Bluetooth antenna and head-mounted Bluetooth earphone

Abstract

The utility model relates to the technical field of Bluetooth earphones, in particular to a Bluetooth antenna and a head-mounted Bluetooth earphone. The Bluetooth antenna comprises a first connecting part and a second connecting part, the first connecting part is provided with a first side face and a second side face which are oppositely arranged, the first side face is provided with a connecting bonding pad which is suitable for being connected with a metal elastic piece of a mainboard, the second side face is provided with a first adhesive layer, and the second connecting part is flexibly connected with the first connecting part. The second connecting part is provided with a third side face and a fourth side face which are oppositely arranged, the third side face is provided with a circuit, the end of the circuit is connected with the connecting bonding pad, and the fourth side face is provided with a second adhesive layer. The second connecting part is configured to be capable of being bent relative to the first connecting part. The head-mounted Bluetooth earphone comprises the Bluetooth antenna. The Bluetooth antenna is flexible in assembly mode, and the head-mounted Bluetooth earphone using the Bluetooth antenna has a good Bluetooth signal transmission effect.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth headset technology, and in particular to a Bluetooth antenna and a Bluetooth headset. Background Technology

[0002] Headphones can receive electrical signals from media players or receivers and convert them into audible sound waves using speakers placed close to the ears.

[0003] For over-ear Bluetooth headphones, the antenna typically uses an onboard inverted F-antenna (IFA) or other types of onboard antennas. The disadvantage of this type of antenna is that it occupies a significant amount of motherboard space. In cases with metal earcups or irregularly shaped and small motherboards, antenna radiation is affected by the metal earcups. Furthermore, the motherboard area is insufficient to support a large onboard antenna, impacting the headphone's signal transmission and interference resistance, ultimately leading to a poor user experience when enjoying music. Utility Model Content

[0004] The main purpose of this invention is to propose a Bluetooth antenna and a Bluetooth headset, aiming to solve the technical problems that Bluetooth antennas occupy a large amount of motherboard space and are easily interfered with, thus affecting signal transmission.

[0005] To achieve the above objectives, this utility model proposes a Bluetooth antenna, comprising:

[0006] A first connecting portion has a first side and a second side disposed opposite to each other. The first side is provided with a connecting pad, which is adapted to be connected to a metal spring on the motherboard. The second side is provided with a first adhesive layer.

[0007] The second connecting part is flexibly connected to the first connecting part. The second connecting part has a third side and a fourth side that are disposed opposite to each other. The third side is provided with a line, the end of which is connected to the connecting pad. The fourth side is provided with a second adhesive layer.

[0008] The second connecting portion is configured to bend relative to the first connecting portion.

[0009] In some embodiments, a flexible connecting portion is provided between the first connecting portion and the second connecting portion.

[0010] In some embodiments, the first connecting portion is provided with a first reinforcing plate on the second side, and the first adhesive layer is provided on the side of the first reinforcing plate away from the first connecting portion.

[0011] In some embodiments, the thickness D1 of the first reinforcing plate satisfies: 0.2mm≤D1≤0.3mm.

[0012] In some embodiments, the second connecting portion is provided with a second reinforcing plate on the third side, and the line is disposed between the second connecting portion and the second reinforcing plate.

[0013] In some embodiments, the thickness D2 of the second reinforcing plate satisfies: 0.2mm≤D2≤0.3mm.

[0014] In some embodiments, the first connecting portion is provided with a positioning hole.

[0015] Correspondingly, this utility model also proposes a Bluetooth headset, comprising:

[0016] The Bluetooth antenna described in any of the above embodiments includes a first connecting portion and a second connecting portion that are flexibly connected, wherein the first connecting portion is provided with a connecting pad.

[0017] The ear shell has an outer top wall and a side peripheral wall that are perpendicular to each other, and a receiving cavity is formed between the outer top wall and the side peripheral wall, and the Bluetooth antenna is disposed in the receiving cavity;

[0018] A motherboard is disposed within the receiving cavity, and the motherboard is provided with a metal spring, which is connected to the connecting pad;

[0019] The second connecting portion can be bent relative to the first connecting portion to the side wall.

