Pin adjusting device for semiconductor chip production
By designing a movable adjustment stage structure in the pin adjustment device for semiconductor chip production, the safety hazards caused by cylinder failure are solved, ensuring that the operating space is separated from the pressure plate, avoiding hand injuries, and achieving a safe and reliable operating environment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YIYA SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-05-29
Smart Images
Figure CN224306319U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of pin adjustment technology, and more specifically, to a pin adjustment device for semiconductor chip manufacturing. Background Technology
[0002] In the semiconductor chip manufacturing industry, pin adjustment is a key process to ensure that chip pins meet design specifications and subsequent packaging requirements. Existing pin adjustment devices for semiconductor chip manufacturing typically employ a cylinder-driven pressure plate descent structure. Specifically, the device includes a pressure plate and an adjustment platform located directly below the pressure plate. The adjustment platform is used to place the semiconductor chip with pins to be adjusted. During operation, the cylinder drives the pressure plate downward to cooperate with the adjustment platform, thereby achieving the adjustment operation of the semiconductor chip pins through specific mechanical action.
[0003] However, this existing pin adjustment device has significant safety hazards in practical use. Because the adjustment platform is fixed directly below the clamping plate, if the cylinder malfunctions or fails to control it during semiconductor chip handling, causing the clamping plate to suddenly fall, the worker's hand is likely to be in the operating area between the adjustment platform and the clamping plate, easily causing severe crush injuries and endangering their personal safety. Therefore, we have made improvements and proposed a pin adjustment device for semiconductor chip production. Utility Model Content
[0004] This utility model provides a pin adjustment device for semiconductor chip production, including a support base, a second protective box on the support base, a cylinder mounted on the top of the support base, the bottom end of the cylinder passing through the support base and extending into the second protective box and connected to a clamping plate, a base fixedly connected to the bottom of the second protective box, a protective plate connected to one side of the base via a hinge, a first slide rail mounted on the top of the protective plate, a second slide rail mounted on the top of the base, a slider slidably connected to the outer surface of the second slide rail, an adjustment platform mounted above the base, and the bottom of the adjustment platform connected to the slider.
[0005] As a preferred technical solution of this application, a limiting rod is fixedly connected to the top of the clamping plate, and the top end of the limiting rod passes through the support seat and extends above the support seat.
[0006] As a preferred technical solution of this application, the support base is further provided with a first protective box located above the second protective box, and the cylinder is located inside the first protective box.
[0007] As a preferred technical solution of this application, a number of heat dissipation vents are provided on the outer periphery of the first protective box.
[0008] As a preferred technical solution of this application, a first threaded groove is provided on one side of the adjustment table, and a pull rod is threadedly connected to the first threaded groove.
[0009] As a preferred technical solution of this application, a second threaded groove is provided on the inner side wall of the second protective box, and the size of the second threaded groove is the same as the size of the first threaded groove.
[0010] As a preferred technical solution of this application, a pad is connected to the bottom of the protective plate.
[0011] As a preferred technical solution of this application, the top of the base near the protective plate has a notch, and the size of the notch is adapted to the protective plate.
[0012] As a preferred technical solution of this application, the bottom of the protective plate is also provided with a buckle body, and the first protective box is provided with a buckle hook that cooperates with the buckle body.
[0013] As a preferred technical solution of this application, the sides of the base, the adjustment platform and the support are provided with grooves, and the position of the grooves corresponds to the position of the first slide rail.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0015] In the scheme of this application:
[0016] This application sets the adjustment platform as an outwardly movable structure. When the operator is picking up or placing semiconductor chips, the adjustment platform can be moved out of the area directly below the clamping plate, so that the operating space is completely separated from the working area of the clamping plate. In this way, even if the clamping plate falls accidentally during the chip picking process, it will not cause injury to the operator's hands. This effectively reduces the safety accidents caused by the accidental fall of the clamping plate in the prior art and provides the operator with a safe and reliable operating environment. Attached Figure Description
[0017] Figure 1 A schematic diagram of the pin adjustment device for semiconductor chip manufacturing provided in this application;
[0018] Figure 2 A schematic diagram of the upper pressure block provided in this application;
[0019] Figure 3 Provided for this application Figure 2 A schematic diagram of the structure viewed from below;
[0020] Figure 4 Structural diagrams of the first and second protective boxes provided in this application;
[0021] Figure 5A schematic diagram of the notch provided in this application;
[0022] Figure 6 This is a schematic diagram of the structure of the pin adjustment device for semiconductor chip manufacturing provided in this application when carried out.
