Patch shielded power inductor

Abstract

This utility model relates to a surface-mount shielded power inductor in the field of inductors, comprising a ferrite core, a coil, and a ferrite cover. The coil is wound around the sidewall of the ferrite core. A base plate is provided at one end of the ferrite core. The ferrite cover is fitted over the outside of the ferrite core and the coil and is connected to the base plate. A solder groove and a silver plating section are provided at the end of the base plate away from the ferrite core. The two ends of the coil are leads, which are bent and extended into the solder groove. The middle section of the silver plating section coincides with the solder groove. The leads extending into the solder groove are electrically connected to the silver plating section by soldering. The silver plating section is used to achieve a solder connection with the PCB, which greatly improves the mounting strength of the inductor on the PCB. The soldering area is located in the solder groove of the base plate and the solder groove is connected to the outside, so that the solder joints of the leads and terminal metal sheets are completely exposed. The soldering quality during the production process can be directly inspected by visual inspection.

Description

Technical Field

[0001] This utility model relates to the field of inductors, and in particular to surface-mount shielded power inductors. Background Technology

[0002] Surface mount inductors are one of the key passive components in modern electronic circuits, widely used in power converters, filters, impedance matching circuits, and other circuits, primarily responsible for energy storage, filtering, and suppressing electromagnetic interference. Their miniaturization and high-density mounting characteristics meet the growing demand for thinner and lighter electronic devices.

[0003] Traditional surface mount inductors consist of a ferrite core, a coil, and a ferrite shield. The coil is wound around the sidewalls of the ferrite core to store and convert energy. The ferrite shield is fitted over the ferrite core and coil, forming a closed magnetic circuit structure that effectively reduces electromagnetic radiation and prevents interference with surrounding electronic components. This structure exhibits good stability in high-power circuits and is therefore widely used in power management, motor drives, and other applications.

[0004] Traditional surface mount inductors typically use epoxy resin to fix their bottom metal terminals. This connection method has poor shock resistance, and the metal terminals are prone to falling off or loosening when the electronic equipment is subjected to vibration or impact. In addition, the solder joints of the coil are wrapped inside the ferrite magnetic cover and cannot be directly observed. When defects such as poor soldering or false soldering occur during the soldering process, it is difficult to detect them in time during the production inspection. Utility Model Content

[0005] To overcome the shortcomings of existing technical solutions, this utility model provides a surface-mount shielded power inductor, which can effectively solve the technical problems of easy detachment and inability to directly observe the soldering condition.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A surface-mount shielded power inductor includes a ferrite core, a coil, and a ferrite shield. The coil is wound around the sidewall of the ferrite core. A base plate is provided at one end of the ferrite core. The ferrite shield is fitted over the outside of the ferrite core and the coil and is connected to the base plate. A solder groove and a silver plating section are provided at the end of the base plate away from the ferrite core. The two ends of the coil are leads, which are bent and extend into the solder groove. The middle section of the silver plating section coincides with the solder groove. The leads extending into the solder groove are electrically connected to the silver plating section by soldering.

[0008] Furthermore, a positioning boss is provided at the end of the ferrite core away from the base plate, and the side wall of the positioning boss cooperates with the inner wall of the ferrite cover.

[0009] Furthermore, the base plate is in the shape of a cross, and an opening is provided between the base plate and the ferrite magnetic cover to facilitate the passage of pins.

[0010] Furthermore, the surface of the soldered part after being pushed out is flush with the silver-plated part.

[0011] Compared with existing technologies, the advantages of this invention are as follows: By setting a silver plating section on the base plate and eliminating the traditional epoxy resin adhesive structure for bonding metal terminals, the bottom of the inductor can be directly soldered to the PCB through the silver plating section. The silver plating layer has excellent conductivity and solderability, forming a strong metallurgical bond with the PCB pads, significantly improving the mounting strength of the inductor on the PCB. The soldering area is located in the soldering groove on the base plate, and the soldering groove is connected to the outside, so that the soldering points of the leads and terminal metal pieces are fully exposed. The soldering quality during the production process can be directly inspected visually, and defects such as cold solder joints, false solder joints, and insufficient solder can be quickly identified. Attached Figure Description

[0012] Figure 1 This is a front perspective view of the present invention;

[0013] Figure 2 This is a bottom-view perspective view of the present invention;

[0014] Figure 3 This is an exploded view of the main front view of this utility model;

[0015] Figure 4 This is an exploded view of the present invention from below;

[0016] Figure 5 This is a schematic diagram of the structure of this utility model;

[0017] The numbers in the diagram are: 1-Ferrite core, 2-Coil, 201-Pin, 3-Ferrite cover, 4-Base plate, 401-Welding groove, 402-Silver plating part, 5-Solder, 6-Positioning boss, 7-Opening. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] The following is combined with Figures 1-4 A detailed description of the surface-mount shielded power inductor of this invention is provided below:

[0020] A surface-mount shielded power inductor includes a ferrite core 1, a coil 2, and a ferrite cover 3. The coil 2 is wound around the side wall of the ferrite core 1. A base plate 4 is provided at one end of the ferrite core 1. The ferrite cover 3 is sleeved on the outside of the ferrite core 1 and the coil 2 and is connected to the base plate 4. A solder groove 401 and a silver plating part 402 are provided at the end of the base plate 4 away from the ferrite core 1. The two ends of the coil 2 are leads 201. The leads 201 are bent and extend into the solder groove 401. The silver plating part 402 extends into the inner wall of the solder groove 401. The leads 201 extending into the solder groove 401 are electrically connected to the terminal metal sheet by solder 5.

