Low-cost assembled door lock fingerprint chip module
By designing an adjustable installation housing and fixing mechanism, the existing fingerprint recognition modules are solved for complex installation and inadequate to chips of different thicknesses, and the flexible fixation and installation process of chips of different thicknesses is achieved, reducing costs.
Patent Information
- Application Number
- CN202421416602.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-20
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-20
AI Technical Summary
Existing fingerprint recognition modules are usually installed with screws, requiring specific tools to disassemble and assemble, and are troublesome to install. At the same time, the height of the cover is a fixed value, which cannot adapt to the recognition module sensor chip of different thicknesses, reducing practicality.
A low-cost assembled door lock fingerprint chip module is designed, using an adjustable mounting housing and fixing mechanism, electrically connected to the identification module sensor chip through wires, placing the plate and threaded rod to achieve the fixation of chips of different heights, and simplifying the installation and disassembly process through the design of cover plates and insert rods.
It realizes flexible fixation of sensor chips for different thickness identification modules, improves the practicality of the module, and reduces installation costs and labor costs by simplifying the installation process, and solves the complexity of traditional screw installation.