Cosmetic refrigerated container

Abstract

The utility model relates to a beauty makeup refrigerating box which comprises a box body. The heat conducting plate divides the interior of the box body into a refrigeration area and a back area which are arranged in the first direction; the two refrigeration assemblies are arranged at intervals in the second direction, each refrigeration assembly comprises a semiconductor refrigeration sheet and a radiator which are arranged in the back area, the cold end of the semiconductor refrigeration sheet abuts against the heat conduction plate, and the hot end of the semiconductor refrigeration sheet is connected to the radiator. The semiconductor chilling plates of the two refrigeration assemblies form two cold energy sources on the heat conduction plate to cool the heat conduction plate, then cold energy is provided for the refrigeration area through the heat conduction plate, the refrigeration effect in the refrigeration area can be improved, and therefore the size of a radiator at the hot ends of the semiconductor chilling plates in the first direction can be reduced, and the overall size of the refrigerator body is smaller; and since the semiconductor chilling plates of the two refrigeration assemblies transfer heat through the same heat conducting plate, the cold ends of the semiconductor chilling plates do not need to be provided with radiators in the first direction, and the thickness of the box body can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, and in particular to a cosmetics refrigerator. Background Art

[0002] Currently, there is a type of small cooler that is used to store cosmetics and other items due to its aesthetically pleasing appearance. Small coolers for storing such items are generally placed on bedside tables or dressing tables, which requires a smaller overall thickness, for example, approximately 20 cm to 23 cm. Therefore, in order to accommodate more items, the space for the back refrigeration device must be minimized and the cooler must be as thin as possible. In some related technologies, cosmetics coolers have a problem with the back refrigeration device being thick, which takes up a lot of space and results in a larger overall thickness of the beauty cooler. Utility Model Content

[0003] Some embodiments of the present invention provide a cosmetics refrigerator to alleviate the problem of large thickness.

[0004] In one aspect of the present invention, a cosmetics refrigerator is provided, comprising:

[0005] Box;

[0006] a heat conducting plate, which divides the box into a refrigeration area and a back area arranged along a first direction; and

[0007] Two refrigeration components are arranged at intervals along the second direction, each refrigeration component includes a semiconductor refrigeration plate and a radiator arranged in the back area, the cold end of the semiconductor refrigeration plate is abutted against the heat conduction plate, and the hot end of the semiconductor refrigeration plate is connected to the radiator, and the second direction intersects with the first direction.

[0008] In some embodiments, it also includes a thermal insulation layer arranged in the back area, the thermal insulation layer is arranged in contact with the heat conduction plate, the semiconductor refrigeration plate is arranged inside the thermal insulation layer, and the heat sink of the radiator is located outside the thermal insulation layer.

[0009] In some embodiments, each refrigeration component further includes a heat conductive block located inside the insulation layer, wherein the first end of the heat conductive block is in contact with the heat conductive plate, and the second end of the heat conductive block is in contact with the cold end of the semiconductor refrigeration plate.

[0010] In some embodiments, the heat conducting plate comprises a heat conducting aluminum plate, and the heat conducting block comprises a heat conducting aluminum block.

[0011] In some embodiments, each of the refrigeration components further includes a first fan, which is disposed in the back area and located on one side of the radiator in a third direction, where the third direction intersects with the first direction and the second direction respectively.

[0012] In some embodiments, at least one of the two refrigeration assemblies further includes a second fan, the second fan is disposed in the refrigeration area, and the second fan is configured to blow air upward.

[0013] In some embodiments, the heat conduction plate includes a first plate, a second plate and a connecting plate, the first plate and the second plate are connected by the connecting plate, the first plate and the second plate are both flat plates, the second plate is located below the first plate, and the second plate is located on the rear side of the first plate, the cold end of the semiconductor refrigeration plate of one of the two refrigeration components is abutted against the first plate, and the cold end of the semiconductor refrigeration plate of the other of the two refrigeration components is abutted against the second plate.

[0014] In some embodiments, the lower refrigeration assembly of the two refrigeration assemblies further includes a second fan, which is disposed on a side of the second plate located in the refrigeration area, and the second fan is configured to blow air upward.

[0015] In some embodiments, a main control panel is further included. The main control panel is disposed between the two refrigeration components, and the main control panel is located on a side of the first panel facing away from the refrigeration area.

