An RFID label applicator

Abstract

The application relates to the technical field of label production, in particular to an RFID label sticking device, which comprises a supporting plate, the front surface of the supporting plate is rotationally connected with a first guide roller, two second guide rollers, a third guide roller, two composite rollers and a fourth guide roller. The application adjusts by a motor-driven limiting ring, adjusts the limiting width according to different specifications of the material belt, effectively solves the composite defect problem caused by the transverse deviation of the material belt, improves the compatibility of the equipment, and guarantees the stability of the composite precision; a radio frequency analysis module and a hot air blower are arranged on a detection supporting assembly, when an abnormal chip is detected, the air-permeable platform is lifted to provide rigid support, the hot air blower heats the adhesive layer of the fault area, the detection purpose of the chip is achieved, the hot air blower heating can facilitate the peeling of the subsequent chip, through the arrangement of a peeling assembly, the automatic complete removal of the defective chip is realized, and the automatic chip replacement of adsorption, transfer and sticking is realized through the electric suction cup.

Description

Technical Field

[0001] This application relates to the field of RFID tag manufacturing technology, specifically to an RFID tag affixing device. Background Technology

[0002] Electronic tag lamination is a core process in RFID (Radio Frequency Identification) technology production. It refers to the process of combining core components such as RFID chips and antennas with substrates (such as paper and plastics) using precision equipment and technical means to form a complete electronic tag.

[0003] Chinese utility model patent CN209159099U discloses an ultrasonic electronic tag laminating machine. This machine includes a machine base, an ultrasonic laminating mechanism mounted on top of the machine base, a laminating roller mounted above the ultrasonic laminating mechanism, three feeding rollers on the left side of the machine base, and a receiving roller on the right side of the machine base. The ultrasonic laminating mechanism includes a laminating table, an ultrasonic generator positioned at the center of the bottom of the laminating table, and countersunk through holes at the four corners of the laminating table. Guide rods with shoulders are installed within these countersunk through holes. The bottom of the guide rods is threaded to the machine base, and springs are fitted onto the guide rods. The springs are positioned between the upper surface of the machine base and the lower surface of the laminating table, and are always under compression, ensuring that the upper surface of the laminating table is in close contact with the bottom of the laminating roller.

[0004] The aforementioned laminating machine utilizes a spring-loaded laminating table and a heated laminating roller for lamination, resulting in high efficiency and good lamination effect. However, this equipment can only complete physical layer lamination and cannot perform electrical performance testing on the chip strip before lamination. When the chip has defects such as poor soldering, chip damage, or incorrect information, the defective chip will be directly laminated onto the finished product label, affecting product quality. Utility Model Content

[0005] To address the shortcomings of existing technologies, this application provides an RFID tag attaching device that offers advantages such as improved production yield and solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this application provides the following technical solution: an RFID tag pasting device, comprising a support plate, wherein a first guide roller, two second guide rollers, a third guide roller, two composite rollers and a fourth guide roller are rotatably connected to the front side of the support plate, the first guide roller is used to convey upper film tape, the two second guide rollers are used to convey chip tape, the third guide roller is used to convey lower film tape, and the two composite rollers are used for the composite bonding of the upper film tape, the chip tape and the lower film tape;

[0007] The surfaces of the first guide roller, the two second guide rollers, the third guide roller and the fourth guide roller are all provided with through grooves, and each groove is provided with a correction component.

[0008] A detection support assembly is provided below the two second guide rollers;

[0009] A peeling component is provided above the detection support component;

[0010] A replacement component is provided in front of the detection support component.

[0011] Furthermore, each of the aforementioned correction components includes a bidirectional lead screw, with both ends of the bidirectional lead screw rotatably connected to the inner sidewall of the adjacent groove. Each end of the outer surface of the bidirectional lead screw is threaded with a limit ring, and each limit ring is slidably connected to the adjacent slot. The first guide roller, the two second guide rollers, the third guide roller, and the fourth guide roller are all equipped with motors, and the output end of each motor is fixedly connected to one end of the adjacent bidirectional lead screw.

