Integrated circuit package adhesive dispensing apparatus

Abstract

The utility model relates to the field of integrated circuit package especially relates to integrated circuit package glue body point gum device, including installation base still including tooling plate, the both sides of front and back of installation base upper end all are fixedly installed with support slide bar, the surface of support slide bar is provided with moving seat, the upper end electric control guide rail frame of moving seat, the surface of electric control guide rail frame is provided with point gum module, the side of support slide bar is fixedly installed with electric displacement guide rail in the upper end of installation base, the both sides of left and right of installation base upper end all are fixedly installed with the engagement frame, the utility model discloses setting up operating area on the both sides of equipment, and the operating area of both ends can carry out point gum processing work and feeding and discharging work respectively, when the point gum processing work of one side is completed, utilizes the displacement mechanism to drive point gum mechanism to move to the operating area of the other side and carries out point gum processing, and the previous operating area can adjust the setting light structure, and the point gum glue body sets, and carries out feeding and discharging operation to realize double workstations alternate operation.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging, and in particular to an integrated circuit packaging colloid dispensing device. Background Technology

[0002] Integrated circuits (ICs) are microelectronic components and their interconnecting wires that are integrated onto a very small semiconductor substrate using special semiconductor processes. This creates a miniature structure with specific circuit functions. ICs are the core engine of modern electronic technology. By integrating a massive number of microelectronic components onto a tiny semiconductor chip, they have achieved miniaturization, high performance, low cost, and high reliability of electronic devices, completely changing human production and lifestyles. IC packaging adhesive dispensing technology is a key process in microelectronics manufacturing. It achieves chip protection, connection, and functional optimization through precise control of adhesive coating.

[0003] For example, patent number (CN222739559U) discloses a dispensing device for integrated circuit packaging, relating to the field of integrated circuit manufacturing technology. This invention includes a supporting component comprising a base, a reinforcing frame disposed on top of the base, a support frame disposed inside the reinforcing frame, a dispensing bucket disposed inside the support frame, and a dispensing head disposed at the bottom of the dispensing bucket; and a heating component comprising a moving assembly disposed inside the support frame and a heating assembly disposed inside the moving assembly. This invention uses the moving assembly to drive a threaded rod to rotate, causing the threaded block to move, which in turn moves the heating assembly, heating the liquid inside the dispensing bucket to rapidly soften it. Furthermore, a connecting belt drives a stirring shaft, enabling the stirring block to rotate and stir the colloid inside the dispensing bucket, ensuring uniform heating and further accelerating the softening of the colloid.

[0004] Currently, integrated circuit packaging adhesive dispensing equipment requires sequential loading, encapsulation dispensing, and unloading during operation. This limits the planning of process flow and operation time, especially when performing batch encapsulation dispensing, which is not conducive to improving the working efficiency of integrated circuit packaging adhesive dispensing equipment.

[0005] Therefore, to address the above problems, a dual-station integrated circuit packaging colloid dispensing device can be designed. Utility Model Content

[0006] To overcome the limitations of encapsulation and dispensing equipment in planning process flow and operation time, especially when batch encapsulation and dispensing processing is carried out, which is not conducive to improving the working efficiency of the equipment.

[0007] The technical solution of this utility model is as follows: an integrated circuit packaging colloid dispensing device, including a mounting base and a tooling plate. Supporting slide rods are fixedly installed on both the front and rear sides of the upper end of the mounting base. A movable seat is provided on the surface of the supporting slide rod. An electrically controlled guide rail frame is installed on the upper end of the movable seat. A dispensing module is provided on the surface of the electrically controlled guide rail frame. An electric displacement guide rail is fixedly installed on the upper end of the mounting base next to the supporting slide rod. A locking frame is fixedly installed on both the left and right sides of the upper end of the mounting base. A support frame is fixedly installed on the upper end of the mounting base next to the locking frame. A rotary cylinder is fixedly installed on the upper end of the support frame. A shaping light is fixedly installed at the output end of the rotary cylinder. An arc-shaped groove is opened at the lower end of the tooling plate. A movable groove is opened on the inner side of the locking frame at the upper end of the mounting base. A limiting sleeve is fixedly installed inside the movable groove. A spring is fixedly installed inside the limiting sleeve. A limiting movable block is fixedly installed on the upper end of the spring. A movable rod is fixedly installed on the upper end of the limiting movable block. A locking ball is fixedly installed on the upper end of the movable rod extending to the outer side of the limiting sleeve.

