Adhesive-free laminated polyimide flexible copper-clad plate

By setting up a glue storage tank on the copper foil of the glue-free stacked polyimide flexible copper clad plate and adding thermal filler, the problem of unsolid bond between the copper foil and the polyimide thermoplastic adhesive layer is solved, the shear resistance and heat resistance are improved, and the curling phenomenon is avoided.

CN222662883UActive Publication Date: 2025-03-25SHENZHEN FUJINO ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421751573.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-23
Publication Date
2025-03-25
Estimated Expiration
2034-07-23

AI Technical Summary

Technical Problem

The copper foil of the existing glue-free stacked polyimide flexible copper clad plate is relatively smooth, resulting in low bonding between the copper foil and the polyimide thermoplastic adhesive layer, which is easy to separate and curl after working for a long time and heat generation.

Method used

The first and second glue storage tanks are respectively arranged on the upper copper foil and the lower copper foil. The polyimide composite adhesive layer can be extruded into the glue storage tank to enhance the shear resistance at the connection between the polyimide composite adhesive layer and the copper foil, and a thermal filler is added to the polyimide composite adhesive layer to improve thermal conductivity.

Benefits of technology

By enhancing the adhesion and thermal conductivity, the separation problem between the copper foil and the polyimide thermoplastic adhesive layer is solved, and the shear resistance and heat resistance of the flexible copper clad plate are improved, thereby avoiding curling.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model discloses a non-adhesive laminated polyimide flexible copper-clad plate, which belongs to the technical field of flexible copper-clad plates, and comprises a polyimide composite adhesive layer, an upper copper foil is fixedly connected to the upper side wall of the polyimide composite adhesive layer, a lower copper foil is fixedly connected to the lower side wall of the polyimide composite adhesive layer, and the lower copper foil is fixedly connected to the lower side wall of the polyimide composite adhesive layer. An upper protection film is attached to the upper side wall of the upper copper foil, a lower protection film is attached to the lower side wall of the lower copper foil, and the side walls of the sides, close to the polyimide composite adhesive layer, of the upper copper foil and the lower copper foil are subjected to roughening treatment. According to the utility model, the first glue storage groove is arranged on the upper copper foil, and the second glue storage groove is arranged on the lower copper foil, so that the anti-shearing performance of the joint among the polyimide composite adhesive layer, the upper copper foil and the lower copper foil can be improved, the cohesiveness is stronger, the dielectric coefficient is low, and the performance is good; the heat conduction and heat dissipation effects of the upper copper foil and the lower copper foil can be improved, and the heat resistance is improved.
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