[0020] In some embodiments, a connecting rib is provided on the side of the outer top wall near the receiving cavity, and the side of the first connecting portion away from the connecting pad is connected to the connecting rib.

[0021] In some embodiments, a positioning post is provided on the side of the outer top wall near the receiving cavity, and the first connecting portion is provided with a positioning hole, wherein the positioning post is configured to be inserted into the positioning hole.

[0022] Compared with the prior art, the beneficial effects of this utility model are:

[0023] In this invention, the connecting pads are mainly located in the first connecting part, and the wiring is mainly located in the second connecting part. When connecting the Bluetooth antenna to the motherboard, only the first connecting part can be connected to the motherboard, allowing the connecting pads and the metal spring to make direct contact, ensuring current conduction between the Bluetooth antenna and the motherboard. Simultaneously, the second connecting part can be bent away from the contact surface between the motherboard and the first connecting part, making the connection between the second connecting part and the motherboard more flexible in space. Compared to a connection method where the Bluetooth antenna is integrally connected to the motherboard, since this invention only requires the first connecting part to be attached to the surface of the motherboard, the connection between the Bluetooth antenna and the motherboard is not limited by the size of the motherboard. Even if the motherboard has an irregular shape or a small size, it can still support the small area of ​​the first connecting part, thereby improving the connection flexibility between the Bluetooth antenna and the motherboard and reducing the assembly difficulty and cost of the Bluetooth antenna.

[0024] Furthermore, for cases with metal earcups, the second connecting part can be bent away from the metal earcup, increasing the distance between the second connecting part and the metal earcup. This ensures that the circuit will not be interfered with by the metal earcup when conducting current. For example, if the metal earcup is typically located on the top outer wall of the headphone housing, the second connecting part can be bent to the side wall of the headphone housing, allowing the circuit to avoid the metal earcup or the main board. Using this structure reduces interference from the metal earcup or the user's head on signal transmission (when wearing a Bluetooth headset normally, the side wall of the headphone housing is not blocked by the user's head, preventing interference with the Bluetooth antenna's signal transmission), ensuring the signal radiation range and transmission distance of the Bluetooth antenna, thereby guaranteeing the communication performance of the Bluetooth headset and providing users with a better music experience.

[0025] The Bluetooth headphones using the aforementioned Bluetooth antenna are simple to assemble and have good Bluetooth signal transmission performance, which can improve the user's experience when enjoying music while wearing these Bluetooth headphones. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a Bluetooth antenna provided in an embodiment of the present invention from a first-view perspective; wherein, the Bluetooth antenna does not have a tear-off release film;

[0028] Figure 2 This is a schematic diagram of the structure of a Bluetooth antenna provided in an embodiment of the present invention from a second perspective; wherein the Bluetooth antenna does not have a tear-off release film;

[0029] Figure 3 This is a schematic diagram of the structure of a Bluetooth antenna provided in an embodiment of the present invention from a first-view perspective; wherein the Bluetooth antenna is provided with a tear-off release film;

[0030] Figure 4 This is a schematic diagram of the structure of a Bluetooth antenna provided in an embodiment of the present invention from a second perspective; wherein the Bluetooth antenna is provided with a tear-off release film;

[0031] Figure 5 This is a side view of the structure of the first connecting part in a Bluetooth antenna according to an embodiment of the present invention;

[0032] Figure 6 This is a side view of the structure of the second connection portion in a Bluetooth antenna according to an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of a Bluetooth antenna provided in an embodiment of the present invention after the second connecting part is bent relative to the first connecting part;

[0034] Figure 8 This is a schematic diagram of the motherboard provided in an embodiment of the present invention from a first-view perspective;

[0035] Figure 9 This is a schematic diagram of the motherboard provided in an embodiment of the present invention from a second perspective.

