Pick-up mechanism, transfer device and display device repairing system

Abstract

The utility model relates to a pick-up mechanism, a transfer device and a display device repair system, and the pick-up mechanism comprises a seat body which is driven by an external movement mechanism to move in the pick-up direction; the sliding seat is arranged on the seat body in a sliding manner along the picking direction; the adsorption head is connected to the sliding seat, the adsorption head is communicated with an external positive and negative pressure device, and the adsorption head moves along with the seat body in the pickup direction to pick up or place the chip; the pushing and ejecting seat is arranged on the sliding seat in a sliding mode in the picking direction, and the pushing and ejecting seat is elastically connected with the sliding seat; and the pressure sensing piece is installed on the seat body, and the ejection seat abuts against the measuring end of the pressure sensing piece in the pickup direction. The adsorption head is gradually compressed on the surface of the chip through the elastic force between the sliding seat and the pushing seat, and the pressure applied to the chip by the adsorption head is measured by the pressure sensing piece, so that the chip is ensured to be tightly adsorbed by the adsorption head while the damage of the two parts is avoided, and the chip picking and transferring stability is improved.

Description

Technical Field

[0001] This application relates to the field of chip pickup technology, and in particular to a pickup mechanism, a transfer device, and a display device repair system. Background Technology

[0002] MicroLED (micro-light-emitting diode) display devices are widely used due to their advantages such as small size, low power consumption, high brightness, high color saturation, fast response, and long lifespan. To improve the yield of MicroLED display devices, the current manufacturing process involves precise addressing detection and repair of the LED chips after transfer, eliminating any non-displayable chips and thus improving the overall yield.

[0003] Chips to be transferred are typically arranged in batches on a spare substrate. When a defective point on the substrate to be repaired needs to be fixed, the chip is picked up from the spare substrate and then transferred to the defective point on the substrate to be repaired. Generally, the chip is picked up using methods such as adhesive bonding, adsorption, or magnetism. After picking up the chip, it is placed at the defective point and fixed in place.

[0004] In related technologies, a motion mechanism or robotic arm drives the adsorption head to move, and negative pressure is applied to the adsorption head to adsorb and pick up the chip, thereby realizing the transfer of the chip.

[0005] Because of the small size of the chip, during the chip picking process, it is necessary to ensure that the adsorption surface of the adsorption head is in close contact with the chip surface to avoid gaps between the adsorption head and the chip, thus ensuring stable adsorption of the chip.

[0006] However, directly pressing down on the adsorption head and controlling its descent height to ensure it adheres tightly to the chip can lead to varying pressures on different chips due to slight height differences. This can result in excessive pressure damaging both the chip and the adsorption head, as well as weak chip adhesion and poor chip pickup performance. Utility Model Content

[0007] This application provides a pickup mechanism, a transfer device, and a display device repair system to solve the technical problems in the related art where it is difficult to control the adsorption head to press the chip with a specified pressure when adsorbing and picking up the chip, which easily causes damage to the chip and the adsorption head, and the chip is not firmly adsorbed, resulting in poor chip pickup effect.

[0008] Firstly, a pickup mechanism is provided, comprising:

[0009] The seat body is driven by an external motion mechanism to move in the pickup direction;

[0010] A sliding seat, which is slidably disposed on the seat body along the picking direction;

[0011] The adsorption head is connected to the sliding seat and is connected to an external positive and negative pressure device. The adsorption head picks up or places the chip as the seat moves in the picking direction.

[0012] A pusher seat, which is slidably disposed on the sliding seat along the picking direction, and the pusher seat is elastically connected to the sliding seat;

[0013] A pressure sensor is mounted on the base, and the pusher abuts against the measuring end of the pressure sensor in the pickup direction.

[0014] In some embodiments, the picking mechanism further includes:

[0015] A guide rod is connected to the sliding seat, the guide rod is arranged along the picking direction in the length direction, and the guide rod passes through the push seat;

[0016] A first elastic element, the two ends of which are respectively connected to the sliding seat and the push seat.

[0017] In some embodiments, the adsorption element includes:

[0018] A syringe, wherein the syringe is inserted and fixed to the sliding seat, and the syringe is connected to an external positive and negative pressure device;

[0019] The needle body has one end inserted and connected to the needle body and is connected to the syringe, and the other end of the needle body is pressed against the chip.