[0016] In some embodiments, the dimension of the first plate in the second direction accounts for at least two-thirds of the height of the box.

[0017] In some embodiments, the two refrigeration components are flush with each other on a side facing away from the refrigerated area.

[0018] In some embodiments, the two refrigeration assemblies are configured to be independently controlled.

[0019] Based on the above technical solution, the present invention has at least the following beneficial effects:

[0020] In some embodiments, a whole heat conduction plate is provided in the body of the beauty refrigerator, which divides the body of the refrigerator into a refrigerated area and a back area arranged along a first direction. The semiconductor refrigeration plates and radiators of the two refrigeration components are arranged in the back area, the radiator is close to the hot end of the corresponding semiconductor refrigeration plate, and the cold end of the semiconductor refrigeration plate is in contact with the heat conduction plate. The semiconductor refrigeration plates of the two refrigeration components form two sources of cold energy on the heat conduction plate, which cools the heat conduction plate and then provides cold energy to the refrigerated area through the heat conduction plate, thereby improving the refrigeration effect in the refrigerated area; and since the semiconductor refrigeration plates of the two refrigeration components transfer heat through the same heat conduction plate, the cold end of the semiconductor refrigeration plate no longer needs to be provided with a radiator along the first direction, which can reduce the size of the refrigeration component in the first direction; furthermore, by providing two semiconductor refrigeration plates to cool the refrigerated area, the refrigeration effect can be improved, so the size of the radiator at the hot end of the semiconductor refrigeration plate in the first direction can be appropriately reduced, making the overall size of the box thinner, more beautiful, and more suitable for placement on a bedside table or dressing table. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 This is a schematic cross-sectional view of a cosmetics refrigerator provided according to some embodiments of the present invention;

[0023] Figure 2 A schematic diagram of two refrigeration components of a cosmetics refrigerator provided according to some embodiments of the present invention;

[0024] Figure 3 This is a schematic rear view of a cosmetics refrigerator provided according to some embodiments of the present invention.

[0025] The reference numerals in the accompanying drawings are described as follows:

[0026] 1-Box body; 11-Refrigerated area; 12-Back area;

[0027] 2-heat conducting plate; 21-first plate; 22-second plate; 23-connecting plate;

[0028] 3- refrigeration component; 31- semiconductor refrigeration chip; 32- radiator; 33- heat conduction block; 34- first fan; 35- second fan;

[0029] 4-Insulation layer;

[0030] 5- Main control board.

[0031] It should be understood that the size of each part shown in the drawings is not drawn according to the actual proportional relationship.In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present invention and its application or use. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete and to fully convey the scope of the present invention to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and numerical values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0033] The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are simply used to distinguish different parts. Terms such as "include" or "comprising" mean that the elements preceding the term include the elements listed after the term, and do not exclude the possibility of also including other elements. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0034] In the present invention, when a specific device is described as being located between a first device and a second device, an intervening device may or may not be present between the specific device and the first device or the second device. When a specific device is described as being connected to another device, the specific device may be directly connected to the other device without an intervening device, or may be connected to the other device without an intervening device but with an intervening device.

[0035] All terms (including technical or scientific terms) used in this utility model have the same meaning as those understood by ordinary technicians in the field to which this utility model belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0037] In some related arts, due to the refrigeration demand, the thickness of the radiator of the refrigerator needs to be large to effectively cool down (for example, the thickness of the radiator is 40mm to 50mm), and the radiator is superimposed with an axial flow fan in the thickness direction, so that the thickness of the entire refrigeration appliance of the refrigerator exceeds 10 centimeters. If the entire refrigeration appliance is arranged in the upper area of ​​the back of the refrigerator, the upper area will be raised toward the refrigeration area, forming a protruding structure, making the volume utilization rate of the originally small refrigeration compartment very poor (the upper part can hardly be used to place things). And in order to level, the entire refrigeration appliance of the refrigerator is placed backward, and it is necessary to set up space to accommodate the entire refrigeration appliance, causing the overall thickness of the refrigerator including the insulation layer to exceed 40 centimeters, making the refrigerator relatively thick and unable to be placed on some dressing tables or bedside tables, or even if placed on a dressing table or bedside table, part of the refrigerator will be suspended or there will be no operating space at the front of the dressing table.

[0038] Based on this, an embodiment of the present utility model provides a beauty and cosmetics refrigerator, which is used to alleviate the problem of the large thickness of the beauty and cosmetics refrigerator.

