Hot pressing device for flexible packaging bag processing

By using a combination of semiconductor cooling plates and fan blades in the flexible packaging bag processing device, the mechanical wear and energy consumption problems caused by frequent fan startup are solved, rapid cooling and convenient disconnection are achieved, production efficiency is improved and maintenance costs are reduced.

CN223340160UActive Publication Date: 2025-09-16ZHEJIANG TUOFENG PACKAGING MATERIAL CO LTD
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Patent Information

Application Number
CN202422788737.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-15
Publication Date
2025-09-16
Estimated Expiration
2034-11-15

AI Technical Summary

Technical Problem

In existing flexible packaging bag processing equipment, the frequent starting and stopping of fans causes wear and tear of mechanical parts, shortening their service life, increasing maintenance costs and electricity bills, and unnecessary increase in energy consumption.

Method used

The design combines semiconductor cooling plates and fan blades. The fan blades rotate when the movable shell moves up and down, achieving rapid cooling of the resistance wire heating plate and avoiding frequent starting and stopping of the fan. The movable plate and spring structure facilitate the separation of the package from the heating plate.

Benefits of technology

It improves production efficiency, reduces failure rate and maintenance complexity, shortens production cycle, and reduces energy consumption and maintenance costs.

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Abstract

The utility model provides an ironing device for flexible packaging bag processing, and belongs to the technical field of flexible packaging bag processing. Comprising a workbench, a first cavity is formed in the workbench, a plurality of vent grooves are formed in the two sides of the workbench, the first cavity is communicated with the vent grooves, a mounting table is fixedly mounted at the top of the workbench, and an electric cylinder is fixedly mounted at the top of the mounting table. The semiconductor refrigeration plate and the fan blades are arranged, and the fan blades rotate while moving up and down in the movable shell, so that cold air is conveyed to the interior of the second cavity, the resistance wire heating plate can be rapidly cooled, the temperature of the resistance wire heating plate can be timely reduced, the resistance wire heating plate can be conveniently separated from a packaging piece, and the packaging efficiency is improved. The hot-pressing process can be completed more quickly, the production period is shortened, the overall production efficiency is improved, frequent starting and stopping after the fan blades are powered on are avoided, and the fault rate and maintenance complexity are reduced.
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