Electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, and provides electronic equipment which is used for solving the problem that the overall thickness is affected by a layout mode of screen outgoing lines in traditional electronic equipment. The electronic equipment comprises a mainboard, a display screen and a screen outgoing line, the display screen is connected with the mainboard through the screen outgoing line, the electronic equipment further comprises a first device and a second device which are connected with the mainboard and the display screen, the first device comprises a non-thickness bottleneck region device, and the second device comprises a thickness bottleneck region device, the area where the screen outgoing line is located and the first device have an overlapping area in the thickness direction of the electronic equipment, and the area where the screen outgoing line is located and the second device are arranged in a staggered mode in the plane direction where the display screen is located. According to the layout mode of the screen outgoing line provided by the embodiment, the light and thin design of the whole machine can be realized on the premise of not influencing other characteristics of the electronic equipment, so that the use experience of a user is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the continuous development of science and technology, more and more electronic devices, such as mobile phones, tablets, and laptops, are widely used in people's daily lives and work, bringing great convenience. People not only have increasingly higher requirements for the performance of electronic devices in areas such as photography, heat dissipation, and power consumption, but also for their aesthetic appearance. How to achieve a slim and lightweight design without affecting other performance aspects of electronic devices is a pressing technical problem that needs to be solved. Utility Model Content

[0003] This application provides an electronic device that enables a thinner and lighter design.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] This application provides an electronic device, including a motherboard, a display screen, and a screen cable. The display screen is connected to the motherboard via the screen cable. The electronic device also includes a first device and a second device connected to the motherboard and the display screen. The first device includes a non-thickness bottleneck area device, and the second device includes a thickness bottleneck area device. The area where the screen cable is located overlaps with the first device in the thickness direction of the electronic device, and the area where the screen cable is located and the second device are offset in the plane direction of the display screen.

[0006] The electronic device provided in this application embodiment maximizes the utilization of internal space by overlapping the thickness of the area where the screen cable is located with the first device and avoiding misalignment between the screen cable and the second device, thereby making the electronic device thinner and achieving a lightweight design.

[0007] Optionally, the first device may be a device without light transmission requirements, and the second device may be a device with light transmission requirements; and / or, the first device may be a stress-sensitive device, and the second device may be a non-stress-sensitive device.

[0008] In some embodiments, the display screen includes a first short side and a second short side arranged opposite to each other, and a first long side and a second long side arranged opposite to each other. The screen cable is led out from the first short side and connected to the motherboard after being bent. A first device is disposed on the side closer to the first short side, and a second device is disposed on the side closer to the second short side.

[0009] Optionally, in this embodiment, the long and short sides of the display screen can be determined based on the physical shape of the display screen, with the two relatively longer sides designated as long sides and the two relatively shorter sides designated as short sides. When the lengths of the four edges of the display screen are relatively close, two opposite sides of the display screen can be designated as long sides and the other two opposite sides as short sides.

[0010] In this embodiment, the screen cable extends from the first short side of the display screen, which is the short side where the first device is located. Since the first device located on this first short side is not a thickness bottleneck device, even if the area where the screen cable is located overlaps with the first device in the thickness direction of the electronic device, it will not affect the overall thickness. Furthermore, the second device, which is a thickness bottleneck device, is located on the second short side, away from the location of the screen cable. Therefore, the screen cable will not occupy the thickness at the location of the second device, thus avoiding the core thickness bottleneck area of ​​the electronic device.

[0011] In some embodiments, the first device includes a first audio component, a screen component, a first light-transmitting component, and a second light-transmitting component; wherein the first audio component, screen component, first light-transmitting component, and second light-transmitting component are offset in the plane direction of the display screen and are closer to the first short side; the area where the screen cable exits has a partially or completely overlapping area with the first audio component, screen component, first light-transmitting component, and second light-transmitting component in the thickness direction of the electronic device, and the screen cable exits has a first cutout in the thickness direction of the electronic device, the first cutout being used to transmit through the first light-transmitting component or the second light-transmitting component; the area where the screen cable exits has no overlapping area with the second device in the thickness direction of the electronic device.

[0012] In this embodiment, by horizontally misaligning the screen cable with each component in the first device and ensuring no overlap with the second device in the thickness direction, a more reasonable layout is obtained. This maximizes the utilization of the internal space of the electronic device, thereby making the electronic device thinner and achieving a lightweight design.

[0013] In addition, for components that require light transmission, a hole is set in the corresponding area of ​​the screen's output line, so that the light-transmitting component can pass through the hole without affecting its normal operation.

[0014] In some embodiments, the electronic device further includes a mid-frame structure, the first device further includes a screen chip, the screen chip is disposed opposite to the first audio component, the mid-frame structure is disposed between the screen chip and the first audio component and is a steel sheet, the steel sheet is made of stainless steel with a thickness between 0.15mm and 0.35mm and a stiffness of elastic modulus greater than or equal to 200GPa.

[0015] In this embodiment, the original mid-frame between the first audio component and the screen chip is removed, and a thinner stainless steel sheet with higher rigidity (i.e., a thickness between 0.15mm and 0.35mm and a rigidity with an elastic modulus greater than or equal to 200GPa) is used to replace the original thicker aluminum alloy or magnesium alloy mid-frame structure material, thereby solving the thickness bottleneck problem of the whole machine caused by the relative arrangement of the first audio component and the screen chip.

[0016] In some embodiments, the first device further includes a first antenna plate, which is disposed on a side close to the first short side and is offset from the first audio component, screen component, first light-transmitting component and second light-transmitting component in the plane direction of the display screen. The first antenna plate in the area where the screen leads out has no overlapping area in the thickness direction of the electronic device.

