Connecting device
By setting an adsorption seat and a conductive part in the connection device, automatic adsorption of the circuit board plane and automatic contact test points are achieved, which solves the problems of cumbersome operation and low efficiency in the existing technology and improves the efficiency and reliability of the whole machine testing and maintenance.
Patent Information
- Application Number
- CN202422661107.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-31
AI Technical Summary
Existing whole-machine testing and maintenance methods have shortcomings in efficiency and ease of operation, especially in the wire bonding test and burning process, which are cumbersome and time-consuming, affecting production efficiency.
A connection device is designed, including a connecting wire, a connecting head and an adsorption seat. The adsorption seat is provided with an adsorption part and a conductive part. The conductive part protrudes from the adsorption seat. The adsorption part automatically adsorbs the circuit board plane, and the conductive part automatically contacts the test point, which simplifies operation and improves reliability.
It simplifies the operation steps of wire bonding test and burning process, improves the efficiency of whole machine testing and maintenance, reduces the probability of poor contact, and enhances the reliability of connection.