[0020] In some embodiments, the needle body comprises a glass needle tube.

[0021] In some embodiments, the pickup direction is arranged vertically, and the pressure sensor, the pusher, the sliding seat, and the suction head are arranged sequentially from top to bottom.

[0022] In some embodiments, the pickup mechanism further includes a second elastic element that connects the seat and the sliding seat, supports the sliding seat, and the elastic force of the second elastic element counteracts part or all of the weight of the component loaded by the second elastic element.

[0023] The beneficial effects of the technical solution provided in this application include:

[0024] This application provides a pickup mechanism that, when picking up a chip, drives the entire pickup mechanism to move along the pickup direction, causing the adsorption head to contact the chip surface. As the adsorption head presses against the chip, the sliding seat moves closer to the push seat. Due to the elastic connection between the sliding seat and the push seat, a hard collision between the adsorption head and the chip is avoided. This not only prevents collision damage between the adsorption head and the chip, but also ensures that the adsorption head presses firmly against the chip surface due to the elastic force applied by the push seat to the sliding seat and the adsorption head.

[0025] Furthermore, during the process of the adsorption head pressing the chip, the adsorption head pushes the pusher seat through the sliding seat. The pusher seat then acts on the pressure sensor, which measures the pressure applied by the adsorption head to the chip. This ensures that the adsorption head applies the required pressure to the chip, ensuring stable chip adsorption and guaranteeing chip transfer accuracy. Using pressure measurement to control the movement distance of the adsorption head relative to the chip avoids applying excessive pressure to the chip, which could damage both the chip and the adsorption head. It also prevents the adsorption head from failing to adhere firmly to the chip, thus optimizing the chip pickup effect of the adsorption head.

[0026] Secondly, a transfer device is provided, including the pickup mechanism as described above.

[0027] In some embodiments, the transfer device further includes:

[0028] Pick-up rack;

[0029] A pickup drive assembly is mounted on the pickup frame and is driven by the pickup mechanism to drive the pickup mechanism to move in the front-back, left-right, and up-down directions.

[0030] In some embodiments, the transfer device further includes a visual inspection component, the visual inspection component comprising:

[0031] A visual positioning device, wherein the imaging direction of the visual positioning device is arranged along the picking direction, and the visual positioning device captures the marking points on the spare substrate.

[0032] A visual monitoring device, wherein the imaging direction of the visual monitoring device is tilted to the plane where the spare substrate is located, and the visual monitoring device images the chip to be picked up.

[0033] Another embodiment of this application provides a transfer device. Since the transfer device includes the above-mentioned picking mechanism, the beneficial effects of the picking device are the same as those of the above-mentioned picking mechanism, and will not be repeated here.

[0034] Thirdly, a display device repair system is provided, including the pickup mechanism as described above, and / or the transfer device as described above.

[0035] Another embodiment of this application provides a display device repair system. Since the display device repair system includes the above-mentioned pickup mechanism and / or transfer device, the beneficial effects of the display device repair system are consistent with the beneficial effects of the above-mentioned pickup mechanism and transfer device, and will not be repeated here. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic diagram of the pickup mechanism provided in the embodiments of this application;

[0038] Figure 2 A schematic diagram of the adsorption head provided in an embodiment of this application;

[0039] Figure 3 A schematic diagram of a transfer device provided in another embodiment of this application.

[0040] In the figure: 1. Base; 2. Sliding base; 3. Adsorption head; 301. Syringe; 302. Needle body; 4. Push base; 5. Pressure sensor; 6. Guide rod; 7. First elastic element; 8. Second elastic element; 9. Pickup frame; 10. Pickup drive assembly; 11. Vision inspection assembly; 1101. Vision positioning element; 1102. Vision monitoring element. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] This application provides a pickup mechanism, a transfer device, and a display device repair system. The elastic force between the sliding seat and the push seat gradually presses the adsorption head against the chip surface. A pressure sensor measures the pressure applied to the chip by the adsorption head, preventing damage to both while ensuring the adsorption head firmly holds the chip, thus improving the stability of chip pickup and transfer. This application solves the technical problems in related technologies where it is difficult to control the adsorption head to press the chip with a specified pressure, easily causing damage to the chip and adsorption head, as well as situations where the chip is not firmly adsorbed, resulting in poor chip pickup performance.