[0039] Figure 1 This is a schematic diagram of the structure of some embodiments of the beauty refrigerator according to the present invention. Figure 1 In some embodiments, the beauty refrigerator includes a box body 1, a heat conducting plate 2 and two refrigeration components 3.

[0040] The heat conducting plate 2 divides the interior of the box 1 into a refrigeration area 11 and a back area 12 arranged along a first direction X.

[0041] refer to Figure 1 and Figure 2 The two cooling assemblies 3 are spaced apart along a second direction Y. Each cooling assembly 3 includes a semiconductor cooling fin 31 and a heat sink 32 provided in the back area 12. The cold end of the semiconductor cooling fin 31 abuts the heat conducting plate 2, and the hot end of the semiconductor cooling fin 31 is connected to the heat sink 32. The second direction Y intersects the first direction X. Optionally, the second direction Y is perpendicular to the first direction X.

[0042] In some embodiments, the first direction X is the thickness direction of the box body 1 .

[0043] In the above embodiment, a whole heat conducting plate 2 is arranged in the box body 1, and the heat conducting plate 2 divides the box body 1 into a cold storage area 11 and a back area 12 arranged along the first direction X. Two refrigeration components 3, semiconductor refrigeration plates 31 and a radiator 32 are arranged in the back area 12. The radiator 32 is close to the hot end of the corresponding semiconductor refrigeration plate 31, and the cold end of the semiconductor refrigeration plate 31 is in contact with the heat conducting plate 2. The semiconductor refrigeration plates 31 of the two refrigeration components 3 form two sources of cold energy on the heat conducting plate 2, which cools the heat conducting plate 2, and then provides cold energy to the cold storage area 11 through the heat conducting plate 2, which can improve the cooling effect in the cold storage area. Since the semiconductor refrigeration plates 31 of the two refrigeration components 3 transfer heat through the same heat conducting plate 2, the heat conducting plate 2 is arranged at the cold end of the semiconductor refrigeration plate 31, which is equivalent to an evaporator for cooling the refrigerated area 11. Therefore, the cold end of the semiconductor refrigeration plate 31 no longer needs to be provided with a radiator along the first direction X, which can reduce the size of the refrigeration component 3 in the first direction X; furthermore, by providing two semiconductor refrigeration plates 31 to cool the refrigerated area 11, the cooling effect can be improved. Therefore, the size of the radiator at the hot end of the semiconductor refrigeration plate 31 in the first direction X can be appropriately reduced, so that the overall size of the box body 1 is thinner, more beautiful, and more suitable for placement.

[0044] In the above embodiment, two refrigeration components 3 are arranged at intervals along the second direction Y in the back area 12 of the box body 1. Since the areas of the semiconductor refrigeration plates 31 are basically the same, for example, the area is 40mmx40mm, the arrangement of two semiconductor refrigeration plates 31 can preferably double the heat dissipation area and improve the refrigeration effect of the refrigeration area 11.

[0045] In the above embodiment, the cooling capacity provided by the two semiconductor refrigeration plates 31 is twice that of a single semiconductor refrigeration plate, and the hot ends of the two semiconductor refrigeration plates 31 are each equipped with a heat sink 32 for independent heat dissipation, so the radiator 32 can be set to be thinner and smaller, thereby making the size of the back area 12 in the first direction X smaller. When the entire box body 1 is thinner, the space of the refrigeration area 11 is not affected.

[0046] In some embodiments, the first direction X is the thickness direction of the cabinet 1, that is, the direction from the door opening side to the back side of the cabinet 1, or the depth direction of the cabinet 1. The second direction Y is the height direction of the cabinet 1, that is, the vertical direction of the cabinet 1 when it is normally placed. The third direction Z is the width direction of the cabinet 1. The third direction Z is perpendicular to the first direction X and the second direction Y. The first direction X is perpendicular to the second direction Y. In this embodiment, the two refrigeration assemblies 3 are spaced apart along the height direction of the cabinet 1.

[0047] In other embodiments, the first direction X is the thickness direction of the cabinet 1, that is, the direction between the door opening side and the back side of the cabinet 1, or the depth direction of the cabinet 1. The second direction Y is the width direction of the cabinet 1. The third direction Z is the height direction of the cabinet 1, that is, the vertical direction of the cabinet 1 when the cabinet 1 is normally placed. The third direction Z is perpendicular to the first direction X and the second direction Y. The first direction X is perpendicular to the second direction Y. In this embodiment, the two refrigeration assemblies 3 are spaced apart along the width direction of the cabinet 1.

