Light emitting device

By eliminating auxiliary structures in the light-emitting device and directly placing the polarization element on the substrate or light-transmitting connecting layer, the problems of complex manufacturing processes and increased costs are solved, achieving the effects of simplifying the manufacturing process and reducing costs.

CN224265412UActive Publication Date: 2026-05-19SHENZHEN OPTISEEN TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN OPTISEEN TECHNOLOGY CO LTD
Filing Date
2025-02-27
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

The addition of glass or plastic sheets to existing light-emitting devices has led to complex manufacturing processes and increased production costs.

Method used

By directly placing the polarization element on the substrate or the light-transmitting connecting layer in the light-emitting device, the auxiliary structure is eliminated, simplifying the structure and reducing production costs.

Benefits of technology

It simplifies the manufacturing process of light-emitting devices, reduces production costs, and improves the filtering effect of unpolarized light.

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Abstract

The utility model relates to a light emitting device. The light-emitting device comprises a substrate, a light-emitting chip, a first lens and a polarization element, wherein the light-emitting chip is arranged on the substrate; the first lens is arranged on the substrate and covers the light-emitting chip; the polarization element is arranged between the light-emitting chip and the first lens; wherein the polarization element is supported by the substrate, or the polarization element is arranged on the light-emitting chip through a light-transmitting connecting layer. According to the light-emitting device, the polarization element is integrated in the first lens, an auxiliary structure used for installing the polarization element does not need to be arranged, the structure of the light-emitting device is simplified, the production process of the light-emitting device is simplified, and the production cost of the light-emitting device is reduced; meanwhile, the polarization element is arranged close to the light-emitting chip, so that the area is reduced, and the production cost of the light-emitting device is further reduced.
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Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a light-emitting device. Background Technology

[0002] Infrared LEDs (Light Emitting Diodes) are typically used as supplementary light sources, often employing polarizers to filter out some unpolarized light. In recognition systems such as facial recognition and palmprint recognition, the unpolarized light emitted by infrared LEDs, when illuminating an object's surface, results in reflected light containing unwanted polarization components, reducing the signal-to-noise ratio of the image. Polarizers filter out reflected light with specific polarization directions, minimizing its impact on image quality and making the image clearer, facilitating the extraction and identification of target object features. In infrared lighting scenarios, such as nighttime surveillance and automotive infrared night vision systems, glare may occur, affecting observation. Polarizers can filter out some of the polarized light that causes glare, reducing visual interference and improving observation clarity and comfort.

[0003] Because polarizers are thin and relatively soft, a transparent glass or plastic sheet needs to be pre-placed before the polarizer is installed. The polarizer is then placed on the glass or plastic sheet, which supports the polarizer and prevents it from warping or deforming. However, adding this glass or plastic sheet complicates the manufacturing process of the light-emitting device and increases production costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a light-emitting device that addresses the problem of increased production costs and complex manufacturing processes caused by the addition of glass or plastic sheets.

[0005] A light-emitting device, comprising:

[0006] Base;

[0007] A light-emitting chip, wherein the light-emitting chip is disposed on the substrate;

[0008] A first lens, disposed on the substrate and covering the light-emitting chip; and

[0009] A polarizing element is disposed between the light-emitting chip and the first lens;

[0010] The polarization element is supported by the substrate, or the polarization element is disposed on the light-emitting chip through a light-transmitting connecting layer.

[0011] In one embodiment, the substrate is provided with a die bonding groove, and the light-emitting chip is disposed in the die bonding groove; the polarizing element covers the die bonding groove and is disposed at intervals with the light-emitting chip and the first lens, respectively.

[0012] In one embodiment, the polarizing element is disposed on the surface of the light-transmitting connection layer facing away from the light-emitting chip, and is spaced apart from the first lens.

[0013] In one embodiment, the substrate is provided with a die bonding groove, the light-emitting chip is disposed in the die bonding groove, and the polarizing element covers the die bonding groove.

[0014] In one embodiment, the light-emitting device further includes a second lens disposed on the polarizing element and located between the polarizing element and the first lens.

[0015] In one embodiment, the surface of the second lens facing away from the polarizing element is planar and is in contact with the first lens; or the surface of the second lens facing away from the polarizing element is convex and is spaced apart from the first lens.

[0016] In one embodiment, the second lens has a connecting surface and an inclined side surface, the connecting surface being located on the polarizing element, the inclined side surface being connected to the connecting surface, and the inclined side surface being gradually widened in the direction of the light output axis.

[0017] A light-emitting device, comprising:

[0018] Base;

[0019] A light-emitting chip, wherein the light-emitting chip is disposed on the substrate;

[0020] A first lens is disposed on the substrate and covers the light-emitting chip;

[0021] A second lens, disposed between the light-emitting chip and the first lens; and

[0022] A polarizing element is disposed between the first lens and the second lens;

[0023] The second lens is disposed on the light-emitting chip, and the polarizing element is disposed on the second lens and in contact with the second lens. The surface of the polarizing element facing away from the second lens is in contact with or spaced apart from the first lens.

