Connecting device

By setting an adsorption seat and a conductive part in the connection device, automatic adsorption of the circuit board plane and automatic contact test points are achieved, which solves the problems of cumbersome operation and low efficiency in the existing technology and improves the efficiency and reliability of the whole machine testing and maintenance.

CN223348080UActive Publication Date: 2025-09-16SHANGHAI ANKELIAN TECH CO LTD
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Patent Information

Application Number
CN202422661107.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-09-16
Estimated Expiration
2034-10-31

AI Technical Summary

Technical Problem

Existing whole-machine testing and maintenance methods have shortcomings in efficiency and ease of operation, especially in the wire bonding test and burning process, which are cumbersome and time-consuming, affecting production efficiency.

Method used

A connection device is designed, including a connecting wire, a connecting head and an adsorption seat. The adsorption seat is provided with an adsorption part and a conductive part. The conductive part protrudes from the adsorption seat. The adsorption part automatically adsorbs the circuit board plane, and the conductive part automatically contacts the test point, which simplifies operation and improves reliability.

Benefits of technology

It simplifies the operation steps of wire bonding test and burning process, improves the efficiency of whole machine testing and maintenance, reduces the probability of poor contact, and enhances the reliability of connection.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model discloses a connecting device. The connecting device comprises a connecting line; the connector is arranged at one end of the connecting line, and the connector is used for being connected with debugging equipment; the adsorption seat is arranged at the other end of the connecting wire, an adsorption part and a conductive part are arranged on the adsorption seat, the conductive part is electrically connected with the connecting wire, and the adsorption part is used for adsorbing the plane where the circuit board is located, so that the conductive part is connected with a test point on the circuit board; wherein the conductive piece is configured to protrude out of the adsorption seat. According to the utility model, the adsorption member is arranged on the adsorption seat, so that the adsorption seat automatically adsorbs the plane where the circuit board is located, the operation is simplified, the conductive member protruding out of the adsorption seat is matched with the adsorption seat, and the protruding conductive member is easier to contact with a test point, thereby improving the reliability and reducing the probability of poor contact.
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