[0017] As can be seen from this embodiment, the screen cable overlaps with some components in the first device in the thickness direction of the electronic device, while it does not overlap with other components in the first device in the thickness direction of the electronic device. This depends on the cable routing and area occupied by the screen cable. In the actual assembly process, this can be configured according to specific assembly requirements; this embodiment does not impose any limitations on this.

[0018] In some embodiments, the display screen includes a first short side and a second short side disposed opposite to each other, as well as a first long side and a second long side. The screen cable extends from the second short side and is connected to the motherboard after being bent. A first device is disposed on the side closer to the first short side, and a second device is disposed on the side closer to the second short side. The area where the screen cable is located avoids the second device.

[0019] In this embodiment, the screen cable is led out from the second short side of the display screen. The second short side is provided with a second device that serves as a thickness bottleneck device. When the screen cable is led out from this side, it avoids the second device so that it does not overlap with the second device in the thickness direction of the electronic device, thereby not affecting the overall thickness of the device.

[0020] In some embodiments, the first device further includes a second audio component and a screen component disposed near the second short side, the second device including a Type-C interface; wherein the second audio component, the screen component, and the Type-C interface are offset in the plane direction of the display screen; the screen cable has a partially or completely overlapping area with the second audio component and the screen component in the thickness direction of the electronic device, and the screen cable has a second cutout in the thickness direction of the electronic device, the second cutout being used to accommodate the Type-C interface.

[0021] In this embodiment, the area where the screen cable exits is located is overlapped with the first device in thickness, and a hole is made at the corresponding position of the screen cable exits and the second device. The second device is avoided by the hole, so that the screen cable exits and the second device will not interfere with each other when they are on the same side of the display screen.

[0022] In some embodiments, the electronic device further includes a battery; the motherboard is disposed on the side near the first long side, and the battery is disposed on the side near the second long side; the electronic device further includes structural reinforcement members, which are respectively disposed in a first receiving area between the motherboard and the first long side, a second receiving area between the motherboard and the battery, and a third receiving area between the battery and the second long side.

[0023] In this embodiment, a lightweight design of the entire device is achieved through a frame-like design of the structural reinforcement components. The original structural reinforcement ribs with wires extending along the long side can be replaced with battery functional components, increasing the overall competitiveness of the device. This frame-like structural reinforcement solution differs from existing methods on the market that rely on material reinforcement (aluminum alloy / titanium alloy) and increased area; it occupies less space, is the lightest, and still meets product requirements.

[0024] In some embodiments, if there is a device in the first device with a thickness greater than or equal to a second preset threshold, the area where the screen cable exits is located and the device with a thickness greater than or equal to the second preset threshold are misaligned in the plane direction where the display screen is located.

[0025] The second preset threshold can be determined based on the actual assembly thickness of the electronic device.

[0026] In some embodiments, the electronic device is a tablet computer with a size less than or equal to a preset size, wherein the preset size includes the long side of the electronic device ranging from 150mm to 250mm and the short side ranging from 100mm to 200mm.

[0027] The screen cable layout provided in this embodiment can be applied to all electronic devices that require a thinner and lighter design, such as small tablets or ultra-thin mobile phones. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0029] Figure 2 for Figure 1 Cross-sectional view along the AA direction;

[0030] Figure 3 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0031] Figure 4This is a schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0032] Figure 5 A schematic diagram of a screen cable layout provided in an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of the structure of a display screen in an electronic device provided in an embodiment of this application;

[0034] Figure 7 A schematic diagram of an electronic device with a second light-transmitting component disposed at a central position, according to an embodiment of this application;

[0035] Figure 8A This is a schematic diagram illustrating the relative positional relationship between the screen cable and the display screen according to an embodiment of this application;

[0036] Figure 8B A cross-sectional view along the thickness direction of the electronic device of the region where the second light-transmitting component is located, as provided in an embodiment of this application;

[0037] Figure 9 A schematic diagram of a screen cable layout provided in another embodiment of this application;

[0038] Figure 10 This is a schematic diagram illustrating the relative positional relationship between the screen cable and the display screen according to an embodiment of this application;

[0039] Figure 11 This is a schematic diagram illustrating the layout of the audio component and the screen chip according to an embodiment of this application;

[0040] Figure 12 This is a schematic diagram of a frame-type structural reinforcement provided in an embodiment of this application. Attached image description:

[0042] 101-Housing, 100-Mainboard, 200-Display, 300-Screen cable exit, 500-Mid-frame structure, 600-Battery, 700-Structural reinforcement, 301-Bending area, 302-Adapter area, 201-First short side, 202-Second short side, 203-First long side, 204-Second long side, 205-Avoidance area, 401-First audio component, 402-Screen device, 403-First light-transmitting component, 404-Second light-transmitting component, 405-First antenna board, 406-Second antenna board, 407-Second audio component, 408-Screen chip, 409-Type-C interface, 3011-First cutout, 3012-Second cutout, 501-Steel sheet, 701-First receiving area, 702-Second receiving area, 703-Third receiving area. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature.

[0045] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this application, it should be understood that the terms "inner", "outer", "side", "upper", "bottom", "front", "rear", etc., indicating the orientation or positional relationship are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0050] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0051] With the rapid development of computer technology, electronic devices (such as tablets and mobile phones) play an important role in people's daily work, home education, and audio-visual entertainment. Besides the functional characteristics of the electronic devices themselves, their appearance (such as a slim and lightweight design) is also a key factor for consumers when purchasing them. Whether commuting, in a coffee shop, or enjoying outdoor leisure, slim and lightweight electronic devices are often the first choice for people's leisure and work while out and about. Their slim and lightweight design not only gives electronic devices a stylish appearance but also reduces the burden of carrying them, making them more comfortable for long-term use and preventing additional physical strain on the user. Furthermore, slim and lightweight electronic devices usually mean the integration of more advanced technologies, providing powerful performance and rich functionality while maintaining a compact size, giving them a high-tech feel.