[0036] Figure 10 This is a schematic diagram showing the connection relationship between the Bluetooth antenna and the motherboard according to an embodiment of the present invention.

[0037] Explanation of icon numbers:

[0038] 10. Bluetooth antenna;

[0039] 100. First connecting part;

[0040] 110. First side surface; 120. Second side surface; 130. Positioning hole;

[0041] 111. Connect the pads;

[0042] 121. First adhesive layer; 122. First reinforcing plate;

[0043] 200. Second connecting part;

[0044] 210. Third side view; 220. Fourth side view;

[0045] 211. Line; 212. Second reinforcing plate;

[0046] 221. Second adhesive layer;

[0047] 300. Flexible connection part;

[0048] 400. Motherboard;

[0049] 410. Metal shrapnel;

[0050] 500. Hand-tear release film.

[0051] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0053] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0054] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or," "and / or," or "and / or" throughout the text implies three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where A and B are simultaneously satisfied. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0055] Headphones can receive electrical signals from media players or receivers and convert them into audible sound waves using speakers placed close to the ears.

[0056] For over-ear Bluetooth headphones, the antenna typically uses an onboard inverted F-antenna (IFA) or other types of onboard antennas. The disadvantage of this type of antenna is that it occupies a significant amount of motherboard space. In cases with metal earcups or irregularly shaped and small motherboards, antenna radiation is affected by the metal earcups. Furthermore, the motherboard area is insufficient to support a large onboard antenna, impacting the headphone's signal transmission and interference resistance, ultimately leading to a poor user experience when enjoying music.

[0057] Based on this, in order to solve the technical problem that the Bluetooth antenna 10 occupies a large space on the motherboard and is easily affected by interference, thus affecting signal transmission, referring to Figures 1 to 10 This utility model provides a Bluetooth antenna 10 in one embodiment. The Bluetooth antenna 10 includes a first connecting portion 100 and a second connecting portion 200. The first connecting portion 100 has a first side surface 110 and a second side surface 120 disposed opposite to each other. The first side surface 110 is provided with a connecting pad 111, which is adapted to connect with a metal spring 410 of a motherboard 400. For example, after the connecting pad 111 directly contacts the metal spring 410, current can be conducted between the first connecting portion 100 (i.e., the Bluetooth antenna 10) and the motherboard 400. The second side surface 120 is provided with a first adhesive layer 121. The first adhesive layer 121 is adhesive, allowing the first connecting portion 100 to be attached to a suitable position. More preferably, when the first connecting portion 100 is not attached, a peelable release film 500 is provided on the surface of the first adhesive layer 121. When it is necessary to attach the first connecting portion 100, the peelable release film 500 can be removed.

[0058] The second connecting portion 200 is flexibly connected to the first connecting portion 100. The second connecting portion 200 has a third side 210 and a fourth side 220 disposed opposite to each other. The third side 210 is provided with a line 211, the end of which is connected to a connecting pad 111. When the connecting pad 111 and the metal spring 410 come into direct contact, current is conducted through the line 211 between the first connecting portion 100, the second connecting portion 200, and the motherboard 400, that is, current is conducted through the line 211 between the Bluetooth antenna 10 and the motherboard 400. The fourth side 220 is provided with a second adhesive layer 221. The second adhesive layer 221 is sticky, and the second connecting portion 200 can be attached to a suitable position through the second adhesive layer 221. More preferably, when the second connecting portion 200 is not attached, a peelable release film 500 is provided on the surface of the second adhesive layer 221. When it is necessary to attach the second connecting portion 200, the peelable release film 500 can be removed.

[0059] The second connecting portion 200 is configured to be bent relative to the first connecting portion 100. For example, the bent second connecting portion 200 and the first connecting portion 100 can form an acute angle, a right angle, or an obtuse angle. By bending the second connecting portion 200, the attachment position of the second connecting portion 200 relative to the first connecting portion 100 can be changed, greatly improving the setting flexibility of the Bluetooth antenna 10.

