Wafer feeding and discharging equipment

Abstract

The utility model relates to the technical field of semiconductor testing, in particular to wafer loading and unloading equipment, which comprises a mounting table used for mounting a wafer, and the wafer can be fixedly arranged on the mounting table through a locking piece; the dismounting device comprises a dismounting assembly, a temperature detection assembly, a height detection assembly and a prompting assembly; the temperature detection assembly is electrically connected with the dismounting assembly, the temperature detection assembly is used for obtaining the temperature value of the mounting table, and the dismounting assembly is rotationally connected with the locking piece; the height detection assembly is electrically connected with the prompting assembly, the height detection assembly is used for obtaining the height value of the locking piece relative to the mounting table, and the prompting assembly sends out warning information; according to the utility model, high-temperature dismounting deformation of the mounting table or the wafer can be avoided, so that the mounting precision of the wafer and the mounting table is ensured; meanwhile, under the condition that the locking piece is not installed in place or not disassembled in place, the prompting assembly is controlled to send out warning information to prompt an operator to conduct manual intervention, the installation stability of the wafer is guaranteed, and the wafer testing result is prevented from being affected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a wafer loading and unloading device. Background Technology

[0002] As electronic products require electronic components to have good performance and reliability, it is necessary to perform electrical performance testing on wafers.

[0003] Existing testing equipment mainly includes wafer loading / unloading equipment and wafer testing equipment, thereby realizing automated chip testing. After the wafer under test enters the wafer loading / unloading equipment, it needs to be transferred from the wafer loading / unloading equipment to the wafer testing equipment for performance testing. To ensure that the wafer does not shift during the testing process, it needs to be fixed on the wafer testing equipment. That is, the wafer needs to be fixed or removed during the loading / unloading process.

[0004] Existing technologies typically employ manual installation or removal during wafer disassembly, resulting in low efficiency. Furthermore, the impact of environmental factors on wafer disassembly is not considered, leading to wafer deformation and consequently affecting wafer testing results. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model can ensure the installation accuracy of the wafer and the mounting stage; at the same time, if the locking part is not installed or not disassembled in place, the control prompting component will issue a warning message to prompt the operator to intervene manually, so as to ensure the installation stability of the wafer and avoid affecting the wafer test results.

[0006] This utility model provides a wafer loading and unloading device, including:

[0007] A mounting platform is provided with a locking element, and the wafer can be fixedly mounted on the mounting platform by the locking element.

[0008] A disassembly device, comprising a disassembly assembly, a temperature detection assembly, a height detection assembly, and a warning assembly;

[0009] The temperature detection component is electrically connected to the disassembly component. The temperature detection component is used to obtain the temperature value of the mounting platform. The disassembly component is rotatably connected to the locking component.

[0010] The height detection component is electrically connected to the prompting component. The height detection component is used to obtain the height value of the locking member relative to the mounting platform, and the prompting component is used to issue a warning message.

[0011] Furthermore, the disassembly assembly includes a disassembly component and an adsorption sleeve sleeved on the outside of the disassembly component;

[0012] An adsorption channel is formed between the sidewall of the disassembly component and the sidewall of the adsorption sleeve, and the entrance of the adsorption channel is located above the wafer.

[0013] Furthermore, the disassembly component protrudes from one end of the adsorption sleeve near the wafer.

[0014] Furthermore, the disassembly component has a snap-fit ​​groove at one end near the wafer, which snaps into one end of the locking component, allowing the disassembly component to rotate the locking component.

[0015] Furthermore, at least one adsorption hole is provided on the side wall of the snap-fit ​​groove, and the adsorption hole is in communication with the adsorption channel.

[0016] Furthermore, the disassembly assembly also includes a vacuum adsorption assembly, which is connected to the adsorption channel and is used to adsorb air in the adsorption channel to create a negative pressure in the adsorption channel.

[0017] Furthermore, both the temperature detection component and the height detection component are mounted on the disassembly component, and the temperature detection component, the height detection component, and the disassembly component move in coordination.

[0018] Furthermore, the disassembly device also includes a drive assembly, which is driven to the disassembly assembly and is capable of moving the disassembly assembly toward or away from the wafer.

[0019] Furthermore, it also includes a data acquisition device for acquiring the wafer coding information, the data acquisition device being disposed above the mounting platform and fixedly connected to the disassembly assembly.

