Stamping die with variable die cavity
Through the design of stamping dies with variable cavity, the combination of buffer mechanism and auxiliary mechanism, the problem of single-model production of dies is solved, and the multi-purpose adaptability and life extension of dies are achieved.
CN223394158UActive Publication Date: 2025-09-30CHANGSHU TIANQI MOULD CO LTD
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Patent Information
- Application Number
- CN202422643248.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-10-31
AI Technical Summary
Technical Problem
The existing stamping die can only produce one type of workpiece when in use, and the processing range is small. The die needs to be replaced to produce other types of workpieces, which makes it inflexible to use.
Method used
A stamping die with a variable die cavity is designed. The impact force is buffered by a buffer mechanism, and the size of the die cavity is adjusted by an auxiliary mechanism to achieve the multi-purpose adaptability of the die.
Benefits of technology
It can effectively cushion the impact force, extend the life of the mold, and adjust the size of the mold cavity to meet the production needs of different workpieces, reducing the damage rate.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the field of stamping dies, and discloses a stamping die with a variable die cavity, which comprises a lower die mechanism and an upper die mechanism, buffer mechanisms are fixedly arranged at four corners in the upper end of the lower die mechanism, and an adjusting mechanism is fixedly arranged in the middle of the upper end in the lower die mechanism. And an auxiliary mechanism is fixedly arranged at the lower end in the lower die mechanism. According to the die disclosed by the utility model, the buffer mechanism is arranged, the buffer mechanism moves under impact force through a first moving plate and extrudes a second buffer spring and a first connecting plate, when the first connecting plate is extruded to move, a moving block is driven to move, and when the moving block moves, a first tooth block is driven to move; and when the first gear block moves, the first gear is driven to rotate, when the moving block moves, the first buffer spring can be extruded, and the buffer mechanism is used through cooperation of the first buffer spring, the first gear, the first gear block, the moving block and a second buffer spring.
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