Cooling device for curing epoxy glue production

Abstract

The utility model belongs to the technical field of epoxy glue production, and particularly relates to a cooling device for curing epoxy glue production, which comprises a cooling box, and a cooling mechanism and a circulating mechanism are respectively arranged in the cooling box. The cooling mechanism comprises a mounting box, epoxy glue is placed in the mounting box to achieve fixed clamping, and cooling action is facilitated; and the circulating mechanism comprises a circulating water pump, and the circulating water pump realizes circulating cooling of cooling water, so that the action of cooling use is facilitated. According to the cooling device for cured epoxy glue production, the cooling mechanism and the circulating mechanism are arranged, the cooling mechanism fixedly clamps epoxy glue through a mounting box, the circulating mechanism circularly cools and uses cooling water through a circulating water pump, cooling use is facilitated, and the problems that an existing device cools the epoxy glue through water cooling, and the cooling efficiency is high are solved. And the temperature of the cooling liquid is increased, so that the cooling effect on the epoxy glue is influenced when the cooling liquid is recycled for cooling.

Description

Technical Field

[0001] This utility model relates to the field of epoxy adhesive production technology, and in particular to a cooling device for the production of cured epoxy adhesive. Background Technology

[0002] A cooling device for cured epoxy adhesive disclosed on the Chinese patent website (publication number: CN220624576U) solves the technical problems of traditional devices that use spray heads, where the spray head angle cannot be changed, resulting in uneven spraying of the adhesive product and the adhesive product being prone to displacement due to water pressure during spraying, thus preventing the spray head from effectively cooling the adhesive product and resulting in poor spraying effect. However, the following problems still exist:

[0003] In actual use, the epoxy resin is cooled only by water. After spraying, the coolant absorbs the heat of the epoxy resin, and the temperature of the coolant itself will rise. Recirculating the coolant for cooling will affect the cooling effect on the epoxy resin, making it inconvenient to use. Utility Model Content

[0004] Based on the existing technical problem of cooling epoxy adhesives by water, where the coolant absorbs heat from the epoxy adhesive after spray cooling, causing the coolant temperature to rise, and reusing the coolant for cooling affects the cooling effect on the epoxy adhesive, this utility model proposes a cooling device for the production of cured epoxy adhesives.

[0005] The present invention discloses a cooling device for the production of cured epoxy adhesive, comprising a cooling box, wherein a cooling mechanism and a circulation mechanism are respectively arranged inside the cooling box.

[0006] The circulation mechanism is located below the cooling mechanism.

[0007] The cooling mechanism includes a mounting box, in which epoxy resin is placed for fixed clamping, facilitating the cooling process.

[0008] The circulation mechanism includes a circulating water pump, which circulates and cools the cooling water to facilitate its use.

[0009] Preferably, the cooling mechanism further includes a mounting plate, the surface of which has an upper cooling groove, and a sliding rod is fixedly connected to the surface of the mounting plate. The two sliding rods are symmetrically distributed about the axis of the width direction of the mounting plate. A compression spring is provided on the outer side of the sliding rod, and the two ends of the compression spring are fixedly connected to the surface of the mounting plate and the top of the mounting box, respectively.

[0010] Preferably, a connecting plate is fixedly connected to the top of the slide rod, a handle is fixedly connected to the upper surface of the connecting plate, a lifting cylinder is fixedly connected to the top of the cooling box, the output end of the lifting cylinder is fixedly connected to the upper surface of the mounting box, and the two lifting cylinders are symmetrically distributed about the axis in the width direction of the mounting box.

[0011] Preferably, the bottom of the mounting box is provided with a mounting groove, the surface of the mounting groove is provided with a lower cooling hole, and guide sliders are fixedly connected to both sides of the mounting box. Guide rods are slidably connected to the surface of the guide sliders, and the upper ends of the two guide rods are fixedly connected to the top of the cooling box.

[0012] Preferably, the circulation mechanism further includes a partition plate, the surface of which is fixedly connected to the inner wall of the cooling box, the partition plate is located below the mounting box, the surface of which has a connecting groove, the surface of which is fixedly connected to the lower ends of the two guide rods respectively, and a temperature sensor is fixedly connected to the surface of which.

[0013] Preferably, a stirring rod is provided below the partition plate, both ends of the stirring rod are rotatably connected to the inner wall of the cooling box, a stirring motor is fixedly connected to the surface of the cooling box, and the output shaft of the stirring motor is fixedly connected to one end of the stirring rod through a coupling.

