LED welding plate

Abstract

The utility model discloses an LED welding plate, and relates to the field of LED display devices, the LED welding plate comprises a substrate assembly, the substrate assembly comprises a welding substrate and a plurality of LED bonding pads located on the upper surface of the welding substrate, one ends of the plurality of LED bonding pads are integrated to form a common electrode, and the other ends of the plurality of LED bonding pads are integrated to form a common electrode. The other ends of the LED bonding pads are dispersed in the direction away from the common electrode and are arranged at equal intervals to form independent non-common electrodes, and included angles formed between any two LED bonding pads are equal; the acting assembly comprises a pin unit which is located on the bottom face of the welding substrate and connected with the common electrode, one end of the pin unit is connected with the common electrode, the other end of the pin unit extends in the direction away from the common electrode and is formed on the back face of one vertex angle of the welding substrate, and the front face of the vertex angle is located between the non-common electrodes of the two adjacent LED bonding pads.

Description

Technical Field

[0001] This utility model relates to the field of LED display devices, and specifically to an LED welding plate. Background Technology

[0002] The "caterpillar" phenomenon, also known as caterpillar stray light or short-circuit caterpillar in the LED display industry, is one of the more challenging problems in small-pitch LED displays. This phenomenon manifests as a series of constantly lit bars appearing on the screen, and it is particularly prominent on small-pitch LED displays, where any single lit bar per unit area is highly noticeable.

[0003] The "caterpillar" phenomenon is mainly caused by the excessively close distance between the non-common electrodes of the LEDs, resulting in an unexpected electrical connection between them. Additionally, solder bridging between chip electrodes and between LED pads can also cause this problem. The "caterpillar" phenomenon not only causes abnormal bright lines or bright spots on the display screen, reducing image clarity and aesthetics and affecting the viewer's visual experience, but it can also lead to abnormal operation of the entire display screen's circuitry, reducing the product's reliability and lifespan. Utility Model Content

[0004] This application provides an LED welding board that can solve the technical problems existing in the prior art, such as short circuits between non-common electrodes of LED chips and solder bridging between chip electrodes and solder pads, which cause the "caterpillar" phenomenon, leading to abnormal circuit operation, reduced product reliability and lifespan, and reduced user visual experience.

[0005] This application provides an LED welding plate, comprising:

[0006] A substrate assembly includes a welding substrate and a plurality of LED pads located on the upper surface of the welding substrate. One end of the plurality of LED pads is integrated to form a common electrode, and the other end is dispersed and equidistantly arranged in a direction away from the common electrode to form independent non-common electrodes. The included angle between any two LED pads is equal.

[0007] The functional component includes a pin unit located on the bottom surface of the welding substrate and connected to the common electrode. One end of the pin unit is connected to the common electrode, and the other end extends away from the common electrode and is formed on the back side of one of the top corners of the welding substrate. The front side of the top corner is located between the non-common electrodes of two adjacent LED pads.

[0008] In one embodiment, an anti-bridging material layer is laid on the outer periphery of the pin unit passage and the outer periphery of the LED pad passage, and the anti-bridging material layer protrudes from the surface of the LED pad.

[0009] In one embodiment, a first filler hole is formed at the center of the welding substrate, and one end of one of the plurality of LED pads is integrated into the first filler hole to form the common electrode.

[0010] In one embodiment, the welding substrate has a plurality of second filler holes equal in number to the LED pads, and each non-common electrode of the LED pad is connected to a second filler hole.

[0011] In one embodiment, a non-common electrode lead is provided between the second filler hole and the non-common electrode.

[0012] In one embodiment, there are three LED pads and three second filler holes, and the three second filler holes are located at three of the apex corners of the welding substrate.

[0013] In one embodiment, both the first and second filling holes are provided with filling material.

[0014] In one embodiment, the pin unit includes a control pin and a pin lead connecting the control pin and the first filler hole.

[0015] In one embodiment, the control pin is located on the back of the top corner of the welding substrate where the second filler hole is not provided.

[0016] In one embodiment, the anti-tin bridging material layer comprises ink.