[0052] Currently, user needs for the actual user experience of electronic devices and the cost requirements of key components present greater challenges in the design of electronic devices. For example, the fixed dimensions of certain key components (such as flexible printed circuits (FPCs) connecting the screen and Type-C interfaces) limit the product's thickness and bezel design. For instance, the FPC, used to connect the screen (display) to the motherboard, typically needs to conform to industry standards in terms of width and thickness to ensure the compatibility and reliability of the electronic device. Therefore, to meet product requirements, the screen bezel of electronic devices cannot be made extremely narrow, thus affecting the screen-to-body ratio and overall appearance. Similarly, although the Type-C interface is smaller than traditional interfaces, its PCB connector height (approximately 3.2mm) and FPC trace width (usually requiring 4-6 layers) are difficult to further reduce due to industry standards (such as pin count and current carrying capacity). It is evident that the fixed dimensions of key components limit the thickness of electronic devices, and combined with the overall layout, the appearance of current electronic devices on the market needs further improvement.

[0053] One possible approach is to reduce the size of the device by compressing the space occupied by other functional components inside. However, this method can easily compromise other functional characteristics of the electronic device; for example, compressing the space where the battery is located can lead to a reduction in battery capacity.

[0054] Understandably, in electronic devices, the layout of the screen wiring is a core factor affecting the overall thinness, reliability, and display performance. Its design must balance multiple constraints, including mechanical strength, signal integrity, and space utilization. When other functional components within the electronic device cannot be structurally compressed, adjusting the screen wiring layout can be considered to achieve device thinning.

[0055] The screen cable connects the screen chip (also known as the driver chip) and the motherboard, and is typically located at one edge of the screen, which can be the bottom, top, or either side of the screen. The screen cable includes a bending area and a transition area. In this embodiment, the focus is on the impact of the bending area layout on the thickness of the electronic device. Unless otherwise specified, "screen cable" refers to the bending area of ​​the screen cable.

[0056] Currently, based on the relative positions of the screen cable and the Type-C interface, there are generally two layout methods for the screen cable. The following is a brief introduction to these two layout methods.

[0057] In one possible implementation, the screen wiring overlaps with the Type-interface in the thickness direction, see [link / reference]. Figure 1 and Figure 2 As shown in the figure. Among them, Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, relating to the structure of a candybar mobile phone. Figure 2 for Figure 1 The diagram shows a cross-sectional view of the electronic device along the AA direction. Figure 1 and Figure 2 As can be seen, in the structure of a candybar phone, the screen cable and the Type-C port overlap in the thickness direction of the electronic device. This is based on the phone's functionality and battery capacity requirements. The thickness bottleneck of a phone is mainly concentrated in the battery and motherboard layout area. Therefore, the overlap of the screen cable and the Type-C port in the thickness direction of the electronic device does not affect the overall thickness of the device, and at the same time, it can save internal layout space in the candybar phone.

[0058] However, this method is suitable for relatively thick candybar phones, which are generally about 8mm thick, and their thickness bottleneck is usually the battery area. It is not suitable for tablet products (where the battery is large and thin) or electronic devices where the thickness bottleneck includes Type-C interface. For example, if the screen cable and the Type-C interface overlap in the thickness direction of the electronic device, the thickness of the whole device will increase, thus affecting the thin and light characteristics of the whole device.

[0059] In another possible implementation, the screen cable exits completely opposite to the Type-C interface, meaning the area where the screen cable exits and the area where the Type-C interface is located do not intersect in the thickness direction of the electronic device. See also Figure 3 The diagram shown is a structural schematic of an electronic device according to another embodiment of this application, relating to the structure of a tablet computer. Based on the functional and usage requirements of a tablet computer, its thinness and lightness need to be significantly greater than that of a traditional smartphone, and its surface area also needs to be larger. For example... Figure 3 As shown, the screen cable routing is located on one long side of the tablet. Since there are no other major functional components on this side of the tablet, sufficient space can be provided for the screen cable routing. It is understood that the layout of the various components in this embodiment can also be applied to foldable devices; see [link to previous section]. Figure 4 As shown in the image. Compared to candybar phones, tablets or foldable phones generally have larger and thinner batteries. The overall thickness bottleneck increases the space occupied by the Type-C port / audio cable, so the layout of the screen cable exit can be referenced. Figure 3 as well as Figure 4 As shown, the screen cable exits from components in the core thickness bottleneck area, such as the Type-C interface.

[0060] However, in this method, the screen cable is led out from the long side of one side of the electronic device, which increases the length of the bending area. Especially when there is a thickness offset on one side of the bending area, the thickness offset of the entire bending area will increase significantly, and it will not be able to overlap with the thickness of the battery area. Therefore, the bending area needs to occupy additional space in the overall layout, resulting in an increase in the overall thickness of the electronic device.

[0061] As can be seen, all of the above different implementation methods have the problem of affecting the overall thickness of electronic devices. Therefore, the layout of the screen wiring in traditional electronic devices cannot achieve the goal of making electronic devices thinner and lighter.

[0062] Therefore, this application provides an electronic device to solve the problem that the layout of screen wiring in traditional electronic devices affects the overall thickness. The layout provided in this embodiment can achieve a thin and light design without affecting other characteristics of the electronic device, thereby improving the user experience.

[0063] Before introducing the technical solutions provided in the embodiments of this application, the relevant terms and concepts involved in the embodiments of this application will be briefly introduced first.

[0064] Display driver integrated circuit (DDIC): Also known simply as screen chip, it is the chip used to drive the screen to light up. Screen chips are made of fragile materials, usually glass, and are easily broken upon impact. Therefore, when placing screen chips inside electronic devices, sufficient clearance must be provided between the screen chip and other internal components.