[0060] Specifically, in this embodiment, the connecting pad 111 is mainly located in the first connecting portion 100, and the line 211 is mainly located in the second connecting portion 200. When connecting the Bluetooth antenna 10 and the motherboard 400, only the first connecting portion 100 and the motherboard 400 can be connected, allowing the connecting pad 111 and the metal spring 410 to make direct contact, ensuring current conduction between the Bluetooth antenna 10 and the motherboard 400. Simultaneously, the second connecting portion 200 can be bent in a direction away from the contact surface between the motherboard 400 and the first connecting portion 100, making the connection between the second connecting portion 200 and the motherboard 400 more flexible in space. Compared to the connection method of connecting the Bluetooth antenna 10 as a whole to the motherboard 400, since this embodiment only requires the first connecting part 100 to be attached to the surface of the motherboard 400, the connection between the Bluetooth antenna 10 and the motherboard 400 in this embodiment is not limited by the size of the motherboard 400. Even if the motherboard 400 has an irregular shape or a small size, it is sufficient to support the small area of ​​the first connecting part 100. This helps to improve the connection flexibility between the Bluetooth antenna 10 and the motherboard 400 and reduce the assembly difficulty and assembly cost of the Bluetooth antenna 10.

[0061] Furthermore, for cases with metal earcups, the second connecting portion 200 can be bent away from the metal earcup, increasing the distance between the second connecting portion 200 and the metal earcup. This ensures that the wire 211 will not be interfered with by the metal earcup when conducting current. For example, if the metal earcup is typically located on the outer top wall of the headphone housing, the second connecting portion 200 can be bent to the side wall of the headphone housing, allowing the wire 211 to avoid the metal earcup or the mainboard 400. Using this structure reduces interference from the metal earcup or the user's head on signal transmission (when wearing a Bluetooth headset normally, the side wall of the headphone housing is not blocked by the user's head, preventing interference with the signal transmission of the Bluetooth antenna 10), ensuring the signal radiation range and transmission distance of the Bluetooth antenna 10, thereby guaranteeing the communication performance of the Bluetooth headset and providing users with a better music experience.

[0062] In some embodiments, refer to Figures 1 to 4 ,as well as Figure 7A flexible connecting portion 300 is provided between the first connecting portion 100 and the second connecting portion 200. The size of the flexible connecting portion 300 can be smaller than the size of the first connecting portion 100 or the size of the second connecting portion 200. The design size of the flexible connecting portion 300 is sufficient to ensure the connection strength between the first connecting portion 100 and the second connecting portion 200.

[0063] Specifically, in this embodiment, compared to the structure in which the first connecting part 100 and the second connecting part 200 are directly connected as one unit, by providing the flexible connecting part 300, it is beneficial to increase the connection interval between the first connecting part 100 and the second connecting part 200, so that there is a larger bending space between the first connecting part 100 and the second connecting part 200, and the second connecting part 200 can be bent at a large angle and within a large range relative to the first connecting part 100, thereby improving the assembly flexibility of the Bluetooth antenna 10.

[0064] It should be noted that the surface of the flexible connection part 300 is not provided with an adhesive layer.

[0065] In some embodiments, refer to Figure 5 The first connecting portion 100 is provided with a first reinforcing plate 122 on the second side 120, and a first adhesive layer 121 is provided on the side of the first reinforcing plate 122 away from the first connecting portion 100. For example, the first reinforcing plate 122 can be a PI reinforcing plate (i.e., a polyimide reinforcing plate).

[0066] Specifically, in this embodiment, when assembling the Bluetooth antenna 10, the second side 120 of the first connecting part 100 is bonded to the (metal) earcup via a first adhesive layer 121. A first reinforcing plate 122 is provided between the first connecting part 100 and the (metal) earcup. The thickness of the first reinforcing plate 122 increases the distance between the first connecting part 100 and the (metal) earcup, thereby reducing the interference of the (metal) earcup on the Bluetooth antenna 10 during signal transmission, improving the Bluetooth performance of the over-ear Bluetooth headset, and ensuring a better music experience for the user.