[0017] The beneficial effects of the technical solutions provided in this application include:

[0018] The non-common electrodes of multiple LED pads are equidistantly distributed, which ensures that the multiple non-common electrodes are spread out to the maximum extent on the soldering substrate, maximizes the distance between the non-common electrodes of two adjacent LED pads, and improves the color deviation of solder bridging. By setting a pin unit at the bottom of the soldering substrate, with one end connected to the common electrode and the other end extending away from the common electrode and located between the backs of two adjacent non-common electrodes, the connection length between the pin unit and the common electrode can be maximized in a limited area, further ensuring the normal operation of the LED pads. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A top view of an LED welding plate provided in an embodiment of this application;

[0021] Figure 2 A bottom view of an LED welding plate provided in an embodiment of this application;

[0022] Figure 3 This is a side view of an LED welding plate provided in an embodiment of this application.

[0023] In the diagram: 1. Soldering substrate; 2. LED pad; 3. Control pin; 301. Pin lead; 4. First via; 5. Second via; 6. Non-common electrode lead; 7. Anti-bridging material layer. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0025] LED (Light Emitting Diode) is a semiconductor device that converts electrical energy into light energy. It is widely used in various lighting applications, from home lighting to automotive headlights, and indicator lights and backlights for electronic devices.

[0026] This application provides an LED soldering board that can solve the technical problems existing in the prior art, such as short circuits between non-common electrodes of LEDs and solder bridging between chip electrodes and solder pads, which cause the "caterpillar" phenomenon, leading to abnormal circuit operation, reduced product reliability and service life, and reduced user visual experience.

[0027] Figure 1 This is a top view of an LED welding plate provided in an embodiment of this application. Figure 2 A bottom view of an LED welding plate provided in an embodiment of this application, such as... Figure 1 , Figure 2 As shown, the LED welding board in this application includes a base component and an active component. The base component is mainly used for the basic welding and fixing of the LED chip and to ensure the distance between the non-common electrodes of the LED chip pads. The active component is used to prevent solder bridging between chip electrodes and between LED pads 2, and further prevent the generation of the "caterpillar" phenomenon.

[0028] Specifically, the substrate assembly includes a welding substrate 1 and a plurality of LED pads 2 located on the upper surface of the welding substrate 1. One end of the plurality of LED pads 2 is integrated to form a common electrode, and the other end of the plurality of LED pads 2 is dispersed and equidistantly arranged in a direction away from the common electrode to form independent non-common electrodes. The included angle between any two LED pads 2 is equal.

[0029] The welding substrate 1 is a fundamental component used to support the LED chip and provide electrical connection and heat dissipation functions. It ensures effective connection between the LED chip and the external power supply and ensures that current can flow smoothly through the LED chip, thereby emitting bright light. At the same time, the LED chip generates a certain amount of heat during operation. Therefore, the welding substrate 1 must have good heat dissipation performance to keep the operating temperature of the LED chip stable. Common LED chip substrate materials include metal substrates, ceramic substrates, and composite substrates that have emerged in recent years. The specific material is determined according to actual needs and is not specifically limited in this application. In addition, the shape of the welding substrate 1 is commonly square or circular. Considering the arrangement of multiple LED pads 2 in this application, the welding substrate 1 in this application adopts a square shape.

[0030] LED pads 2 are typically made into small, round or rectangular metal pieces located at the bottom of the LED chip. By applying appropriate heat and pressure to the LED pads 2, the LED chip can be firmly fixed to the circuit board, enabling it to function properly. One end of multiple LED pads 2 is integrated to form a common electrode, serving as the common cathode or common anode for all LED chips. The other ends of multiple LED pads 2 are centered on the common electrode, spreading outwards in a direction away from the common electrode, and are fixed to the soldering substrate 1 to form their own independent non-common electrodes.

[0031] In one embodiment of this application, based on actual working conditions, there are three LED pads 2, which are used to solder LED chips containing red, green and blue colors respectively, thereby achieving a mixture of multiple different colors and brightness. The three LED pads 2 are equidistantly distributed, and the included angle between any two adjacent LED pads 2 is equal, so as to ensure the distance between the non-common poles of two adjacent LED pads 2. Based on this setting, the phenomenon of LED color deviation can be effectively improved.

[0032] Furthermore, the functional component includes a pin unit located on the bottom surface of the welding substrate 1 and connected to the common electrode. One end of the pin unit is connected to the common electrode, and the other end extends away from the common electrode and is formed on the back side of one of the top corners of the welding substrate 1. The front side of the top corner is located between the non-common electrodes of two adjacent LED pads 2.