[0023] The image shows:
[0024] 1. Support base; 101. First protective box; 102. Second protective box; 103. Heat dissipation vent; 104. Cylinder; 105. Pressing plate; 106. Limiting rod; 107. Base; 108. Adjustment platform; 109. Protective plate; 110. Pad; 111. Notch; 112. First slide rail; 113. Second slide rail; 114. Slider; 2. First threaded groove; 3. Pull rod; 4. Second threaded groove; 5. Hook and loop body; 501. Hook and loop hook; 6. Groove. Detailed Implementation
[0025] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0026] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.
[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0028] For an example, please refer to... Figures 1-5A pin adjustment device for semiconductor chip manufacturing includes a support base 1, a second protective box 102 mounted on the support base 1, a cylinder 104 mounted on the top of the support base 1, the bottom end of the cylinder 104 passing through the support base 1 and extending into the second protective box 102 and connected to a clamping plate 105, a base 107 fixedly connected to the bottom of the second protective box 102, a protective plate 109 connected to one side of the base 107 via a hinge, a first slide rail 112 mounted on the top of the protective plate 109, a second slide rail 113 mounted on the top of the base 107, a slider 114 slidably connected to the outer surface of the second slide rail 113, and a top of the base 107... The device is equipped with an adjustment platform 108, and the bottom of the adjustment platform 108 is connected to the slider 114. By setting the adjustment platform 108 as a structure that can move outward, when the operator picks up and puts up the semiconductor chip, the adjustment platform 108 can be moved out of the area directly below the clamping plate 105, so that the operating space is completely separated from the working area of the clamping plate 105. In this way, even if the clamping plate 105 falls accidentally during the chip picking process, it will not cause injury to the operator's hands. This effectively reduces the safety accidents caused by the accidental fall of the clamping plate 105 in the prior art, and provides the operator with a safe and reliable operating environment.
[0029] There are two first slide rails 112 and two second slide rails 113, and four sliders 114. The four sliders 114 are located on the two second slide rails 113 respectively, and the length of the sliders 114 is greater than the distance between the first slide rail 112 and the second slide rail 113.
[0030] Furthermore, a limiting rod 106 is fixedly connected to the top of the pressing plate 105. The top end of the limiting rod 106 passes through the support base 1 and extends above the support base 1. The limiting rod 106 can limit the pressing plate 105 to improve the stability of the pressing plate 105 when it is raised or lowered. A linear bearing is provided at the connection between the limiting rod 106 and the pressing plate 105.
[0031] Furthermore, the support base 1 is also provided with a first protective box 101 located above the second protective box 102. The cylinder 104 is located inside the first protective box 101. Both the first protective box 101 and the second protective box 102 are connected to the support base 1 by bolts. The first protective box 101 can protect the cylinder 104. The first protective box 101 is also provided with holes for the cylinder 104 pipe to pass through. Several heat dissipation ports 103 are provided on the outer periphery of the first protective box 101.
[0032] Furthermore, a first threaded groove 2 is provided on one side of the adjustment table 108, and a pull rod 3 is threadedly connected to the first threaded groove 2. The pull rod 3 facilitates pushing and pulling the adjustment table 108. A second threaded groove 4 is provided on the inner side wall of the second protective box 102, and the size of the second threaded groove 4 is the same as that of the first threaded groove 2. When the pull rod 3 is separated from the first threaded groove 2, it can be connected to the second threaded groove 4 to store the pull rod 3.
[0033] Furthermore, a pad 110 is connected to the bottom of the protective plate 109. When the base 107 and the pad 110 are placed on the support plane, the pad 110 is used to support the protective plate 109 so that the protective plate 109 remains horizontal with the adjustment table 108.
[0034] Furthermore, a notch 111 is provided on the top of the base 107 near the protective plate 109. The size of the notch 111 is adapted to the protective plate 109. When the protective plate 109 is rotated vertically, the bottom end of the protective plate 109 can be inserted into the notch 111 to avoid interference between the base 107 and the protective plate 109.
[0035] Furthermore, the bottom of the protective plate 109 is provided with a buckle body 5, and the first protective box 101 is provided with a buckle hook 501 that works with the buckle body 5. After the protective plate 109 is rotated and erected, the buckle body 5 can be fastened together with the buckle hook 501 to limit the position of the protective plate 109.
[0036] Furthermore, the base 107, the adjustment platform 108 and the support base 1 are provided with grooves 6 on their sides, and the position of the grooves 6 corresponds to the position of the first slide rail 112. When the protective plate 109 and the first slide rail 112 are erected, the grooves 6 can accommodate the first slide rail 112.