[0067] In addition, by setting the first reinforcing plate 122, it is beneficial to improve the structural strength of the first connecting part 100, so that the first reinforcing plate 122 can support the first connecting part 100.

[0068] In some embodiments, refer to Figure 5 The thickness D1 of the first reinforcing plate 122 satisfies: 0.2mm ≤ D1 ≤ 0.3mm. For example, the value of D1 can be 0.2mm, 0.23mm, 0.25mm, 0.27mm, 0.3mm, etc.

[0069] Specifically, in this embodiment, the thickness of the first reinforcing plate 122 is set within the aforementioned range. On the one hand, this prevents the thickness of the first reinforcing plate 122 from being too thin, for example, 0.1mm, 0.15mm, 0.18mm, etc., which would result in the structural strength of the first connecting part 100 remaining weak and the first reinforcing plate 122 failing to provide effective support for the first connecting part 100. On the other hand, this prevents the thickness of the first reinforcing plate 122 from being too thick, for example, 0.35mm, 0.4mm, 0.45mm, etc., which would result in the overall thickness of the first connecting part 100 being too large, which would be detrimental to saving space inside the earphone shell.

[0070] In some embodiments, refer to Figure 6 The second connecting portion 200 is provided with a second reinforcing plate 212 on the third side 210, and the line 211 is disposed between the second connecting portion 200 and the second reinforcing plate 212. For example, the second reinforcing plate 212 can be a PI reinforcing plate (i.e., a polyimide reinforcing plate).

[0071] Specifically, in this embodiment, when assembling the Bluetooth antenna 10, the second connecting part 200 can be bent to the side wall of the ear shell and bonded to the side wall through the second adhesive layer 221 of the fourth side surface 220 of the second connecting part 200. At this time, the line 211 of the third side surface 210 of the second connecting part 200 is positioned towards the motherboard 400. The line 211 is positioned between the second connecting part 200 and the second reinforcing plate 212. Utilizing the thickness of the second reinforcing plate 212, the line 211 and the motherboard 400 can be isolated, increasing the spacing between them. This reduces the interference of the motherboard 400 on the Bluetooth antenna 10 during signal transmission, improves the Bluetooth performance of the over-ear Bluetooth headset, and ensures a better music experience for the user.

[0072] Furthermore, by placing the line 211 between the second connecting part 200 and the second reinforcing plate 212, on the one hand, the second connecting part 200 and the second reinforcing plate 212 can clamp the line 211 and fix it in place. Even if the Bluetooth headset is bumped or dropped, the line 211 will not shift, thus ensuring the transmission effect of the Bluetooth signal. On the other hand, the second connecting part 200 and the second reinforcing plate 212 can protect the line 211 and prevent it from being damaged, thereby extending the service life of the Bluetooth headset.

[0073] In some embodiments, refer to Figure 6 The thickness D2 of the second reinforcing plate 212 satisfies: 0.2mm ≤ D2 ≤ 0.3mm. For example, the value of D2 can be 0.2mm, 0.23mm, 0.25mm, 0.27mm, 0.3mm, etc.

[0074] Specifically, in this embodiment, the thickness of the second reinforcing plate 212 is set within the aforementioned range. On the one hand, this prevents the second reinforcing plate 212 from being too thin, for example, with a thickness of 0.1mm, 0.15mm, 0.18mm, etc., which would result in the structural strength of the second connecting part 200 remaining weak, the second reinforcing plate 212 failing to provide effective support for the second connecting part 200, and the second reinforcing plate 212 failing to provide effective protection for the circuit 211. On the other hand, this prevents the second reinforcing plate 212 from being too thick, for example, with a thickness of 0.35mm, 0.4mm, 0.45mm, etc., which would result in a large overall thickness of the second connecting part 200, which is not conducive to saving space inside the earphone shell.

