Air-tight optical module

By designing an hermetically sealed metal casing and metal bracket, the problem of poor mechanical structural strength of the hermetically sealed optical module was solved, enabling stable optical path transmission under harsh environments and wide temperature conditions.

CN224354613UActive Publication Date: 2026-06-12HISENSE & JONHON OPTICAL ELECTRICAL TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HISENSE & JONHON OPTICAL ELECTRICAL TECH CO LTD
Filing Date
2025-06-23
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing airtight optical modules have poor mechanical strength, making them unable to withstand strong mechanical vibrations and impacts, and are not suitable for wide-temperature environments.

Method used

The design employs a hermetically sealed metal housing and metal bracket, which combines snap-fit ​​and structural adhesive to fix the FA components, metal bracket and circuit board into one unit. Kovar alloy material is used to improve mechanical strength, and hermetically sealed welding is achieved through metal sealing joints.

🎯Benefits of technology

The mechanical structure strength of the airtight optical module has been improved, enabling it to withstand strong mechanical vibration and impact, making it suitable for military applications and maintaining optical path stability in a wide temperature range.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a kind of airtight optical module, including airtight packaging metal shell, FA component and metal support, circuit board is fixed in the recess of airtight packaging metal shell, recess is formed with protruding part, optical chip is arranged on the horizontal top surface of protruding part and is bonded with circuit board, first clamping part is formed on the two opposite sides of protruding part respectively;The positioning matrix of FA component is located on the horizontal top surface of protruding part, the bottom end of the two side plates of metal support is formed with second clamping part respectively, second clamping part and first clamping part are clamped and the positioning matrix is clamped between protruding part and metal support, top plate and the top surface of positioning matrix are fixedly connected, side plate and the side of positioning matrix are fixedly connected.The positioning matrix of the utility model airtight optical module is stably clamped and fixed between protruding part and metal support, so that FA component, metal support and airtight packaging metal shell are fixed into an organic whole, ensure that FA component has reliable mechanical structural strength, can withstand strong mechanical vibration and mechanical impact.
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Description

Technical Field

[0001] This utility model relates to the field of optical fiber communication technology, and in particular to an airtight optical module. Background Technology

[0002] With the development of big data processing, communication technology, and the Internet of Things, there is a need to transmit large-capacity, high-density communication data, leading to the increasingly widespread application of highly integrated airtight optical modules.

[0003] In related technologies, the FA (fiber optic array) component of the hermetic optical module is usually directly glued to the PCB board by applying adhesive to the bottom and sides of the FA component. In other words, the optical path is only fixed by structural adhesive, resulting in poor mechanical strength of the entire hermetic optical module. When applied to harsh environments, such as the military field where strong mechanical vibration and impact are frequently encountered, the hermetic optical module in related technologies cannot withstand such harsh environments and is prone to problems such as decreased optical performance and optical path misalignment.

[0004] Furthermore, since the FA component is only fixed by structural adhesive, in a wide operating temperature range (low temperature, high temperature, wide temperature range), the reliability of the structural adhesive deteriorates at low or high temperatures, causing optical path deviation. Therefore, the existing airtight optical module is not suitable for wide temperature operating environments.

[0005] Therefore, there is still room for improvement in existing airtight optical modules. Summary of the Invention

[0006] This invention proposes an airtight optical module that can solve the problem of poor mechanical strength and difficulty in withstanding strong mechanical vibration and impact in related technologies.

[0007] To achieve the above technical objectives, the technical solution of this utility model is an airtight optical module, comprising:

[0008] An hermetically sealed metal housing includes a hermetically sealed metal outer shell and a cover plate. The hermetically sealed metal outer shell has a groove with an opening facing the cover plate. The cover plate covers the opening of the groove and is integrally connected to the hermetically sealed metal outer shell. The hermetically sealed metal outer shell is provided with a plurality of pins and a tail tube. A circuit board is fixedly disposed in the groove. A protrusion protruding towards its opening side is also formed in the groove. A through portion that avoids the protrusion is formed on the circuit board. An optical chip is disposed on the horizontal top surface of the protrusion and bonded to the circuit board. A first snap-fit ​​portion is formed on each of the two opposite sides of the protrusion.