[0012] The above solution enables adaptive limiting of material strips of different widths. By driving a bidirectional lead screw with a motor to synchronously open and close the limiting ring, it not only ensures precise control of the material strip conveying path but also improves the equipment's compatibility with diverse production needs.

[0013] Furthermore, the detection support assembly includes a fixed frame, which is fixedly connected to a support plate. A bellows is provided in front of the fixed frame, and a set of guide rods is fixedly connected to the bottom of the bellows. Each guide rod slides and inserts into the adjacent fixed frame. The bellows is located below the two second guide rollers. A ventilation platform is fixedly connected to the upper surface of the bellows. An RF analysis module for chip detection is fixedly installed inside the ventilation platform. A hot air fan is installed on the inner bottom wall of the ventilation platform. A support cylinder is fixedly installed at the bottom of the fixed frame. The output end of the support cylinder is fixedly connected to the bottom of the bellows for adjusting the height of the bellows and the ventilation platform.

[0014] The above solution enables the detection of the conveyed chips. When a chip abnormality is detected, the device immediately stops operating. At this time, the detection support component drives the air box and ventilation platform to move upward through the support cylinder, and fits tightly with the bottom of the chip strip. This provides a stable support platform to prevent the strip from deforming, and the hot air blower precisely preheats and softens the adhesive layer in the faulty chip area, creating favorable conditions for subsequent peeling operations.

[0015] Furthermore, the peeling assembly includes a peeling linear module, which is fixedly connected to the front of the mounting plate. A peeling frame is slidably connected to the front of the peeling linear module. Two symmetrically arranged pressure plates are fixedly connected to the bottom of the peeling frame. Peeling cylinders are installed on the left and right inner sidewalls of the peeling frame. Pressure blocks are fixedly connected to the output ends of the two peeling cylinders. Pressure sleeves are slidably fitted onto the bottom ends of the two pressure blocks. A compression spring is installed between each pressure sleeve and the interior of its adjacent pressure block. A peeling plate is fixedly connected to the bottom end of each pressure sleeve.

[0016] The above solution employs a dual-peel symmetrical pressure design. After the strip is fixed by the pressure plate, the peeling cylinder drives the pressure block to move the peeling discs into the chip edge at a specific angle. The spring buffer mechanism ensures that the peeling discs and the chip maintain a constant contact pressure. The complete peeling of the chip is achieved by the synchronous opposite movement of the two peeling discs, while avoiding damage to the strip substrate.

[0017] Furthermore, the replacement component includes a placement tray, which is fixedly connected to the front of the air box. A horizontal linear module is provided at the bottom of the placement tray, and a vertical linear module is slidably connected below the horizontal linear module. A C-shaped rod is slidably connected back and forth below the vertical linear module. The top of the C-shaped rod is located above the placement tray, and a replacement cylinder that is vertically arranged is fixedly connected to the top of the C-shaped rod. An electric suction cup is fixedly installed at the bottom of the replacement cylinder.

[0018] The above solution enables automatic chip replacement. Through the coordinated movement of the horizontal and vertical linear modules and the C-shaped rod, the electric suction cup is precisely displaced between the placement tray and the material strip. The replacement cylinder controls the vertical movement of the suction cup to complete the picking up of faulty chips and pressing of new chips. Combined with the continuous heating function of the ventilated platform, it ensures that the new chip and the material strip are reliably bonded. The entire process requires no manual intervention, significantly improving production efficiency and yield.

