Light emitting device
The design of the supporting bracket connected by the conductive substrate avoids metal card point support, and the cutting surface separates the supporting bracket and the metal frame, which solves the problem of supporting bracket damage during the manufacturing process of light-emitting devices and improves the yield rate and lighting efficiency.
Patent Information
- Application Number
- CN202422403506.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-09-30
AI Technical Summary
During the manufacturing process of light-emitting devices, the supporting bracket is easily damaged due to the force of the stuck points, resulting in a decrease in the yield rate.
The supporting bracket is connected through a conductive substrate to avoid the use of metal card points for support. The cutting surface formed by cutting separates the supporting bracket and the metal frame to reduce stress transfer. Transparent materials and reflective layers are used to improve light efficiency.
The damage rate of the supporting bracket is reduced, the product yield rate is improved, and the risk of glue overflow is reduced by reducing the use of metal materials and cutting design, thereby improving the lighting effect and product stability.