[0024] A light-emitting device, comprising:

[0025] Base;

[0026] A light-emitting chip, wherein the light-emitting chip is disposed on the substrate;

[0027] A first lens is disposed on the substrate and covers the light-emitting chip;

[0028] The second lens is disposed between the light-emitting chip and the first lens;

[0029] A polarizing element, wherein the polarizing element is disposed between the first lens and the second lens; and

[0030] A support member is connected between the substrate and the first lens; a polarizing element is disposed on the support member and is spaced apart from the second lens and the first lens respectively; the second lens is disposed on the light-emitting chip; or, the second lens is disposed on the support member and is spaced apart from the light-emitting chip.

[0031] A light-emitting device, comprising:

[0032] Base;

[0033] A light-emitting chip, wherein the light-emitting chip is disposed on the substrate;

[0034] A first lens, disposed on the substrate and covering the light-emitting chip, includes a main body and a mounting portion. The main body has an optical interface facing away from the substrate, and the mounting portion is disposed at the periphery of the optical interface.

[0035] A polarizing element is disposed on the mounting portion and covers the optical interface of the main body portion.

[0036] The aforementioned light-emitting device eliminates the need for auxiliary structures to mount polarization elements, simplifying the device's structure and manufacturing process, and reducing costs. Furthermore, as the distance between the polarization element and the light-emitting chip gradually decreases, the area of ​​the polarization element correspondingly decreases, further reducing the production cost of the light-emitting device. Attached Figure Description

[0037] Figures 1 to 6 This is a cross-sectional view of the light-emitting device of Embodiments 1 to 6 (first group of embodiments) of this application, wherein the polarization element is disposed between the light-emitting chip and the first lens.

[0038] Figures 7 to 10 This is a cross-sectional view of the light-emitting device of Embodiments 7 to 10 (second group of embodiments) of this application, wherein the polarizing element is disposed between the second lens and the first lens.

[0039] Figures 11 to 13This is a cross-sectional view of the light-emitting device of Embodiments 11 to 13 (third group of embodiments) of this application, wherein the polarizing element is disposed outside the first lens.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100-Light-emitting device; 110-Substrate; 112-Die bonding groove; 114-Separator; 116-Protrusion structure; 120-Light-emitting chip; 130-First lens; 132-Optical interface; 134-Main body; 136-Support; 138-Mounting part; 140-Polarizing element; 150-Light-transmitting connecting layer; 160-Second lens; 162-Inclined side; 170-Support member. Detailed Implementation

[0042] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0043] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0048] This application provides a light-emitting device, including a substrate, a light-emitting chip, a first lens, and a polarizing element. The light-emitting chip is disposed on the substrate. The first lens is disposed on the substrate and covers the light-emitting chip. The polarizing element is disposed between the light-emitting chip and the first lens, forming a first set of embodiments (Embodiments 1 to 6), as shown below. Figures 1 to 6 As shown. The light-emitting device of this application can also have a second lens disposed on its light-emitting chip, and a polarizing element placed between the second lens and the first lens, thus forming a second set of embodiments (Embodiments 7 to 10), as shown. Figures 7 to 10 As shown. Furthermore, the light-emitting device of this application can also have a polarizing element disposed outside the first lens, thus forming a third set of embodiments (Embodiments 11 to 13), as shown. Figures 11 to 13As shown. The light-emitting device of this application does not require an auxiliary structure to mount the polarization element, which simplifies the structure of the light-emitting device, simplifies its manufacturing process, and reduces costs; moreover, as the distance between the polarization element and the light-emitting chip gradually decreases, the area of ​​the polarization element gradually decreases accordingly, further reducing the production cost of the light-emitting device.

[0049] Please see Figure 1 , Figure 1 A cross-sectional view of the light-emitting device in Embodiment 1 of this application is shown. The light-emitting device 100 provided in Embodiment 1 includes a substrate 110, a light-emitting chip 120, a first lens 130, and a polarizing element 140. The light-emitting chip 120 is disposed on the substrate 110. The first lens 130 is disposed on the substrate 110 and covers the light-emitting chip 120. The polarizing element 140 is disposed between the light-emitting chip 120 and the first lens 130 and is supported by the substrate 110. By disposing the polarizing element 140 on the substrate 110 and located between the light-emitting chip 120 and the first lens 130, and integrating the polarizing element 140 within the first lens 130, the auxiliary structure for mounting the polarizing element 140 is eliminated, thus simplifying the structure of the light-emitting device 100 and its manufacturing process, and reducing its production cost. Furthermore, the proximity of the polarizing element 140 to the light-emitting chip 120 helps to reduce its area, further reducing the production cost of the light-emitting device 100.

[0050] The substrate 110 has a die-bonding groove 112, and the light-emitting chip 120 is disposed in the die-bonding groove 112. The die-bonding groove 112 has a partition 114, dividing the substrate 110 into a first part and a second part. The light-emitting chip 120 is die-bonded on the first part and electrically connected to the second part via bonding wires (not shown). It is understood that in other embodiments, the substrate 110 may include a substrate and a dam, with the dam disposed on the substrate to form the die-bonding groove 112.

[0051] The substrate 110 is specifically a support, and die bonding grooves 112 are formed on one surface of the support. The number of die bonding grooves 112 on the substrate 110 can be set according to actual needs and is not limited to one. In alternative embodiments, the substrate 110 can also be a circuit board, a glass substrate, or other substrates, depending on actual needs.

[0052] The light-emitting chip 120 can be, but is not limited to, an LED chip. Specifically, it can be a red LED chip, and its quantity is not limited to one, but can be set according to the actual situation. In other embodiments, the light-emitting chip 120 can be a blue LED chip, a green LED chip, or a combination of LED chips of different light-emitting colors. The light-emitting chip 120 can also be a flip chip, which is directly bonded to the first part and the second part without wire bonding.