[0075] In some embodiments, refer to Figures 1 to 4 ,as well as Figure 7 The first connecting portion 100 is provided with positioning holes 130. For example, the first connecting portion 100 may be provided with multiple positioning holes 130, which may be circular holes with a diameter of 1 mm. Alternatively, the positioning holes 130 may also be square holes.

[0076] Specifically, in this embodiment, the positioning hole 130 is adapted to connect to the positioning post inside the ear shell of the over-ear Bluetooth headset. After the connecting pad 111 of the first connecting part 100 and the metal spring 410 of the motherboard 400 are in contact, the positioning post can be inserted into the positioning hole 130 accordingly, and the positioning post is used to support and limit the first connecting part 100. Even if the over-ear Bluetooth headset is bumped or dropped, the first connecting part 100 will not shift because the positioning post supports it, ensuring the contact stability between the connecting pad 111 and the metal spring 410 and improving the Bluetooth signal transmission effect of the over-ear Bluetooth headset.

[0077] Correspondingly, another embodiment of this utility model also provides a Bluetooth headset, which includes the Bluetooth antenna 10 in any of the above embodiments. The Bluetooth antenna 10 includes a first connecting portion 100 and a second connecting portion 200 that are flexibly connected, and the first connecting portion 100 is provided with a connecting pad 111. The Bluetooth headset also includes an ear shell and a main board 400. The ear shell has an outer top wall and a side peripheral wall that are perpendicular to each other, and a receiving cavity is formed between the outer top wall and the side peripheral wall. The Bluetooth antenna 10 is disposed in the receiving cavity, and the main board 400 is disposed in the receiving cavity. The main board 400 is provided with a metal spring 410, and the metal spring 410 is connected to the connecting pad 111. The second connecting portion 200 can be bent relative to the first connecting portion 100 to the side peripheral wall.

[0078] Specifically, in this embodiment, when assembling the Bluetooth antenna 10, the first connecting portion 100 of the Bluetooth antenna 10 is first connected to the motherboard 400, so that the connecting pad 111 of the first connecting portion 100 and the metal spring 410 of the motherboard 400 make contact and connect, realizing the current conduction between the Bluetooth antenna 10 and the motherboard 400. Then, the second connecting portion 200 is bent relative to the first connecting portion 100 to the side wall. For example, the bent second connecting portion 200 can be perpendicular to the first connecting portion 100, so that the second connecting portion 200 is offset from the contact surface between the motherboard 400 and the first connecting portion 100. With the above structure, since only the first connecting portion 100 and the motherboard 400 are attached together, the connection area between the Bluetooth antenna 10 and the motherboard 400 can be reduced, so that the connection between the Bluetooth antenna 10 and the motherboard 400 is not limited by the size or irregular shape of the motherboard 400, improving the connection flexibility of the Bluetooth antenna 10 and the motherboard 400, and reducing the assembly difficulty and assembly cost of the Bluetooth antenna 10 and the motherboard 400.

[0079] Since the bent second connecting part 200 will deviate from the motherboard 400, that is, the distance between the bent second connecting part 200 and the motherboard 400 will increase, the signal interference of the motherboard 400 to the Bluetooth antenna 10 can be reduced, thereby improving the Bluetooth performance of the over-ear Bluetooth headset and ensuring the stability of the Bluetooth performance of the over-ear Bluetooth headset.

[0080] In some embodiments, a connecting rib is provided on the side of the outer top wall near the receiving cavity, and the side of the first connecting portion 100 away from the connecting pad 111 is connected to the connecting rib. For example, the side of the first connecting portion 100 away from the connecting pad 111 abuts against the connecting rib.

[0081] Specifically, in this embodiment, when the outer top wall is a metal shell, the connecting rib can effectively raise the first connecting portion 100 (for example, the connecting rib can raise the first connecting portion 100 by 3mm) to increase the gap between the first connecting portion 100 and the outer top wall, thereby reducing the signal interference of the metal shell to the Bluetooth antenna 10 and ensuring the stability of the Bluetooth antenna 10 when transmitting signals. In addition, by setting the connecting rib, it is beneficial to improve the structural strength of the ear shell.