[0014] Preferably, the circulating water pump is located below the cooling tank, the inlet of the circulating water pump is fixedly connected to the bottom of the cooling tank, the outlet of the circulating water pump is fixedly connected to a circulating water pipe, one end of the circulating water pipe is fixedly connected to a branch pipe, the surface of the branch pipe is fixedly connected to the inner wall of the cooling tank, and a spray pipe is fixedly connected to the surface of the branch pipe. Multiple spray pipes are arranged in a linear array along the length of the branch pipe.

[0015] The beneficial effects of this utility model are as follows:

[0016] By setting up a cooling mechanism and a circulation mechanism, the cooling mechanism uses a mounting box to fix and clamp the epoxy resin, and the circulation mechanism uses a circulating water pump to circulate and cool the epoxy resin, which is convenient for cooling. This solves the technical problem of existing devices that use water cooling to cool the epoxy resin. After spray cooling, the coolant absorbs heat from the epoxy resin, and the temperature of the coolant itself will rise. Recirculating the coolant for cooling will affect the cooling effect on the epoxy resin. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a cooling device for producing cured epoxy adhesive according to the present invention;

[0018] Figure 2This is a front view of the mounting box structure of a cooling device for producing cured epoxy adhesive according to this utility model;

[0019] Figure 3 This is a perspective view of the mounting plate structure of a cooling device for producing cured epoxy adhesive, as proposed in this utility model.

[0020] Figure 4 This is a perspective view of the partition plate structure of a cooling device for producing cured epoxy adhesive, as proposed in this utility model.

[0021] In the diagram: 1. Cooling box; 2. Mounting box; 3. Circulating water pump; 201. Mounting pressure plate; 202. Upper cooling tank; 203. Slide rod; 204. Compression spring; 205. Connecting plate; 206. Handle; 207. Lifting cylinder; 208. Mounting slot; 209. Lower cooling hole; 210. Guide slider; 211. Guide rod; 301. Divider plate; 302. Connecting slot; 303. Temperature sensor; 304. Stirring rod; 305. Stirring motor; 306. Circulating water pipe; 307. Diverter pipe; 308. Spray pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Reference Figures 1-4 A cooling device for the production of cured epoxy adhesive includes a cooling box 1, and the interior of the cooling box 1 is respectively provided with a cooling mechanism and a circulation mechanism.

[0024] The circulation mechanism is located below the cooling mechanism.

[0025] To prevent epoxy resin from falling off during the cooling process, it is secured and clamped for rapid cooling. A cooling mechanism is installed, such as... Figures 1-3 The cooling mechanism includes a mounting box 2, in which epoxy resin is placed and fixedly clamped to facilitate cooling.

[0026] The cooling mechanism also includes a mounting plate 201. The surface of the mounting plate 201 is provided with an upper cooling groove 202. A slide rod 203 is fixedly connected to the surface of the mounting plate. The two slide rods 203 are symmetrically distributed with the axis in the width direction of the mounting plate 201 as the center. A compression spring 204 is provided on the outside of the slide rod 203. The two ends of the compression spring 204 are fixedly connected to the surface of the mounting plate 201 and the top of the mounting box 2, respectively.

[0027] Furthermore, the top of the mounting box 2 is elastically connected to the upper surface of the mounting plate 201 via a compression spring 204, so that the mounting plate 201 fixes and limits the epoxy resin placed at the bottom of the mounting box 2.

[0028] A connecting plate 205 is fixedly connected to the top of the slide bar 203, and a handle 206 is fixedly connected to the upper surface of the connecting plate 205. A lifting cylinder 207 is fixedly connected to the top of the cooling box 1. The output end of the lifting cylinder 207 is fixedly connected to the upper surface of the mounting box 2. The two lifting cylinders 207 are symmetrically distributed with the axis in the width direction of the mounting box 2 as the center.

[0029] Furthermore, pulling the handle 206 causes the mounting plate to slide upward via the slide bar 203, making it easier to place epoxy adhesive products below the mounting plate 201.

[0030] The bottom of the mounting box 2 is provided with a mounting groove 208, and the surface of the mounting groove 208 is provided with a lower cooling hole 209. Guide sliders 210 are fixedly connected to both sides of the mounting box 2. Guide rods 211 are slidably connected to the surface of the guide sliders 210. The upper ends of the two guide rods 211 are fixedly connected to the top of the cooling box 1.