[0053] The polarizing element 140 covers the die-bonding groove 112 and is spaced apart from the light-emitting chip 120 and the first lens 130, respectively. Since the area of ​​the polarizing element 140 is much larger than the area of ​​the light-emitting surface of the light-emitting chip 120, the polarizing element 140 can essentially filter all the light emitted by the light-emitting chip 120, thereby improving the filtering effect of unpolarized light. Furthermore, the spacing between the polarizing element 140 and the light-emitting chip 120 facilitates wire bonding and prevents the polarizing element 140 from interfering with the chip's wire bonding.

[0054] To facilitate fixing the polarization element 140, the substrate 110 is provided with a protrusion structure 116, which is located on the periphery of the die bonding groove 112. The polarization element 140 is fixed to the protrusion structure 116. The polarization element 140 can be fixed to the protrusion structure 116 by bonding or hot pressing. The protrusion structure 116 can be, but is not limited to, a protruding ring structure.

[0055] The polarizing element 140 is specifically a polarizer, an optical element made of a specific material that filters light vibrating in a specific direction. The principle of the polarizer is based on the phenomenon of polarized light, which is light vibrating along a specific plane. The polarizer is formed by shearing, stretching, or compressing an isotropic sheet, creating a principal axis and a secondary axis perpendicular to the principal axis. Light along the principal axis has an electric field component parallel to it, while light along the secondary axis has an electric field component perpendicular to it. When natural light passes through the polarizer, due to its selective absorption, only light parallel to the principal axis can pass through, while light perpendicular to the principal axis is absorbed or reflected. Therefore, the light after passing through the polarizer becomes polarized light. It should be noted that, in alternative embodiments, the polarizing element 140 can be a polarizing film or other polarizing devices capable of achieving the above functions.

[0056] The first lens 130 has an optical interface 132 facing away from the substrate 110. The optical interface 132 is a convex curved surface, which can improve light utilization and reduce Fresnel loss.

[0057] The first lens 130 is specifically a plano-convex lens, including a main body 134 and a support 136. The support 136 is disposed on the plane of the main body 134 and supports the substrate 110. The first lens 130 is mounted on the substrate 110 and covers the polarizing element 140 and the light-emitting chip 120. The main body 134 and the support 136 can be integrally formed. The first lens 130 can be molded onto the substrate 110, or it can be formed first and then bonded to the substrate 110. It is understood that in other embodiments, the support 136 can be replaced by a support structure, meaning the first lens 130 does not require a support 136; the support structure is fixed to the substrate 110, and the first lens 130 is fixed to the support structure.

[0058] Please see Figure 2 , Figure 2 A cross-sectional view of the light-emitting device in Embodiment 2 of this application is shown. The light-emitting device 100 provided in Embodiment 2 includes a substrate 110, a light-emitting chip 120, a first lens 130, and a polarizing element 140. The light-emitting chip 120 is disposed on the substrate 110. The first lens 130 is disposed on the substrate 110 and covers the light-emitting chip 120. The polarizing element 140 is disposed between the light-emitting chip 120 and the first lens 130, and is disposed on the light-emitting chip 120 through a light-transmitting connecting layer 150. The polarization element 140 is disposed on the light-emitting chip 120 by means of the light-transmitting connecting layer 150, and the polarization element 140 is integrated in the first lens 130. The auxiliary structure for mounting the polarization element 140 is not required, which simplifies the structure of the light-emitting device 100 and the manufacturing process of the light-emitting device 100, thereby reducing its production cost. Since the light-transmitting connecting layer 150 mainly serves to connect the light-emitting chip 120 and the polarization element 140 to avoid the polarization element 140 directly contacting the light-emitting chip 120, this situation can be regarded as the polarization element 140 being disposed on the light-emitting chip 120, that is, the polarization element 140 is disposed closer to the light-emitting chip 120, which greatly reduces the area of ​​the polarization element 140 and significantly reduces the cost of the light-emitting device 100.

[0059] The material of the light-transmitting bonding layer 150 can be, but is not limited to, transparent adhesive, epoxy resin, UV adhesive or other transparent glue. The greater its thickness, the easier it is to bring out the bonding wires on the front side of the light-emitting chip 120.

[0060] The polarizing element 140 is disposed on the surface of the light-transmitting connecting layer 150 facing away from the light-emitting chip 120, and is spaced apart from the first lens 130. The light-transmitting connecting layer 150 can also be designed with different shapes to improve light extraction efficiency, thereby improving the luminous efficacy of the light-emitting device 100. When there is only one light-emitting chip 120, the area of ​​the polarizing element 140 can be equal to or slightly larger than the area of ​​the front side of the light-emitting chip 120, and the area of ​​the light-transmitting connecting layer 150 can be equal to or smaller than the area of ​​the front side of the light-emitting chip 120.

[0061] The specific arrangement of the substrate 110, light-emitting chip 120, polarizing element 140 and first lens 130 of the light-emitting device 100 in this embodiment 2 is basically the same as the corresponding part of the light-emitting device 100 in the above embodiment 1. The specific details can be referred to the description of the above embodiment 1, and will not be repeated here.