[0065] In some embodiments, a single screen chip is provided within the electronic device to enable screen illumination. However, to improve the efficiency of screen brightness illumination, two screen chips can also be provided within the electronic device. For example, the two screen chips can be arranged sequentially along the length or width of the electronic device (e.g., for an electronic device with a foldable screen, it could be along the length of the screen when folded).

[0066] Screen cables, also known as screen ribbon cables, are used for data transmission within moving parts and areas. In the field of electronic devices, screen cables are the data cables connecting the mobile phone motherboard to the screen. Screen cables can be moved, bent, and twisted without damaging the wires and can conform to different shapes and special package sizes.

[0067] Long side of screen: refers to the longer edge of the physical shape of the display screen.

[0068] Short side of the screen: This refers to the shorter edge of the physical shape of the display screen. Electronic device displays typically consist of two opposite long sides and two short sides, with the long and short sides connected end-to-end. The length and width of the screen are usually directly related to its aspect ratio.

[0069] It should be noted that in some electronic devices, such as foldable phones in their unfolded state, the lengths of the four edges of the foldable phone are relatively close, making it difficult to accurately determine which side of the screen is the long side and which is the short side. Therefore, it is possible to designate two opposite edges of the screen as the long side and the other two opposite edges as the short side.

[0070] Long side screen cable: This refers to the screen cable being led out from the long side of the electronic device screen.

[0071] Short-side screen cable: This refers to a screen cable that extends from the short side of the screen of an electronic device.

[0072] Screen cable exit area: The area occupied by the screen cable. In this embodiment, the screen cable exit area can refer to the corresponding area formed by the transition area and the bending area of ​​the screen cable.

[0073] Thickness bottleneck components: These are key components that directly affect the overall thickness of electronic devices, such as batteries and Type-C interfaces.

[0074] Non-thickness bottleneck devices: These are devices that have a relatively small impact on the overall thickness of electronic devices, or whose thickness can be further optimized, such as motherboards, audio components, and sensors.

[0075] It should be understood that the same device may belong to different types in different electronic devices. For example, a Type-C interface may be a non-thickness bottleneck device in a candybar phone, but a thickness bottleneck device in a tablet computer.

[0076] The following describes the electronic device provided in the embodiments of this application.

[0077] The electronic device provided in this application embodiment includes a motherboard 100, a display screen 200, and a screen cable 300. The display screen 200 is connected to the motherboard 100 through the screen cable 300. The electronic device also includes a first device and a second device connected to the motherboard 100 and the display screen 200. The area where the screen cable 300 is located overlaps with the first device in the thickness direction of the electronic device, and the area where the screen cable 300 is located and the second device are offset in the plane direction of the display screen 200.

[0078] It should be noted that in this embodiment, "first device" and "second device" refer to a collective term for a certain type of device in an electronic device; it can be a single device or a class of devices. For example, the first device can be a non-thickness bottleneck device, and the second device can be a thickness bottleneck device; and / or, the first device can be a device without light transmission requirements, and the second device can be a device with light transmission requirements, such as a camera; and / or, the first device can be a stress-sensitive device, such as a DDIC, and the second device can be a non-stress-sensitive device.

[0079] The electronic device provided in this application embodiment achieves maximum internal space utilization by overlapping the screen outlet 300 area with the first device (such as a non-thickness bottleneck area device) in thickness, and staggering the screen outlet 300 with the second device (such as a thickness bottleneck area device) to avoid misalignment. This results in a thinner electronic device and a lighter, thinner design.

[0080] The following will combine Figures 5 to 10 The structure of the electronic device provided in the embodiments of this application will be explained by way of example.

[0081] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown below. Figure 5 As shown in the illustration, the electronic device provided in this application embodiment may include a housing 101, and a motherboard 100, a display screen 200, a screen cable 300, a first device, and a second device disposed within the housing 101. The first device includes a first audio component 401, a screen component 402 (e.g., a touch panel (TP) and a display processing device), a first light-transmitting component 403 (e.g., a rear camera) and a second light-transmitting component 404 (e.g., a front camera), a mid-frame structure 500, a first antenna board 405, a second antenna board 406, a second audio component 407, and a screen chip 408. The second device includes a battery 600 and a Type-C interface 409.

[0082] It should be noted that in this embodiment, the first device and the second device may also include more or fewer devices, or combine certain components, or be obtained by splitting certain components, or be obtained by different component arrangement methods. The components included in the first device and the second device illustrated in the embodiments of this application do not constitute a specific limitation on the first device and the second device.

[0083] The mid-frame structure 500 extends throughout the entire interior of the electronic device, primarily serving as structural support. It connects the outer casing 101 and the display screen 200 and is positioned parallel to the display screen 200. The battery 600 is located on the side of the mid-frame structure 500 furthest from the display screen 200, while the screen chip 408 and screen cable 300 are located on the side of the mid-frame structure 500 closest to the display screen 200. The screen chip 408 is attached to the screen cable 300, and both the screen chip 408 and the screen cable 300 are located on the side of the battery 600 closest to the display screen 200. The battery 600 is separated from the screen chip 408 and the screen cable 300 by the mid-frame structure 500.

[0084] The display screen 200 includes a first short side 201 and a second short side 202 that are arranged opposite to each other, and a first long side 203 and a second long side 204 that are arranged opposite to each other. See [link / reference] Figure 6 As shown in the figure. It should be noted that the long side and short side involved in this embodiment can be determined according to the length of the screen size of the electronic device, or they can be specified.

[0085] The motherboard 100 is located on the side of the display screen 200 near the first long side 203, and the battery 600 is adjacent to the motherboard 100 and located on the side of the display screen 200 near the second long side 204.