[0020] Furthermore, the axis of the locking component is arranged parallel to the axis of the disassembly component.

[0021] Implementing the embodiments of this utility model has the following beneficial effects:

[0022] This invention, through the integration of a temperature detection component, a height detection component, and a prompting component, enables the temperature detection component to monitor the temperature of the mounting stage. Only when the temperature of the mounting stage and the wafer drops to a suitable level is the disassembly component used to remove the locking components fixed to the wafer. This ensures wafer disassembly accuracy and prevents deformation of the mounting stage or wafer due to high temperatures, thus guaranteeing subsequent wafer-to-mounting stage installation accuracy. Simultaneously, the height detection component obtains the height of the locking components, accurately determining whether they are properly installed or removed. If a locking component is not properly installed or removed, the prompting component issues a warning message to prompt manual intervention, thereby ensuring wafer installation stability or ensuring all locking components on the wafer are completely removed. This prevents unremoved locking components from interfering with and damaging the wafer during wafer unloading, thus avoiding impact on wafer testing results. Attached Figure Description

[0023] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this utility model. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0024] Figure 1 This is a structural diagram of the wafer loading and unloading equipment described in this embodiment;

[0025] Figure 2 for Figure 1 A partial view;

[0026] Figure 3 This is a structural diagram of the disassembly device described in this embodiment;

[0027] Figure 4 This is a structural diagram of the disassembly component and the adsorption sleeve after they are connected in this embodiment;

[0028] Figure 5 This is a structural diagram of the bit of the disassembly component described in this embodiment.

[0029] The corresponding reference numerals in the figure are:

[0030] 1-Mounting platform; 2-Disassembly assembly; 3-Temperature detection assembly; 4-Height detection assembly; 5-Wafer; 6-Locking component; 7-Data acquisition device; 21-Disassembly component; 22-Adsorption sleeve; 211-Snap-fit ​​groove; 212-Adsorption hole. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. In the description of the present invention, it should be understood that the terms "upper," "lower," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0034] See appendix Figures 1-5This embodiment provides a wafer loading and unloading device, including: a mounting platform 1, on which a locking member 6 is provided, and a wafer 5 can be fixedly mounted on the mounting platform 1 by means of the locking member 6; a disassembly device, which includes a disassembly assembly 2, a temperature detection assembly 3, a height detection assembly 4, and a warning assembly; the temperature detection assembly 3 is electrically connected to the disassembly assembly 2, and is used to obtain the temperature value of the mounting platform 1, and the disassembly assembly 2 is rotatably connected to the locking member 6; the height detection assembly 4 is electrically connected to the warning assembly, and is used to obtain the height value of the locking member 6 relative to the mounting platform 1, and the warning assembly is used to issue a warning message; this application, by setting the mutually cooperating temperature detection assembly 3, height detection assembly 4, and warning assembly, can detect the temperature value of the mounting platform 1 by means of the temperature detection assembly 3, and when the temperature of the mounting platform 1 is within a certain range, the device can detect the temperature value of the mounting platform 1. Only when the temperature of wafer 5 drops to a suitable value is the locking component 6 fixed on wafer 5 removed by disassembly component 2. This ensures the disassembly accuracy of wafer 5 and avoids deformation of the mounting stage 1 or wafer 5 due to high temperature disassembly, thereby ensuring the subsequent installation accuracy of wafer 5 and mounting stage 1. At the same time, the height of locking component 6 is obtained by height detection component 4 to accurately determine whether locking component 6 is installed or removed in place. If locking component 6 is not installed or removed in place, the control prompt component issues a warning message to prompt the operator to intervene manually. This ensures the installation stability of wafer 5 or ensures that all locking components 6 on wafer 5 are completely removed, preventing the remaining locking components 6 on wafer 5 from interfering with and damaging wafer 5 during wafer unloading, thus avoiding affecting the test results of wafer 5.

