Coating sand mill
By installing a cooling device in the paint sand grinder, the cooling problem of the machine head is solved. By installing a cooling device in the paint sand grinder, the heat accumulation problem of the machine head in the prior art is solved, and the efficient operation of the equipment and the effective cleaning of the cleaning components are achieved.
CN223367099UActive Publication Date: 2025-09-23HEBEI TIANBAO PAINT CO LTD
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Patent Information
- Application Number
- CN202422493314.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-15
AI Technical Summary
Technical Problem
The head of the paint sand grinder in the prior art lacks a cooling device, which causes heat to accumulate continuously and easily leads to overall overheating.
Method used
A paint sand grinder was designed, which adopted a cooling cylinder and circulating pump structure, combined with semiconductor refrigeration plates and circulating liquid to achieve cooling of the machine head, and effectively cleaned scale through the cleaning component to prevent heat accumulation.
Benefits of technology
It effectively avoids the overheating problem of the paint sand grinder due to heat accumulation, and cleans the components to ensure the efficient and reliable operation of the equipment.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of coating processing, and provides a coating sand mill which comprises a sand mill main body, a cooling cylinder is fixedly connected to the outer side of a machine head of the sand mill main body, a circulating pump is fixedly connected to the outer side of the cooling cylinder, and an outer leading pipeline is fixedly connected to the input end of the circulating pump. The end, away from the circulating pump, of the outer leading pipeline communicates with the bottom end of the cooling cylinder, a temperature conducting ring is fixedly connected to the outer side of the outer leading pipeline, semiconductor chilling plates are fixedly connected to the two ends of the temperature conducting ring, extending bases are fixedly connected to the two ends of the top of the cooling cylinder, and a flow dividing pipe is fixedly connected between the two extending bases and communicates with the top end of the cooling cylinder. The output end of the circulating pump communicates with the flow dividing pipe through a liquid supply pipeline, and a cleaning assembly is arranged in the cooling barrel. By means of the technical scheme, the problems that in the prior art, effective machine head cooling measures are lacked, heat is continuously accumulated, and overall overheating operation is likely to happen are solved.
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