[0048] In some embodiments, the beauty refrigerator also includes an insulation layer 4, which is arranged in the back area 12, and the insulation layer 4 is arranged in contact with the heat conduction plate 2, the semiconductor refrigeration plate 31 is arranged inside the insulation layer 4, and the heat sink of the radiator 32 is located outside the insulation layer 4.

[0049] In the above embodiment, the semiconductor refrigeration sheet 31 is arranged inside the insulation layer 4. The semiconductor refrigeration sheet 31 will no longer occupy additional space in the first direction X, which can make the space utilization of the back area 12 more efficient, and is more conducive to reducing the thickness of the back area 12, making the entire box body 1 thinner.

[0050] In the above embodiment, the semiconductor refrigeration plate 31 is arranged inside the thermal insulation layer 4, and the heat sink of the radiator 32 is arranged outside the thermal insulation layer 4. The thermal insulation layer 4 can effectively reduce the impact of the external environment on the cold end of the semiconductor refrigeration plate 31, reduce the loss of cold energy, and enable the semiconductor refrigeration plate 31 to provide cold energy more concentratedly, making it easier to reach and maintain the temperature of the refrigerated area 11 within the required temperature range, thereby improving the cooling effect and efficiency.

[0051] In some embodiments, part of the heat sink 32 is embedded in the thermal insulation layer 4 .

[0052] In some embodiments, the heat sink 32 includes a base, to which the heat sink is connected, and the base is disposed within the insulation layer 4. Optionally, the base has a thickness of 3 mm to 5 mm. The base is embedded within the insulation layer 4, and airflow only blows over the heat sink, forming an air duct.

[0053] In some embodiments, each refrigeration component 3 also includes a heat conductive block 33 located inside the insulation layer 4, the first end of the heat conductive block 33 is in contact with the heat conductive plate 2, and the second end of the heat conductive block 33 is in contact with the cold end of the semiconductor refrigeration plate 31.

[0054] In the above embodiment, the heat conducting block 33 makes it easier to connect the semiconductor refrigeration plate 31 with the heat conducting plate 2, reducing the direct stress between the semiconductor refrigeration plate 31 and the heat conducting plate 2. The heat conducting block 33 itself has a high thermal conductivity, which can quickly transfer the cold generated by the semiconductor refrigeration plate 31 to the heat conducting plate 2, reducing the thermal resistance between the semiconductor refrigeration plate 31 and the heat conducting plate 2, ensuring that the cold can be efficiently transferred, which is beneficial to improving the overall cooling effect of the refrigeration area 11.

[0055] In some embodiments, the heat conducting plate 2 comprises a heat conducting aluminum plate, and the heat conducting block 33 comprises a heat conducting aluminum block.

[0056] In the above embodiment, the heat conducting plate 2 and the heat conducting block 33 are both made of aluminum. Aluminum as a heat conducting member has the characteristics of high thermal conductivity, good heat conduction effect and low cost.

[0057] In some embodiments, the heat conducting plate 2 is a solid aluminum plate.

[0058] refer to Figure 3 In some embodiments, each cooling assembly 3 further includes a first fan 34. The first fan 34 is disposed in the back area 12 and is located on one side of the radiator 32 in the third direction Z. The third direction Z intersects the first direction X and the second direction Y. Optionally, the third direction Z is perpendicular to the first direction X and the second direction Y.

[0059] In the above embodiment, the first fan 34 is arranged in the back area 12 and is located on one side of the radiator 32 in the third direction Z. The first fan 34 and the heat sink of the radiator 32 are arranged flush on the side away from the refrigeration area 11. The first fan 34 will not expand the size of the first direction X, which can be beneficial to reducing the volume of the refrigeration component 3 and making the box body 1 thinner. The first fan 34 draws in ambient air from the outside and blows out heat to the radiator 32, thereby improving the heat dissipation effect of the radiator 32.

[0060] In some embodiments, the first fan 34 comprises a centrifugal fan.

[0061] In some embodiments, at least one of the two refrigeration assemblies 3 further includes a second fan 35 . The second fan 35 is disposed in the refrigeration area 11 . The second fan 35 is configured to blow air upward.

