Wafer glue thickness detection device

Abstract

The utility model relates to the technical field of wafer photoetching detection devices, in particular to a wafer glue thickness detection device which comprises a detection platform and an irradiation platform arranged on the upper side of the detection platform, the detection platform is used for fixing a wafer, and the irradiation platform is movably provided with a mounting plate. A laser detection assembly is arranged on the side, facing the detection platform, of the mounting plate and used for measuring the distance between the laser detection assembly and the lowest position of the upper surface of the wafer. The wafer detection device has the following effects that the laser detection assembly is used for emitting corresponding laser towards the wafer, the laser irradiates the surface of the wafer or the opening and is received by the laser detection assembly again after being emitted, and the mounting plate completely irradiates the surface of the wafer according to a pre-track, so that the distance between the emitting end and the lowest position of the wafer is measured; and the abnormal region is detected again subsequently, which is relatively simple and accurate.

Description

Technical Field

[0001] This application relates to the technical field of wafer photolithography inspection equipment, and in particular to a wafer resist thickness inspection equipment. Background Technology

[0002] The formation of the CD aperture depends on several key steps in the photolithography process:

[0003] Photoresist Coating: A photosensitive material (photoresist) is uniformly coated onto the wafer surface. Exposure: The design pattern is projected onto the photoresist using ultraviolet (UV) or extreme ultraviolet (EUV) light through a photomask. The chemical properties of the exposed areas change. Development: The photoresist in the exposed areas is dissolved, forming the desired pattern openings (i.e., CD openings). Unexposed areas are retained to protect against subsequent etching or electroplating steps. Post-processing: Baking enhances the mechanical stability of the photoresist.

[0004] The lithography process may result in CD aperture abnormalities (not open or not fully open). After lithography, it is necessary to check whether the above abnormalities occur. At present, the main detection method is to select points in special areas by microscope, which may miss abnormal areas. However, if the number of test points is increased, the probability of missed detection will be reduced, but the test time will be longer, which urgently needs to be optimized. Utility Model Content

[0005] To balance efficiency and accuracy in detecting resist thickness, this application provides a wafer resist thickness detection device.

[0006] This application provides a wafer resist thickness detection device, which adopts the following technical solution: A wafer resist thickness detection device includes a detection platform and an irradiation platform disposed on the upper side of the detection platform. The detection platform is used to fix the wafer. The irradiation platform is movably disposed with a mounting plate. A laser detection component is disposed on the side of the mounting plate facing the detection platform. The laser detection component is used to measure the distance between itself and the lowest point of the upper surface of the wafer.

[0007] By adopting the above technical solution, the laser detection component is used to emit a corresponding laser towards the wafer. After the laser irradiates the wafer surface or the opening, it is received again by the laser detection component. The mounting plate completely irradiates the wafer surface according to the pre-set trajectory, thereby measuring the distance between the emitting end and the lowest point of the wafer. If all distances are the same, the opening is not open. If two distances are detected, the opening is complete. If more than three distances are detected, it indicates that there are two situations: complete opening and incomplete opening. Subsequent detection of abnormal areas is simple and accurate.

[0008] Preferably, the laser detection component includes multiple sets of transmitters and receivers, and a plurality of laser detection components are arrayed on the mounting plate.

[0009] Preferably, a movable plate is movably disposed on the irradiation platform, and two slide rails are provided at intervals on the side of the movable plate near the detection platform. The two sides of the mounting plate are respectively inserted into and connected to the two slide rails, and the slide rails are provided with fasteners for fixing the mounting plate.

[0010] By adopting the above technical solution, for different wafer structures, the corresponding mounting plate can be disassembled and replaced using fasteners.

[0011] Preferably, the fixing component includes a fixing bolt, and the inner wall of the slide rail near the movable plate is provided with a fixing screw hole for the fixing bolt to connect, and the inner wall of the slide rail away from the movable plate and the edge of the mounting plate are provided with through holes for the fixing bolt to pass through.

[0012] Preferably, the mounting plate extends a certain distance along the length of the slide rail to form an extension portion for picking up the mounting plate.

[0013] By adopting the above technical solution, the extensions at both ends of the mounting plate can be easily removed, and when removing them, the laser detection component located in the middle can be avoided.

[0014] Preferably, the inner wall of the slide rail near the movable plate has a positioning post, the inner wall of the slide rail has a positioning hole for the positioning post to be inserted, a positioning spring is provided in the positioning hole, one end of the positioning spring is connected to the bottom of the positioning hole, and the other end is connected to the positioning post, and the mounting plate has a groove for the positioning post to be inserted.

[0015] By adopting the above technical solution, due to the existence of the limiting part, it is also necessary to ensure that the mounting plate is installed in the predetermined position each time during installation. When the mounting plate is inserted, the positioning spring can push the positioning post into the groove, thereby achieving the function of pre-positioning.