[0008] Preferably, the electrically controlled guide rail frame, in conjunction with the dispensing module, can perform dispensing processing on the integrated circuit board inside the tooling plate. Operating areas are provided on both sides of the mounting base, allowing simultaneous loading and unloading of the tooling plate on the other side. An electric displacement guide rail can move the moving seat, adjusting the processing area of ​​the electrically controlled guide rail frame and the dispensing module. A rotary cylinder can move the shaping lamp, which can shape the dispensing adhesive. A spring can compress the limiting block and the moving rod, limiting the interaction distance. A locking ball can tightly fit the arc-shaped groove within the set area. The tooling plate connection structure is easy to disassemble and replace, and can be changed according to the model and size of the integrated circuit board being produced.

[0009] Preferably, the surface of the support slide rod is slidably connected to the moving seat, and the output end of the electric displacement guide rail is fixedly connected to the moving seat.

[0010] Preferably, the dispensing module is slidably connected to the electronically controlled guide rail, and an external glue supply hose is fixedly connected to the upper end of the dispensing module.

[0011] Preferably, an electric displacement guide rail is used to drive the moving seat to move back and forth, and an electrically controlled guide rail frame is used to drive the dispensing module to move back and forth.

[0012] Preferably, a rotary cylinder is used to drive the shaping lamp to rotate back and forth, and a power control module is fixedly installed on the upper end of the shaping lamp.

[0013] Preferably, the surface of the limiting movable block is slidably connected to the limiting sleeve, and the surface of the movable rod is slidably connected to the limiting sleeve.

[0014] Preferably, the locking frame is engaged with the tooling plate, the surface of the locking ball is slidably connected with the movable groove, and the end of the locking ball away from the movable rod extends to the outside of the movable groove and is adapted to the arc-shaped groove.

[0015] The beneficial effects of this utility model are:

[0016] 1. This integrated circuit packaging colloid dispensing device has operating areas on both sides of the mounting base. The operating areas at both ends can perform dispensing and loading / unloading operations respectively. When the dispensing operation on one side is completed, the dispensing mechanism is used to move the dispensing mechanism to the operating area on the other side. The dispensing module works in conjunction with the electrically controlled guide rail to perform dispensing. At the same time, the structure of the shaping lamp in the operating area can be adjusted. The photochemical reaction is triggered by ultraviolet light of a specific wavelength, which instantly turns the liquid colloid into a solid, shaping the dispensing colloid and performing loading / unloading operations. This realizes dual-station alternating operation, which helps to optimize the equipment operation process, save time, and improve work efficiency.

[0017] 2. This integrated circuit packaging adhesive dispensing device uses a clamping frame to clamp the tooling plate, and a flexible sleeve structure to drive the clamping ball to transparently fit the arc-shaped groove, improving the stability of the tooling plate clamping and preventing the integrated circuit from shifting during processing. This ensures the quality of the dispensing process. At the same time, this tooling plate connection structure is easy to disassemble and replace. It can be replaced according to the model and size of the integrated circuit board being produced. Using the corresponding tooling plate to position the integrated circuit board improves the adaptability of the integrated circuit packaging adhesive dispensing device. Attached Figure Description

[0018] Figure 1 The diagram shown is a schematic representation of the overall structure of the integrated circuit packaging colloid dispensing device of this utility model.

[0019] Figure 2 The diagram shown is a schematic representation of the support slide bar structure of the integrated circuit packaging colloid dispensing device of this utility model.

[0020] Figure 3 The diagram shown is a schematic of the shaping lamp structure of the integrated circuit packaging colloid dispensing device of this utility model.

[0021] Figure 4 The diagram shown is a schematic diagram of the tooling plate structure of the integrated circuit packaging colloid dispensing device of this utility model.

[0022] Figure 5 This utility model is shown. Figure 4 Enlarged structural diagram of point A in the middle.