[0086] Combination Figure 6As shown, the screen cable 300 includes a bending area 301 and a connecting area 302. The connecting area 302 overlaps with the area where the battery 600 is located and passes through the area where the battery 600 is located, connecting to the motherboard 100 near the first long side 203 via an interface. The other end connects to the bending area 301. The planar structure formed by the connecting area 302 can be flexibly configured according to the actual assembly space of the electronic device. It can be elongated, Z-shaped, or L-shaped to avoid interference with other components in the electronic device. In the actual assembly process, it can be configured as needed; this embodiment does not impose any limitations on this. One end of the bending area 301 extends from one edge of the display screen 200 and connects to the screen chip 408, and then extends from the screen chip 408 to connect to the connecting area 302.

[0087] The following section first introduces the relative positional relationship between the first device and the screen output line 300.

[0088] In this embodiment, the screen cable 300 is led out from the first short side 201, and after being bent, it forms a bending area 301. It is connected to the transition area 302 and the motherboard 100 through the screen chip 408. The area where the screen cable 300 is located overlaps with the various components in the first device in the thickness direction of the electronic device, and is offset from the various components in the second device in the plane direction where the display screen 200 is located.

[0089] In one possible implementation of this embodiment, combined with Figure 5 as well as Figure 6 As shown, the first audio component 401, screen component 402, first light-transmitting component 403, second light-transmitting component 404, and first antenna plate 405 in the first device are horizontally offset in the plane of the display screen 200 and are closer to the first short side 201; the second antenna plate 406 and second audio component 407 are horizontally offset from the other components in the first device in the plane of the display screen 200 and are closer to the second short side 202. The screen cable 300 extends from the first short side 201 and has a partially or completely overlapping area with the first audio component 401, screen component 402, and first light-transmitting component 403 in the thickness direction of the electronic device, such as... Figure 5 and Figure 6 The gray area is shown.

[0090] In some embodiments, the area where the screen exit line 300 is located has a first punch-hole 3011 in the thickness direction of the electronic device. The first punch-hole 3011 is used to allow the first light-transmitting component 403 or the second light-transmitting component 404 to pass through. The number of first punch-holes 3011 can be one or more, depending on the actual number of light-transmitting components assembled in the electronic device; this embodiment does not impose a limitation on this. When there are two first punch-holes 3011, one first punch-hole 3011 can be used to allow the first light-transmitting component 403 to pass through, and the other first punch-hole 3011 can be used to allow the second light-transmitting component 404 to pass through. Optionally, the first punch-hole 3011 can also be used not only to allow the light-transmitting component to pass through, but also to allow other components that overlap with the screen exit line 300 to pass through.

[0091] It is understandable that light-transmitting components in electronic devices, such as front-facing or rear-facing cameras, may be located at the corner of one side (i.e., the side of the first short side 201) in the top direction of the display screen 200, or they may be located in the center in the top direction of the electronic device. During the assembly process, there can be multiple assembly methods. This means that when the screen exit cable 300 and the light-transmitting component are located on the same side of the display screen 200, the area where the screen exit cable 300 is located may block the light-transmitting component, causing it to malfunction. However, in some cases, due to the requirements of the electronic device's appearance or assembly, the location of the light-transmitting component cannot be significantly altered. Therefore, in this embodiment, for components requiring light transmission, a first cutout 3011 is provided in the bending area 301 of the screen exit cable 300 so that the light-transmitting component can pass through, avoiding affecting its normal operation. This solves the bottleneck of overall device thickness stacking while also achieving optimal device layout.

[0092] For example, see Figure 7 As shown, the first light-transmitting component 403 is disposed at the corner of the first short side 201 of the display screen 200, and the area where the screen exit line 300 is located does not overlap with the area where the first light-transmitting component 403 is located in the thickness direction, or partially overlaps in the thickness direction but does not affect the normal operation of the first light-transmitting component 403. The second light-transmitting component 404 is disposed in the center of the display screen near the first short side 201, and the area where the screen exit line 300 is located overlaps with the area where the second light-transmitting component 404 is located in the thickness direction. See also Figure 8AThe diagram shown illustrates the relative positional relationship between the screen cable and the display screen according to an embodiment of this application. A first hole 3011 is formed at the corresponding position in the thickness direction of the screen cable 300 and the second light-transmitting component 404. The diameter of the first hole 3011 can be greater than or equal to the diameter of the second light-transmitting component 404 (assuming the second light-transmitting component is circular), allowing the second light-transmitting component to pass through the first hole 3011 of the screen cable 300 without affecting its normal operation. Simultaneously, a clearance area 205 is provided at the corresponding position of the display screen 200 and the second light-transmitting component 404, allowing the second light-transmitting component 404 to also pass through the clearance area 205 of the display screen 200.

[0093] See Figure 8B The image shown is a cross-sectional view along the thickness direction of the electronic device in the region where the second light-transmitting component 404 is located, according to an embodiment of this application. Figure 8B As can be seen, the area where the screen cable 300 is located has a perforated structure at the position corresponding to the second light-transmitting component 404. The diameter of the perforated structure is larger than the diameter of the second light-transmitting component 404, and the second light-transmitting component 404 can pass through the perforated part, so that the normal operation of the second light-transmitting component 404 is not affected after the screen cable 300 is led out from the first short side 201 of the display screen 200.

[0094] In some embodiments, the screen exit 300 forms the first punch-hole 3011 by avoiding the cable. That is, the cable layout can bypass the location of the first punch-hole 3011 while maintaining the cable function, thereby forming the first punch-hole 3011.

[0095] It should be noted that the corresponding position involved in this embodiment refers to the position corresponding to the screen output line 300 in the thickness direction of the electronic device, and the thickness direction of the electronic device refers to the direction perpendicular to the plane where the display screen 200 is located.

