A mobile phone mainboard

Abstract

The utility model provides a kind of mobile phone mainboard, it is related to mainboard heat dissipation technical field, the utility model includes mainboard, the mainboard includes board body, the both sides of board body are provided with heat dissipation module, two the heat dissipation module board body is clamped and carries out heat exchange absorption board body heat dissipation heat, the surface of two the heat dissipation module is uniformly provided with clamping portion, wherein clamping portion is fixed with two heat dissipation modules on the surface of board body.The utility model utilizes two heat dissipation modules to board body heat dissipation, by clamping portion two heat dissipation modules are fixed, heat dissipation module and board body direct heat exchange and spread to air, and then carry out rapid heat dissipation to board body.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation technology, and in particular to a mobile phone motherboard. Background Technology

[0002] All of a mobile phone’s functions (such as making calls, accessing the internet, taking photos, and running apps) rely on the motherboard: it connects all hardware components such as the processor, memory, camera, battery, and screen through internal circuitry, transmitting power and data signals to ensure that all components work together.

[0003] After removing peripherals such as cameras and screens from multiple mobile phone motherboards, they are grouped together in a chassis to form a "mobile phone cluster". Although the ARM processors (such as Snapdragon and Dimensity series) of mobile phone motherboards are not as powerful as x86 servers, when there are enough of them, they can form a low-power computing cluster suitable for handling parallel and lightweight tasks (mobile phone motherboards are small in size and have low power consumption (the power consumption of a single motherboard is usually 10-30W, which is far lower than that of servers)). When mobile phone motherboards are grouped together and working together, heat accumulation can easily occur, which can affect the normal operation of the motherboards. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a mobile phone motherboard.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a mobile phone motherboard, comprising a motherboard body, wherein the motherboard body is functionally divided into upper and lower regions, wherein the upper region is the core of the processing module, and the lower region is an area integrating charging, sound acquisition, sound playback, and haptic feedback, and the upper and lower regions are electrically connected. The upper region of the motherboard body is provided with a front camera, a rear camera, and the core processing module, and a notch on the edge of the motherboard body allows the camera module to be installed at the notch to form the front camera and the rear camera. The camera module and the motherboard body are detachably electrically connected. The lower region of the motherboard body... The upper part of the plate is equipped with a vibration motor and a charging module. The vibration motor is held in place by a notch on the edge of the plate. The vibration motor and the plate are detachably electrically connected. The space between the upper and lower parts is for the battery to be inserted. The battery is embedded in the plate and is detachably electrically connected to the plate. The plate is equipped with a mounting part. Heat dissipation modules are provided on both sides of the plate. The two heat dissipation modules clamp the plate and exchange heat with the plate to absorb the heat dissipated by the plate. The surfaces of the two heat dissipation modules are evenly provided with clamping parts, which clamp and fix the two heat dissipation modules on the surface of the plate.

[0006] The aforementioned components achieve the following effect: when multiple mobile phone motherboards need to be installed together inside the host, the peripheral components (front camera, rear camera, vibration motor, and battery) on the mobile phone motherboard are removed, an external DC power supply is connected to power the motherboard, and then connected to the input module on the motherboard via a data cable (the motherboard can be controlled by computer simulation software to perform calculations). Two heat dissipation modules are used to dissipate heat from the board, and the two heat dissipation modules are fixed by a clamping part. The heat dissipation modules and the board directly exchange heat and dissipate it into the air, thereby quickly dissipating heat from the board.

[0007] Preferably, the heat dissipation module includes a heat dissipation plate, the outline of which is consistent with the outline of the plate body, wherein the heat dissipation plate is attached to the surface of the plate body, the gap between the heat dissipation plate and the plate body is filled with thermally conductive silicone grease, and fins are uniformly arranged on the side of the heat dissipation plate away from the plate body, wherein the fins and the heat dissipation plate are integrally formed.

[0008] The effects achieved by the above components are as follows: the heat sink is a copper plate, and the thermal grease between the heat sink and the plate can improve the heat exchange speed between the heat sink and the plate. The thermal grease is a non-conductive product. The core processing module on the plate generates heat during operation, and the heat is transferred to the heat sink through the thermal grease. The heat sink has fins integrally formed on its surface, which increases the contact area between the heat sink and the air, thereby improving the heat transfer effect of the heat sink and quickly dissipating the heat generated on the surface of the plate. (It should be noted that it can be used with a fan to accelerate airflow, and can also be used with an air conditioner to lower the room temperature and with a fan to blow cool air onto the fins.)