[0062] Please see Figure 3 , Figure 3A cross-sectional view of the light-emitting device in Embodiment 3 of this application is shown. Based on the light-emitting device 100 in Embodiment 2 above, Embodiment 3 of this application provides a light-emitting device 100 in which the polarization element 140 extends outward and covers the die-bonding groove 112. The polarization element 140 is disposed on the light-emitting chip 120 by means of the light-transmitting connecting layer 150 and the substrate 110, and the polarization element 140 is integrated in the first lens 130. There is no need to set up an auxiliary structure for mounting the polarization element 140, which simplifies the structure of the light-emitting device 100, simplifies the manufacturing process of the light-emitting device 100, and reduces its manufacturing cost. The polarization element 140 is disposed close to the light-emitting chip 120, which helps to reduce its area and further reduce the manufacturing cost of the light-emitting device 100. Moreover, the polarization element 140 is supported on both the substrate 110 and the light-transmitting connecting layer 150, which can prevent the polarization element 140 from warping or deforming, which helps to improve the filtering effect on unpolarized light.

[0063] As for the other aspects of the light-emitting device 100 in this embodiment 3, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 2. The specific content can be referred to the description of the above embodiment 2, and will not be repeated here.

[0064] Please see Figure 4 , Figure 4 A cross-sectional view of the light-emitting device in Embodiment 4 of this application is shown. Compared with the light-emitting device 100 in Embodiment 2 above, the light-emitting device 100 provided in Embodiment 4 of this application further includes: a second lens 160, which is disposed on the polarizing element 140 and located between the polarizing element 140 and the first lens 130. The polarization element 140 is disposed on the light-emitting chip 120 by means of the light-transmitting connecting layer 150, while the polarization element 140 is integrated in the first lens 130. This eliminates the need for auxiliary structures for mounting the polarization element 140, simplifying the structure of the light-emitting device 100 and its manufacturing process, and reducing its production cost. Since the light-transmitting connecting layer 150 mainly serves to connect the light-emitting chip 120 and the polarization element 140 to prevent the polarization element 140 from directly contacting the light-emitting chip 120, this situation can be regarded as the polarization element 140 being disposed on the light-emitting chip 120, that is, the polarization element 140 is disposed closer to the light-emitting chip 120, which greatly reduces the area of ​​the polarization element 140 and significantly reduces the cost of the light-emitting device 100. Moreover, the second lens 160 can improve light utilization and reduce Fresnel loss.

[0065] The surface of the second lens 160 facing away from the polarizing element 140 is planar and is in contact with the first lens 130. Since the light-emitting surface of the second lens 160 is in contact with the light-incident surface of the first lens 130, it is beneficial to reduce the overall size of the light-emitting device 100. The refractive index of the second lens 160 is less than that of the first lens 130. When the light-emitting chip 120 emits light, the light propagates from the optically less dense medium to the optically denser medium, preventing total internal reflection and thus improving luminous efficiency. It should be noted that in other embodiments, the refractive index of the second lens 160 may be equal to or greater than that of the first lens 130.

[0066] Furthermore, the second lens 160 has a connecting surface (not labeled) and an inclined side surface 162. The connecting surface is located on the polarizing element 140, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light output axis. The four sides of the second lens 160 are inclined to reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is prone to total internal reflection due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can directly enter the first lens 130 and be utilized by the first lens 130, improving the light energy utilization rate, minimizing light energy loss, improving light efficiency, and significantly increasing brightness.

[0067] The second lens 160 may be, but is not limited to, a light-transmitting adhesive, a light-transmitting adhesive filled with microparticles, or other materials. The light-transmitting adhesive may be, but is not limited to, one or a combination of epoxy resin and silicone resin. The microparticles may be, but is not limited to, one or a combination of phosphor, diffusing powder (scattering powder), and colorant.

[0068] The first lens 130 is a plano-convex lens and has no obvious support. The plane (incident surface) of the plano-convex lens is basically directly supported on the substrate 110, and can directly contact the light-emitting surface of the second lens 160, thereby reducing the volume of the entire light-emitting device 100.

[0069] As for the other aspects of the light-emitting device 100 in this embodiment 4, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 2. The specific content can be referred to the description of the above embodiment 2, and will not be repeated here.

[0070] Please see Figure 5 , Figure 5A cross-sectional view of the light-emitting device in Embodiment 5 of this application is shown. Compared with the light-emitting device 100 in Embodiment 4 above, the surface of the second lens 160 of the light-emitting device 100 facing away from the polarizing element 140 in Embodiment 5 is a convex curved surface, and it is spaced apart from the first lens 130. The polarization element 140 is mounted on the light-emitting chip 120 via the light-transmitting connecting layer 150, while the polarization element 140 is integrated within the first lens 130. This eliminates the need for auxiliary structures for mounting the polarization element 140, simplifying the structure and manufacturing process of the light-emitting device 100 and reducing its production cost. Since the light-transmitting connecting layer 150 primarily connects the light-emitting chip 120 and the polarization element 140 to prevent the polarization element 140 from directly contacting the light-emitting chip 120, this can be considered as the polarization element 140 being mounted on the light-emitting chip 120. This significantly reduces the area of ​​the polarization element 140 and substantially lowers the cost of the light-emitting device 100. Furthermore, because the light-emitting surface of the second lens 160 is spaced apart from the light-incident surface of the first lens 130, light is refracted through the second lens 160, the cavity, and the first lens 130 before exiting, ensuring that the emitted light accurately reaches the preset light-emitting angle and achieving good light control. Therefore, the entire light-emitting device 100 can achieve zoned and precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0071] Furthermore, the second lens 160 has a connecting surface and an inclined side surface 162. The connecting surface is located on the polarizing element 140, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light output axis. The inclined side surface 162 of the second lens 160 can reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is prone to total internal reflection due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can enter the first lens 130, be utilized by the first lens 130, improve the light energy utilization rate, reduce light energy loss, improve light efficiency, and significantly increase brightness.

