), a valve is provided inside the connecting pipe (2), a storage chamber (3) is provided inside the cleaning pool (1), the top of the storage chamber (3) is connected to the inner wall of the connecting pipe (2), a filter plate (9) is fixedly connected to the inner wall of the storage chamber (3), a transmission pipe (4) is fixedly connected to one side of the cleaning pool (1), and the bottom of the transmission pipe (4) extends into the storage chamber (3). The inner wall of the transmission pipe (4) passes through the filter plate (9), a pump (5) is fixedly connected to one side of the cleaning tank (1), the pump (5) is connected to the transmission pipe (4), a collar (6) is fixedly connected to the top of the cleaning tank (1), the collar (6) is sleeved on the outer wall of the transmission pipe (4), a nozzle (7) is fixedly connected to the top of the transmission pipe (4), and the connecting pipe (2), the transmission pipe (4), the pump (5), the collar (6) and the nozzle (7) are all provided in multiple groups and are symmetrically distributed on both sides of the cleaning tank (1).

2. A semiconductor cleaning device according to claim 1, characterized in that: A side plate (10) is fixedly connected to one side of the cleaning tank (1), a second hydraulic cylinder (19) is fixedly connected to one side of the side plate (10), an output end of the second hydraulic cylinder (19) is fixedly connected to a top plate (11), a first hydraulic cylinder (12) is fixedly connected to the bottom of the top plate (11), an output end of the first hydraulic cylinder (12) is fixedly connected to a push plate (13), a rotating motor (14) is fixedly connected to the bottom of the push plate (13), a rotating rod (15) is fixedly connected to the output end of the rotating motor (14), a gear (16) is fixedly connected to the outer wall of the rotating rod (15), a rack (17) is meshed on one side of the gear (16), a top end of the rack (17) passes through the push plate (13), an L-shaped plate (18) is fixedly connected to the bottom of the rack (17), and a pull block is provided on one side of the placement plate (8).

3. A semiconductor cleaning device according to claim 2, characterized in that: The gear (16), rack (17), pull block and L-shaped plate (18) are each provided in two groups and are symmetrically distributed on the outer wall of the rotating rod (15).

4. A semiconductor cleaning device according to claim 3, characterized in that: The outer wall of the rotating rod (15) is fixedly connected with a first bevel tooth (20), the bottom of the first bevel tooth (20) is meshed with a second bevel tooth (21), the bottom of the second bevel tooth (21) is fixedly connected with a fan blade (22), the bottom of the push plate (13) is fixedly connected with a hoop (23), the hoop (23) is sleeved on the outer wall of the fan blade (22), and the first bevel tooth (20), the second bevel tooth (21), the fan blade (22) and the hoop (23) are all arranged in three groups and are distributed in parallel on the outer wall of the rotating rod (15).

5. A semiconductor cleaning device according to claim 4, characterized in that: The top end of the push plate (13) is fixedly connected to a limiting sleeve (24), which is sleeved on the outer wall of the rack (17). Two groups of limiting sleeves (24) are provided and are symmetrically distributed on the top end of the push plate (13).

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