[0062] Inside the refrigerator, because cold air is denser than hot air, it naturally sinks to the bottom, while hot air rises to the top. This natural convection phenomenon causes the bottom temperature of the refrigerator to be lower than the top temperature. Therefore, at least one of the two refrigeration assemblies 3 also includes a second fan 35. This second fan 35 blows air upward, distributing the cooling energy to the top, thereby facilitating a uniform temperature distribution within the refrigerated area 11.

[0063] In some embodiments, two refrigeration assemblies 3 are arranged one above the other.

[0064] In some embodiments, the lower refrigeration assembly 3 of the two refrigeration assemblies 3 further includes a second fan 35 . The second fan 35 is disposed in the refrigeration area 11 . The second fan 35 is configured to blow air upward.

[0065] refer to Figure 1 In some embodiments, the heat conducting plate 2 includes a first plate 21, a second plate 22 and a connecting plate 23. The first plate 21 and the second plate 22 are connected by the connecting plate 23. The first plate 21 and the second plate 22 are both flat plates. The second plate 22 is located below the first plate 21, and the second plate 22 is located on the rear side of the first plate 21. The cold end of the semiconductor refrigeration plate 31 of one of the two refrigeration components 3 is in contact with the first plate 21, and the cold end of the semiconductor refrigeration plate 31 of the other of the two refrigeration components 3 is in contact with the second plate 22.

[0066] Because the entire refrigerator body 1 is relatively thin, a drawer is provided at the bottom of the refrigerated area 11 to accommodate usage needs. To increase the drawer's capacity, the thickness of the back area 12 at the bottom needs to be further reduced. Therefore, the second plate 22 of the heat conducting plate 2 is located behind the first plate 21 to expand the drawer's capacity and maximize the space within the refrigerator body 1. Furthermore, the specifications of components such as the radiator 32 of the refrigeration assembly 3, which is located in the position corresponding to the second plate 22, can be further reduced, making the entire back area 12 more compact.

[0067] The thickness of the radiator 32 of the refrigeration assembly 3 located below is smaller than the thickness of the radiator 32 of the refrigeration assembly 3 located above.

[0068] In the above embodiment, in order to accommodate the thinner space at the bottom of the back region 12 , the heat conducting block 33 of the cooling assembly 3 located below can also be configured to be thinner.

[0069] The thickness of the heat conducting block 33 of the refrigeration assembly 3 located at the bottom is smaller than the thickness of the heat conducting block 33 of the refrigeration assembly 3 located at the top.

[0070] Optionally, the thickness of the heat conducting block 33 of the lower refrigeration assembly 3 is 10 mm, and the thickness of the heat conducting block 33 of the upper refrigeration assembly 3 is 20 mm.

[0071] In some embodiments, the lower refrigeration assembly 3 of the two refrigeration assemblies 3 further includes a second fan 35. The second fan 35 is provided on a side of the second plate 22 located in the refrigeration area 11. The second fan 35 is configured to blow air upward.

[0072] In the above embodiment, the second plate 22 of the heat conduction plate 2 is located at the rear side of the first plate 21, so as to expand the capacity of the drawer area, and a small second fan 35 can be arranged in the expanded drawer area space. The second fan 35 inhales the air in the compartment and blows upward to release the cold energy of the heat conduction plate 2 into the refrigeration compartment, so as to achieve refrigeration of the refrigeration compartment, and the structure is more compact.

[0073] In some embodiments, the second fan 35 includes a centrifugal fan.

[0074] Reference Figure 1 and Figure 3 In some embodiments, the makeup refrigeration box further includes a main control board 5, which is arranged between the two refrigeration assemblies 3 and located on the side of the first plate 21 away from the refrigeration area 11.

[0075] In the above embodiment, the main control board 5 is arranged between the two refrigeration assemblies 3 by using the space of the back area 12, and the side of the main control board 5 away from the refrigeration area 11 is flush with the refrigeration assemblies 3, so that the structure is compact, the thickness of the back area 12 is not expanded, and the space utilization of the entire back area 12 is improved.

[0076] In some embodiments, the size of the first plate 21 in the second direction Y accounts for at least two-thirds of the height of the box body 1.

[0077] In the above embodiment, most of the area of the heat conduction plate 2 is the flat first plate 21, which is beneficial to make the back of the box body 1 neat and flat.