[0072] The second lens 160 can be, but is not limited to, a plano-convex lens. Its connecting surface is the plane of the plano-convex lens, and its convex surface can be a hemispherical surface, a spherical cap surface, a semi-ellipsoidal surface, or other convex surfaces.

[0073] The first lens 130 is also a plano-convex lens. The first lens 130 includes a main body 134 and a support 136. The support 136 is disposed on the plane of the main body 134 and is supported on the substrate 110. The first lens 130 is mounted on the substrate 110. The support 136 provides a gap space for the spacing between the second lens 160 and the first lens 130. Thus, the first lens 130 can cover the light-emitting chip 120, the light-transmitting connecting layer 150, the polarizing element 140, and the second lens 160.

[0074] As for the other aspects of the light-emitting device 100 in this embodiment 5, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 4. The specific details can be referred to the description of the above embodiment 4, and will not be repeated here.

[0075] Please see Figure 6 , Figure 6 A cross-sectional view of the light-emitting device in Embodiment 6 of this application is shown. Based on the light-emitting device 100 in Embodiment 5 above, Embodiment 6 of this application provides a light-emitting device 100 in which the polarization element 140 extends outward and covers the die-bonding groove 112. The polarization element 140 is disposed on the light-emitting chip 120 by means of the light-transmitting connecting layer 150 and the substrate 110, and the polarization element 140 is integrated in the first lens 130. There is no need to set up an auxiliary structure for mounting the polarization element 140, which simplifies the structure of the light-emitting device 100, simplifies the manufacturing process of the light-emitting device 100, and reduces its manufacturing cost. The polarization element 140 is disposed close to the light-emitting chip 120, which helps to reduce its area and further reduce the manufacturing cost of the light-emitting device 100. Moreover, the polarization element 140 is supported on both the substrate 110 and the light-transmitting connecting layer 150, which can prevent the polarization element 140 from warping or deforming, which helps to improve the filtering effect on unpolarized light.

[0076] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 5. The specific details can be referred to the description of the above embodiment 5, and will not be repeated here.

[0077] Please see Figure 7 , Figure 7A cross-sectional view of the light-emitting device in Embodiment 7 of this application is shown. The light-emitting device 100 provided in Embodiment 7 includes a substrate 110, a light-emitting chip 120, a first lens 130, a polarizing element 140, and a second lens 160. The light-emitting chip 120 is disposed on the substrate 110. The first lens 130 is disposed on the substrate 110 and covers the light-emitting chip 120. The second lens 160 is disposed between the light-emitting chip 120 and the first lens 130. The polarizing element 140 is disposed between the first lens 130 and the second lens 160. By disposing the polarizing element 140 between the first lens 130 and the second lens 160, and integrating the polarizing element 140 within the first lens 130, the auxiliary structure for mounting the polarizing element 140 is eliminated, simplifying the structure of the light-emitting device 100 and its manufacturing process, thus reducing its production cost. Furthermore, the proximity of the polarizing element 140 to the light-emitting chip 120 helps reduce its area, further lowering the production cost of the light-emitting device 100.

[0078] The area of ​​polarizing element 140 is larger than the area of ​​the light-emitting surface of second lens 160, which can fully filter the light emitted from second lens 160 and improve the filtering effect on unpolarized light.

[0079] The second lens 160 is disposed on the light-emitting chip 120, and the polarizing element 140 is disposed on the second lens 160. The surface of the polarizing element 140 facing away from the second lens 160 is in contact with the first lens 130. Since the light-emitting surface of the polarizing element 140 is in direct contact with the light-incident surface of the first lens 130, it is beneficial to reduce the overall size of the light-emitting device 100.

[0080] Furthermore, the second lens 160 has a connecting surface and an inclined side surface 162. The connecting surface is located on the light-emitting chip 120, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light emission optical axis. The four sides of the second lens 160 are inclined to reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is easy for total internal reflection to occur due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can directly enter the first lens 130 and be utilized by the first lens 130, thereby improving the light energy utilization rate, minimizing light energy loss, improving luminous efficiency, and significantly increasing brightness.

[0081] The first lens 130 is a plano-convex lens and has no obvious support. The plane (incident surface) of the plano-convex lens is basically directly supported on the substrate 110, and can directly contact the light-emitting surface of the second lens 160, thereby reducing the volume of the entire light-emitting device 100.

[0082] As for the other aspects of the light-emitting device 100 in this embodiment 7, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 4. The specific content can be referred to the description of the above embodiment 2, and will not be repeated here.

