Hot runner system

Abstract

The utility model provides a hot runner system which comprises a splitter plate, a hot nozzle connected with the splitter plate and a membrane heater arranged outside the hot nozzle. The membrane heater comprises a metal substrate, a first insulating layer arranged on the metal substrate, a conductor layer and a resistive layer which are arranged on the first insulating layer, and a second insulating layer arranged on the conductor layer and the resistive layer, and the membrane heater is sintered and attached to the periphery of the hot nozzle through the metal substrate. In the hot runner system provided by the invention, the diaphragm heater is directly sintered and pasted outside the hot nozzle, and the heat of the diaphragm heater can be directly transferred to the hot nozzle, so that the heat loss is reduced.

Description

Technical Field

[0001] This application relates to the field of hot runner technology, and more particularly to a hot runner system. Background Technology

[0002] Current methods for heating nozzles involve bending the heating wire into a specific shape, machining corresponding grooves on the outer surface of the nozzle, and embedding the heating wire into these grooves for heating; alternatively, a tubular heater can be installed over the nozzle. Machining grooves on the nozzle is costly, requires specialized equipment for pressing the heating wire into the nozzle, and is inconvenient to assemble; subsequent maintenance and disassembly of the heating wire are also inconvenient; and since each heating zone relies on a single heating wire, heating uniformity needs further improvement. Installing a tubular heater over the nozzle requires high precision in its machining; otherwise, gaps can easily form between the nozzle and the heater, affecting heat transfer. Summary of the Invention

[0003] The purpose of this application is to provide a hot runner system that uses a diaphragm heater directly sintered and attached to the outside of the hot nozzle, thus solving the problem of high processing / installation costs of the heater in the prior art.

[0004] To achieve one of the above-mentioned objectives, one embodiment of this application provides a hot runner system, including a manifold, a hot nozzle connected to the manifold, and a diaphragm heater disposed outside the hot nozzle. The diaphragm heater includes a metal substrate, a first insulating layer disposed on the metal substrate, a conductor layer and a resistive layer disposed on the first insulating layer, and a second insulating layer disposed on the conductor layer and the resistive layer. The diaphragm heater is sintered and attached to the outer periphery of the hot nozzle through the metal substrate.

[0005] As a further improvement of one embodiment of this application, the area of ​​the diaphragm heater attached to the outer periphery of the hot nozzle is ≥ 60% of the outer periphery area of ​​the hot nozzle.

[0006] As a further improvement of one embodiment of this application, the hot nozzle is provided with a temperature sensing groove, which extends along the length direction of the hot nozzle.

[0007] As a further improvement of one embodiment of this application, the temperature sensing groove and the diaphragm heater do not overlap in the radial direction of the hot nozzle.

[0008] As a further improvement of one embodiment of this application, the resistive layer includes resistance lines that are unevenly distributed on the first insulating layer.

[0009] As a further improvement of one embodiment of this application, the resistance lines of the diaphragm heater are more densely distributed near both ends than in the middle.

[0010] As a further improvement of one embodiment of this application, the resistance lines of the diaphragm heater are more densely distributed at the end away from the shunt plate than at the end closer to the shunt plate.

[0011] As a further improvement of one embodiment of this application, the first insulating layer is a ceramic layer and the second insulating layer is a glass layer.

[0012] As a further improvement to one embodiment of this application, the power density of the diaphragm heater is 40-100 W / cm². 2 .

[0013] As a further improvement of one embodiment of this application, the heating rate of the diaphragm heater is 80-150°C / s.

[0014] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0015] In the hot runner system provided in this application, a diaphragm heater is attached to the outer periphery of the hot nozzle to heat the nozzle. The diaphragm heater is sintered and fixed to the outside of the hot nozzle by the metal substrate of the diaphragm heater, so that the diaphragm heater can fit the hot nozzle, avoiding the formation of gaps between the diaphragm heater and the hot nozzle, which would affect the heat transfer, reduce heat loss, and is easy to install. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the hot runner system in an embodiment of this application.

