COB structure of vehicle-mounted camera module

The car-mounted camera module COB structure addresses the limitations of CSP and BGA technologies by integrating the chip, protective component, and PCB with UV and thermal adhesives, enhancing reliability and imaging quality for advanced automotive sensing systems.

CN222691955UActive Publication Date: 2025-03-28JIANGXI SHENGTAI PRECISION OPTICS CO LTD
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Patent Information

Application Number
CN202421016422.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-11
Publication Date
2025-03-28
Estimated Expiration
2034-05-11

AI Technical Summary

Technical Problem

Current CSP and BGA chip packaging technologies in car-mounted cameras fail to meet market demands for high-quality imaging, particularly in the context of advanced automotive sensing and intelligent driving systems.

Method used

A car-mounted camera module COB (Chip-On-Board) structure is proposed, featuring a PCB board with chips connected via adhesive, a protective component with UV and thermal adhesives, and a high-transparency protective component with a pre-molded connection bracket and escape vent, designed to prevent contamination and enhance reliability.

Benefits of technology

This solution enhances the reliability and imaging quality of car-mounted camera modules by integrating the chip, protective component, and PCB into a single unit, reducing the risk of pollution and improving the module's overall reliability and delivery efficiency.

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Abstract

The utility model discloses a COB structure of a vehicle-mounted camera module. The COB structure comprises a PCB, a chip is arranged above the PCB, the chip is connected with the PCB through third glue, a protection assembly is arranged above the chip, the protection assembly is connected with the chip through first glue, and a gold thread on the periphery of the chip is covered with second glue located on the periphery of the protection assembly. After a bare chip is connected with a gold thread, a protection assembly is attached to the position over a non-imaging area of the chip to protect the chip from being polluted in the production process, the gold thread is covered with second glue, so that the reliability risk is reduced, the protection assembly, the gold thread, the chip and a PCB are connected into a whole while the gold thread is covered with the second UV glue, and the reliability of the chip is improved. The reliability risk of the module is further reduced, and the customer delivery cycle is shortened by adopting a bare chip COB structure manufacturing process.
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