[0019] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0020] This invention achieves synchronous three-layer conveying and bonding of upper film strip, chip strip, and lower film strip through the arrangement of a first guide roller, a second guide roller, a third guide roller, and a composite roller. The bidirectional screw correction assembly built into each guide roller dynamically adjusts the limit ring via a motor-driven mechanism, adjusting the limit width according to different strip specifications. This effectively solves the problem of poor bonding caused by lateral strip offset, improving equipment compatibility and ensuring stable bonding accuracy. The detection support assembly includes an RF analysis module and a hot air blower. When an abnormal chip is detected, the ventilated platform rises to provide rigid support, and the hot air blower heats the adhesive layer in the faulty area, achieving the purpose of chip detection. The hot air blower heating facilitates subsequent chip peeling. The peeling assembly enables automatic and complete removal of defective chips. Combined with the replacement assembly, an electric suction cup enables automated chip replacement through adsorption, transfer, and pasting, thereby effectively improving the production efficiency of electronic tags and ensuring the anti-counterfeiting quality of the products. Attached Figure Description

[0021] Figure 1 This is a front view of the overall structure of this application;

[0022] Figure 2 This is a three-dimensional schematic diagram of the overall structure of this application;

[0023] Figure 3 This is a structural diagram of the correction component in this application;

[0024] Figure 4 This application provides structural diagrams of the testing support components, stripping components, and replacement components.

[0025] Figure 5 This is a structural diagram of the testing support components for this application;

[0026] Figure 6 This is a structural diagram of the component stripped from the present application;

[0027] Figure 7 This is a structural diagram of the compression spring in this application;

[0028] Figure 8 The component structure diagram for this application has been changed.

[0029] In the picture:

[0030] 1. Support plate; 2. First guide roller; 3. Second guide roller; 4. Third guide roller; 5. Composite roller; 6. Fourth guide roller; 7. Slide groove;

[0031] 8. Correction assembly; 801. Two-way lead screw; 802. Limit ring; 803. Motor;

[0032] 9. Testing support components; 901. Fixing frame; 902. Air box; 903. Guide rod; 905. Ventilation platform; 906. Radio frequency analysis module; 907. Hot air blower; 908. Support cylinder;

[0033] 10. Peeling assembly; 1001. Peeling linear module; 1002. Peeling frame; 1003. Pressure plate; 1004. Peeling cylinder; 1005. Pressure block; 1006. Pressure sleeve; 1007. Compression spring; 1008. Peeling disc;

[0034] 11. Replace components; 1101. Placement tray; 1102. Horizontal linear module; 1103. Vertical linear module; 1104. C-shaped rod; 1105. Replace cylinder; 1106. Electric suction cup. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] Please see Figure 1 , Figure 2 and Figure 4 An RFID tag pasting device in this embodiment includes a support plate 1. The front side of the support plate 1 is rotatably connected to a first guide roller 2, two second guide rollers 3, a third guide roller 4, two composite rollers 5, and a fourth guide roller 6. The first guide roller 2 is used to convey the upper film strip, the two second guide rollers 3 are used to convey the chip strip, the third guide roller 4 is used to convey the lower film strip, and the two composite rollers 5 are used for the composite bonding of the upper film strip, the chip strip, and the lower film strip.

[0037] Please see Figure 1 , Figure 2 and Figure 3The surfaces of the first guide roller 2, the two second guide rollers 3, the third guide roller 4, and the fourth guide roller 6 are all provided with through grooves 7. Each groove 7 is equipped with a correction component 8. The correction component 8 can limit the two sides of the material strip, ensuring that multiple strips are always accurately aligned, effectively preventing lateral deviation of the strip during conveying, and significantly improving the composite accuracy and product quality stability. Each correction component 8 includes a bidirectional lead screw 801. The two ends of the bidirectional lead screw 801 are rotatably connected to the inner sidewall of the groove 7 adjacent to it. The two ends of the outer surface of each bidirectional lead screw 801 are threadedly connected to limit rings 802. Each limit ring 802 is connected to its corresponding limit ring. The adjacent slots are slidably connected. The first guide roller 2, the two second guide rollers 3, the third guide roller 4, and the fourth guide roller 6 are all equipped with motors 803. The output end of each motor 803 is fixedly connected to one end of its adjacent bidirectional lead screw 801. By driving the bidirectional lead screw 801 to rotate through the motor 803, the two adjacent limit rings 802 can be driven to move closer or further apart, thereby fixing different types of material strips. This achieves an adaptive limit function for material strips of different widths. By driving the bidirectional lead screw 801 through the motor 803 to drive the limit rings 802 to open and close synchronously, it can not only ensure the precise control of the material strip conveying path, but also improve the equipment's compatibility with diverse production needs.