[0009] Preferably, the heat dissipation module includes a first clamping plate and a second clamping plate. The first clamping plate is attached to the surface of the plate body, and thermal grease is applied between the first clamping plate and the plate body. A copper tube is provided between the first clamping plate and the second clamping plate. The copper tube is fixed between the first clamping plate and the second clamping plate by a triangular piece, wherein one end of the copper tube is connected to the output end of the air pump.

[0010] The effects achieved by the above components are as follows: the first clamping plate is a copper plate, and the thermal grease between the first clamping plate and the plate body can improve the heat exchange speed between the first clamping plate and the plate body. The thermal grease is a non-conductive product. The core processing module on the plate body generates heat during operation. The heat is transferred to the first clamping plate through the thermal grease, and then external air is blown in by an air pump. The air flows in the copper pipe (which can be used with an air conditioner to generate cold air, and the cold air is blown into the copper pipe by the air pump to remove the heat). The copper pipe absorbs the heat on the first clamping plate and exchanges it with the air, thereby achieving rapid cooling (it should be noted that a water pump can also be used to deliver coolant to the copper pipe).

[0011] Preferably, the clamping part is a U-shaped clamp. When the two heat sinks are clamped on the surface of the plate and the U-shaped clamp is clamped on the surface of the two heat sinks, the clamping part of the U-shaped clamp always maintains a tendency to move closer to each other.

[0012] The effect achieved by the above-mentioned components is that the U-shaped clip made of elastic material can be pried open, and then the clamping part can be used to clamp the two heat sinks and clamp the heat sinks to the surface of the plate, thereby fixing the heat sinks.

[0013] Preferably, the U-shaped clamping parts are provided with an inclined surface on the side where they are close to each other, and the U-shaped clamping parts are provided with a rubber pad on the side where they are close to each other.

[0014] The above components achieve the following effects: the inclined surface allows the U-shaped clip to be easily pushed and clamped onto the heat dissipation module, and the rubber pad prevents the heat dissipation module from deforming.

[0015] Preferably, the clamping part is a U-shaped clamp, wherein the U-shaped clamp has an annular groove in the middle.

[0016] The effect achieved by the above components is that the ring groove allows the U-shaped clamp to bend elastically in the middle.

[0017] Preferably, the clamping part is a U-shaped clamp, wherein the U-shaped clamp is cut off in the middle and the two U-shaped clamps are connected by an elastic element.

[0018] The effect achieved by the above components is that the elastic element can be a spring or a sheet, and the elastic force of the elastic element causes the clamping part of the U-shaped clamp to clamp onto the heat dissipation module.

[0019] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0020] 1. In this utility model, two heat dissipation modules are used to dissipate heat from the board. The two heat dissipation modules are fixed by a clamping part. The heat dissipation modules and the board directly exchange heat and spread it into the air, thereby quickly dissipating heat from the board.

[0021] 2. In this utility model, the heat sink is a copper plate. The thermal grease between the heat sink and the plate body can improve the heat exchange speed between the heat sink and the plate body. The thermal grease is a non-conductive product. The core processing module on the plate body generates heat during operation. The heat is transferred to the heat sink through the thermal grease. The surface of the heat sink is integrally formed with fins. The fins increase the contact area between the heat sink and the air, thereby improving the heat transfer effect of the heat sink.

[0022] 3. In this utility model, heat is transferred to the first clamping plate through thermally conductive silicone grease, and then external air is blown in by an air pump. The air flows in the copper pipe, and the copper pipe absorbs the heat on the first clamping plate and exchanges with the air to achieve the function of heat dissipation. Attached Figure Description

[0023] Figure 1 This utility model provides a three-dimensional structural diagram of the main body structure of a mobile phone motherboard;

[0024] Figure 2 This is a schematic diagram of the structure of the first embodiment of the present utility model;

[0025] Figure 3 This utility model Figure 2 Enlarged view of point A;

[0026] Figure 4 This is a schematic diagram of the structure of the second embodiment of the present utility model;

[0027] Figure 5 This utility model Figure 4 Enlarged view of point B;

[0028] Figure 6 This is a partial disassembly diagram of the heat dissipation module in the second embodiment of this utility model;

[0029] Figure 7 This utility model Figure 6 Enlarged view at point C;

[0030] Figure 8 This is a schematic diagram of the clamping part in the first embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of the clamping part in the third embodiment of the present invention;

[0032] Figure 10 This is a schematic diagram of the clamping part in the fourth embodiment of the present invention.