[0096] In this embodiment, the screen cable 300 is led out from the first short side 201 of the display screen 200. There are many components located near the first short side 201 in the electronic device, including not only some structural components of the first device, but also other components such as fingerprint sensor, power button, volume button and earpiece on the first short side 201. Therefore, when the screen cable 300 is led out from the first short side 201, the layout is more complex, and there are many components that need to be overlapped and avoided. It is necessary to consider not only the layout with the first device, but also the layout with other devices.

[0097] In some embodiments, if the first device contains a component with a thickness greater than or equal to a second preset threshold, the area where the screen cable exits is located is offset from the component with a thickness greater than or equal to the second preset threshold in the plane direction of the display screen. The second preset threshold can be determined based on the actual assembly thickness of the electronic device.

[0098] For example, if some components in the first device, which is offset from the screen exit cable 300 in the thickness direction of the electronic device, have protruding or recessed structures, the screen exit cable 300 can be adaptively adjusted to accommodate the arrangement of each component. For instance, for components with protruding structures, a recessed structure can be provided at the corresponding position of the screen exit cable 300 to accommodate the protruding components. Alternatively, the rear camera of the electronic device may include multiple cameras, and the thickness of each camera may be different. In this case, the screen exit cable 300 can overlap with the thinner camera in the thickness direction, while avoiding the thicker camera. Furthermore, if the area where the screen exit cable 300 is located overlaps with the area where the motherboard 100 is located, in order to achieve a thinner and lighter design for the entire device, other components cannot be placed in this overlapping area, or special designs are required if other components are placed there, such as punch-hole designs or modifications to the bending path.

[0099] In some embodiments, if the screen assembly 402 itself is thick, it needs to be arranged to avoid overlap with the motherboard 100 to meet the thickness requirements of the electronic device. Therefore, when there is an overlap between a thick device and the screen cable 300 in the thickness direction, an avoidance arrangement is required.

[0100] Next, we will introduce the relative positional relationship between the second device and the screen output line 300.

[0101] This embodiment takes a second device including a battery 600 and a Type-C interface 409 as an example. The placement of the battery 600 in the electronic device has been described in previous embodiments and will not be repeated here. The Type-C interface 409 in the second device is located on one side of the second short side 202 of the display screen 200. In this embodiment, since the screen cable 300 is led out from the first short side 201 of the display screen 200 and does not intersect with the area where the Type-C interface 409 is located, it will not occupy the thickness of the area where the Type-C interface 409 is located, thereby avoiding the core thickness bottleneck area of ​​the electronic device.

[0102] The screen cable exiting the device 300 layout provided in this embodiment improves upon the issue of increased thickness and additional space requirements associated with long-side cable exiting layouts, which rely on the bend. This is achieved by exiting the cable at the first short side 201 of the display screen 200. Furthermore, the cable exiting the device 300, after exiting from the first short side 201 and undergoing a bend, can directly connect to the adapter area 302 without needing to avoid or cross over adapter boards of other components. This reduces space requirements, allowing for more design flexibility for other components, such as the heat sink for cooling. In this case, the heat sink can be positioned near the second short side 202 to provide cooling for components like the Type-C interface. Compared to methods where the cable exiting from the second short side 202 requires staggering the Type-C and battery adapters, which necessitates a larger space and involves a more complex connection process, increasing the overall thickness, this approach enables a thinner and lighter design for electronic devices.

[0103] In addition, in this embodiment, the position of the screen cable 300 avoids the shape of the components (such as the Type-C interface 409) in the thickness bottleneck area of ​​the electronic device. In this example, the screen cable 300 and the components in the thickness bottleneck area are staggered to avoid the shape. When the screen cable 300 and other components in the first device have overlapping areas in the thickness direction of the electronic device, the screen cable 300 avoids the shape of other components with light transmission requirements (such as the second light-transmitting device, which may be the front camera, etc.) by making partial holes. This improves the space utilization of the whole device without affecting the normal function of the internal components of the electronic device.

[0104] As shown in the foregoing embodiments, the screen cable 300 can be designed to avoid devices in the thickness bottleneck area.

[0105] Based on this, this application provides another layout for the screen cable exit, which uses a cutout design to avoid the screen cable exit 300 from the components in the thickness bottleneck area, so that the exit position of the screen cable exit 300 can be set in the area where the components in the thickness bottleneck area are located. See [link to relevant documentation]. Figure 9 As shown. Figure 9 As shown, as another implementation of this application embodiment, the layout of the screen output cable 300 provided in this embodiment is similar to... Figure 5 The layout of the screen cable 300 shown is different in that the screen cable 300 is led out from the second short side 202 of the display screen 200, which is the side where the Type-C interface 409 in the second device is located.

[0106] In this embodiment, since the area where the screen cable 300 is located overlaps with the location of the Type-C interface 409, a hole-cutting design can be implemented at the corresponding location of the Type-C interface in the area where the screen cable is located to avoid this overlap.

[0107] For example, see Figure 10 As shown, the screen cable 300 extends from the second short side 202, bends, and is directly soldered to the screen chip 408. A second cutout 3012 is provided at the corresponding position of the bend area 301 and the Type-C interface 409. This second cutout 3012 avoids the Type-C interface 409, ensuring that the screen cable 300 and the Type-C interface 409 do not interfere with each other when they are on the same side of the display screen 200. The size and shape of the second cutout 3012 can be determined according to the shape and size of the Type-C interface 409 that needs to be avoided. This method allows the bend area 301 of the screen cable 300 and the Type-C interface 409 to overlap in the thickness direction, achieving a reduction in the overall thickness of the device without affecting the position and normal operation of the Type-C interface 409.