[0031] Furthermore, both sides of the mounting box 2 slide along the surface of the guide rod 211 via guide sliders 210, ensuring the smooth movement of the mounting box 2.

[0032] To prevent the cooling water temperature from rising after prolonged use and affecting the cooling effect of subsequent epoxy adhesive products, a circulation mechanism is installed, such as... Figures 1-2 and Figure 4 The circulation mechanism includes a circulating water pump 3, which circulates and cools the cooling water to facilitate its use.

[0033] The circulation mechanism also includes a partition plate 301. The surface of the partition plate 301 is fixedly connected to the inner wall of the cooling box 1. The partition plate 301 is located below the mounting box 2. A connecting groove 302 is opened on the surface of the partition plate 301. The surface of the partition plate 301 is fixedly connected to the lower ends of two guide rods 211 respectively. A temperature sensor 303 is fixedly connected to the surface of the partition plate 301.

[0034] Furthermore, a temperature sensor 303 installed on the surface of the partition plate 301 monitors the temperature of the cooling water, so that cooling measures can be added in time when the temperature is too high.

[0035] A stirring rod 304 is provided below the partition plate 301. Both ends of the stirring rod 304 are rotatably connected to the inner wall of the cooling box 1. A stirring motor 305 is fixedly connected to the surface of the cooling box 1. The output shaft of the stirring motor 305 is fixedly connected to one end of the stirring rod 304 through a coupling.

[0036] Furthermore, the cooling water is stirred by the stirring rod 304 to prevent the temperature difference of the cooling water from affecting the cooling of the epoxy resin.

[0037] The circulating water pump 3 is located below the cooling tank 1. The inlet of the circulating water pump 3 is fixedly connected to the bottom of the cooling tank 1. The outlet of the circulating water pump 3 is fixedly connected to the circulating water pipe 306. One end of the circulating water pipe 306 is fixedly connected to the diversion pipe 307. The surface of the diversion pipe 307 is fixedly connected to the inner wall of the cooling tank 1. The surface of the diversion pipe 307 is fixedly connected to the spray pipe 308. Multiple spray pipes 308 are linearly arrayed along the length of the diversion pipe 307.

[0038] Furthermore, the circulating water pump 3 installed at the bottom of the cooling tank 1 pumps cooling water into the top of the cooling tank 1 through the circulating water pipe 306, and cools it down through the spray pipe 308.

[0039] By setting up a cooling mechanism and a circulation mechanism, the cooling mechanism uses the mounting box 2 to fix and clamp the epoxy resin, and the circulation mechanism uses the circulating water pump 3 to circulate and cool the epoxy resin, which facilitates cooling and solves the technical problem of existing devices that use water cooling to cool the epoxy resin. After spray cooling, the coolant absorbs the heat of the epoxy resin, and the temperature of the coolant itself will rise. Recirculating the coolant for cooling will affect the cooling effect on the epoxy resin.

[0040] Working principle:

[0041] Before use, pull the handle 206 on the top of the mounting box 2 upwards. The handle 206, connected to the connecting plate 205 at its lower end, moves the two sliding rods 203 upwards. The mounting pressure plate 201, connected to the lower end of the sliding rods 203, moves upwards, compressing the compression spring 204. Place the epoxy resin product under the mounting pressure plate 201. The bottom of the mounting box 2 has a mounting groove 208. Place the epoxy resin product inside the mounting groove 208. Release the handle 206. The compression spring 204 moves the mounting pressure plate 201 to fix the upper surface of the epoxy resin, preventing the epoxy resin product from falling off during cooling. The surface of the mounting groove 208 has a lower cooling hole 209, and the surface of the mounting pressure plate 201 has an upper cooling groove 202, facilitating contact cooling with cooling water to cool the surface of the epoxy resin and improve the cooling effect. The lifting cylinder 207 on the top of the cooling box 1 moves the mounting box 2 downwards. The two sides of the mounting box 2 slide along the surface of the guide rod 211 via guide sliders 210, maintaining the temperature rise and fall of the mounting box 2. The epoxy resin placed at the bottom of the installation box 2 is introduced into the cooling water at the bottom of the cooling box 1 to cool the surface of the epoxy resin. The lower surface of the installation box 2 is limited by the partition plate 301 set inside the cooling box 1 to prevent the installation box 2 from interfering with the structure below. The surface of the partition plate 301 has a connecting groove 302 to facilitate the flow of cooling water. The stirring motor 305 set on the surface of the cooling box 1 drives the stirring rod 304 to rotate and stir the cooling water inside the cooling box 1 to prevent the cooling water temperature near the installation box 2 from rising too quickly and affecting the cooling effect. The temperature sensor 303 set on the surface of the partition plate 301 monitors the cooling water temperature inside the cooling box 1. When the cooling water temperature is too high, it is replaced or cooled in time to prevent the cooling water temperature from rising and affecting the cooling effect. The circulating water pump 3 set at the bottom of the cooling box 1 pumps the cooling water from the bottom of the cooling box 1 into the diversion pipe 307 near the top of the cooling box 1 through the circulating water pipe 306, and sprays it downward from the multiple spray pipes 308 set at the lower end of the diversion pipe 307 for cooling.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling device for producing cured epoxy adhesive, comprising a cooling box (1), characterized in that: The cooling box (1) is equipped with a cooling mechanism and a circulation mechanism inside; The circulation mechanism is located below the cooling mechanism; The cooling mechanism includes a mounting box (2), in which epoxy resin is placed inside the mounting box (2) for fixed clamping, which facilitates the cooling action; The circulation mechanism includes a circulating water pump (3), which circulates and cools the cooling water to facilitate its use.