[0033] The pin unit is arranged on the back side of the welding substrate 1. One end of the pin unit is connected to the back side of the common electrode, and the other end is formed on the welding substrate 1 and is maximized away from the common electrode. Based on the above description, the welding substrate 1 has a apex corner. The three LED pads 2 non-common electrodes are located on the front side of three apex corners of the welding substrate 1, and the pin unit is located on the back side of the remaining blank apex corner of the welding substrate 1, so as to maximize the dispersion of each electrode on the entire LED welding board.

[0034] Furthermore, an anti-solder bridging material layer 7 is laid on the entire outer periphery of the pin unit and the entire outer periphery of the LED pad 2, which can effectively prevent short circuits caused by solder bridging. At the same time, the anti-solder bridging material layer 7 protrudes from the surface of the LED pad 2, making the upper surface of the LED pad 2 concave relative to the anti-solder bridging material layer 7. This facilitates subsequent die bonding and allows the electrode to be secured on the LED pad 2. It can also effectively prevent solder bridging of the pins during screen mounting. Furthermore, based on this structure, the coverage area of ​​the anti-solder bridging material layer 7 is smaller, which can also reduce the amount of material used.

[0035] Furthermore, a first filler hole 4 is formed at the center of the welding substrate 1, and one end of multiple LED pads 2 is integrated into the first filler hole 4 to form a common electrode. The first filler hole 4 is filled with filler material. In the LED field, the common electrode filler hole can ensure that the current can flow through the LED chip uniformly and stably, avoiding uneven light emission or thermal effects caused by current concentration or uneven distribution. In this application, the common electrode filler hole is preferably filled by electroplating, and commonly used materials include copper, nickel, etc., to improve airtightness. The common electrode and the electroplating filler hole of the common electrode are common methods in the field, and will not be described in detail here.

[0036] Furthermore, the welding substrate 1 has a number of second filler holes 5 equal to the number of LED pads 2, and each non-common electrode of LED pad 2 is connected to a second filler hole 5. A non-common electrode lead 6 is provided between the second filler hole 5 and the non-common electrode, and each second filler hole 5 is also provided with filler material.

[0037] Multiple LED pads 2 are integrated at one end into a first via 4, and at the other end are evenly distributed. Each LED pad 2 is connected to a second via 5 for its non-common electrode. The second via 5 is filled according to actual production needs and product parameters. A non-common electrode lead 6 is provided between the second via 5 and the non-common electrode to achieve electrical connection. The non-common electrode lead 6 is made of conductive metal, including but not limited to copper, aluminum and other materials, depending on the actual use requirements. No specific restrictions are imposed in this application.

[0038] Furthermore, there are three LED pads 2 and three second filler holes 5. The three second filler holes 5 are located at three of the three apex corners of the welding substrate 1. Based on the above description, the welding substrate 1 is square with four apex corners. The three second filler holes 5 are located at the three apex corners of the welding substrate 1 on the front side. The three LED pads 2 are equidistantly distributed, and the distribution direction of the three LED pads 2 is as follows: Figure 1 For example, two LED pads 2 are distributed diagonally downwards, and two non-common electrodes are formed at the two apex corners of the bottom of the soldering substrate 1. Another LED pad 2 extends upwards, and the non-common electrode is located at the center of the top edge of the soldering substrate 1. For ease of description, the non-common electrode located at the center of the top edge of the soldering substrate 1 is called the center non-common electrode. In order to maximize the distance between the non-common electrodes of the three LED pads 2 and the uniformity of the distribution, and also to increase the distance between the non-common electrode and the control pin 3, the non-common electrode lead 6 at the center non-common electrode is longer than the non-common electrode lead 6 at the other two non-common electrodes, so as to lead the flow path at the center non-common electrode to one apex corner of the top of the soldering substrate 1. The pin unit is provided on the back side at the other apex corner.

[0039] Furthermore, the pin unit includes a control pin 3 and a pin lead 301 connecting the control pin 3 and the first filler hole 4. The control pin 3 is located on the back of the top corner of the soldering substrate 1 where the second filler hole 5 is not provided. The pin lead 301 connects the common electrode and the control pin 3, forming a complete circuit loop. In conjunction with the above description, three second filler holes 5 are provided on the front of three top corners of the soldering substrate 1 and are connected to the non-common electrode of the three LED pads 2. Therefore, the control pin 3 in this application is formed on the back of the top corner of the soldering substrate 1 where the second filler hole 5 is not provided. Based on this arrangement, the distance between the three second filler holes 5 and between the control pin 3 and the common electrode can be maximized, reducing solder bridging between chip electrodes and between LED pads 2, and effectively avoiding the generation of the "caterpillar" phenomenon.