[0043] Reference Figure 1 A pickup mechanism includes a base 1, a sliding base 2, an adsorption head 3, a pusher 4, and a pressure sensor 5. The sliding base 2 is slidably disposed on the base 1, the adsorption head 3 is connected to the sliding base 2, and the pusher 4 is elastically connected to the sliding base 2, pressing against the measuring end of the pressure sensor 5. As the adsorption head 3 approaches and presses against the chip, the sliding base 2 slides on the base 1 and elastically pushes the pusher 4, causing the pusher 4 to press against the measuring end of the pressure sensor 5, thereby measuring the pressure applied to the chip by the adsorption head 3 in real time.

[0044] This configuration, due to the elastic connection between the sliding seat 2 and the push seat 4, avoids hard collisions between the adsorption head 3 and the chip. This not only prevents collision damage to both the adsorption head 3 and the chip, but also ensures that the adsorption head 3 is firmly pressed against the chip surface due to the elastic force applied by the push seat 4 to the sliding seat 2 and the adsorption head 3. The pressure sensor 5 measures the pressure applied to the chip by the adsorption head 3, ensuring that the adsorption head 3 applies the required pressure to the chip, avoiding excessive pressure that could damage the chip and the adsorption head 3, and preventing the adsorption head 3 from failing to adhere firmly to the chip. This optimizes the chip pickup performance of the adsorption head 3.

[0045] Reference Figure 1 The base 1 moves in the pickup direction along with the external motion mechanism, thereby causing the entire pickup mechanism to move in the pickup direction. In the pickup direction, the adsorption head 3 moves closer to or further away from the chip as the base 1 moves.

[0046] Reference Figure 1 The sliding seat 2 is slidably mounted on the seat 1 along the picking direction. In this embodiment, the sliding seat 2 is slidably mounted on the seat 1 via a guide rail assembly.

[0047] Reference Figure 1 The adsorption head 3 is mounted on the sliding base 2 and slides along with the sliding base 2 onto the base 1. The adsorption head 3 moves with the base 1 in the pickup direction to pick up or place the chip. The adsorption head 3 is connected to an external positive and negative pressure device. By applying negative pressure to the adsorption head 3, the adsorption head 3 adsorbs and picks up the chip. By applying positive pressure to the adsorption head 3, the vacuum between the adsorption head 3 and the chip is broken by airflow and positive pressure, thereby separating the adsorption head 3 and the chip. The positive and negative pressure device may include a positive pressure air source and a negative pressure air source.

[0048] Specifically, the adsorption head 3 moves in the picking direction to approach the chip on the spare substrate, and after the adsorption head 3 adsorbs and picks up the chip, the chip is transferred to the defect point of the substrate to be repaired by driving the adsorption head 3 to move, and the adsorption head 3 and the chip move close to the defect point, and the chip is placed at the defect point of the substrate to be repaired by using the adsorption head 3.

[0049] With this configuration, when the suction head 3 contacts the chip, it slides along the sliding base 2 on the base 1, thus avoiding direct pressure of the suction head 3 on the chip, preventing hard collisions between the suction head 3 and the chip, and avoiding damage to both. Furthermore, when placing the chip, after the chip contacts the substrate, the chip and suction head 3 can slide together along the sliding base 2 on the base 1, avoiding direct pressure of the chip on the defect point and preventing hard collisions between the chip and the substrate to be repaired.

[0050] The pusher seat 4 slides on the sliding seat 2 along the pickup direction, and the pusher seat 4 and the sliding seat 2 are elastically connected. The pusher seat 4 presses against the measuring end of the pressure sensor 5 in the pickup direction.

[0051] With this configuration, as the suction head 3 presses against the chip, the sliding seat 2 moves closer to the push seat 4. Due to the elastic connection between the sliding seat 2 and the push seat 4, a hard collision between the suction head 3 and the chip is avoided. This not only prevents collision damage to both the suction head 3 and the chip, but also ensures that the suction head 3 is firmly pressed against the chip surface due to the elastic force applied by the push seat 4. The suction head 3 pushes the push seat 4 through the sliding seat 2, and the push seat 4 then acts on the pressure sensor 5. The pressure sensor 5 measures the pressure applied by the suction head 3 to the chip, ensuring that the suction head 3 applies the required pressure to the chip, ensuring stable chip adhesion, guaranteeing chip transfer accuracy, and preventing damage due to excessive pressure.