[0083] Please see Figure 8 , Figure 8 A cross-sectional view of the light-emitting device in Embodiment 8 of this application is shown. Compared with the light-emitting device 100 in Embodiment 7, the polarization element 140 of the light-emitting device 100 provided in Embodiment 8 is spaced apart from the surface of the second lens 160 and the first lens 130. By placing the polarization element 140 on the second lens 160 and integrating the polarization element 140 within the first lens 130, there is no need for auxiliary structures for mounting the polarization element 140, thus simplifying the structure of the light-emitting device 100, simplifying the manufacturing process of the light-emitting device 100, and reducing its production cost. At the same time, the polarization element 140 is placed closer to the light-emitting chip 120, which greatly reduces the area of ​​the polarization element 140 and significantly reduces the cost of the light-emitting device 100. Moreover, the light is refracted by the second lens 160, the polarization element 140, the cavity, and the first lens 130 before being emitted, so that the emitted light can accurately reach the preset light emission angle, resulting in good light control. Therefore, the entire light-emitting device 100 can achieve zoned and precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0084] The first lens 130 is a plano-convex lens. The first lens 130 includes a main body 134 and a support 136. The support 136 is disposed on the plane of the main body 134 and is supported on the substrate 110. The first lens 130 is mounted on the substrate 110. The support 136 provides a gap space for the spacing between the polarizing element 140 and the first lens 130, so that the first lens 130 can cover the light-emitting chip 120, the second lens 160 and the polarizing element 140.

[0085] The second lens 160 is specifically a light-transmitting adhesive filled with microparticles. The light-transmitting adhesive may be, but is not limited to, one or a combination of epoxy resin and silicone resin, and the microparticles may be, but is not limited to, one or a combination of phosphor, diffusing powder, and colorant. However, in other embodiments, the second lens 160 may also be a light-transmitting adhesive without filling particles.

[0086] As for the other aspects of the light-emitting device 100 in this embodiment 8, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 7. The specific details can be referred to the description of the above embodiment 7, and will not be repeated here.

[0087] Please see Figure 9 , Figure 9A cross-sectional view of the light-emitting device in Embodiment 9 of this application is shown. Compared with the light-emitting device 100 in Embodiment 8 above, the light-emitting device 100 provided in Embodiment 9 of this application further includes: a support member 170, which is connected between the substrate 110 and the first lens 130. A polarizing element 140 is disposed on the support member 170 and is spaced apart from the second lens 160 and the first lens 130, respectively. By placing the polarization element 140 on the support 170 and integrating it inside the light-emitting device 100, the auxiliary structure for mounting the polarization element 140 is eliminated, simplifying the structure and manufacturing process of the light-emitting device 100 and reducing its production cost. Simultaneously, the polarization element 140's proximity to the light-emitting chip 120 helps reduce its area, further lowering the production cost. Moreover, the light emitted from the light-emitting chip 120 is refracted through the second lens 160, the cavity, the polarization element 140, the cavity, and the first lens 130 before exiting, ensuring the emitted light accurately reaches the preset emission angle, resulting in excellent light control. Therefore, the entire light-emitting device 100 can achieve zoned, precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0088] The second lens 160 is disposed on the light-emitting chip 120. The surface of the second lens 160 facing away from the light-emitting chip 120 is convex curved, thereby improving light utilization and reducing Fresnel loss.

[0089] Furthermore, the second lens 160 has a connecting surface and an inclined side surface 162. The connecting surface is located on the light-emitting chip 120, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light emission optical axis. The four sides of the second lens 160 are inclined to reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is easy for total internal reflection to occur due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can directly enter the first lens 130 and be utilized by the first lens 130, thereby improving the light energy utilization rate, minimizing light energy loss, improving luminous efficiency, and significantly increasing brightness.

[0090] The second lens 160 can be, but is not limited to, a plano-convex lens, and its connecting surface is the plane of the plano-convex lens.

[0091] The support member 170 has a hollow structure, in which the hollow space is used to accommodate the second lens 160 and the polarizing element 140. The support member 170 can be bonded and fixed to the substrate 110, while the first lens 130 can be molded onto the support member 170. The support member 170 has a step on the side facing away from the substrate 110, and the polarizing element 140 can be bonded or hot-pressed to the step.

[0092] As for the other aspects of the light-emitting device 100 in this embodiment 9, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 8. The specific details can be referred to the description of the above embodiment 8, and will not be repeated here.

[0093] Please see Figure 10 , Figure 10 A cross-sectional view of the light-emitting device in Embodiment 10 of this application is shown. Compared with the light-emitting device 100 in Embodiment 9 above, the second lens 160 of the light-emitting device 100 provided in Embodiment 10 of this application is disposed on the support member 170 and is spaced apart from the light-emitting chip 120. By disposing of the polarization element 140 on the support member 170 and integrating the polarization element 140 inside the light-emitting device 100, there is no need to set up an auxiliary structure for mounting the polarization element 140, which simplifies the structure of the light-emitting device 100, simplifies the manufacturing process of the light-emitting device 100, and reduces its production cost. At the same time, the polarization element 140 is disposed close to the light-emitting chip 120, which helps to reduce its area and further reduce the production cost of the light-emitting device 100. Moreover, the light emitted from the light-emitting chip 120 is refracted through the cavity, the second lens 160, the cavity, the polarization element 140, the cavity, and the first lens 130 before being emitted, so that the emitted light can accurately reach the preset light emission angle, resulting in good light control effect. Therefore, the entire light-emitting device 100 can achieve zoned and precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0094] The second lens 160 is convex, and can be, but is not limited to, a biconvex lens. The second lens 160 can be molded into the hollow space of the support member 170 using an upper and lower mold, or it can be integrally formed with the support member 170. Alternatively, a slot can be provided on the inner side of the support member 170, and the two ends of the second lens 160 can be engaged with the slot to mount the second lens 160 onto the support member 170.