[0038] Please see Figure 1 , Figure 2 and Figure 5 A detection support assembly 9 is provided below the two second guide rollers 3. The detection support assembly 9 includes a fixing frame 901, which is fixedly connected to the support plate 1. A wind box 902 is provided in front of the fixing frame 901. A set of guide rods 903 are fixedly connected to the bottom of the wind box 902. Each guide rod 903 slides up and down into the fixing frame 901 that is close to it. The wind box 902 is located below the two second guide rollers 3. A ventilation platform 905 is fixedly connected to the upper surface of the wind box 902. An RF analysis module 906 for chip detection is fixedly installed inside the ventilation platform 905. A heat exchanger is installed on the inner bottom wall of the ventilation platform 905. The blower 907 and the fixed frame 901 have a support cylinder 908 fixedly installed at the bottom. The output end of the support cylinder 908 is fixedly connected to the bottom of the air box 902, which is used to adjust the height of the air box 902 and the ventilation platform 905. This enables the detection of the conveyed chips. When an abnormal chip is detected, the device immediately stops operating. At this time, the detection support component 9 drives the air box 902 and the ventilation platform 905 to move upward through the support cylinder 908, so that they fit tightly against the bottom of the chip strip. This provides a stable support platform to prevent the strip from deforming, and the hot air blower 907 precisely preheats and softens the adhesive layer in the area of ​​the faulty chip, creating favorable conditions for subsequent peeling operations.

[0039] Please see Figure 1 , Figure 6 and Figure 7 A peeling assembly 10 is provided above the support assembly 9. The peeling assembly 10 includes a peeling linear module 1001, which is fixedly connected to the front of the support plate 1. A peeling frame 1002 is slidably connected to the front of the peeling linear module 1001. Two symmetrically arranged pressure plates 1003 are fixedly connected to the bottom of the peeling frame 1002. The pressure plates 1003 can press the chip strip during peeling to prevent displacement. Peeling cylinders 1004 are installed on the left and right inner walls of the peeling frame 1002. The peeling cylinders 1004 are arranged parallel to the chip strip. Pressure blocks 1005 are fixedly connected to the output ends of the two peeling cylinders 1004. The two peeling cylinders 1004 can drive the pressure blocks 1005 to move closer or further apart. The bottom ends of the two pressure blocks 1005 are both... A pressure sleeve 1006 is slidably connected to the bottom. Each pressure sleeve 1006 and its adjacent pressure block 1005 are equipped with a pressure spring. A peeling tab is fixedly connected to the bottom of each pressure sleeve 1006. With the pressure spring, after the pressure plate 1003 fixes the chip strip, the peeling tab compresses the pressure spring and makes tight contact with the chip strip through the reaction force. Finally, the peeling cylinder 1004 drives the two peeling tabs to move closer to each other to peel the chip. With the above settings, a dual peeling tab symmetrical pressure design is adopted. After the pressure plate 1003 fixes the strip, the peeling cylinder 1004 drives the pressure block 1005 to move the peeling tab to cut into the chip edge at a specific angle. The pressure spring buffer mechanism ensures that the peeling tab and the chip maintain a constant contact pressure. The complete peeling of the chip is achieved by the synchronous opposite movement of the two peeling tabs, while avoiding damage to the substrate of the strip.

