Electronic device
By setting a recessed portion on the heat spreader of the electronic device, the problem of difficulty in making the electronic device thinner in the prior art is solved, and the thickness of the device is reduced while ensuring the impact resistance of the fingerprint module.
Patent Information
- Application Number
- CN202422768289.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-13
AI Technical Summary
In the prior art, as electronic devices develop towards being thinner and lighter, conventional stacking solutions are difficult to effectively reduce the thickness of the devices, especially while ensuring the impact resistance of the fingerprint module.
By setting a first recessed portion in the area of the heat spreader opposite to the fingerprint module and spacing the end surface of the main body of the fingerprint module from the bottom surface of the recessed portion, the distance between the display module and the heat spreader is reduced while maintaining a sufficient distance to prevent damage to the fingerprint module.
It achieves the goal of reducing the thickness of electronic devices while ensuring the impact resistance of the fingerprint module, thereby improving the lightweight effect of the device.