[0095] As for the other aspects of the light-emitting device 100 in this embodiment 10, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 9. The specific content can be referred to the description of the above embodiment 9, and will not be repeated here.

[0096] Please see Figure 11 , Figure 11A cross-sectional view of the light-emitting device in Embodiment 11 of this application is shown. The light-emitting device 100 provided in Embodiment 11 includes a substrate 110, a light-emitting chip 120, a first lens 130, and a polarizing element 140. The light-emitting chip 120 is disposed on the substrate 110. The first lens 130 is disposed on the substrate 110 and covers the light-emitting chip 120. The first lens 130 includes a main body portion 134 and a mounting portion 138. The main body portion 134 has an optical interface 132 facing away from the substrate 110, and the mounting portion 138 is disposed at the periphery of the optical interface 132. The polarizing element 140 is disposed on the mounting portion 138 and covers the optical interface 132 of the main body portion 134. By directly disposing the polarizing element 140 on the mounting portion 138 of the first lens 130, there is no need to provide auxiliary structures for mounting the polarizing element 140, thus simplifying the structure of the light-emitting device 100, simplifying the manufacturing process of the light-emitting device 100, and reducing its production cost.

[0097] The optical interface 132 of the main body 134 of the first lens 130 is a convex curved surface, which supports the polarization element 140 and can prevent the polarization element 140 from warping or deforming, which is beneficial to improving the filtering effect on unpolarized light.

[0098] The first lens 130 also includes a support portion 136, which is disposed on the surface of the main body 134 facing the substrate 110. The support portion 136 supports the substrate 110, and the first lens 130 is mounted on the substrate 110, thus creating a gap between the light-emitting chip 120 and the main body 134. The light emitted by the light-emitting chip 120 is directly emitted through the first lens 130 and then filtered by the polarizing element 140.

[0099] The main body 134, the support 136 and the mounting part 138 are integrally formed, which helps to simplify the production process of the light-emitting device 100.

[0100] As for the other aspects of the light-emitting device 100 in this embodiment 11, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 1. The specific content can be referred to the description of the above embodiment 1, and will not be repeated here.

[0101] Please see Figure 12 , Figure 12A cross-sectional view of the light-emitting device in Embodiment 12 of this application is shown. Based on Embodiment 11 above, the light-emitting device 100 provided in Embodiment 12 of this application further includes a second lens 160, which is disposed on the light-emitting chip 120 and located between the light-emitting chip 120 and the first lens 130. By directly disposing the polarization element 140 on the mounting portion 138 of the first lens 130, there is no need to provide an auxiliary structure for mounting the polarization element 140, thus simplifying the structure of the light-emitting device 100, simplifying the manufacturing process of the light-emitting device 100, and reducing its production cost; moreover, the second lens 160 can improve light utilization and reduce Fresnel loss.

[0102] The second lens 160 is disposed on the light-emitting chip 120, and its surface facing away from the polarizing element 140 is planar and in contact with the first lens 130. The refractive index of the second lens 160 is less than that of the first lens 130. Because the light-emitting surface of the second lens 160 is in contact with the light-incident surface of the first lens 130, it is beneficial to reduce the overall volume of the light-emitting device 100. Since the refractive index of the second lens 160 is less than that of the first lens 130, when the light-emitting chip 120 emits light, the light propagates from the optically less dense medium to the optically denser medium, and total internal reflection does not occur, which is beneficial to improving luminous efficiency. It should be noted that in other embodiments, the refractive index of the second lens 160 may be equal to or greater than that of the first lens 130.

[0103] Furthermore, the second lens 160 has a connecting surface and an inclined side surface 162. The connecting surface is located on the light-emitting chip 120, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light emission optical axis. The four sides of the second lens 160 are inclined to reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is prone to total internal reflection due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can directly enter the first lens 130 and be utilized by the first lens 130, improving the light energy utilization rate, minimizing light energy loss, improving luminous efficiency, and significantly increasing brightness.

[0104] The first lens 130 is a plano-convex lens and has no obvious support. The plane (incident surface) of the plano-convex lens is basically directly supported on the substrate 110, and can directly contact the light-emitting surface of the second lens 160, thereby reducing the volume of the entire light-emitting device 100.

[0105] As for the other aspects of the light-emitting device 100 in this embodiment 12, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 11. The specific content can be referred to the description of the above embodiment 11, and will not be repeated here.

