Vacuum film tearing platform suitable for Lift-off process

By designing a vacuum film tearing platform, using negative pressure adsorption and individually controlled adsorption holes, the problem of insufficient applicability of the vacuum film tearing platform in the prior art is solved, and efficient and low-cost single-layer chip porcelain dielectric capacitor preparation is achieved.

CN223303069UActive Publication Date: 2025-09-05BEIJING YUANLU HONGYUAN ELECTRONIC TECH CO LTD +1
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Patent Information

Application Number
CN202422890774.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-09-05
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

There is a lack of vacuum tearing platform devices suitable for different sizes of metallized substrates and different manufacturing processes in the prior art, resulting in inconvenient operation of preparing single-layer chip ceramic dielectric capacitors.

Method used

A vacuum tearing membrane platform is designed, using a vacuum adsorption plate and a vacuum controller to adsorb the metalized ceramic substrate through negative pressure. The adsorption holes can be controlled separately, and are equipped with a display screen and manual/automatic switching buttons to achieve fast and flexible film tearing.

Benefits of technology

The vacuum film tearing process with simple structure and convenient operation is realized, which reduces production costs and improves the efficiency and accuracy of preparing single-layer chip porcelain dielectric capacitors.

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Abstract

The vacuum film tearing platform suitable for the Lift-off technology comprises a vacuum adsorption plate and a vacuum controller connected with the vacuum adsorption plate, one side end face of the vacuum adsorption plate is provided with one or more adsorption holes, a pipe joint is installed on the side face of the vacuum adsorption plate, and the vacuum controller is connected with the vacuum adsorption plate. One end of the pipe joint is communicated with the adsorption hole through an airflow channel arranged in the vacuum adsorption plate, the other end of the pipe joint is communicated with the vacuum controller through a pipeline, and the vacuum controller is used for generating vacuum suction force and controlling on-off of vacuum adsorption. The vacuum film tearing platform is used for adsorbing a metallized ceramic substrate, material suction and discharging are carried out in a negative pressure mode, so that a film is torn more conveniently and rapidly, the multiple adsorption holes can be independently controlled, and operation is convenient.
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