[0052] Specifically, the pressure sensing element 5 includes a pressure sensor.

[0053] Reference Figure 1 Specifically, the picking mechanism includes a guide rod 6 and a first elastic element 7, and the pusher seat 4 is elastically slidably disposed on the sliding seat 2 through the guide rod 6 and the first elastic element 7.

[0054] Specifically, the guide rod 6 is connected to the sliding seat 2, and the guide rod 6 is arranged along the pickup direction in its length direction, passing through the push seat 4. Guided by the guide rod 6, the push seat 4 slides relative to the sliding seat 2 in the pickup direction. When the guide rod 6 is a non-rotating body, at least one guide rod 6 is arranged. When the guide rod 6 is a rotating body, at least two guide rods 6 are arranged. This restricts the movement or rotation of the push seat 4 in other directions.

[0055] The two ends of the first elastic element 7 are connected to the sliding seat 2 and the push seat 4, respectively. In this embodiment, the first elastic element 7 is sleeved on the guide rod 6, and the first elastic element 7 is in a compressed state. Under the action of elastic force, the two ends of the first elastic element 7 press against the sliding seat 2 and the push seat 4, respectively. As the sliding seat 2 moves further closer to the push seat 4, the first elastic element 7 is further compressed.

[0056] The first elastic element 7 includes one or more of a spring, an elastic sheet, and an elastic block.

[0057] This configuration, due to the elastic connection between the pusher 4 and the sliding seat 2, ensures that the adsorption element remains pressed against the chip under the action of elastic force, thus guaranteeing chip compression. Furthermore, it prevents the pusher 4 from moving freely relative to the sliding seat 2, ensuring chip stability during transfer. Additionally, the sliding seat 2 applies pressure to the pressure sensor 5 through the first elastic element 7 and the pusher 4, instead of the sliding seat 2 acting directly on the pressure sensor 5. This allows for sliding space on the sliding seat 2, enabling the adsorption head 3 to gradually increase the pressure applied to the chip, ensuring that the applied pressure is the specified pressure.

[0058] Reference Figure 1 and Figure 2 The adsorption component includes a syringe 301 and a needle body 302. The syringe 301 is inserted and fixed to the sliding seat 2, and its length direction is arranged along the pickup direction. The syringe 301 is connected to an external positive and negative pressure device. One end of the needle body 302 is inserted and connected to the syringe 301, and the other end of the needle body 302 is pressed against the chip.

[0059] With this configuration, since the needle 302 directly interacts with the chip, it is prone to wear and damage. To ensure adsorption stability, the needle 302 needs to be replaced periodically. The detachable connection between the syringe 301 and the needle 302 facilitates needle 302 replacement and reduces replacement costs. The needle 302 replacement operation is simple and efficient. Furthermore, it allows for easy replacement of needles 302 with different inner diameters when picking up chips of different sizes.

[0060] Preferably, the needle body 302 comprises a glass needle tube.

[0061] This design makes it easier to process the inner and outer diameters of the glass needle tip to be small, given that the chip size is at the micrometer level. Using a glass needle, it is easy to completely press the tip onto the chip and ensure the vacuum between the chip and the glass needle, thus meeting the adsorption and pickup requirements.

[0062] In addition, because the chips are closely arranged, when the glass needle is pressed down to pick up the chip, the glass needle is only pressed onto the designated chip surface. The surrounding chips are less likely to interfere with the downward pressure of the glass needle, thus ensuring that the chip is pressed tightly and picked up stably.

[0063] In this embodiment, the inner diameter of the glass needle tip ranges from 5 to 15 micrometers, which can meet the pickup requirements of chips of different sizes.

[0064] In this embodiment, the pickup direction is perpendicular to the chip surface. The pressure sensor 5, push base 4, sliding base 2, and suction head 3 are arranged sequentially from top to bottom. The suction head 3 descends to pick up the chip. In other embodiments, the pickup direction is arranged according to the plane of the chip surface; no limitation is imposed here.

[0065] Reference Figure 1 The picking mechanism further includes a second elastic element 8, which connects the seat 1 and the sliding seat 2, supports the sliding seat 2, and the elastic force of the second elastic element 8 offsets part or all of the weight of the load component.