[0023] Explanation of reference numerals in the attached drawings: 1. Mounting base; 2. Support slide bar; 3. Movable seat; 4. Electrically controlled guide rail frame; 5. Dispensing module; 6. Electric displacement guide rail; 7. Clamping frame; 8. Support frame; 9. Rotary cylinder; 10. Shaping illumination lamp; 11. Tooling plate; 12. Arc-shaped groove; 13. Movable groove; 14. Limiting sleeve; 15. Spring; 16. Limiting movable block; 17. Movable rod; 18. Clamping ball. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Please see Figures 1-5 This utility model provides an embodiment of an integrated circuit packaging colloid dispensing device, including a mounting base 1 and a tooling plate 11. Supporting slide rods 2 are fixedly mounted on both the front and rear sides of the upper end of the mounting base 1. A movable seat 3 is provided on the surface of the supporting slide rod 2. An electrically controlled guide rail frame 4 is mounted on the upper end of the movable seat 3. A dispensing module 5 is provided on the surface of the electrically controlled guide rail frame 4. An electric displacement guide rail 6 is fixedly mounted on the upper end of the mounting base 1, located on the side of the supporting slide rod 2. A locking frame 7 is fixedly mounted on both the left and right sides of the upper end of the mounting base 1. A support frame 8 is fixedly mounted on the upper end of the mounting base 1, located on the side of the locking frame 7. A rotary cylinder 9 is fixedly mounted on the upper end of the support frame 8. A shaping lamp 10 is fixedly mounted on the output end of the rotary cylinder 9. An arc-shaped groove 12 is formed at the lower end of the tooling plate 11. The upper end of the mounting base 1 is located within the inner part of the locking frame 7. A movable slot 13 is provided on the side. A limiting sleeve 14 is fixedly installed inside the movable slot 13. A spring 15 is fixedly installed inside the limiting sleeve 14. A limiting movable block 16 is fixedly installed at the upper end of the spring 15. A movable rod 17 is fixedly installed at the upper end of the limiting movable block 16. A locking ball 18 is fixedly installed at the upper end of the movable rod 17 extending to the outside of the limiting sleeve 14. The dispensing mechanism is used to dispense the integrated circuit board of the tooling plate 11. The tooling plate 11 on the other side can be loaded and unloaded at the same time. After the dispensing is completed on this side, the dispensing mechanism is moved to the other side for dispensing through the displacement structure. The operating area on this side uses a shaping lamp 10 to shape the dispensed adhesive, which facilitates loading and unloading operations and realizes dual-station alternating operation. This helps to optimize the equipment operation process, save time, and improve work efficiency.

[0026] Please see Figures 1-4In this embodiment, the surface of the supporting slide rod 2 is slidably connected to the movable seat 3, the output end of the electric displacement guide rail 6 is fixedly connected to the movable seat 3, the dispensing module 5 is slidably connected to the electric control guide rail frame 4, and an external glue supply hose is fixedly connected to the upper end of the dispensing module 5. The electric displacement guide rail 6 is used to drive the movable seat 3 to move back and forth, the electric control guide rail frame 4 is used to drive the dispensing module 5 to move back and forth, the rotary cylinder 9 is used to drive the shaping lamp 10 to rotate back and forth, and a power control module is fixedly installed on the upper end of the shaping lamp 10. The dispensing device is equipped with a terminal system to facilitate unified control of the equipment and various driving components (the two electric displacement guide rails 6 work synchronously). The electric control guide rail frame 4, in conjunction with the dispensing module 5, can perform dispensing processing on the integrated circuit board inside the tooling plate 11. (The electric control guide rail frame 4 can be set as a driving component with similar functions.) Operating areas are provided on both sides of the mounting base 1. The guide rail 6 can drive the movable seat 3 to move (the electric displacement guide rail 6 can be set as a driving component with similar functions). The support slide rod 2 can provide auxiliary support and limit guidance for the movable seat 3, ensuring the stability of the movable seat 3. This displacement structure can adjust the processing position of the electric control guide rail frame 4 and the dispensing module 5. The rotary cylinder 9 can drive the shaping lamp 10 to move above the tooling plate 11 (the rotary cylinder 9 can be set as a driving component with similar functions). The shaping lamp 10 uses ultraviolet light of a specific wavelength to trigger a photochemical reaction, causing the liquid colloid to instantly turn into a solid, shaping the dispensing colloid. The shaping lamp 10 is basically close to the tooling plate 11 and is equipped with a functional lampshade to limit the direction of light illumination, which can prevent the shaping lamp 10 from shining on the workers (the shaping lamp 10 will only be controlled to turn on when it is above the tooling plate 11, and the time is short, within half a minute).

[0027] Please see Figure 1 , Figure 4 and Figure 5 In this embodiment, the surface of the limiting movable block 16 is slidably connected to the limiting sleeve 14, the surface of the movable rod 17 is slidably connected to the limiting sleeve 14, the engaging frame 7 is engaging with the tooling plate 11, the surface of the engaging ball 18 is slidably connected to the movable groove 13, and the end of the engaging ball 18 away from the movable rod 17 extends to the outside of the movable groove 13 and is adapted to the arc-shaped groove 12. The spring 15 can squeeze the limiting movable block 16 and the movable rod 17, the limiting movable block 16 and the limiting sleeve 14 can limit the interaction distance, and the engaging ball 18 can tightly fit the arc-shaped groove 12 within the set area, improving the stability of the engaging connection between the tooling plate 11 and the engaging frame 7. The tooling plate 11 connection structure is easy to disassemble and replace, and can be replaced according to the model and size of the integrated circuit board being produced (different tooling plates 11 have different sizes of upper positioning grooves, used to position and place different models of integrated circuit boards). The corresponding tooling plate 11 is used to position and place the integrated circuit board.