[0082] In some embodiments, a positioning post is provided on the side of the outer top wall near the receiving cavity, and a positioning hole 130 is provided on the first connecting part 100, wherein the positioning post is configured to be inserted into the positioning hole 130.

[0083] Specifically, in this embodiment, after the connecting pad 111 of the first connecting part 100 and the metal spring 410 of the motherboard 400 are in contact, the positioning post can be inserted into the positioning hole 130. The positioning post can provide limiting support for the first connecting part 100, improving the positioning stability of the first connecting part 100. Even if the Bluetooth headset is bumped or dropped, the position of the first connecting part 100 will not deviate under the limiting support of the positioning post, so that the connecting pad 111 and the metal spring 410 still maintain contact connection, ensuring that the Bluetooth antenna 10 and the motherboard 400 are still in a conductive state.

[0084] Thanks to the improvements to the Bluetooth antenna 10 described above, the over-ear Bluetooth headset of this embodiment has the same technical effect as the Bluetooth antenna 10 described above, which will not be repeated here.

[0085] It should be noted that other aspects of the Bluetooth antenna 10 and the over-ear Bluetooth headset disclosed in this utility model can be found in the prior art, and will not be repeated here.

[0086] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A Bluetooth antenna, characterized in that, include: A first connecting portion has a first side and a second side disposed opposite to each other. The first side is provided with a connecting pad, which is adapted to be connected to a metal spring on the motherboard. The second side is provided with a first adhesive layer. The second connecting part is flexibly connected to the first connecting part. The second connecting part has a third side and a fourth side that are disposed opposite to each other. The third side is provided with a line, the end of which is connected to the connecting pad. The fourth side is provided with a second adhesive layer. The second connecting portion is configured to bend relative to the first connecting portion.

2. The Bluetooth antenna according to claim 1, characterized in that, A flexible connecting part is provided between the first connecting part and the second connecting part.

3. The Bluetooth antenna according to claim 1, characterized in that, The first connecting portion is provided with a first reinforcing plate on the second side, and the first adhesive layer is provided on the side of the first reinforcing plate away from the first connecting portion.

4. The Bluetooth antenna according to claim 3, characterized in that, The thickness D1 of the first reinforcing plate satisfies: 0.2mm≤D1≤0.3mm.

5. The Bluetooth antenna according to claim 1, characterized in that, The second connecting part is provided with a second reinforcing plate on the third side, and the circuit is disposed between the second connecting part and the second reinforcing plate.

6. The Bluetooth antenna according to claim 5, characterized in that, The thickness D2 of the second reinforcing plate satisfies: 0.2mm≤D2≤0.3mm.

7. The Bluetooth antenna according to claim 1, characterized in that, The first connecting part is provided with a positioning hole.

8. A Bluetooth headset, characterized in that, include: The Bluetooth antenna according to any one of claims 1 to 7, the Bluetooth antenna includes a first connecting portion and a second connecting portion that are flexibly connected, the first connecting portion being provided with a connecting pad; The ear shell has an outer top wall and a side peripheral wall that are perpendicular to each other, and a receiving cavity is formed between the outer top wall and the side peripheral wall, and the Bluetooth antenna is disposed in the receiving cavity; A motherboard is disposed within the receiving cavity, and the motherboard is provided with a metal spring, which is connected to the connecting pad; The second connecting portion can be bent relative to the first connecting portion to the side wall.

9. The over-ear Bluetooth headset according to claim 8, characterized in that, A connecting rib is provided on the side of the outer top wall near the receiving cavity, and the side of the first connecting portion away from the connecting pad is connected to the connecting rib.

10. The over-ear Bluetooth headset according to claim 8, characterized in that, A positioning post is provided on the side of the outer top wall near the receiving cavity, and a positioning hole is provided on the first connecting part. The positioning post is configured to be inserted into the positioning hole.

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