[0108] In one implementation of this embodiment, combined with Figure 9 As shown in the illustration, in this embodiment, the screen assembly 402 and the second audio assembly 407 in the first device are positioned on the side of the display screen 200 near the second short side 202. That is, the area where the screen assembly 402 and the second audio assembly 407 are located overlaps with the area where the screen cable 300 is located. In this case, the area where the screen cable 300 is located overlaps with the area where the screen assembly 402 and the second audio assembly 407 in the thickness direction of the electronic device. Since the screen assembly 402 and the second audio assembly 407 are not thickness bottleneck devices in the electronic device, the overlap between the area where the screen cable 300 is located and the area where the screen assembly 402 and the second audio assembly 407 are located in the thickness direction of the electronic device will not affect the overall thickness.

[0109] In the technical solution provided in this embodiment, for some large components in electronic devices that cannot be misaligned in the horizontal direction of the plane where the display screen 200 is located due to space limitations, assuming that the first audio component 401 and the screen chip 408 cannot be misaligned in the horizontal direction of the plane where the display screen 200 is located, the structural components in this area can be spliced ​​together to avoid misalignment, and the original thicker aluminum alloy or magnesium alloy material can be replaced with thinner stainless steel material, thereby solving the bottleneck of the overall thickness of the device.

[0110] For example, see Figure 11As shown, the areas where the screen output cable 300 and the screen chip 408 are located correspond to the areas where the first audio component 401 is located in the thickness direction of the electronic device, and the two cannot be partially or completely offset in the horizontal direction. In this case, since the first audio component 401 itself is a vibrating device, a large cavity is required to meet its vibration space during audio output. However, the screen chip 408, located on top of the first audio component 401, is made of glass and is fragile after being hit or pressed hard. This results in the mid-frame structure 500 between the first audio component 401 and the screen chip 408 having a certain thickness to withstand the pressure generated by the top screen and the vibration interference generated by the bottom first audio component 401 when it outputs sound. The thickness of the mid-frame structure 500, plus the thickness of the first audio component 401 itself and the thickness of the required vibration space, leads to an increase in the overall thickness of the electronic device. In this embodiment, the original mid-frame between the first audio component 401 and the screen chip 408 is removed, and a thinner stainless steel sheet 501 with higher rigidity (i.e., thickness within a preset range and rigidity greater than a first preset threshold) replaces the original thicker aluminum alloy or magnesium alloy mid-frame material, thereby solving the problem of overall device thickness bottleneck. The thickness of the steel sheet 501 can range from 0.15mm to 0.35mm, and the rigidity can range from an elastic modulus greater than or equal to 200GPa.

[0111] The layout of the screen cable 300 extending from the two short sides of the display screen 200 provided in this application embodiment not only enables a thinner and lighter design of the electronic device without affecting its performance, reducing the overall thickness of the product by 0.6mm, but also facilitates production line reuse. Furthermore, by extending the screen cable 300 from the two short sides of the display screen 200, the number of screen chips 408 required can be reduced at the same resolution, thereby saving equipment costs.

[0112] The above describes the layout of various types of devices in an electronic device when the screen cable 300 is led out from the two short sides of the display screen 200, as provided in the embodiments of this application.

[0113] It should be understood that in traditional technical solutions, the screen cable exits from one of the long sides of the display screen. Taking the second long side as an example, combined with... Figure 3 As shown, since there are no other major functional components on the second long side of the electronic device, sufficient space can be provided for the screen cable exit. Furthermore, when assembling the screen cable exit on the second long side, a thicker and stronger structural reinforcing rib can be used to wrap the screen cable. This serves two purposes: protecting the screen cable and strengthening the overall structural strength of the device, thus eliminating the need for other special designs.

[0114] In the technical solution provided in this application embodiment, the screen exit cable 300 is positioned on the two short sides of the display screen 200, thereby freeing up the area on the first long side previously used for the screen exit cable 300 for use by other functional components. For example, with the battery 600 capacity remaining unchanged, the freed-up area of ​​the screen exit cable 300 can be added to the battery 600 to maximize the area of ​​the battery 600 and minimize its thickness; or, with the battery 600 thickness remaining unchanged, the freed-up area of ​​the screen exit cable 300 can be added to the battery 600 to increase its area, thereby increasing its battery life. This layout allows for a capacity increase of over 10% in the battery 600, enhancing the overall competitiveness of the device. In other implementations of this embodiment, assuming the freed-up area is allocated to the motherboard 100, a single-sided layout and reduced layer / level of the motherboard 100 can be achieved, thereby reducing the overall cost of the device.

[0115] Meanwhile, in this embodiment, see Figure 12 As shown, the mid-frame structure 500 between the battery 600 and the second long side 204 is removed, and a structural reinforcement 700 with a stiffness greater than a first preset threshold and a small area is embedded to provide overall rigidity. This compensates for the impact on overall rigidity caused by the removal of the structural reinforcement ribs previously used to wrap the screen cable 300 and reinforce overall rigidity. After the structural reinforcement 700 is embedded, it has good rigidity and is thin, thus reducing the overall thickness of the device.

[0116] In some embodiments, structural reinforcement members 700 are respectively disposed in a first receiving area 701 between the motherboard 100 and the first long side 203, a second receiving area 702 between the motherboard 100 and the battery 600, and a third receiving area 703 between the battery and the second long side 204. In this embodiment, by setting frame-type structural reinforcement members 700 in the first receiving area 701, the second receiving area 702, and the third receiving area 703, the side space between each component (such as the battery compartment frame) is utilized, and high-strength reinforcing material is inlaid in the middle, occupying a very small area to improve the rigidity of the whole machine. In addition, based on the high-strength reinforcing material inlaid in the side space, the area between each structural reinforcement member 700 (for example, the middle frame area overlapping with the part where the motherboard 100 is located) can be hollowed out to reduce weight without affecting the overall performance of the machine, thereby reducing the weight of the device.