[0035] Understandably, the temperature detection component 3 is used to obtain the temperature value of the mounting stage 1 near the wafer 5. If the temperature value is greater than or equal to the preset temperature value, it indicates that the mounting stage 1 is in a high-temperature state. If the wafer 5 is disassembled at this time, it is easy to cause high-temperature deformation of the mounting stage 1 and the wafer 5. Therefore, the disassembly component 2 is not rotatably connected to the locking component 6 at this time. If the temperature value is less than the preset temperature value, it indicates that the mounting stage 1 is in a low-temperature state. If the wafer 5 is disassembled at this time, the mounting stage 1 and the wafer 5 will not undergo high-temperature deformation. At this time, the disassembly component 2 is controlled to rotatably connect to the locking component 6 fixed on the wafer 5 to lock it. When component 6 is removed from wafer 5, the height detection component 4 detects the height value of the locking component 6. If the height value is lower than the second preset height value, it indicates that the locking component 6 is not properly removed, meaning that the locking component 6 is still connected to wafer 5. If wafer 5 is cut at this time, it will cause interference between the locking component 6 and wafer 5, damaging wafer 5, which will affect the test results of wafer 5. If wafer 5 is installed on the mounting stage 1, the height detection component 4 obtains the height value of the locking component 8. If the height value is higher than the first preset height value, it indicates that the locking component 6 is not properly installed, which will affect the installation stability of wafer 5.

[0036] It should be noted that the second preset height value is greater than the first preset height value, and the continuous height area between the first preset height value and the second preset height value forms a preset height range. When the locking component 6 is within the preset height range, it indicates that the locking component 6 is not installed or not removed properly, and at this time the prompt component can be controlled to display a warning message.

[0037] Specifically, when wafer 5 is locked to locking member 6, if the height value is greater than the first preset height value, the prompting component displays the first warning message; when wafer 5 is released from locking member 6, if the height value is less than the second preset height value, the prompting component displays the second warning message.

[0038] In some other possible embodiments, if the locking member 6 is not properly installed or disassembled, the disassembly assembly continues to control the locking member 6 to lock or disassemble it. Specifically, when the wafer 5 and the locking member 6 are locked together, if the height value is greater than a first preset height value, it indicates that the locking member 6 is not locked. At this time, the disassembly assembly 2 drives the locking member 6 to rotate in a first direction to lock the locking member 6. When the wafer 5 and the locking member 6 are released, if the height value is less than a second preset height value, it indicates that the locking member 6 is not completely disassembled. At this time, the disassembly assembly 2 drives the locking member 6 to rotate in a second direction to disassemble the locking member 6. The first direction and the second direction are opposite.

[0039] In this embodiment, the wafer loading and unloading equipment also includes a controller. The controller is communicatively connected to the disassembly component 2, the temperature detection component 3, the height detection component 4, and the prompting component. The controller can receive the temperature value obtained by the temperature detection component 3 and determine whether the temperature value is low. If it is low, the controller controls the disassembly component 2 to rotate and connect with the locking component 6. The controller can also receive the height value obtained by the height detection component 4. If the height value is within a preset height range, the controller controls the prompting component to issue a warning message.

[0040] Specifically, the warning message can be at least one of the following: text message, sound message, video message, light message, or vibration message.

[0041] In this embodiment, the mounting stage 1 has a mounting notch for mounting the wafer 5. At least two first mounting holes are provided around the mounting notch at intervals. At least two second mounting holes are provided on the wafer 5. The locking member 6 passes through the first mounting holes and the second mounting holes in sequence to fix the wafer 5 at the mounting notch of the mounting stage 1.

[0042] In this embodiment, the locking element 6 is a snap-fit ​​structure or a threaded connection structure.

[0043] Specifically, locking component 6 is a screw.

[0044] In some possible embodiments, the disassembly assembly 2 includes a disassembly member 21 and an adsorption sleeve 22 sleeved on the outside of the disassembly member 21; an adsorption channel is formed between the side wall of the disassembly member 21 and the side wall of the adsorption sleeve 22, and the entrance of the adsorption channel is located above the wafer 5. By forming an adsorption channel on the outside of the disassembly member 21, the debris generated by the locking member 6 during the installation or disassembly process can be adsorbed into the adsorption channel, thus avoiding the generated debris from scratching the wafer 5 and ensuring that the mounting stage 1 is clean.

[0045] In this embodiment, there is a gap between the outer wall of the disassembly component 21 and the inner wall of the adsorption sleeve 22 to form an adsorption channel. The specific value of the gap is not limited, as long as the adsorption channel can adsorb the debris on the wafer 5.