[0009] The FA assembly includes an array of optical fibers and a positioning base for positioning the front end of the array of optical fibers. The positioning base is located on the horizontal top surface of the protrusion. The front optical end face of the array of optical fibers is coupled to the optical chip. The pigtail of the array of optical fibers extends out of the hermetically sealed metal housing through the tail tube and is hermetically welded to the tail tube.

[0010] The metal bracket includes a top plate and two side plates connected to both ends of the top plate. The bottom ends of the two side plates are respectively formed with second snap-fit ​​portions. The second snap-fit ​​portions snap-fit ​​with the first snap-fit ​​portions to clamp the positioning base between the protrusion and the metal bracket. The top plate is fixedly connected to the top surface of the positioning base, and the side plates are fixedly connected to the side surfaces of the positioning base.

[0011] The technical solution of this utility model also includes the following additional technical features:

[0012] The top plate is structurally bonded to the top surface of the positioning base, and the side plate is structurally bonded to the side surface of the positioning base.

[0013] The structural adhesive on the top surface of the positioning substrate is bonded to the structural adhesive on the side surface.

[0014] The top plate and the two side plates of the metal bracket are respectively formed with adhesive holes.

[0015] The metal support is made of Kovar alloy.

[0016] The periphery of the circuit board abuts against the inner wall of the groove, thereby positioning the circuit board by the groove; at least two opposing inner walls of the through portion abut against the corresponding side walls of the protrusion, thereby positioning the protrusion by the through portion.

[0017] The pigtail is provided with a metal sealing joint, which is welded to the tail tube to achieve airtight welding.

[0018] The hermetically sealed metal housing is a butterfly-shaped housing, and the front end optical face of the array optical fiber is a 45° beveled face.

[0019] The front end face of the array optical fiber is actively coupled to the optical chip.

[0020] Compared with the prior art, the present invention has the following advantages and positive effects:

[0021] This utility model relates to an airtight optical module. A metal bracket spans the protrusion on the airtight metal housing and the positioning base of the FA component. The second snap-fit ​​portion at the bottom of the side plates engages with the first snap-fit ​​portion of the protrusion, fixing the metal bracket in the groove of the airtight metal housing. The top plate of the metal bracket is fixedly connected to the top surface of the positioning base, and the side plates of the metal bracket are fixedly connected to the side surfaces of the positioning base. This securely clamps and fixes the positioning base between the protrusion and the metal bracket, thus fixing the FA component, the metal bracket, and the airtight metal housing into a single unit. This ensures reliable mechanical fixation of the FA component, resulting in good mechanical structural strength, the ability to withstand strong mechanical vibration and impact, and meets the requirements of military applications. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the airtight optical module in an embodiment of the present utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the airtight optical module without the cover plate in this embodiment of the present invention;

[0024] Figure 3 for Figure 2 Enlarged view of part A;

[0025] Figure 4 This utility model embodiment shows a schematic diagram of the FA component in a pre-fixed state within a hermetically sealed metal casing.

[0026] Figure 5 A three-dimensional structural schematic diagram of the hermetically sealed metal shell in an embodiment of this utility model;

[0027] Figure 6 A three-dimensional structural schematic diagram of the hermetically sealed metal shell from another perspective in an embodiment of this utility model;

[0028] Figure 7 This is a three-dimensional structural diagram of the metal bracket in an embodiment of the present utility model;

[0029] Figure 8 This is a schematic diagram of the structure of the structural adhesive between the metal bracket and the positioning substrate in an embodiment of this utility model;

[0030] Figure 9 This is a schematic diagram of the circuit board structure in an embodiment of the present invention.

[0031] Figure label:

[0032] 100. Hermetically sealed metal housing; 110. Hermetically sealed metal outer shell; 111. Groove; 112. Protrusion; 1121. First protrusion; 1122. Second protrusion; 113. First snap-fit; 114. Protruding edge; 120. Cover plate; 130. Pin; 140. Tail tube;

[0033] 200. FA assembly; 210. Arrayed fiber; 211. Optical end face; 212. Pigtail; 220. Positioning substrate; 230. Metal sealing joint;

[0034] 300. Metal bracket; 310. Top plate; 320. Side plate; 330. Second snap-fit ​​part; 340. Glue dispensing hole;

[0035] 400. Circuit board; 410. Through section; 411. First through section; 412. Second through section;

[0036] 500, optical chip;

[0037] 600. Integral structural adhesive. Detailed Implementation

[0038] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] Reference Figures 1 to 9 In some embodiments, an airtight optical module is proposed, including an airtight metal housing 100, an FA component 200, and a metal bracket 300.

