Mobile phone side edge type fingerprint chip module with high connection strength
By designing the installation mechanism in the side-type fingerprint chip module of the mobile phone, the sliding connection and rapid disassembly of the module housing and the cover plate are achieved, and the problem of inconvenient disassembly and maintenance of the fingerprint chip module in the prior art is solved, and the convenience of use and maintenance practicality are improved.
CN222691750UActive Publication Date: 2025-03-28江苏金佑电子科技有限公司
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Patent Information
- Application Number
- CN202421414986.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-20
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-20
AI Technical Summary
Technical Problem
The existing fingerprint chip module is not convenient for disassembly and maintenance, resulting in inconvenient use and difficulty in maintenance.
Method used
A mobile phone side fingerprint chip module with high connection strength is designed. By setting up an installation mechanism between the module housing and the cover plate, including installation blocks, installation chambers, springs and fixing blocks, the sliding connection and rapid disassembly of the module housing and the cover plate are achieved.
Benefits of technology
It realizes rapid disassembly and maintenance of the module, improves the convenience of use and maintenance practicality, and ensures stable and fixed connections of structures such as fingerprint sensors.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to a mobile phone side edge type fingerprint chip module with high connection strength, and belongs to the technical field of mobile phone side edge type fingerprint chip modules with high connection strength, the mobile phone side edge type fingerprint chip module comprises a mobile phone shell frame, the right side of the mobile phone shell frame is provided with a mounting hole, and the mounting hole is slidably connected with a module shell. A flexible circuit board is fixed to the right side of the module shell, an IC chip is fixed in the module shell, a PCB is fixed to the left side of the IC chip, a fingerprint sensor is fixed to the left side of the PCB, a cover plate is installed on the left side of the fingerprint sensor, and an installation mechanism is arranged on the module shell. The mounting mechanism comprises mounting blocks fixed on the upper side and the lower side of the cover plate, and two mounting grooves are formed in the right side of the mobile phone shell frame. According to the mobile phone side edge type fingerprint chip module with high connection strength, the module shell and the cover plate can be quickly detached from the mounting hole through the mounting mechanism, so that convenience is provided for maintenance of structures such as a fingerprint sensor and the like.
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