[0046] In this embodiment, the disassembly component 21 is an electric screwdriver. The electric screwdriver has a detachable bit on the side near the wafer 5. The bit is a screwdriver head installed on the electric screwdriver for turning screws. Its shape and size vary depending on the type and specification of the screw. Common types include slotted, Phillips, or hexagonal screws.

[0047] Specifically, the length of the adsorption sleeve 22 is not limited, that is, the adsorption sleeve 22 can be completely fitted onto the disassembly part 21, or the adsorption sleeve 22 can be fitted onto part of the disassembly part 21.

[0048] Preferably, in order to reduce the manufacturing cost and installation difficulty of the adsorption sleeve 22, the length of the adsorption sleeve 22 is adapted to the length of the electric screwdriver bit, and the adsorption sleeve 22 is fitted onto the bit of the electric screwdriver.

[0049] In some possible embodiments, the disassembly component 21 protrudes from the end of the adsorption sleeve 22 near the wafer 5. With the above arrangement, it can be ensured that the adsorption sleeve 22 will not interfere with the wafer 5 during the disassembly of the locking component 6 by the disassembly component 21, thus avoiding damage to the wafer 5. It can also ensure that there is a gap between the adsorption sleeve 22 and the wafer 5, thereby ensuring the adsorption area and adsorption effect of the adsorption sleeve 22 on the wafer 5.

[0050] In this embodiment, the length of the protrusion of the disassembly component 21 relative to the end of the adsorption sleeve 22 near the wafer 5 is not limited, as long as it is ensured that the suction sleeve 22 does not interfere with the wafer 5 during the disassembly or installation of the locking component 6 by the disassembly component 21.

[0051] In some possible embodiments, the end of the disassembly member 21 near the wafer is provided with a snap-fit ​​groove 211, which snaps into one end of the locking member 6. The disassembly member 21 can drive the locking member 6 to rotate. By providing the snap-fit ​​groove 211, the locking member 6 can be prevented from falling off the disassembly member 21 during operation, ensuring that the disassembly member 21 can stably drive the locking member 6 to rotate, thereby ensuring the operational stability of both.

[0052] In this embodiment, the disassembly component 21 is an electric screwdriver, and the aforementioned snap-fit ​​groove 211 is provided on the screwdriver bit. The aforementioned snap-fit ​​groove 211 is a slotted, Phillips, or hexagonal snap-fit ​​groove 211 of the same type and specification as the locking component 6.

[0053] Specifically, the depth of the locking groove 211 is also adapted to the type and specifications of the locking element 6, and is not limited here.

[0054] In some possible embodiments, at least one adsorption hole 212 is provided on the side wall of the snap-fit ​​groove 211. The adsorption hole 212 is connected to the adsorption channel. The snap-fit ​​groove 211 can be sleeved on one end of the locking member 6. The adsorption hole can adsorb the debris generated by the one end of the locking member 6 under the action of the disassembly member. At the same time, the adsorption channel can adsorb the debris on the surface of the wafer 5. This can improve the debris adsorption efficiency and ensure the debris adsorption effect.

[0055] In this embodiment, the adsorption hole 212 is provided on the side wall of the snap-fit ​​groove 211. The adsorption hole 212 is used to adsorb some of the debris generated by the locking member 6 contained in the snap-fit ​​groove 211. After the snap-fit ​​groove 211 is fitted onto the locking member 6, the locking member 6 cannot cover the adsorption hole 212, that is, there is a distance between the locking member 6 and the adsorption hole 212.

[0056] In some possible embodiments, the adsorption hole 212 is located near the bottom of the snap-fit ​​groove 211. After the snap-fit ​​groove 211 is engaged with the locking member 6, there is a distance between the adsorption hole 212 and the locking member 6.

[0057] In this embodiment, at least one adsorption hole 212 is arranged at circumferential intervals along the snap-fit ​​groove 211.

[0058] In some possible embodiments, four adsorption holes 212 are evenly spaced on the sidewall of the snap-fit ​​groove 211.

[0059] In some possible embodiments, the disassembly assembly 2 further includes a vacuum adsorption assembly, which is connected to the adsorption channel. The vacuum adsorption assembly is used to adsorb air in the adsorption channel to form a negative pressure in the adsorption channel. By setting the vacuum adsorption assembly, the adsorption channel can be vacuum adsorbed, so that the suction channel forms a negative pressure, thereby enabling the adsorption channel to adsorb debris.