[0066] Specifically, in this embodiment, the load-bearing components of the second elastic element 8 include a sliding seat 2, an adsorption head 3, a guide rod 6, a first elastic element 7, and a pusher seat 4. In other embodiments, the load-bearing components of the second elastic element 8 are determined according to the components arranged on the sliding seat 2. Preferably, the elastic force of the second elastic element 8 counteracts the weight of all the load-bearing components of the second elastic element 8.

[0067] With this configuration, due to the arrangement of the second elastic element 8, the elastic force of the second elastic element 8 balances the weight of its load components. At this time, the weight of the sliding seat 2, suction head 3, guide rod 6, first elastic element 7 and push seat 4 no longer acts on the pressure sensor 5, avoiding the pressure sensor 5 being under stress for a long time, ensuring the accuracy of the pressure sensor 5, protecting the pressure sensor 5, and extending the service life of the pressure sensor 5.

[0068] Furthermore, the elastic forces of the second elastic element 8 and the first elastic element 7 synchronously constrain the position of the sliding seat 2, preventing the adsorption head 3 from moving arbitrarily and ensuring the stability of chip transfer during the chip transfer process. This also facilitates determining the specific position of the adsorption head 3 in the pickup direction, allowing for precise control of the distance the adsorption head 3 travels towards the chip.

[0069] This application provides a pickup mechanism that, when picking up a chip, drives the entire pickup mechanism to move along the pickup direction, causing the adsorption head 3 to contact the chip surface. As the adsorption head 3 presses against the chip, the sliding seat 2 moves closer to the push seat 4. Due to the elastic connection between the sliding seat 2 and the push seat 4, a hard collision between the adsorption head 3 and the chip is avoided. This not only prevents collision damage between the adsorption head 3 and the chip, but also ensures that the adsorption head 3 is pressed tightly against the chip surface by the elastic force applied by the push seat 4 to the sliding seat 2 and the adsorption head 3.

[0070] Furthermore, during the process of the adsorption head 3 pressing the chip, the adsorption head 3 pushes the pusher seat 4 through the sliding seat 2. The pusher seat 4 then acts on the pressure sensor 5, which measures the pressure applied to the chip by the adsorption head 3. This ensures that the adsorption head 3 applies the required pressure to the chip, ensuring stable adsorption of the chip and guaranteeing chip transfer accuracy. By using pressure measurement to control the movement distance of the adsorption head 3 relative to the chip, excessive pressure on the chip is avoided, which could damage the chip and the adsorption head 3. It also prevents the adsorption head 3 from being loosely attached to the chip, thus optimizing the chip pickup effect of the adsorption head 3.

[0071] Another embodiment of this application provides a transfer device, including the pickup mechanism described above.

[0072] Reference Figure 3 The transfer device further includes a pickup frame 9 and a pickup drive assembly 10. The pickup drive assembly 10 is mounted on the pickup frame 9 and is driven by the pickup mechanism to drive the pickup mechanism to move in the front-back, left-right, and up-down directions.

[0073] Reference Figure 3 Specifically, the base 1 of the pickup mechanism is mounted on the driving end of the pickup driving assembly 10, so that the adsorption head 3 is driven by the pickup driving assembly 10 to move in multiple directions. In this embodiment, the pickup driving assembly 10 is assembled from multiple linear modules. Preferably, the pickup driving assembly 10 is assembled from three linear modules, and the driving directions of the three linear modules are up and down, left and right, and front and back, respectively.

[0074] Specifically, the linear module includes a lead screw mechanism or a linear motor.

[0075] With this configuration, driven by the pickup drive component 10, the adsorption head 3 is moved to various positions, causing it to descend, press, and pick up the chip. The chip is then transferred to the defect location on the substrate to be repaired, and pressed firmly at the defect location. This achieves fully automated chip transfer.

[0076] The transfer device also includes a visual inspection component 11, which includes a visual positioning component 1101 and a visual monitoring component 1102.

[0077] The visual positioning element 1101 is mounted on the pickup frame 9, and the relative position of the visual positioning element 1101 and the plane of the spare substrate of the adsorption head 3 remains unchanged. The imaging direction of the visual positioning element 1101 is arranged along the pickup direction, and the visual positioning element 1101 captures the marked points on the spare substrate.