[0106] Please see Figure 13 , Figure 13 A cross-sectional view of the light-emitting device in Embodiment 13 of this application is shown. Based on Embodiment 11, the light-emitting device 100 provided in Embodiment 13 of this application further includes a second lens 160. The second lens 160 is disposed on the light-emitting chip 120. The surface of the second lens 160 facing away from the polarizing element 140 is a convex curved surface and is spaced apart from the first lens 130. By directly setting the polarizing element 140 on the mounting portion 138 of the first lens 130, there is no need to set an auxiliary structure for mounting the polarizing element 140, which simplifies the structure of the light-emitting device 100, simplifies the manufacturing process of the light-emitting device 100, and reduces its production cost. Moreover, the second lens 160 can improve light utilization and reduce Fresnel loss. Since the light-emitting surface of the second lens 160 is spaced apart from the light-incident surface of the first lens 130, the light emitted from the light-emitting chip 120 is refracted by the second lens 160, the cavity, and the first lens 130 before being emitted to the polarizing element 140, so that the emitted light can accurately reach the preset light-emitting angle, resulting in good light control. Therefore, the entire light-emitting device 100 can achieve zoned and precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0107] Furthermore, the second lens 160 has a connecting surface and an inclined side surface 162. The connecting surface is located on the polarizing element 140, and the inclined side surface 162 is connected to the connecting surface. The inclined side surface 162 is gradually widened in the direction of the light output axis. The inclined side surface 162 of the second lens 160 can reflect large-angle light at the edges. The inclined side surface 162 is the interface between the second lens 160 and the cavity. When large-angle light at the edges is incident on the inclined side surface 162, it is prone to total internal reflection due to light entering from a denser medium to a less dense medium. After total internal reflection, the large-angle light at the edges will propagate in the direction of the optical axis and can directly enter the first lens 130 and be utilized by the first lens 130, improving the light energy utilization rate, minimizing light energy loss, improving light efficiency, and significantly increasing brightness.

[0108] The second lens 160 can be, but is not limited to, a plano-convex lens. Its connecting surface is the plane of the plano-convex lens, and its convex curved surface can be a hemispherical surface, a spherical cap surface, a semi-elliptical curved surface, or other curved surfaces.

[0109] As for the other aspects of the light-emitting device 100 in this embodiment 13, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiment 11. The specific content can be referred to the description of the above embodiment 11, and will not be repeated here.

[0110] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light emitting device, characterized by, include: Base (110); A light-emitting chip (120) is disposed on the substrate (110); A first lens (130) is disposed on the substrate (110) and covers the light-emitting chip (120); and A polarizing element (140) is disposed between the light-emitting chip (120) and the first lens (130); The polarization element (140) is supported by the substrate (110), or the polarization element (140) is disposed on the light-emitting chip (120) through a light-transmitting connecting layer (150).

2. The light-emitting device according to claim 1, characterized in that, The substrate (110) is provided with a die bonding groove (112), and the light-emitting chip (120) is disposed in the die bonding groove (112); The polarizing element (140) covers the die bonding tank (112) and is spaced apart from the light-emitting chip (120) and the first lens (130).

3. The light emitting device of claim 1, wherein, The polarizing element (140) is disposed on the surface of the light-transmitting connecting layer (150) facing away from the light-emitting chip (120), and is spaced apart from the first lens (130).

4. The light emitting device of claim 3, wherein, The substrate (110) is provided with a die bonding groove (112), the light-emitting chip (120) is disposed in the die bonding groove (112), and the polarizing element (140) covers the die bonding groove (112).

5. The light emitting device according to claim 3 or 4, characterized in that, Also includes: The second lens (160) is disposed on the polarizing element (140) and located between the polarizing element (140) and the first lens (130).

6. The light-emitting device according to claim 5, characterized in that, The surface of the second lens (160) facing away from the polarizing element (140) is planar and is in contact with the first lens (130); or The surface of the second lens (160) facing away from the polarizing element (140) is convex and is spaced apart from the first lens (130).

7. The light emitting device of claim 6, wherein the first and second light emitting devices are arranged in a vertical stack. The second lens (160) has a connecting surface and an inclined side surface (162). The connecting surface is located on the polarizing element (140), and the inclined side surface (162) is connected to the connecting surface. The inclined side surface (162) is gradually widened in the direction of the light output axis.

8. A light-emitting device, characterized in that, include: Base (110); A light-emitting chip (120) is disposed on the substrate (110); The first lens (130) is disposed on the substrate (110) and covers the light-emitting chip (120). A second lens (160) is disposed between the light-emitting chip (120) and the first lens (130); and A polarizing element (140) is disposed between the first lens (130) and the second lens (160); The second lens (160) is disposed on the light-emitting chip (120), and the polarizing element (140) is disposed on the second lens (160) and in contact with the second lens (160). The surface of the polarizing element (140) facing away from the second lens (160) is in contact with or spaced from the first lens (130).

9. A light-emitting device, characterized in that, include: Base (110); A light-emitting chip (120) is disposed on the substrate (110); The first lens (130) is disposed on the substrate (110) and covers the light-emitting chip (120). The second lens (160) is disposed between the light-emitting chip (120) and the first lens (130); A polarizing element (140) is disposed between the first lens (130) and the second lens (160); as well as A support member (170) is connected between the substrate (110) and the first lens (130); The polarizing element (140) is disposed on the support member (170) and is spaced apart from the second lens (160) and the first lens (130), respectively; The second lens (160) is disposed on the light-emitting chip (120); or, the second lens (160) is disposed on the support member (170) and spaced apart from the light-emitting chip (120).

10. A light-emitting device, characterized in that, include: Base (110); A light-emitting chip (120) is disposed on the substrate (110); A first lens (130) is disposed on the substrate (110) and covers the light-emitting chip (120). The first lens (130) includes a main body (134) and a mounting part (138). The main body (134) has an optical interface (132) facing away from the substrate (110), and the mounting part (138) is disposed at the periphery of the optical interface (132). A polarizing element (140) is provided on the mounting portion (138) and covers the optical interface (132) of the main body portion (134).