[0117] In this embodiment, the lightweight design of the entire device is achieved through the frame design of the structural reinforcement component 700. The original structural reinforcement ribs with wires extending along the long side are replaced with battery functional components, increasing the overall competitiveness of the device. The frame-type structural reinforcement component 700 solution differs from existing methods on the market that use material reinforcement (aluminum alloy / titanium alloy) and increase area, occupying less space, being the lightest, and still meeting product requirements.

[0118] It is understood that the structures and layouts illustrated in the embodiments of this application do not constitute a specific limitation on the various devices in the electronic device. In other embodiments of this application, the electronic device may adopt various different layouts according to the layout ideas provided in the embodiments of this application, and this embodiment does not impose any restrictions on these layouts.

[0119] The layout provided in the above embodiments of this application can also be applied to various electronic devices that require thinness and lightness, such as mobile phones, tablets, laptops, or augmented reality (AR) / virtual reality (VR) terminal devices.

[0120] Optionally, the electronic device provided in this application embodiment can be a tablet computer with a size smaller than or equal to a preset size, i.e., a small-sized tablet computer. The preset size includes a long side of the tablet computer ranging from 150mm to 250mm and a short side ranging from 100mm to 200mm.

[0121] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0122] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An electronic device, comprising: The device includes a motherboard (100), a display screen (200), and a screen cable (300). The display screen (200) is connected to the motherboard (100) through the screen cable (300). The electronic device also includes a first device and a second device connected to the motherboard (100) and the display screen (200). The first device includes a non-thickness bottleneck area device, and the second device includes a thickness bottleneck area device. The area where the screen cable (300) is located overlaps with the area of ​​the first device in the thickness direction of the electronic device, and the area where the screen cable (300) is located is offset from the area of ​​the second device in the plane direction of the display screen (200).

2. The electronic device of claim 1, wherein, The display screen (200) includes a first short side (201) and a second short side (202) arranged opposite to each other, and a first long side (203) and a second long side (204) arranged opposite to each other. The screen cable (300) is led out from the first short side (201) and connected to the motherboard (100) after being bent. The first device is disposed on the side closer to the first short side (201), and the second device is disposed on the side closer to the second short side (202).

3. The electronic device of claim 2, wherein, The first device includes a first audio component (401), a screen component (402), a first light-transmitting component (403), and a second light-transmitting component (404); The first audio component (401), the screen component (402), the first light-transmitting component (403), and the second light-transmitting component (404) are offset in the plane direction of the display screen (200) and are closer to the first short side (201). The area where the screen cable (300) is located has a partially or completely overlapping area with the first audio component (401), the screen component (402), the first light-transmitting component (403), and the second light-transmitting component (404) in the thickness direction of the electronic device, and the screen cable (300) has a first cutout (3011) in the thickness direction of the electronic device, the first cutout (3011) being used to allow the first light-transmitting component (403) or the second light-transmitting component (404) to pass through; The area where the screen output line (300) is located does not overlap with the area of ​​the second device in the thickness direction of the electronic device.

4. The electronic device of claim 3, wherein, The electronic device further includes a mid-frame structure (500), and the first device further includes a screen chip (408). The screen chip (408) is disposed opposite to the first audio component (401). The mid-frame structure (500) is disposed between the screen chip (408) and the first audio component (401) and is a steel sheet (501). The steel sheet (501) is made of stainless steel with a thickness between 0.15mm and 0.35mm and a stiffness of elastic modulus greater than or equal to 200GPa.

5. The electronic device of claim 3 or 4, wherein, The first device further includes a first antenna plate (405), which is disposed on a side close to the first short side (201) and is offset from the first audio component (401), the screen component (402), the first light-transmitting component (403) and the second light-transmitting component (404) in the plane direction of the display screen (200). The first antenna plate (405) in the area where the screen line (300) is located has no overlapping area in the thickness direction of the electronic device.

6. The electronic device of claim 1, wherein, The display screen (200) includes a first short side (201) and a second short side (202) arranged opposite to each other, and a first long side (203) and a second long side (204) arranged opposite to each other. The screen cable (300) is led out from the second short side (202) and connected to the motherboard (100) after being bent. The first device is disposed on the side closer to the first short side (201), and the second device is disposed on the side closer to the second short side (202). The area where the screen cable (300) is located avoids the second device.

7. The electronic device of claim 6, wherein, The first device further includes a second audio component (407) and a screen component (402) disposed on the side near the second short side (202), the second device including a Type-C interface (409); The second audio component (407), the screen component (402), and the Type-C interface (409) are offset in the plane direction of the display screen (200); The screen cable (300) has a partially or completely overlapping area with the second audio component (407) and the screen component (402) in the thickness direction of the electronic device, and the screen cable (300) has a second cutout (3012) in the thickness direction of the electronic device, the second cutout (3012) being used to accommodate the Type-C interface (409).

8. The electronic device according to any one of claims 2 to 7, characterized by The electronic device also includes a battery (600); The motherboard (100) is located on the side closer to the first long side (203), and the battery (600) is located on the side closer to the second long side (204); The electronic device further includes a structural reinforcement (700), which is respectively disposed in a first receiving area (701) between the motherboard (100) and the first long side (203), a second receiving area (702) between the motherboard (100) and the battery (600), and a third receiving area (703) between the battery and the second long side (204).

9. The electronic device according to any one of claims 1 to 8, characterized by If there is a device in the first device with a thickness greater than or equal to the second preset threshold, the area where the screen line (300) is located is offset from the device with a thickness greater than or equal to the second preset threshold in the plane direction where the display screen (200) is located.

10. The electronic device of any of claims 1-9, wherein, The electronic device is a tablet computer with a size less than or equal to a preset size, the preset size including a long side of the electronic device with a value range of 150mm-250mm and a short side with a value range of 100mm-200mm.

Images