[0040] The hermetically sealed metal housing 100 includes a hermetically sealed metal outer shell 110 and a cover plate 120. A groove 111 is formed inside the hermetically sealed metal outer shell 110, with the opening of the groove 111 facing the cover plate 120. The cover plate 120 covers the opening of the groove 111 and is welded to the hermetically sealed metal outer shell 110. The hermetically sealed metal outer shell 110 is provided with several pins 130 and a tail tube 140. A circuit board 400 is fixed inside the groove 111, and a protrusion 112 protruding towards its opening is also formed inside the groove 111. A corresponding through portion 410 is formed on the circuit board 400 to avoid the protrusion 112 protruding towards the opening of the groove 111. The protrusion 112 has a horizontal top surface, and an optical chip 500 is disposed on the horizontal top surface of the protrusion 112, specifically by adhesive bonding. The optical chip 500 is wire-bonded to the circuit board 400. First snap-fit ​​portions 113 are formed on the two opposite sides of the protrusion 112.

[0041] The FA assembly 200 includes an array optical fiber 210 and a positioning base 220 for positioning the front end of the array optical fiber 210. The positioning base 220 is located on the horizontal top surface of the protrusion 112. The front optical end face 211 of the array optical fiber 210 is coupled to the optical chip 500. The pigtail 212 of the array optical fiber 210 extends out of the hermetically sealed metal housing 110 through the tail tube 140 and is hermetically welded to the tail tube 140.

[0042] The structure of the positioning substrate 220 and its positioning structure for the front end of the array fiber 210 adopt existing technologies, such as setting multiple V-grooves with a set spacing to position each fiber; the coupling method between the front end optical face 211 of the array fiber 210 and the optical chip 500 can be active coupling.

[0043] The metal bracket 300 includes a top plate 310 and two side plates 320 connected to both ends of the top plate 310, making the metal bracket 300 as a whole U-shaped bracket. The bottom ends of the two side plates 320 are respectively formed with second snap-fit ​​portions 330, which snap-fit ​​with the first snap-fit ​​portion 113, so that the metal bracket 300 spans the protrusion 112 and the positioning base 220 on it, and the positioning base 220 is sandwiched between the protrusion 112 and the metal bracket 300. The top plate 310 of the metal bracket 300 is fixedly connected to the top surface of the positioning base 220, and the side plates 320 of the metal bracket 300 are fixedly connected to the side surfaces of the positioning base 220.

[0044] The metal bracket 300 is engaged with the first engaging portion 113 on the protrusion 112 via its second engaging portion 330, and is fixed in the groove 111 of the hermetically sealed metal housing 110. The positioning base 220 is sandwiched between the protrusion 112 and the metal bracket 300. The top plate 310 of the metal bracket 300 is fixedly connected to the top surface of the positioning base 220, and the side plate 320 of the metal bracket 300 is fixedly connected to the side of the positioning base 220. This allows the positioning base 220 to be firmly fixed on the protrusion 112, thus fixing the FA assembly 200, the metal bracket 300, and the hermetically sealed metal housing 100 into a single unit. This ensures that the FA assembly 200 has reliable mechanical fixation, resulting in good mechanical structural strength and the ability to withstand strong mechanical vibration and impact, meeting the requirements of military applications. At the same time, the reliable fixation of the FA assembly 200 allows it to be used in a wider operating temperature range. In addition, the metal bracket 300 is small in size and occupies little space, which helps to reduce the package size.