[0016] Preferably, the portion of the positioning post exposed inside the slide is hemispherical.

[0017] Preferably, there is a gap between the movable plate and the mounting plate.

[0018] By adopting the above technical solution, the gap between the two allows the component located on the side of the mounting plate away from the wafer to have space for connection lines, thus creating a clearance.

[0019] Preferably, the irradiation platform has symmetrically arranged fixed tracks, and the movable plate has a slider that is slidably disposed within the fixed tracks on the side near the irradiation platform.

[0020] Preferably, the fixed track extends to opposite sides on both sides, and the slider has accommodating slots on both sides for the fixed track to be embedded in.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. The laser detection component is used to emit a corresponding laser towards the wafer. After the laser shines on the wafer surface or into the opening, it is received again by the laser detection component. The mounting plate completely illuminates the wafer surface according to the pre-set trajectory, thereby measuring the distance between the emitting end and the lowest point of the wafer. If all distances are the same, the opening is not open. If two distances are detected, the opening is complete. If more than three distances are detected, it indicates that there are two situations: complete opening and incomplete opening. The abnormal area can then be detected again, which is relatively simple and accurate.

[0023] 2. Due to the presence of a limiting part, it is necessary to ensure that the mounting plate is installed in the predetermined position each time during installation. When the mounting plate is inserted, the positioning spring can push the positioning post into the groove, thereby achieving the function of pre-positioning. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of this application;

[0025] Figure 2 This is a partial structural diagram of this application;

[0026] Figure 3 This is a partial explosion diagram of this application;

[0027] Figure 4 This is a partial sectional view of this application.

[0028] Explanation of reference numerals in the attached drawings: 100, detection platform; 110, irradiation platform; 111, mounting plate; 112, laser detection assembly; 113, transmitter; 114, receiver; 115, movable plate; 116, slide rail; 120, fixing bolt; 121, fixing screw hole; 122, through hole; 123, extension; 124, positioning post; 125, positioning hole; 126, positioning spring; 127, groove; 130, fixing track; 131, slider; 132, accommodating long slot; 133, protrusion. Detailed Implementation

[0029] The present application will be further described in detail below with reference to the accompanying drawings.

[0030] This application discloses a wafer resist thickness detection device, referring to... Figure 1 , Figure 2 It includes a detection platform 100 and an irradiation platform 110 arranged parallel to each other from bottom to top. The detection platform 100 is used to fix the wafer, and the wafer has a fixed mounting position for easy detection. The irradiation platform 110 is slidably provided with a mounting plate 111 along its length.

[0031] Reference Figure 2 , Figure 3 A laser detection component 112 is disposed on the side of the mounting plate 111 facing the detection platform 100. The laser detection component 112 is used to measure the distance between itself and the lowest point of the wafer. Specifically, the laser detection component 112 includes multiple sets of emitters 113 and receivers 114, and several laser detection components 112 are arrayed on the mounting plate 111. The emitters 113 emit corresponding lasers, which are reflected on the wafer surface or inside the opening, and then received by the receivers 114, thereby measuring the distance h between itself and the lowest point of the wafer. The value generated by h is then used to determine the wafer opening status. The mounting plate 111 comprehensively detects the wafer along a predetermined route. The arrangement of the laser detection components 112 can be a single column, a matrix arrangement, etc. It is worth noting that the type of laser used in this embodiment can meet the requirement of penetrating into the opening, which will not be elaborated further here.

[0032] In this embodiment, the laser detection component 112 is arranged in a rectangular array. After obtaining the h value, if all values ​​are the same distance, the opening is not open. If two distances are detected, the opening is complete. If more than three distances are detected, it indicates that there are two situations: complete opening and incomplete opening. The abnormal area will be detected again. If the arrangement of the rectangular array may detect the distance h between the laser detection component 112 and the detection platform 100, this distance h needs to be filtered out.

[0033] To inspect wafers of different structural sizes, a movable plate 115 is movably mounted on the irradiation platform 110. Two slide rails 116 are provided on the side of the movable plate 115 closest to the inspection platform 100. A mounting plate 111 is inserted into and connected to each of the two slide rails 116. The slide rails 116 are equipped with fixing components for securing the mounting plate 111. The fixing components include fixing bolts 120. The inner wall of the slide rail 116 closest to the movable plate 115 has fixing screw holes 121 for the fixing bolts 120 to connect to. The inner wall of the slide rail 116 furthest from the movable plate 115 and the edge of the mounting plate 111 have through holes 122 for the fixing bolts 120 to pass through. After the mounting plate 111 is slid to the designated position, the fixing bolts 120 are inserted into the through holes 122, confining the mounting plate 111 within the slide rail 116, while simultaneously being threaded into the fixing screw holes 121. In this embodiment, in order to allow the connecting parts on the side of the mounting plate 111 away from the wafer to be avoided, there is a gap between the movable plate 115 and the mounting plate 111.