[0017] 1. Diverter plate; 11. First diverter section; 12. Second diverter section; 13. Injection section; 14. First surface; 15. Second surface; 2. Hot nozzle; 21. Temperature sensing tank; 3. Diaphragm heater. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] The terms used in this document, such as “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” indicating spatial relative positions, are used for illustrative purposes to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms “spatial relative positions” may be intended to include different orientations of the equipment in use or operation other than those shown in the figures.

[0020] For example, if the device in the figure is flipped, a unit described as being "below" or "under" other units or features will be "above" other units or features. Therefore, the exemplary term "below" can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise) and the spatially related descriptive terms used herein will be interpreted accordingly.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Furthermore, it should be understood that although the terms "first," "second," etc., may be used herein to describe various elements or structures, the objects being described should not be limited by these terms. These terms are only used to distinguish these objects from one another. For example, a first shunt may be referred to as a second shunt, and similarly, a second shunt may be referred to as a first shunt, without departing from the scope of protection of this application.

[0023] This application provides a hot runner system, such as Figure 1 As shown, it includes a flow divider plate 1, a hot nozzle 2 connected to the flow divider plate 1, and a diaphragm heater 3 disposed outside the hot nozzle 2. The diaphragm heater 3 includes a metal substrate, a first insulating layer disposed on the metal substrate, a conductor layer and a resistive layer disposed on the first insulating layer, and a second insulating layer disposed on the conductor layer and the resistive layer. The diaphragm heater 3 is sintered and attached to the outer periphery of the hot nozzle 2 through the metal substrate.

[0024] The metal substrate is a flexible thin metal sheet. In this application, a diaphragm heater 3 is attached to the outer periphery of the hot nozzle 2 for heating the nozzle 2. Specifically, the diaphragm heater 3 is sintered and fixed to the hot nozzle 2 via the metal substrate. That is, the metal substrate not only serves as the substrate of the diaphragm heater 3 but also as a connector to the hot nozzle 2. By sintering and attaching the diaphragm heater 3 to the outside of the hot nozzle 2, the diaphragm heater 3 and the hot nozzle 2 are in direct contact without gaps, thereby directly transferring the heat generated by the diaphragm heater 3 to the hot nozzle 2 and reducing heat loss. Compared with the prior art of attaching the diaphragm heater 3 to a tubular metal cylinder and then sleeve the metal cylinder on the outside of the hot nozzle 2, the heating efficiency and heat utilization rate can be increased by more than 60%, and directly attaching the diaphragm heater 3 to the hot nozzle 2 eliminates the requirement for processing precision, reducing processing difficulty.

[0025] like Figure 1 In this process, the diaphragm heater 3 can also be sintered and attached to the flow divider plate 1 via a metal substrate. The flow divider plate 1 includes a first surface 14 connected to the hot nozzle 2 and a second surface 15 opposite to the first surface 14. The diaphragm heater 3 can be symmetrically attached to the first surface 14 and the second surface 15, so that the flow divider plate 1 is heated uniformly.

[0026] Specifically, the flow divider 1 is H-shaped, comprising a horizontally arranged first flow divider 11 and second flow divider 12, and an injection section 13 connecting the first flow divider 11 and the second flow divider 12. The injection section 13 is used to connect to the main nozzle that supplies the colloid to the flow divider 1. The first flow divider 11 and the second flow divider 12 are arranged parallel to each other, and the injection section 13 is arranged perpendicular to the first flow divider 11 and the second flow divider 12. Four hot nozzles 2 are provided, with two hot nozzles 2 spaced apart from each of the first flow divider 11 and the second flow divider 12. Of course, the number of hot nozzles 2 is not limited to four and can be set as needed. Of course, the shape of the flow divider 1 is not limited to H-shape and can be designed in other shapes as needed.

[0027] In some embodiments of this application, the area of ​​the diaphragm heater 3 attached to the outer periphery of the hot nozzle 2 is ≥ 60% of the outer periphery area of ​​the hot nozzle 2. The diaphragm heater 3 has a large covering area outside the hot nozzle 2, so that the hot nozzle 2 has a large heating area and the hot nozzle 2 can be heated evenly.

[0028] In some embodiments of this application, the hot nozzle 2 is provided with a temperature sensing groove 21, which extends along the length of the hot nozzle 2. The temperature sensing groove 21 is used to set a temperature sensing wire for controlling the temperature of the hot nozzle 2, and the extension of the temperature sensing groove 21 along the length of the hot nozzle 2 makes the processing of the temperature sensing wire the simplest and most convenient.