[0045] In some embodiments, the first latching portion 113 is a latching slot, and the second latching portion 330 is a latching claw. Specifically, as shown... Figure 5 and Figure 6As shown, a protruding edge 114 extends outward from each of the opposite sides of the horizontal top surface of the protrusion 112. The protruding edge 114 is located above the bottom surface of the groove 111, and there is a certain distance between the protruding edge 114 and the bottom surface of the groove 111 in the height direction, so as to form a first engaging part 113 in the form of a slot; correspondingly, as Figure 7 As shown, the bottom end of the side plate 320 of the metal bracket 300 is bent inward to form a second locking part 330 in the form of a strip-shaped claw. The metal bracket 300 moves from bottom to bottom relative to the positioning base 220 on the protrusion 112 until the second locking part 330 and the first locking part 113 are locked together, so that the metal bracket 300 spans and is fixed on the protrusion 112 and the positioning base 220, and the positioning base 220 is clamped between it and the protrusion 112.

[0046] In some embodiments, the first latching portion 113 may also be a latch claw, and correspondingly, the second latching portion 330 may be a latch groove, which will not be described in detail here.

[0047] The top plate 310 of the metal bracket 300 is fixed to the top surface of the positioning base 220 by point structural adhesive, and the side plate 320 of the metal bracket 300 is also fixed to the side surface of the positioning base 220 by point structural adhesive. During fixation, the front end of the array fiber 210 of the FA component 200 and the positioning base 220 are first placed on the protrusion 112 of the groove 111. The front optical end face 211 of the FA component 200 is coupled to the optical chip 500. During coupling, the positioning base 220 can be pre-fixed on the protrusion 112 with adhesive. After coupling, the metal bracket 300 is fixed on the protrusion 112 by the second snap-fit ​​part 330 and the first snap-fit ​​part 113, and the positioning base 220 is clamped inside. Then, structural adhesive is applied between the top plate 310 of the metal bracket 300 and the top surface of the positioning base 220, and between the side plate 320 of the metal bracket 300 and the side surface of the positioning base 220 to achieve the fixed connection between the metal bracket 300 and the positioning base 220. This ensures reliable fixation, is simple to operate, and is easy to operate in the narrow space inside the airtight metal shell.

[0048] Furthermore, the structural adhesive on the top surface of the positioning substrate 220 is integrated with the structural adhesive on the sides to form a U-shaped integral structural adhesive 600, such as... Figure 4 and Figure 8 As shown, the adhesive application area is increased to further improve the bonding reliability between the metal bracket 300 and the positioning base 220.

[0049] In some embodiments, the top plate 310 and side plates 320 of the metal bracket 300 are relatively wide to improve the reliability of fixing the FA assembly 200. In this case, adhesive holes 340 are formed on the top plate 310 and the two side plates 320 of the metal bracket 300, respectively. Figure 4 and Figure 7As shown, structural adhesive is applied between the metal bracket 300 and the positioning substrate 220 through the corresponding dispensing hole 340, so as to fill the contact surface between the metal bracket 300 and the positioning substrate 220 as much as possible, increase the dispensing area, and improve the reliability of the dispensing connection.

[0050] In some embodiments, structural adhesive is applied to the bottom surface of the circuit board 400 to fix it to the bottom surface of the groove 111 for fixing.

[0051] In some embodiments, the periphery of the circuit board 400 is fitted and abutted against the inner wall of the groove 111, so that the groove 111 plays a positioning role in fixing the circuit board 400, thereby improving the fixing and installation efficiency of the circuit board 400.

[0052] In some embodiments, such as Figure 9 As shown, the through portion 410 of the circuit board 400 includes a first through portion 411 and a second through portion 412 connected as one unit. The width of the first through portion 411 is smaller than the width of the second through portion 412. Correspondingly, the protrusion 112 includes a first protrusion 1121 and a second protrusion 1122. The first protrusion 1121 is adapted to fit and fit the first through portion 411, so that the first protrusion 1121 and the first through portion 411 can also cooperate for positioning.

[0053] The second protrusion 1122 is located inside the second through portion 412. The optical chip 500 and the positioning base 220 are specifically disposed on the horizontal top surface of the second protrusion 1122. The protruding edge 114 of the protrusion 112 is formed at the top of the second protrusion 1122. The first snap-fit ​​portion 113 in the form of a slot corresponds to the second protrusion 1122. When the metal bracket 300 is snapped into place on the second protrusion 1122, the bottom end of the side plate 320 of the metal bracket 300 is sandwiched between the side of the second protrusion 1122 and the inner wall of the second through portion 412, so that the second through portion 412 also plays a certain limiting role on the metal bracket 300, which is conducive to improving the fixation stability of the metal bracket 300.