[0033] Legend: 1. Mainboard; 2. Board body; 3. Front camera; 4. Rear camera; 5. Vibration motor; 6. Charging module; 7. Core processing module; 8. Mounting part; 9. Heat dissipation module; 91. Heat sink; 92. Fin; 93. First clamping plate; 94. Second clamping plate; 95. Copper tube; 96. Triangular piece; 10. U-shaped clamp; 11. Rubber pad; 12. Inclined surface; 13. Annular groove; 14. Break; 15. Elastic element. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0035] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0036] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0037] Reference Figure 1 As shown: A mobile phone motherboard 1 includes a motherboard 1, which includes a board body 2. The board body 2 is functionally divided into upper and lower areas. The upper area is the core of the processing module, and the lower area is an area integrating charging, sound acquisition, sound playback, and haptic feedback. The upper and lower areas are electrically connected. The upper area of ​​the board body 2 is provided with a front camera 3, a rear camera 4, and a core processing module 7. A notch is formed on the edge of the board body 2, and the camera module is installed in the notch to form the front camera 3 and the rear camera 4. The camera module is detachably electrically connected to the board body 2. The lower area of ​​the board body 2 is provided with a vibration motor 5 and a charging module 6. The vibration motor part 5 is a notch on the edge of the plate 2, which is used to hold the vibration motor. The vibration motor and the plate 2 are detachably electrically connected. The empty part between the upper and lower areas is used to insert the battery. The battery is embedded in the plate 2 and is detachably electrically connected to the plate 2. The plate 2 is provided with a mounting part 8. When multiple mobile phone motherboards 1 need to be installed in the host, the peripheral components (front camera, rear camera, vibration motor and battery) on the mobile phone motherboard 1 are removed. An external DC power supply is used to power the motherboard 1, and then the motherboard 1 is connected to the input module on the motherboard 1 through a data cable (the motherboard 1 can be controlled by computer simulation software to perform calculations).

[0038] Example 1, such as Figure 2 , Figure 3 and Figure 8As shown, the heat dissipation module 9 includes a heat dissipation plate 91, the outline of which is consistent with the outline of the plate body 2. The heat dissipation plate 91 is attached to the surface of the plate body 2, and the gap between the heat dissipation plate 91 and the plate body 2 is filled with thermal grease. Fins 92 are evenly arranged on the side of the heat dissipation plate 91 away from the plate body 2. The fins 92 and the heat dissipation plate 91 are integrally formed. The clamping part is a U-shaped clamp 10. When the two heat dissipation plates 91 are clamped on the surface of the plate body 2 and the U-shaped clamp 10 is clamped on the surface of the two heat dissipation plates 91, the clamping parts of the U-shaped clamp 10 always maintain a tendency to move closer to each other. An inclined surface 12 is provided on the side of the clamping parts of the U-shaped clamp 10 that are close to each other, and a rubber pad 11 is provided on the side of the clamping parts of the U-shaped clamp 10 that are close to each other.

[0039] Working principle: The heat sink 91 is a copper plate. The thermal grease between the heat sink 91 and the plate 2 improves the heat exchange rate between them. The thermal grease is a non-conductive product. The core processing module 7 on the plate 2 generates heat during operation, which is transferred to the heat sink 91 through the thermal grease. The surface of the heat sink 91 has integrally formed fins 92, which increase the contact area between the heat sink 91 and the air, thereby improving the heat transfer effect of the heat sink 91 and dissipating the heat generated on the surface of the plate 2. (It should be noted that...) In conjunction with a fan to accelerate airflow, it can also be used with an air conditioner to lower the room temperature and with a fan to blow cool air onto the fins 92. The inclined surface 12 makes it easy to push the U-shaped clip 10 onto the heat dissipation module 9. The rubber pad 11 can prevent the heat dissipation module 9 from deforming. The U-shaped clip 10, made of elastic material (preferably elastic plastic TPE, or metal with an insulating layer on the surface, preferably steel sheet), can be pried open. Then, the clip is used to clamp the two heat dissipation plates 91 and clamp the heat dissipation plates 91 onto the surface of the plate body 2, thereby fixing the heat dissipation plates 91.

[0040] Example 2, as Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the heat dissipation module 9 includes a first clamping plate 93 and a second clamping plate 94. The first clamping plate 93 is attached to the surface of the plate body 2, and thermal grease is applied between the first clamping plate 93 and the plate body 2. A copper tube 95 is provided between the first clamping plate 93 and the second clamping plate 94. The copper tube 95 is fixed between the first clamping plate 93 and the second clamping plate 94 by a triangular piece 96. One end of the copper tube 95 is connected to the output end of the air pump.