[0078] In other embodiments, the heat conduction plate 2 can also be a flat plate that is flat as a whole.

[0079] In some embodiments, the two refrigeration assemblies 3 are flush on the side away from the refrigeration area 11.

[0080] In the above embodiment, the two refrigeration assemblies 3 are flush on the side away from the refrigeration area 11, which is beneficial to make the back of the box body 1 neat and flat, and improve the appearance of the makeup refrigeration box.

[0081] In some embodiments, the specifications and sizes of the components in the upper and lower refrigeration assemblies 3 can be the same or different. When there is a surplus in the space above the back area 12, the size of the heat sink 32 of the refrigeration assembly 3 located above in the first direction X can be larger, and the cooling effect is better.

[0082] In some embodiments, the two refrigeration assemblies 3 are configured to be independently controlled.

[0083] In the above embodiment, the semiconductor refrigeration sheets 31 of the two refrigeration assemblies 3 can be independently controlled, and by using the different duty cycle outputs of the semiconductor refrigeration sheets 31 in the two refrigeration assemblies 3 and the combination with the first fan 34, the refrigeration efficiency can be improved, and the fine cold capacity can be adjusted in multiple steps, so that the temperature can be precisely controlled.

[0084] Reference Figures 1 to 3 In some specific embodiments, the makeup refrigerator includes a box body 1, a heat conduction plate 2, two refrigeration assemblies 3, a heat preservation layer 4, and a main control board 5.

[0085] The heat conduction plate 2 is an integral aluminum plate, and the heat conduction plate 2 divides the box body 1 into a refrigeration area 11 and a back area 12 arranged along a first direction X, which is the thickness direction of the box body 1. The front side of the refrigeration area 11 is provided with a door body, and the back side of the refrigeration area 11 is the back area 12. At least two-thirds of the area in the refrigeration area 11 from top to bottom is a storage compartment, and a storage rack can be arranged in the storage compartment. The area below the storage compartment can be provided with a drawer, which is a drawer area. The back area 12 is used to arrange refrigeration devices and the main control board 5, etc.

[0086] The heat conduction plate 2 includes a first plate 21, a second plate 22, and a connecting plate 23 arranged integrally, the first plate 21 and the second plate 22 are connected through the connecting plate 23, the first plate 21 and the second plate 22 are both flat plates, and the second plate 22 is located below the first plate 21. The position where the second plate 22 is located corresponds to the drawer area. In order to increase the capacity of the drawer area, the second plate 22 is located at the back side of the first plate 21, thereby increasing the size of the drawer area in the first direction X.

[0087] The heat preservation layer 4 is arranged in the back area 12 and is attached to the heat conduction plate 2.

[0088] The two refrigeration assemblies 3 are arranged above and below, that is, the two refrigeration assemblies 3 are arranged in the height direction of the box body 1, the main control board 5 is arranged between the two refrigeration assemblies 3, the main control board 5 and the refrigeration assembly 3 located above correspond to the position corresponding to the first plate 21, and the refrigeration assembly 3 located below is arranged at the position corresponding to the second plate 22.

[0089] Each refrigeration assembly 3 includes a semiconductor refrigeration sheet 31, a heat sink 32, a heat conduction block 33, and a first fan 34.

[0090] The semiconductor refrigeration sheet 31 and the heat conduction block 33 are arranged inside the heat preservation layer 4, and the heat dissipation fins of the heat sink 32 are located outside the heat preservation layer 4. The first end of the heat conduction block 33 is in contact with the heat conduction plate 2, and the second end of the heat conduction block 33 is in contact with the cold end of the semiconductor refrigeration sheet 31. The hot end of the semiconductor refrigeration sheet 31 is connected to the heat sink 32.

[0091] The cold end of the semiconductor refrigeration plate 31 of the upper refrigeration assembly 3 abuts against the first plate 21 , and the cold end of the semiconductor refrigeration plate 31 of the lower refrigeration assembly 3 abuts against the second plate 22 .

[0092] The first fan 34 is provided in the back area 12 and is located on one side of the radiator 32 in the third direction Z. Optionally, the first fan 34 is located on one side of the radiator 32 in the width direction of the cabinet 1. The side of the first fan 34 away from the refrigerated area 11 is flush with the sides of the two radiators 32 away from the refrigerated area 11, which helps to make the back of the cabinet 1 flat.