[0040] Please see Figure 1 , Figure 5 and Figure 8A replacement component 11 is located in front of the detection support component 9. The detection support component 9 enables the detection of the conveyed chips. When a chip abnormality is detected, the device stops operating. The detection support component 9 moves upward and attaches to the bottom of the chip strip for support, while simultaneously heating it. Then, the peeling component 10 peels off the faulty chip. After peeling, the replacement component 11 adsorbs and transfers the peeled chip. Finally, the replacement component 11 transfers a new chip and presses it onto the chip strip, completing the chip replacement. 11 includes a placement tray 1101, which allows for the placement of new chips and discarded chips. The placement tray 1101 is fixedly connected to the front of the bellows 902. A horizontal linear module 1102 is provided at the bottom of the placement tray 1101. A vertical linear module 1103 is slidably connected below the horizontal linear module 1102. A C-shaped rod 1104 is slidably connected back and forth below the vertical linear module 1103. The horizontal linear module 1102 and the vertical linear module 1103 allow the C-shaped rod 1104 to be driven left and right. The C-shaped rod 1104 moves horizontally to the right and horizontally back and forth. Its top end is positioned above the placement tray 1101. A vertically arranged replacement cylinder 1105 is fixedly connected to the top end of the C-shaped rod 1104. An electric suction cup 1106 is fixedly installed at the bottom end of the replacement cylinder 1105. The replacement cylinder 1105 drives the electric suction cup 1106 to move up and down, thereby achieving the purpose of adsorbing the removed waste chip and adsorbing the new chip. This is achieved through the replacement cylinder 1105, the horizontal linear module 1102, and the vertical linear module 110... The configuration 3 enables automatic chip replacement of the material strip. Through the coordinated movement of the horizontal linear module 1102, the vertical linear module 1103, and the C-shaped rod 1104, the electric suction cup 1106 is precisely displaced between the placement tray 1101 and the material strip. The replacement cylinder 1105 controls the vertical movement of the suction cup to complete the actions of picking up the faulty chip and pressing the new chip. With the continuous heating function of the ventilated platform 905, the new chip is reliably bonded to the material strip. The entire process requires no manual intervention, significantly improving production efficiency and yield.

[0041] The working principle of the above embodiment is as follows: the upper film tape is conveyed by the first guide roller 2, and after being limited by the correction component 8, it enters the lamination station. The chip tape is conveyed synchronously by two second guide rollers 3, with the chip face upward. When it passes under the RF analysis module 906, it is detected and conveyed by the third guide roller 4, which is symmetrically arranged with the upper film tape to form the composite substrate. The motor 803 in each guide roller drives the bidirectional lead screw 801 to rotate, which drives the limit rings 802 on both sides to open and close synchronously along the slide groove 7. The user can adjust the size of the tape to be used for lamination according to the dimensions of the tape. The spacing is adjusted to ensure the material strip is always centered during transport, preventing misalignment due to offset. When the chip strip passes over the ventilation platform 905, the RF analysis module 906 emits an RF signal to read the chip's UID and EEPROM data. If no response, data error, or impedance abnormality is detected, the control system immediately triggers a stop signal. The support cylinder 908 pushes the air box 902 upward along the guide rod 903, ensuring the ventilation platform 905 is tightly fitted to the bottom of the chip strip. The hot air blower 907 passes through the ventilation platform 905. Hot air is blown towards the faulty chip area to soften the hot melt adhesive between the chip and the substrate. The peeling linear module 1001 drives the peeling frame 1002 to move downwards, and the pressure plate 1003 presses down on the chip strip to prevent it from shifting during peeling. The peeling cylinder 1004 drives the pressure block 1005 to move the peeling plate, using shearing force to completely peel the chip from the substrate. The longitudinal linear module 1103 drives the C-shaped rod 1104 to move to the peeling position, and the electric suction cup 1106 picks up the waste chip. The replacement cylinder 1105 lifts the C-shaped rod 1104, and... Waste chips are transferred to the waste chip storage area of ​​placement tray 1101. C-shaped rod 1104 moves to the new chip storage area of ​​placement tray 1101. Electric suction cup 1106 picks up the new chip. Replacement cylinder 1105 drives electric suction cup 1106 to press down and paste the new chip to the reserved space. Upper film tape, chip tape, and lower film tape enter the gap of composite roller 5 simultaneously. Composite roller 5 applies pressure and temperature to form a three-layer composite structure. After the composite label tape passes through the fourth guide roller 6, it is wound to the external receiving roller to complete the entire production process.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0043] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An RFID tag affixing device, comprising a support plate (1), characterized in that: The front side of the support plate (1) is rotatably connected to a first guide roller (2), two second guide rollers (3), a third guide roller (4), two composite rollers (5) and a fourth guide roller (6). The first guide roller (2) is used to transport the upper film strip, the two second guide rollers (3) are used to transport the chip strip, the third guide roller (4) is used to transport the lower film strip, and the two composite rollers (5) are used for the composite bonding of the upper film strip, the chip strip and the lower film strip. The surfaces of the first guide roller (2), the two second guide rollers (3), the third guide roller (4) and the fourth guide roller (6) are all provided with through grooves (7), and each groove (7) is provided with a correction component (8). A detection support assembly (9) is provided below the two second guide rollers (3); A peeling component (10) is provided above the detection support component (9). A replacement component (11) is provided in front of the detection support component (9).