[0041] Working principle: The first clamping plate 93 is a copper plate. The thermal grease between the first clamping plate 93 and the plate body 2 can improve the heat exchange speed between the first clamping plate 93 and the plate body 2. The thermal grease is a non-conductive product. The core processing module 7 on the plate body 2 generates heat during operation. The heat is transferred to the first clamping plate 93 through the thermal grease. Then, external air is blown in by an air pump. The air flows in the copper pipe 95 (which can be used with an air conditioner to generate cold air. The cold air is blown into the copper pipe by the air pump to remove the heat from the copper pipe 95). The copper pipe 95 absorbs the heat on the first clamping plate 93 and exchanges it with the air, thereby achieving rapid cooling (it should be noted that a water pump can also be used to deliver coolant to the copper pipe 95).

[0042] Example 3, based on Example 1, such as Figure 9 As shown, the clamping part is a U-shaped clamp 10, wherein an annular groove 13 is provided in the middle of the U-shaped clamp 10, and the annular groove 13 is provided to facilitate the elastic bending of the U-shaped clamp 10 in the middle.

[0043] Example 4, based on Example 1, such as Figure 10 As shown, the clamping part is a U-shaped clamp 10, wherein a break 14 is provided in the middle of the U-shaped clamp 10 to cut the U-shaped clamp 10. The two sections of the U-shaped clamp 10 are connected by an elastic element 15. The elastic element 15 can be a spring or a sheet. The elastic force of the elastic element 15 causes the clamping part of the U-shaped clamp 10 to clamp onto the heat dissipation module 9.

[0044] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mobile phone motherboard, comprising a motherboard (1), characterized in that: The motherboard (1) includes a board body (2), which is functionally divided into upper and lower areas. The upper area is the core of the processing module, and the lower area is the area integrating charging, sound acquisition, sound playback, and haptic feedback. The upper and lower areas are electrically connected. The upper area of ​​the board body (2) is provided with a front camera (3), a rear camera (4), and a core processing module (7). The camera module and the board body (2) are detachably electrically connected. The lower area of ​​the board body (2) is provided with a vibration motor (5) and a charging module (6). The vibration motor is held in place by a notch on the edge of the board body (2). The motor and the plate (2) are detachably electrically connected. The empty space between the upper and lower regions is used for the battery to be placed. The battery is embedded in the plate (2). The battery and the plate (2) are detachably electrically connected. The plate (2) is provided with a mounting part (8). Both sides of the plate (2) are provided with heat dissipation modules (9). The two heat dissipation modules (9) clamp the plate (2) and exchange heat with the plate (2) to absorb the heat dissipated by the plate (2). The surfaces of the two heat dissipation modules (9) are evenly provided with clamping parts, which clamp and fix the two heat dissipation modules (9) on the surface of the plate (2).

2. The mobile phone motherboard according to claim 1, characterized in that: The heat dissipation module (9) includes a heat dissipation plate (91), the outline of the heat dissipation plate (91) is consistent with the outline of the plate body (2), the heat dissipation plate (91) is attached to the surface of the plate body (2), the gap between the heat dissipation plate (91) and the plate body (2) is filled with thermal conductive silicone grease, and fins (92) are uniformly arranged on the side of the heat dissipation plate (91) away from the plate body (2), wherein the fins (92) and the heat dissipation plate (91) are integrally formed.

3. The mobile phone motherboard according to claim 1, characterized in that: The heat dissipation module (9) includes a first clamping plate (93) and a second clamping plate (94). The first clamping plate (93) is attached to the surface of the plate body (2), and thermal grease is applied between the first clamping plate (93) and the plate body (2). A copper tube (95) is provided between the first clamping plate (93) and the second clamping plate (94). The copper tube (95) is fixed between the first clamping plate (93) and the second clamping plate (94) by a triangular piece (96). One end of the copper tube (95) is connected to the output end of the air pump.

4. The mobile phone motherboard according to claim 1, characterized in that: The clamping part is a U-shaped clamp (10). When the two heat sinks (91) are clamped on the surface of the plate (2) and the U-shaped clamp (10) is clamped on the surface of the two heat sinks (91), the clamping part of the U-shaped clamp (10) always maintains a tendency to move closer to each other.

5. The mobile phone motherboard according to claim 4, characterized in that: The U-shaped clamp (10) has a sloping surface (12) on the side where the clamping parts are close to each other, and a rubber pad (11) is provided on the side where the clamping parts of the U-shaped clamp (10) are close to each other.

6. The mobile phone motherboard according to claim 1, characterized in that: The clamping part is a U-shaped clamp (10), wherein an annular groove (13) is provided in the middle of the U-shaped clamp (10).

7. The mobile phone motherboard according to claim 1, characterized in that: The clamping part is a U-shaped clamp (10), wherein a break (14) is provided in the middle of the U-shaped clamp (10) to cut the U-shaped clamp (10) into two sections, and the U-shaped clamp (10) is connected by an elastic member (15).

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