[0093] The refrigeration assembly 3 located at the bottom further includes a second fan 35 . The second fan 35 is provided on a side of the second plate 22 located in the refrigeration area 11 . The second fan 35 is configured to blow air upward.

[0094] The two refrigeration components 3 form two sources of cold energy, cooling the heat conducting plate 2, and then blowing upwards through the second fan 35 inside to cool the room. The cooling effect is good at all ambient temperatures, the temperature drop is low, and the temperature uniformity in the room is good, closer to the set temperature.

[0095] In each of the above embodiments, to reduce the overall thickness of the housing 1 and maintain a flat back panel, a dual cooling assembly layout is employed. This reduces the thickness of the radiator 32 (e.g., to 30 mm or less, in this embodiment, 25 mm). Furthermore, the radiator 32 can be partially embedded within the foam insulation layer 4 (e.g., 5 mm), leaving only the cooling fins exposed. Simultaneously, a first fan 34 is positioned flush with the radiator 32, drawing in ambient air and blowing it toward the radiator 32 to dissipate the heat.

[0096] The cooling effect of the dual refrigeration assembly is as follows: since the area of ​​the semiconductor refrigeration plate 31 is basically the same, for example, the specifications of 3A / 4A / 5A / 6A are all 40x40mm in area, if a separate refrigeration assembly is provided, the contact area between the heat conducting block and the semiconductor refrigeration plate is only 40x40mm, and heat dissipation can only rely on the conduction effect of the radiator. However, due to the existence of thermal resistance, the heat transfer gradually declines. The embodiment of the utility model adopts the setting mode of dual refrigeration assembly, which can effectively double the heat dissipation area, and the semiconductor refrigeration plates 31 of the two refrigeration assemblies dissipate heat independently, so the hot end radiator of the semiconductor refrigeration plate 31 can be thinner and smaller, and the space utilization rate of the back area 12 is more efficient.

[0097] After the dual refrigeration component layout, the heat exchange efficiency is improved. Since the upper and lower radiators can be relatively thin, the first fan 34 can also be selected with a thickness of 15mm. In this way, the first fan 34 and the heat dissipation fins of the radiator are matched (exposed about 20mm), forming an overall thinner layout.

[0098] The overall height of the cabinet 1 does not exceed 42 centimeters, while the space required for the refrigeration appliance layout only requires a thickness of 2.2 centimeters (22 mm), far less than the 10 centimeters (100 mm) used in related art. Therefore, the entire cabinet can be less than 23 centimeters thick. When placed on a 40-centimeter dressing table or nightstand, approximately 17 centimeters of free space remains, making it convenient for temporarily placing face cream, eye cream, lipstick, etc. during makeup.

[0099] After adopting the dual refrigeration components, a combination module of dual semiconductor refrigeration plates and dual first fans is formed. Therefore, different cooling capacity controls can be output according to different ambient temperatures to finely control the compartment temperature. As shown in Table 1, the temperature control strategies under different ambient temperatures are listed:

[0100] Table 1 Temperature control strategies at different ambient temperatures

[0101]

[0102] According to Table 1 above, when the ambient temperature is low (for example, the ambient temperature is 14 ° C) and the compartment temperature is close to the set temperature, it means that the cooling capacity demand is very small at this time, and it will switch to gear 1, the semiconductor refrigeration piece will be output at 50%, and the first fan will be at low gear (it can also be steplessly lowered). At this time, if the cooling capacity is insufficient and the compartment temperature rises by 0.1 ° C, it will switch to gear 2, adjust the speed of the first fan, strengthen the heat dissipation of the hot end, and if the cooling capacity is still insufficient, continue to increase the gear until the compartment temperature begins to drop. If the gear is 1 at this time, the cooling capacity is still sufficient, and the compartment continues to drop by 0.1 ° C, then the duty cycle of the semiconductor refrigeration piece will be gradually lowered, for example, by 40% output, so that the cooling capacity is further reduced. In this way, the cooling capacity and the heat leakage of the box can be adjusted to be close to each other, a balance is achieved, and the precise control of the compartment temperature and the set temperature is achieved. The main function of the second fan set in the compartment is to disturb the air flow in the compartment and make the temperature in the compartment more uniform.