[0040] Furthermore, the anti-bridging material layer 7 includes ink, and the coverage area of ​​the anti-bridging material layer 7 includes the pin unit, the outer periphery of the LED pad 2, the non-common electrode lead 6, the first filler via 4, and the second filler via 5. Figure 3 A side view of an LED welding plate provided in an embodiment of this application, such as... Figure 3 As shown, the anti-tin bridging material layer 7 has a certain thickness, so that the horizontal height of the upper surface of the LED pad 2 is lower than the horizontal height of the anti-tin bridging material layer 7. The LED pad 2 is in a concave state, which facilitates subsequent die bonding and allows the electrode to be accurately fixed on the LED pad 2. This effectively prevents the pins from bridging during screen mounting. At the same time, combined with the simplified route design given in this application, the application range of the anti-tin bridging material layer 7 can be greatly reduced compared with the traditional design. During subsequent molding, the encapsulating adhesive can bond better with BT, thereby increasing the bonding force and improving the encapsulation effect.

[0041] The LED soldering board in this application integrates multiple LED pads 2 at one end and disperses them outward from the common electrode at the other end, equidistantly arranging them to form independent non-common electrodes. This maximizes the distance between the non-common electrodes of two adjacent LED pads 2, improving solder bridging and color deviation. By setting pin units on the bottom surface of the soldering substrate 1, the distance between the common electrode and the pin units can also be maximized, further reducing the occurrence of solder bridging.

[0042] When the LED welding boards in this application are spliced, the welding substrate 1 is welded to the circuit board. Based on the square structure of the welding substrate 1 in this application, ink plug holes are opened on the circuit board, and every four welding substrates 1 can share one ink plug hole.

[0043] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0044] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An LED welding board, characterized in that, include: The substrate assembly includes a welding substrate (1) and a plurality of LED pads (2) located on the upper surface of the welding substrate (1), wherein one end of the plurality of LED pads (2) is integrated to form a common electrode, and the other end is dispersed and equidistantly arranged in a direction away from the common electrode to form an independent non-common electrode, wherein the included angle formed between any two LED pads (2) is equal. The functional component includes a pin unit located on the bottom surface of the welding substrate (1) and connected to the common electrode. One end of the pin unit is connected to the common electrode, and the other end extends away from the common electrode and is formed on the back side of one of the top corners of the welding substrate (1), and the front side of the top corner is located between the non-common electrodes of two adjacent LED pads (2).

2. The LED welding plate as described in claim 1, characterized in that, The outer periphery of the pin unit passage and the outer periphery of the LED pad (2) passage are both covered with an anti-tin bridging material layer (7), and the anti-tin bridging material layer (7) protrudes from the surface of the LED pad (2).

3. The LED welding plate as described in claim 1, characterized in that, A first filler hole (4) is formed at the center of the welding substrate (1), and one end of a plurality of LED pads (2) is integrated into the first filler hole (4) to form the common electrode.

4. The LED welding plate as described in claim 3, characterized in that, The welding substrate (1) has a number of second filler holes (5) equal to the number of LED pads (2), and each non-common electrode of the LED pad (2) is connected to a second filler hole (5).

5. An LED welding plate as described in claim 4, characterized in that, A non-common electrode lead (6) is provided between the second filling hole (5) and the non-common electrode.

6. An LED welding plate as described in claim 5, characterized in that, The number of LED pads (2) and the number of second filler holes (5) are both three, and the three second filler holes (5) are located at three of the top corners of the welding substrate (1).

7. An LED welding plate as described in claim 6, characterized in that, Both the first filling hole (4) and the second filling hole (5) are filled with filling material.

8. An LED welding plate as described in claim 6, characterized in that, The pin unit includes a control pin (3) and a pin lead (301) connecting the control pin (3) and the first filler hole (4).

9. An LED welding plate as described in claim 8, characterized in that, The control pin (3) is located on the back of the top corner of the welding substrate (1) where the second filler hole (5) is not provided.

10. An LED welding plate as described in claim 2, characterized in that, The anti-tin bridging material layer (7) includes ink.

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