[0028] During operation, the electrically controlled guide rail 4, in conjunction with the dispensing module 5, performs dispensing on the integrated circuit board inside the fixture plate 11. The fixture plate 11 on the other side can be simultaneously loaded and unloaded. After dispensing on this side, the electric displacement guide rail 6 moves the moving seat 3, causing the electrically controlled guide rail 4 and dispensing module 5 to move to the other side for dispensing. In the operating area on this side, the rotary cylinder 9 moves the setting lamp 10 above the fixture plate 11 to set the dispensed adhesive, and then the setting lamp is adjusted again. The illumination lamp 10 facilitates loading and unloading operations. The spring 15 presses the limiting movable block 16 and the movable rod 17, which, together with the limiting movable block 16 and the limiting sleeve 14, limit the interaction distance, allowing the engaging ball 18 to tightly fit the arc-shaped groove 12 within the set area. This improves the stability of the engagement connection between the tooling plate 11 and the engaging frame 7. Furthermore, this tooling plate 11 connection structure is easy to disassemble and replace, and can be replaced according to the model and size of the integrated circuit board being produced. The corresponding tooling plate 11 is used to position and place the integrated circuit board.

[0029] Through the above steps, the dispensing mechanism performs dispensing on the integrated circuit board of the tooling board 11. The tooling board 11 on the other side can be loaded and unloaded simultaneously. After the dispensing on this side is completed, the dispensing mechanism is moved to the other side for dispensing through the displacement structure. The operating area on this side uses the shaping lamp 10 to shape the dispensing adhesive, which facilitates loading and unloading operations and realizes dual-station alternating operation. This helps to optimize the equipment operation process, save time, and improve work efficiency, thereby solving the problem that the packaging dispensing device has certain limitations in the planning of process flow and operation time, especially when batch packaging dispensing is performed, which is not conducive to improving the work efficiency of the equipment.

Claims

1. An integrated circuit packaging adhesive dispensing device, comprising a mounting base (1), characterized in that: It also includes a tooling plate (11), and support slide rods (2) are fixedly installed on both the front and rear sides of the upper end of the mounting base (1). A movable seat (3) is provided on the surface of the support slide rod (2). An electric control guide rail frame (4) is installed on the upper end of the movable seat (3). A dotted glue module (5) is provided on the surface of the electric control guide rail frame (4). An electric displacement guide rail (6) is fixedly installed on the upper end of the mounting base (1) on the side of the support slide rod (2). A locking frame (7) is fixedly installed on both the left and right sides of the upper end of the mounting base (1). A support frame (8) is fixedly installed on the upper end of the mounting base (1) on the side of the locking frame (7). A rotary cylinder is fixedly installed on the upper end of the support frame (8). 9) A fixed-shape lighting lamp (10) is fixedly installed at the output end of the rotary cylinder (9). An arc-shaped groove (12) is opened at the lower end of the tooling plate (11). An movable groove (13) is opened at the upper end of the mounting base (1) inside the clamping frame (7). A limiting sleeve (14) is fixedly installed inside the movable groove (13). A spring (15) is fixedly installed inside the limiting sleeve (14). A limiting movable block (16) is fixedly installed at the upper end of the spring (15). A movable rod (17) is fixedly installed at the upper end of the limiting movable block (16). A clamping ball (18) is fixedly installed at the upper end of the movable rod (17) extending to the outside of the limiting sleeve (14).

2. The integrated circuit packaging colloid dispensing device according to claim 1, characterized in that: The surface of the support slide rod (2) is slidably connected to the moving seat (3), and the output end of the electric displacement guide rail (6) is fixedly connected to the moving seat (3).

3. The integrated circuit packaging colloid dispensing device according to claim 1, characterized in that: The dispensing module (5) is slidably connected to the electronically controlled guide rail (4), and an external glue supply hose is fixedly connected to the upper end of the dispensing module (5).

4. The integrated circuit packaging colloid dispensing device according to claim 3, characterized in that: The electric displacement guide rail (6) is used to drive the moving seat (3) to move back and forth, and the electric control guide rail frame (4) is used to drive the dispensing module (5) to move back and forth.

5. The integrated circuit packaging colloid dispensing device according to claim 1, characterized in that: The rotary cylinder (9) is used to drive the shaping lamp (10) to rotate back and forth. The upper end of the shaping lamp (10) is fixedly equipped with a power control module.

6. The integrated circuit packaging colloid dispensing device according to claim 1, characterized in that: The surface of the limiting movable block (16) is slidably connected to the limiting sleeve (14), and the surface of the movable rod (17) is slidably connected to the limiting sleeve (14).

7. The integrated circuit packaging colloid dispensing device according to claim 6, characterized in that: The locking frame (7) is engaged with the tooling plate (11), the surface of the locking ball (18) is slidably connected with the movable groove (13), and the end of the locking ball (18) away from the movable rod (17) extends to the outside of the movable groove (13) and is adapted to the arc-shaped groove (12).

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