[0103] In summary, the cosmetics refrigerator provided by the present invention alleviates the problems of related art refrigerators, such as thick radiators, large fans, and thick refrigeration components, which result in the refrigeration equipment occupying a large space, forming protruding structures that waste storage space, or forming an overall unevenness and unsightly appearance. Furthermore, the cosmetics refrigerator provided by the present invention can output different cooling capacities according to different ambient temperatures, enabling precise control of the compartment temperature.

[0104] Based on the above-mentioned embodiments of the present invention, in the absence of explicit negation or conflict, the technical features of one embodiment may be beneficially combined with one or more other embodiments.

[0105] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will understand that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A cosmetics refrigerator, characterized in that: include: Box (1); A heat conducting plate (2) divides the interior of the box (1) into a refrigeration area (11) and a back area (12) arranged along a first direction (X); and Two refrigeration components (3) are arranged at intervals along a second direction (Y), each refrigeration component (3) includes a semiconductor refrigeration plate (31) and a heat sink (32) provided in the back area (12), the cold end of the semiconductor refrigeration plate (31) abuts against the heat conduction plate (2), and the hot end of the semiconductor refrigeration plate (31) is connected to the heat sink (32); the second direction (Y) intersects with the first direction (X).

2. The cosmetics refrigerator according to claim 1, characterized in that: It also includes a heat-insulating layer (4) provided in the back area (12), the heat-insulating layer (4) and the heat-conducting plate (2) are arranged in contact with each other, the semiconductor cooling plate (31) is provided inside the heat-insulating layer (4), and the heat-dissipating fins of the radiator (32) are located outside the heat-insulating layer (4).

3. The cosmetics refrigerator according to claim 2, characterized in that: Each refrigeration assembly (3) further comprises a heat conducting block (33) located inside the thermal insulation layer (4), wherein a first end of the heat conducting block (33) is in contact with and connected to the heat conducting plate (2), and a second end of the heat conducting block (33) is in contact with and connected to a cold end of the semiconductor refrigeration plate (31).

4. The cosmetics refrigerator according to claim 3, characterized in that: The heat conducting plate (2) comprises a heat conducting aluminum plate, and the heat conducting block (33) comprises a heat conducting aluminum block.

5. The cosmetics refrigerator according to claim 1, characterized in that: Each refrigeration assembly (3) further includes a first fan (34), which is arranged in the back area (12) and located on one side of the radiator (32) in a third direction (Z), and the third direction (Z) intersects with the first direction (X) and the second direction (Y).

6. The cosmetics refrigerator according to claim 1, characterized in that: At least one of the two refrigeration assemblies (3) further comprises a second fan (35), wherein the second fan (35) is provided in the refrigeration area (11), and the second fan (35) is configured to blow air upwards.

7. The cosmetics refrigerator according to claim 1, characterized in that: The heat conducting plate (2) comprises a first plate (21), a second plate (22) and a connecting plate (23); the first plate (21) and the second plate (22) are connected via the connecting plate (23); the first plate (21) and the second plate (22) are both flat plates; the second plate (22) is located below the first plate (21), and the second plate (22) is located on the rear side of the first plate (21); the cold end of the semiconductor refrigeration plate (31) of one of the two refrigeration components (3) abuts against the first plate (21); and the cold end of the semiconductor refrigeration plate (31) of the other of the two refrigeration components (3) abuts against the second plate (22).

8. The cosmetics refrigerator according to claim 7, characterized in that: The lower refrigeration assembly (3) of the two refrigeration assemblies (3) further comprises a second fan (35), the second fan (35) being arranged on a side of the second plate (22) located in the refrigeration area (11), and the second fan (35) being configured to blow air upwards.

9. The cosmetics refrigerator according to claim 7, characterized in that: It also includes a main control panel (5), which is arranged between the two refrigeration components (3), and is located on the side of the first panel (21) facing away from the refrigeration area (11).

10. The cosmetics refrigerator according to claim 7, characterized in that: The dimension of the first plate (21) in the second direction (Y) accounts for at least two-thirds of the height of the box body (1).

11. The cosmetics refrigerator according to any one of claims 1 to 10, characterized in that: The two refrigeration components (3) are flush with each other on a side facing away from the refrigeration area (11).

12. The cosmetics refrigerator according to any one of claims 1 to 10, characterized in that: The two refrigeration assemblies (3) are configured to be independently controlled.

Images