[0060] In this embodiment, the vacuum adsorption assembly includes a vacuum adsorption element and a dust collection element. The vacuum adsorption element is used to create a negative pressure in the adsorption channel, and the dust collection element is connected to the adsorption channel and can collect the debris adsorbed by the adsorption channel.

[0061] In some possible embodiments, both the temperature detection component 3 and the height detection component 4 are mounted on the disassembly component 2. The temperature detection component 3, the height detection component 4, and the disassembly component 2 move in coordination. By moving in coordination, the temperature detection component 3 and the height detection component 4 can detect the temperature of the wafer 5 being disassembled or installed by the disassembly component 2 in real time, and detect the height of the locking member 6 on the wafer 5. This can ensure the stability of the wafer 5 during installation and disassembly, and prevent the locking member 6 from being damaged by not being installed in place or not being completely disassembled, thus ensuring the service life of the wafer 5.

[0062] In this embodiment, the disassembly assembly 2 also includes a fixing base. The disassembly component 21, the temperature detection assembly 3, and the height detection assembly 4 are all fixedly mounted on the fixing base so that the temperature detection assembly 3 and the height detection assembly 4 can move in coordination with the disassembly assembly 2.

[0063] Preferably, the temperature detection component 3 and the height detection component 4 are respectively arranged on both sides of the fixed base to achieve a reasonable layout of the structure.

[0064] In this embodiment, the temperature detection component 3 is a temperature sensor, and the height detection component 4 is at least one of an ultrasonic sensor, a laser sensor, a fiber optic sensor, or a displacement sensor.

[0065] In some possible embodiments, the disassembly device further includes a drive assembly, the disassembly assembly 2 is driven to the drive assembly, and the drive assembly can drive the disassembly assembly 2 toward or away from the wafer 5. By setting the drive assembly, the disassembly assembly 2 can be driven toward or away from at least two locking members 6 fixedly set on the wafer 5, thus ensuring that the disassembly assembly 2 can disassemble or install at least two locking members 6 set in different positions, thereby improving the flexibility of the disassembly assembly 2.

[0066] In this embodiment, the driving component is fixedly connected to the fixed base. The driving component can drive the disassembly component 2 to move along the X, Y and Z directions, so as to enable the installation or disassembly of the locking component set at any position on the wafer 5. The X, Y and Z directions are defined with the axis of the wafer 5 as the Z-axis direction, and the two mutually perpendicular diameters in the wafer 5 as the X-axis and Y-axis directions, respectively.

[0067] In this embodiment, as long as the driving component can drive the disassembly component to move along the X, Y and Z directions, the specific structure of the driving component is not limited.

[0068] In some possible embodiments, a data acquisition device 7 for acquiring the coding information of wafer 5 is also included. The data acquisition device 7 is disposed above the mounting platform 1 and is fixedly connected to the disassembly assembly 2. By setting the data acquisition device 7, the coding information of wafer 5 can be acquired, and the coding information of wafer 5, the height value of locking member 6, the disassembly temperature value of wafer 5 and the test results of wafer 5 can be associated and stored. This facilitates the subsequent retrieval of the corresponding test results and improves the convenience of test data organization and acquisition.

[0069] In this embodiment, the data acquisition device 7 is fixedly mounted on the mounting base, and the data acquisition device 7 is a barcode scanner used to scan the code on the wafer 5.

[0070] In some possible embodiments, the axis of the locking member 6 is arranged parallel to the axis of the disassembly member 21. By arranging the axes of the two parallel, it can be ensured that there is no angular deviation between the two during the process of the disassembly member 21 locking the locking member 6, thus ensuring the stability of the disassembly member 21 in installing or disassembling the locking member 6.

[0071] In this embodiment, the axis of the locking member 6 is arranged parallel to the axis of the disassembly member 21. When the disassembly member 21 disassembles the locking member 6, the disassembly member 21 moves to directly above the locking member 6, and the axis of the locking member 6 and the axis of the disassembly member 21 are aligned. This ensures the stability of the disassembly member 21 in installing or disassembling the locking member 6.