[0054] The metal bracket 300 is made of Kovar alloy, such as 4J29 Kovar alloy. Kovar alloy has high hardness, high strength and a very low coefficient of thermal expansion, which can maintain dimensional stability when the temperature changes.

[0055] The hermetically sealed metal housing 110 can also be made of Kovar alloy, such as 4J29 Kovar alloy, and the cover plate 120 can be made of 4J42 alloy. The cover plate 120 is processed by etching process to ensure the required dimensional accuracy and flatness. Then, a parallel sealing and welding machine is used to achieve hermetically sealed connection between the cover plate 120 and the hermetically sealed metal housing 110.

[0056] For the hermetic welding of the pigtail 212 and the tailpipe 140, in some embodiments, the pigtail 212 is sealed to the tailpipe 140 by soldering a metal sealing joint 230 that is welded to it. After the partial cladding of the array fiber 210 of the FA assembly 200 is gold-plated, the metal sealing joint 230 is then welded to the cladding to achieve a hermetic connection between the metal sealing joint 230 and the fiber.

[0057] In some embodiments, the hermetically sealed metal housing 100 is a butterfly-shaped housing, and the front optical end face 211 of the array optical fiber 210 is a 45° beveled end face.

[0058] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. An airtight optical module, characterized in that, include: An hermetically sealed metal housing includes a hermetically sealed metal outer shell and a cover plate. The hermetically sealed metal outer shell has a groove with an opening facing the cover plate. The cover plate covers the opening of the groove and is integrally connected to the hermetically sealed metal outer shell. The hermetically sealed metal outer shell is provided with a plurality of pins and a tail tube. A circuit board is fixedly disposed in the groove. A protrusion protruding towards its opening side is also formed in the groove. A through portion that avoids the protrusion is formed on the circuit board. An optical chip is disposed on the horizontal top surface of the protrusion and bonded to the circuit board. A first snap-fit ​​portion is formed on each of the two opposite sides of the protrusion. The FA assembly includes an array of optical fibers and a positioning base for positioning the front end of the array of optical fibers. The positioning base is located on the horizontal top surface of the protrusion. The front optical end face of the array of optical fibers is coupled to the optical chip. The pigtail of the array of optical fibers extends out of the hermetically sealed metal housing through the tail tube and is hermetically welded to the tail tube. The metal bracket includes a top plate and two side plates connected to both ends of the top plate. The bottom ends of the two side plates are respectively formed with second snap-fit ​​portions. The second snap-fit ​​portions snap-fit ​​with the first snap-fit ​​portions to clamp the positioning base between the protrusion and the metal bracket. The top plate is fixedly connected to the top surface of the positioning base, and the side plates are fixedly connected to the side surfaces of the positioning base.

2. The airtight optical module according to claim 1, characterized in that, The top plate is structurally bonded to the top surface of the positioning base, and the side plate is structurally bonded to the side surface of the positioning base.

3. The airtight optical module according to claim 2, characterized in that, The structural adhesive on the top surface of the positioning substrate is bonded to the structural adhesive on the side surface.

4. The airtight optical module according to claim 3, characterized in that, The top plate and the two side plates of the metal bracket are respectively formed with adhesive holes.

5. The airtight optical module according to claim 1, characterized in that, The metal support is made of Kovar alloy.

6. The airtight optical module according to claim 1, characterized in that, The periphery of the circuit board abuts against the inner wall of the groove, thereby positioning the circuit board by the groove; at least two opposing inner walls of the through portion abut against the corresponding side walls of the protrusion, thereby positioning the protrusion by the through portion.

7. The airtight optical module according to claim 1, characterized in that, The pigtail is provided with a metal sealing joint, which is welded to the tail tube to achieve airtight welding.

8. The airtight optical module according to claim 1, characterized in that, The hermetically sealed metal housing is a butterfly-shaped housing, and the front end optical face of the array optical fiber is a 45° beveled face.

9. The airtight optical module according to claim 1, characterized in that, The front end face of the array optical fiber is actively coupled to the optical chip.