[0037] The second protective box 102 is welded to the top of the base 107. The first slide rail 112 is bolted to the protective plate 109. The second slide rail 113 is bolted to the base 107. The pad 110 is welded to the protective plate 109. The latch body 5 is connected to the second protective box 102 by bolts or welding. The latch hook 501 is connected to the first protective box 101 by bolts or welding. The slider 114 is bolted to the adjusting table 108. The limiting rod 106 is welded to the top of the pressing plate 105. The piston rod of the cylinder 104 passes through the pressing plate 105 and is fixed to the pressing plate 105 by a nut. The latch body 5 and the latch hook 501 are existing components. Their specific structure and principle are existing technology and will not be described in detail in this application.
[0038] Reference Figure 1Pull the lever 3 outward to pull the adjustment platform 108 outward. During the outward movement of the adjustment platform 108, place the semiconductor chip on the adjustment platform 108 and then push the adjustment platform 108 inward into the second protective box 102. When the adjustment platform 108 can no longer move inward, the adjustment platform 108 is aligned with the pressure plate 105. Then the cylinder 104 pushes the pressure plate 105 down, and the pressure plate 105 presses down on the pins of the semiconductor chip to adjust the pins of the semiconductor chip.
[0039] This application is for a portable device; when carried, the form of this application is changed from... Figure 1 Switch to Figure 6 Specifically, rotating the pull rod 3 separates it from the first threaded groove 2, then connecting the pull rod 3 to the second threaded groove 4, rotating the protective plate 109 until it is upright, and then fastening the buckle body 5 and the buckle hook 501 together, as shown. Figure 6 As shown, at this time, the clamping plate 105, the adjusting table 108, the first slide rail 112 and other components are protected by the second protective box 102 and the protective plate 109, and the overall structure is more compact and easy to carry. When using it again, separate the buckle body 5 from the buckle hook 501, then rotate the protective plate 109 to open it, and then separate the pull rod 3 from the second threaded groove 4 and connect it with the first threaded groove 2.
[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0041] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.
Claims
1. A pin adjustment device for semiconductor chip manufacturing, characterized in that, The system includes a support base (1), on which a second protective box (102) is provided. A cylinder (104) is installed on the top of the support base (1). The bottom end of the cylinder (104) passes through the support base (1) and extends into the second protective box (102) and is connected to a pressure plate (105). A base (107) is fixedly connected to the bottom of the second protective box (102). A protective plate (109) is connected to one side of the base (107) by a hinge. A first slide rail (112) is installed on the top of the protective plate (109). A second slide rail (113) is installed on the top of the base (107). A slider (114) is slidably connected to the outer surface of the second slide rail (113). An adjustment platform (108) is provided above the base (107), and the bottom of the adjustment platform (108) is connected to the slider (114).
2. The pin adjustment device for semiconductor chip manufacturing according to claim 1, characterized in that, The top of the clamping plate (105) is fixedly connected to a limiting rod (106), the top of which passes through the support seat (1) and extends above the support seat (1).
3. The pin adjustment device for semiconductor chip manufacturing according to claim 1, characterized in that, The support base (1) is also provided with a first protective box (101) located above the second protective box (102), and the cylinder (104) is located inside the first protective box (101).
4. The pin adjustment device for semiconductor chip manufacturing according to claim 3, characterized in that, The outer periphery of the first protective box (101) is provided with several heat dissipation vents (103).
5. The pin adjustment device for semiconductor chip manufacturing according to claim 1, characterized in that, The adjustment table (108) has a first threaded groove (2) on one side, and a pull rod (3) is threadedly connected to the first threaded groove (2).
6. The pin adjustment device for semiconductor chip manufacturing according to claim 5, characterized in that, The inner wall of the second protective box (102) is provided with a second threaded groove (4), and the size of the second threaded groove (4) is the same as that of the first threaded groove (2).
7. The pin adjustment device for semiconductor chip manufacturing according to claim 3, characterized in that, The bottom of the protective plate (109) is connected to a pad (110).
8. The pin adjustment device for semiconductor chip manufacturing according to claim 7, characterized in that, The base (107) has a notch (111) on the top side near the protective plate (109), and the size of the notch (111) is adapted to the protective plate (109).
9. The pin adjustment device for semiconductor chip manufacturing according to claim 7, characterized in that, The bottom of the protective plate (109) is also provided with a buckle body (5), and the first protective box (101) is provided with a buckle hook (501) that works in conjunction with the buckle body (5).
10. The pin adjustment device for semiconductor chip manufacturing according to claim 1, characterized in that, The base (107), the adjustment platform (108) and the support base (1) are provided with grooves (6) on their sides, and the position of the grooves (6) corresponds to the position of the first slide rail (112).