[0072] The wafer loading and unloading equipment operates as follows: The drive assembly moves the disassembly assembly 2 above the wafer 5 to be unloaded. The temperature detection assembly 3 acquires the temperature value of the mounting stage 1 near the wafer 5. If the temperature value is greater than or equal to the preset temperature value, it indicates that the mounting stage 1 is in a high-temperature state. If the wafer 5 is disassembled at this time, it is easy to cause high-temperature deformation of the mounting stage 1 and the wafer 5. Therefore, the disassembly assembly 2 is not rotatably connected to the locking part 6 at this time. If the temperature value is less than the preset temperature value, it indicates that the mounting stage 1 is in a low-temperature state. If the wafer 5 is disassembled at this time, the mounting stage 1 and the wafer 5 will not undergo high-temperature deformation. At this time, the control disassembly component 2 is rotatably connected to the locking component 6 fixed on the wafer 5 to disassemble the locking component 6 from the wafer 5. At this time, the height detection component 4 detects the height value of the locking component 6. If the height value is lower than the second preset height value, it indicates that the locking component 6 has not been disassembled in place, that is, the locking component 6 is still connected to the wafer 5. If the wafer 5 is unloaded at this time, it will cause interference between the locking component 6 and the wafer 5, damaging the wafer 5. This will affect the test results of the wafer 5. At this time, the control prompt component issues a warning message to prompt the operator to intervene manually. Repeat the above operation until all the locking components 6 on the wafer 5 are disassembled.

[0073] Although the present invention has been described through preferred embodiments, the present invention is not limited to the embodiments described herein, and includes various changes and variations without departing from the scope of the present invention.

[0074] In this document, the directional terms such as front, back, top, and bottom are defined according to the positions of the components in the accompanying drawings and the positions between the components, and are only used for clarity and convenience in expressing the technical solution. It should be understood that the use of these directional terms should not limit the scope of protection claimed by this utility model.

[0075] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

[0076] The above-disclosed embodiment is merely a preferred embodiment of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A wafer loading and unloading device, characterized in that, include: A mounting platform is provided with a locking element, and the wafer can be fixedly mounted on the mounting platform by the locking element. A disassembly device, comprising a disassembly assembly, a temperature detection assembly, a height detection assembly, and a warning assembly; The temperature detection component is electrically connected to the disassembly component. The temperature detection component is used to obtain the temperature value of the mounting platform. The disassembly component is rotatably connected to the locking component. The height detection component is electrically connected to the prompting component. The height detection component is used to obtain the height value of the locking member relative to the mounting platform, and the prompting component is used to issue a warning message.

2. The wafer loading and unloading equipment according to claim 1, characterized in that, The disassembly assembly includes a disassembly component and an adsorption sleeve sleeved on the outside of the disassembly component; An adsorption channel is formed between the sidewall of the disassembly component and the sidewall of the adsorption sleeve, and the entrance of the adsorption channel is located above the wafer.

3. The wafer loading and unloading equipment according to claim 2, characterized in that, The disassembly component protrudes from one end of the adsorption sleeve near the wafer.

4. The wafer loading and unloading equipment according to claim 2, characterized in that, The disassembly component has a snap-fit ​​groove at one end near the wafer, which snaps into one end of the locking component, allowing the disassembly component to rotate the locking component.

5. The wafer loading and unloading equipment according to claim 4, characterized in that, At least one adsorption hole is provided on the side wall of the snap-fit ​​groove, and the adsorption hole is connected to the adsorption channel.

6. The wafer loading and unloading equipment according to claim 2, characterized in that, The disassembly assembly also includes a vacuum adsorption assembly, which is connected to the adsorption channel and is used to adsorb air in the adsorption channel to create a negative pressure in the adsorption channel.

7. The wafer loading and unloading equipment according to any one of claims 1-6, characterized in that, Both the temperature detection component and the height detection component are mounted on the disassembly component, and the temperature detection component, the height detection component, and the disassembly component move in coordination.

8. The wafer loading and unloading equipment according to claim 7, characterized in that, The disassembly device further includes a drive assembly, which is drivenly connected to the drive assembly and is capable of moving the disassembly assembly toward or away from the wafer.

9. The wafer loading and unloading equipment according to any one of claims 1-6, characterized in that, It also includes a data acquisition device for acquiring the wafer coding information, the data acquisition device being disposed above the mounting platform and fixedly connected to the disassembly assembly.

10. The wafer loading and unloading equipment according to any one of claims 1-6, characterized in that, The axis of the locking component is set parallel to the axis of the disassembly component.

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