2. The RFID tag affixing device according to claim 1, characterized in that: Each of the aforementioned correction components (8) includes a bidirectional lead screw (801), the two ends of which are rotatably connected to the inner sidewall of the adjacent groove (7). Each of the two ends of the outer surface of each bidirectional lead screw (801) is threaded with a limiting ring (802), and each limiting ring (802) is slidably connected to the adjacent slot. The first guide roller (2), the two second guide rollers (3), the third guide roller (4) and the fourth guide roller (6) are all equipped with motors (803), and the output end of each motor (803) is fixedly connected to one end of the adjacent bidirectional lead screw (801).

3. The RFID tag affixing device according to claim 1, characterized in that: The detection support assembly (9) includes a fixed frame (901), which is fixedly connected to the support plate (1). A bellows (902) is provided in front of the fixed frame (901). A set of guide rods (903) is fixedly connected to the bottom of the bellows (902). Each guide rod (903) slides and inserts into the fixed frame (901) that is close to it. The bellows (902) is located below the two second guide rollers (3). A ventilation platform (905) is fixedly connected to the upper surface of the bellows (902). An RF analysis module (906) for detecting the chip is fixedly installed inside the ventilation platform (905). A hot air blower (907) is installed on the inner bottom wall of the ventilation platform (905). A support cylinder (908) is fixedly installed at the bottom of the fixed frame (901). The output end of the support cylinder (908) is fixedly connected to the bottom of the bellows (902) for adjusting the height of the bellows (902) and the ventilation platform (905).

4. The RFID tag affixing device according to claim 1, characterized in that: The peeling assembly (10) includes a peeling linear module (1001), which is fixedly connected to the front of the mounting plate. A peeling frame (1002) is slidably connected to the front of the peeling linear module (1001). Two symmetrically arranged pressure plates (1003) are fixedly connected to the bottom of the peeling frame (1002). Peeling cylinders (1004) are installed on the left and right inner walls of the peeling frame (1002). Pressure blocks (1005) are fixedly connected to the output ends of the two peeling cylinders (1004). Pressure sleeves (1006) are slidably sleeved on the bottom ends of the two pressure blocks (1005). A compression spring is installed between the inside of each pressure sleeve (1006) and its adjacent pressure block (1005). A peeling plate is fixedly connected to the bottom end of each pressure sleeve (1006).

5. An RFID tag affixing device according to claim 4, characterized in that: The replacement component (11) includes a placement tray (1101), which is fixedly connected to the front of the air box (902). A horizontal linear module (1102) is provided at the bottom of the placement tray (1101). A vertical linear module (1103) is slidably connected below the horizontal linear module (1102). A C-shaped rod (1104) is slidably connected to the bottom of the vertical linear module (1103). The top of the C-shaped rod (1104) is located above the placement tray (1101). A replacement cylinder (1105) is fixedly connected to the top of the C-shaped rod (1104) and is vertically arranged. An electric suction cup (1106) is fixedly installed at the bottom of the replacement cylinder (1105).

Images