2. The cooling device for producing cured epoxy adhesive according to claim 1, characterized in that: The cooling mechanism also includes a mounting plate (201), on the surface of which an upper cooling groove (202) is provided. A slide rod (203) is fixedly connected to the surface of the mounting plate (201). The two slide rods (203) are symmetrically distributed with the axis of the width direction of the mounting plate (201) as the center. A compression spring (204) is provided on the outside of the slide rod (203). The two ends of the compression spring (204) are fixedly connected to the surface of the mounting plate (201) and the top of the mounting box (2), respectively.

3. The cooling device for producing cured epoxy adhesive according to claim 2, characterized in that: A connecting plate (205) is fixedly connected to the top of the slide bar (203), and a handle (206) is fixedly connected to the upper surface of the connecting plate (205). A lifting cylinder (207) is fixedly connected to the top of the cooling box (1). The output end of the lifting cylinder (207) is fixedly connected to the upper surface of the mounting box (2). The two lifting cylinders (207) are symmetrically distributed with the axis in the width direction of the mounting box (2) as the center.

4. The cooling device for producing cured epoxy adhesive according to claim 1, characterized in that: The bottom of the mounting box (2) is provided with a mounting groove (208), and the surface of the mounting groove (208) is provided with a lower cooling hole (209). Guide sliders (210) are fixedly connected to both sides of the mounting box (2), and guide rods (211) are slidably connected to the surface of the guide sliders (210). The upper ends of the two guide rods (211) are fixedly connected to the top of the cooling box (1).

5. A cooling device for producing cured epoxy adhesive according to claim 4, characterized in that: The circulation mechanism also includes a partition plate (301), the surface of which is fixedly connected to the inner wall of the cooling box (1), the partition plate (301) is located below the mounting box (2), the surface of which is provided with a connecting groove (302), the surface of which is fixedly connected to the lower ends of the two guide rods (211) respectively, and a temperature sensor (303) is fixedly connected to the surface of which.

6. A cooling device for producing cured epoxy adhesive according to claim 5, characterized in that: A stirring rod (304) is provided below the partition plate (301). Both ends of the stirring rod (304) are rotatably connected to the inner wall of the cooling box (1). A stirring motor (305) is fixedly connected to the surface of the cooling box (1). The output shaft of the stirring motor (305) is fixedly connected to one end of the stirring rod (304) through a coupling.

7. A cooling device for producing cured epoxy adhesive according to claim 1, characterized in that: The circulating water pump (3) is located below the cooling tank (1). The inlet of the circulating water pump (3) is fixedly connected to the bottom of the cooling tank (1). The outlet of the circulating water pump (3) is fixedly connected to a circulating water pipe (306). One end of the circulating water pipe (306) is fixedly connected to a diversion pipe (307). The surface of the diversion pipe (307) is fixedly connected to the inner wall of the cooling tank (1). The surface of the diversion pipe (307) is fixedly connected to a spray pipe (308). Multiple spray pipes (308) are arranged in a linear array along the length of the diversion pipe (307).

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