[0078] With this setup, the relative positions of the visual positioning element 1101 and the adsorption head 3 of the pickup mechanism are known. By capturing the marker points on the spare substrate, the relative positions of the visual positioning element 1101 and the spare substrate can be determined, thus revealing the relative positions of the adsorption head 3 and the spare substrate. This facilitates precise movement of the relatively movable adsorption head 3 and the spare substrate, enabling the adsorption head 3 to pick up the chip from the spare substrate.

[0079] Specifically, the visual positioning component 1101 includes a camera or a camera group.

[0080] A visual monitoring device 1102 is mounted on the pickup rack 9. The imaging direction of the visual monitoring device 1102 is tilted towards the plane of the spare substrate, and the visual monitoring device 1102 images the chip to be picked up. When picking up the chip, the visual monitoring device 1102 images the picking process to ensure that the adsorption head 3 picks up the chip, and determines the picking accuracy by the relative position of the adsorption head 3 and the chip, so as to facilitate timely adjustment of the chip picking parameters.

[0081] Specifically, the visual monitoring device 1102 includes a camera or a camera array.

[0082] Another embodiment of this application provides a transfer device. Since the transfer device includes the above-mentioned picking mechanism, the beneficial effects of the picking device are the same as those of the above-mentioned picking mechanism, and will not be repeated here.

[0083] Another embodiment of this application provides a display device repair system, including the pickup mechanism as described above, and / or the transfer device as described above.

[0084] Another embodiment of this application provides a display device repair system. Since the display device repair system includes the above-mentioned pickup mechanism and / or transfer device, the beneficial effects of the display device repair system are consistent with the beneficial effects of the above-mentioned pickup mechanism and transfer device, and will not be repeated here.

[0085] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0086] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0087] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A picking mechanism, characterized in that, It includes: The seat body is driven by an external motion mechanism to move in the pickup direction; A sliding seat, which is slidably disposed on the seat body along the picking direction; The adsorption head is connected to the sliding seat and is connected to an external positive and negative pressure device. The adsorption head picks up or places the chip as the seat moves in the picking direction. A pusher seat, which is slidably disposed on the sliding seat along the picking direction, and the pusher seat is elastically connected to the sliding seat; A pressure sensor is mounted on the base, and the pusher abuts against the measuring end of the pressure sensor in the pickup direction.

2. The picking mechanism according to claim 1, characterized in that, Also includes: A guide rod is connected to the sliding seat, the guide rod is arranged along the picking direction in the length direction, and the guide rod passes through the push seat; A first elastic element, the two ends of which are respectively connected to the sliding seat and the push seat.

3. The picking mechanism according to claim 1, characterized in that, The adsorption element includes: A syringe, wherein the syringe is inserted and fixed to the sliding seat, and the syringe is connected to an external positive and negative pressure device; The needle body has one end inserted and connected to the needle body and is connected to the syringe, and the other end of the needle body is pressed against the chip.

4. The picking mechanism according to claim 1, characterized in that, The needle body comprises a glass needle tube.

5. The picking mechanism according to any one of claims 1-4, characterized in that, The pickup direction is vertically arranged, and the pressure sensor, the pusher seat, the sliding seat, and the suction head are arranged sequentially from top to bottom.

6. The picking mechanism according to claim 5, characterized in that, It also includes a second elastic element, which connects the seat and the sliding seat, supports the sliding seat, and the elastic force of the second elastic element counteracts part or all of the weight of the component loaded by the second elastic element.

7. A transfer device, characterized in that, Includes the pickup mechanism as described in any one of claims 1 to 6.

8. The transfer device according to claim 7, characterized in that, Also includes: Pick-up rack; A pickup drive assembly is mounted on the pickup frame and is driven by the pickup mechanism to drive the pickup mechanism to move in the front-back, left-right, and up-down directions.

9. The transfer device according to claim 7, characterized in that, It also includes a visual inspection component, which includes: A visual positioning device, wherein the imaging direction of the visual positioning device is arranged along the picking direction, and the visual positioning device captures the marking points on the spare substrate. A visual monitoring device, wherein the imaging direction of the visual monitoring device is tilted to the plane where the spare substrate is located, and the visual monitoring device images the chip to be picked up.

10. A display device repair system, characterized in that, It includes the picking mechanism as described in any one of claims 1 to 6, and / or the transfer device as described in any one of claims 7 to 9.

Images