[0034] Reference Figure 1 The mounting plate 111 extends a distance along the length of the slide rail 116 to form an extension 123, in order to avoid direct contact with the laser detection component 112 when the mounting plate 111 is picked up.

[0035] Reference Figure 3 , Figure 4The presence of the extension 123 makes it difficult for the through hole 122 on the mounting plate 111 and the through hole 122 on the slide rail 116 to align when the mounting plate 111 is inserted. To achieve pre-positioning, the inner wall of the slide rail 116 near the movable plate 115 has a positioning post 124, and the inner wall of the slide rail 116 has a positioning hole 125 for the positioning post 124 to be inserted. A positioning spring 126 is provided in the positioning hole 125. One end of the positioning spring 126 is fixedly connected to the bottom of the positioning hole 125, and the other end is fixedly connected to the positioning post 124. At the same time, the mounting plate 111 has a groove 127 for the positioning post 124 to be inserted. In this embodiment, the portion of the positioning post 124 exposed inside the slide rail 116 is hemispherical. During the process of the mounting plate 111 being inserted into the slide rail 116, the end of the positioning post 124 abuts against the mounting plate 111. When the positioning hole 125 aligns with the groove 127, the positioning post 124 can slide within the positioning hole 125 and eventually embed itself into the groove 127. At this point, the two through holes 122 are engaged, allowing the fixing bolt 120 to be installed.

[0036] Reference Figure 2 , Figure 4 In this embodiment, the movable plate 115 slides along a single horizontal direction above the detection platform 100. In other embodiments, it can move in multiple directions or along multiple tracks. The irradiation platform 110 has symmetrically arranged fixed tracks 130, and the movable plate 115 has a slider 131 slidably disposed within the fixed tracks 130 on the side near the irradiation platform 110. Specifically, the two inner walls of the fixed tracks 130 protrude to opposite sides to form ridges 133, and the slider 131 has elongated grooves 132 on both sides for the ridges 133 to be inserted. The movable plate 115 can be driven by a motor gear or by a lead screw device.

[0037] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer resist thickness detection device, characterized in that: The device includes a detection platform (100) and an irradiation platform (110) disposed on the upper side of the detection platform (100). The detection platform (100) is used to fix the wafer. The irradiation platform (110) is movably provided with a mounting plate (111). A laser detection component (112) is disposed on the side of the mounting plate (111) facing the detection platform (100). The laser detection component (112) is used to measure the distance between itself and the lowest point of the upper surface of the wafer.

2. The wafer resist thickness detection device according to claim 1, characterized in that: The laser detection component (112) includes multiple sets of transmitters (113) and receivers (114), and a plurality of laser detection components (112) are arrayed on the mounting plate (111).

3. The wafer resist thickness detection device according to claim 2, characterized in that: An movable plate (115) is movably disposed on the irradiation platform (110). Two slide rails (116) are provided at intervals on the side of the movable plate (115) near the detection platform. The two sides of the mounting plate (111) are respectively inserted into and connected to the two slide rails (116). The slide rails (116) are provided with fixing members for fixing the mounting plate (111).

4. The wafer resist thickness detection device according to claim 3, characterized in that: The fastener includes a fixing bolt (120), and the inner wall of the slide (116) near the movable plate (115) is provided with a fixing screw hole (121) for the fixing bolt (120) to be connected. The inner wall of the slide (116) away from the movable plate (115) and the edge of the mounting plate (111) have through holes (122) for the fixing bolt (120) to pass through.

5. The wafer resist thickness detection device according to claim 4, characterized in that: The mounting plate (111) extends a distance along the length of the slide (116) to form an extension (123) for picking up the mounting plate (111).

6. The wafer resist thickness detection device according to claim 5, characterized in that: The inner wall of the slide (116) near the movable plate (115) has a positioning post (124). The inner wall of the slide (116) has a positioning hole (125) for the positioning post (124) to be inserted. A positioning spring (126) is provided in the positioning hole (125). One end of the positioning spring (126) is connected to the bottom of the positioning hole (125), and the other end is connected to the positioning post (124). The mounting plate (111) has a groove (127) for the positioning post (124) to be inserted.

7. The wafer resist thickness detection device according to claim 6, characterized in that: The portion of the positioning post (124) exposed inside the slide (116) is hemispherical.

8. The wafer resist thickness detection device according to claim 7, characterized in that: There is a gap between the movable plate (115) and the mounting plate (111).

9. The wafer resist thickness detection device according to claim 3, characterized in that: The irradiation platform (110) has symmetrically arranged fixed tracks (130), and the movable plate (115) has a slider (131) that is slidably arranged in the fixed tracks (130) on the side near the irradiation platform (110).

10. A wafer resist thickness detection device according to claim 9, characterized in that: The fixed track (130) extends to opposite sides on both sides, and the slider (131) has accommodating slots (132) on both sides for the fixed track (130) to be inserted.

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