[0029] In some embodiments of this application, the temperature sensing groove 21 and the diaphragm heater 3 do not overlap radially in the hot nozzle 2. As a result, the operation of the temperature sensing wire in the temperature sensing groove 21 and the diaphragm heater 3 does not affect each other. Furthermore, if either the temperature sensing wire or the diaphragm heater 3 is damaged, the damaged one can be replaced without disassembling the other undamaged one, making the maintenance of the hot nozzle 2 simpler.

[0030] In some embodiments of this application, the resistive layer includes resistance wires, which are unevenly distributed on the first insulating layer. Because the hot nozzle 2 is elongated, its flow path along the internal channel is relatively long, and the colloid temperature gradually decreases. To maintain the colloid temperature inside the hot nozzle 2 as much as possible, the amount of heat required at different locations in the hot nozzle 2 is not the same, and the distribution of the resistance wires used for heating is also uneven.

[0031] In some embodiments of this application, the resistance lines of the diaphragm heater 3 are more densely distributed near both ends than in the middle. Sufficient heat is provided to the fluid at the end of the nozzle 2 near the distributor plate 1, preventing the fluid temperature from decreasing as it travels through the nozzle 2. Therefore, the middle section does not need to absorb as much heat from the diaphragm heater 3, resulting in a denser distribution of resistance lines at the ends of the nozzle 2 and a sparser distribution in the middle.

[0032] In some embodiments of this application, the resistance lines of the diaphragm heater 3 are more densely distributed at the end away from the flow divider plate 1 than at the end closer to the flow divider plate 1. The fluid travels the longest distance at the end of the hot nozzle 2 away from the flow divider plate 1, resulting in the most significant heat loss; therefore, the resistance lines of the diaphragm heater 3 are most densely distributed at the end of the hot nozzle 2 away from the flow divider plate 1.

[0033] In some embodiments of this application, the first insulating layer is a ceramic layer and the second insulating layer is a glass layer.

[0034] In some embodiments of this application, the power density of the diaphragm heater is 40-100 W / cm². 2 .

[0035] In some embodiments of this application, the heating rate of the diaphragm heater is 80–150 °C / s.

[0036] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0037] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

Claims

1. A hot runner system characterized by, The device comprises a flow distribution plate, a hot nozzle connected with the flow distribution plate, and a diaphragm heater arranged outside the hot nozzle, wherein the diaphragm heater comprises a metal substrate, a first insulating layer arranged on the metal substrate, a conductor layer and a resistance layer arranged on the first insulating layer, and a second insulating layer arranged on the conductor layer and the resistance layer, and the diaphragm heater is sintered and attached to the outer periphery of the hot nozzle through the metal substrate.

2. The hot- runner system of claim 1, wherein The area of the diaphragm heater attached to the outer periphery of the hot nozzle is greater than 60% of the area of the outer periphery of the hot nozzle.

3. The hot- runner system of claim 1, wherein The hot nozzle is provided with a temperature sensing groove extending along the length direction of the hot nozzle.

4. The hot- runner system of claim 3, wherein In the radial direction of the hot nozzle, the temperature sensing groove and the diaphragm heater do not overlap.

5. The hot- runner system of claim 1, wherein The resistance layer comprises resistance wires, and the resistance wires are unevenly distributed on the first insulating layer.

6. The hot- runner system of claim 5, wherein The resistance wires near the two ends of the diaphragm heater are more densely distributed than the resistance wires in the middle part of the diaphragm heater.

7. The hot-duct system of claim 6, wherein The resistance wires away from one end of the flow distribution plate are more densely distributed than the resistance wires near one end of the flow distribution plate.

8. The hot-duct system of claim 1, wherein, The first insulating layer is a ceramic layer, and the second insulating layer is a glass layer.

9. The hot-duct system of claim 1, wherein, The membrane heater has a power density of 40-100 W / cm 2 .

10. The hot-duct system of claim 1, wherein, The temperature rising speed of the diaphragm heater is 80-150℃ / s.

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