[0021] By setting a silver-plated section 402 on the base plate 4 and eliminating the traditional epoxy resin adhesive structure for bonding metal terminals, the bottom of the inductor is directly soldered to the PCB through the silver-plated section 402. This avoids the risk of adhesive aging and peeling, and maintains a stable conductive connection even under equipment vibration, impact, or high and low temperature environments, significantly enhancing the product's shock resistance and service life.

[0022] A positioning boss 6 is provided at the end of the ferrite core 1 away from the base plate 4. The side wall of the positioning boss 6 mates with the inner wall of the ferrite magnetic cover 3, enabling rapid and precise positioning of the core and the cover during assembly. This not only improves production efficiency but also effectively prevents the magnetic cover from shifting or tilting during assembly, ensuring the symmetry and integrity of the magnetic circuit, thereby improving the consistency of the inductor's electromagnetic performance. Simultaneously, the cooperation between the positioning boss 6 and the magnetic cover enhances the overall mechanical strength of the product, better resisting external impacts and vibrations.

[0023] The base plate 4 is cross-shaped, and an opening 7 is provided between the base plate 4 and the ferrite magnetic cover 3 to facilitate the passage of the pin 201. This ensures the stability of the connection with the ferrite magnetic cover 3, and the opening 7 provides a convenient path for the coil 2 pin 201 to pass through. This avoids the need to open complex wire-passing holes on the magnetic cover or base plate 4, simplifies mold manufacturing and processing, and reduces production costs.

[0024] The surface of the solder joint 5, after being pushed out, is flush with the silver plating section 402, reducing stress concentration points, improving the fatigue resistance of the solder joint, ensuring the continuity and integrity of the silver plating section 402, and maintaining good electrical consistency throughout the entire bottom conductive area. Furthermore, the flat solder surface facilitates subsequent automated inspection and PCB mounting processes, avoiding mounting defects or short circuit risks caused by solder joint protrusions, thus improving product yield and safety.

[0025] The silver plating layer possesses excellent conductivity and solderability, forming a strong metallurgical bond with the PCB pads, significantly improving the inductor's mounting strength on the PCB. The soldering area is located in the soldering groove 401 of the base plate 4, and the soldering groove 401 is connected to the outside, fully exposing the solder joints between the pins 201 and the terminal metal pieces. Soldering quality during production can be directly inspected visually, quickly identifying defects such as cold solder joints, false solder joints, and insufficient solder. This simplifies the overall structure of the inductor, reduces manufacturing process complexity, and helps improve the efficiency of mass production.

[0026] The specific processes are as follows: wire winding, soldering, magnetic shield assembly, adhesive application and fixing, baking, external inspection, and packaging. Compared to traditional processes, this reduces tedious steps such as metal terminal bonding and adhesive curing, shortening the production cycle. Furthermore, the excellent solderability of the silver plating layer and the exposed 401 soldering tank design make each process easier to automate, such as automatic wire winding, automatic soldering, and automatic magnetic shield assembly. This significantly improves production efficiency and product quality stability, while reducing labor costs and the defect rate caused by human error.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A surface-mount shielded power inductor, comprising a ferrite core, a coil, and a ferrite shield, characterized in that: The coil is wound around the side wall of the ferrite core. A base plate is provided at one end of the ferrite core. A ferrite cover is fitted over the outside of the ferrite core and the coil and is connected to the base plate. A welding groove and a silver plating part are provided at the end of the base plate away from the ferrite core. The two ends of the coil are leads. The leads are bent and extended into the welding groove. The middle section of the silver plating part coincides with the welding groove. The leads extending into the welding groove are electrically connected to the silver plating part by soldering.

2. The surface-mount shielded power inductor according to claim 1, characterized in that: A positioning boss is provided at the end of the ferrite core away from the base plate, and the side wall of the positioning boss cooperates with the inner wall of the ferrite cover.

3. The surface-mount shielded power inductor according to claim 1, characterized in that: The base plate is shaped like a cross, and an opening is provided between the base plate and the ferrite magnetic cover to facilitate the passage of pins.

4. The surface-mount shielded power inductor according to any one of claims 1-3, characterized in that: The surface of the soldered part after being pushed out is flush with the silver-plated part.

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