Sensor module, camera module and electronic device

Abstract

The application provides a sensor module, a camera module and an electronic device. The sensor module comprises a shell, a carrier, an image sensor, a driving assembly and a first buffer layer. The shell comprises a first shell and a second shell. The first shell and the second shell are opposite and jointly form a mounting space. The first shell has a light transmission hole communicating with the mounting space. The first shell has a first surface facing the mounting space and surrounding the light transmission hole. The carrier is located in the mounting space and movably connected to the second shell. At least part of the periphery of the carrier is opposite and spaced apart from the first surface. The first buffer layer covers at least part of the first surface. The image sensor is fixed to the carrier. The driving assembly drives the carrier to drive the image sensor to move relative to the first shell. The application provides the first buffer layer on the inner surface of the shell to provide buffer for the collision between the carrier and the shell, thereby reducing the risk of collision debris, and further reducing the risk of POD and POG.

Description

Technical Field

[0001] This application relates to the field of imaging equipment technology, specifically to a sensor module, a camera module, and an electronic device. Background Technology

[0002] With the development of technology, more and more camera modules have adopted optical image stabilization design to improve shooting stability. For example, optical image stabilization is achieved by using a motor to drive the image sensor to shift and rotate.

[0003] However, the image sensor carrier is at risk of collision with other components during movement. The debris generated by the collision increases the risk of sensor smudges (Particle On Die, POD) and lens smudges (Particle On Glass, POD). Utility Model Content

[0004] This application provides a sensor module, a camera module, and an electronic device. The sensor module includes a housing, a carrier, an image sensor, a driving component, and a first buffer layer. The driving component is used to drive the carrier to move the image sensor relative to the housing. By providing a first buffer layer on the inner surface of the housing, a buffer is provided for collisions between the carrier and the housing, thereby reducing the risk of debris generation from collisions and thus reducing the risks of POD and POG.

[0005] In a first aspect, this application provides a sensor module. The sensor module includes a housing, a carrier, an image sensor, a driving component, and a first buffer layer; the housing includes a first shell and a second shell, which are opposite to each other and together form an installation space. The first shell has a light-transmitting hole communicating with the installation space and a first surface facing the installation space and surrounding the light-transmitting hole; the carrier is located in the installation space and is movably connected to the second shell. At least a portion of the periphery of the carrier is directly opposite to and spaced apart from the first surface, and the first buffer layer covers at least a portion of the first surface; the image sensor is fixed to the carrier, and the driving component drives the carrier to move the image sensor relative to the first shell.

[0006] In this application, since the first buffer layer covers at least a portion of the first surface, when the carrier moves toward the first shell and collides, the first buffer layer can provide buffering for the collision between the first shell and the carrier. This not only reduces the risk of collision debris, thereby reducing the risk of POD and POG, but also reduces the risk of deformation of the first shell and the carrier, thereby improving the service life of the carrier and the first shell and improving the overall structural stability.

[0007] In some possible implementations, the first buffer layer extends circumferentially along the light-transmitting hole, which helps the first buffer layer cover the area of ​​the first surface that is at risk of being impacted by the carrier. This allows the first buffer layer to better buffer the impact between the carrier and the first surface, thereby reducing the risk of POG and POD.

[0008] In some possible implementations, the first buffer layer is spaced apart from the inner wall of the light-transmitting hole. In other words, there can be a gap between the first buffer layer and the light-transmitting hole, which helps to reduce the process difficulty of injection molding the first buffer layer onto the first surface.

[0009] In some other possible implementations, the first buffer layer also covers at least a portion of the inner wall of the light-transmitting hole to achieve a rim design for the inner wall of the light-transmitting hole in the first shell. This not only expands the coverage area of ​​the first buffer layer and further improves the buffer protection area, but also reduces the difficulty of the injection molding process of the first buffer layer, eliminating the need for precise control of the gap between the first buffer layer and the inner wall of the light-transmitting hole.

[0010] In some possible implementations, the first buffer layer is continuous as a whole, which is beneficial for injection molding through a one-piece injection molding process, and allows the first buffer layer to cover a larger area on the first surface, providing full-coverage buffer protection.

[0011] In some other possible implementations, the first buffer layer includes multiple sections spaced apart, which can reduce costs.

[0012] The first buffer layer can be distributed in multiple parts in areas of the first surface that are at high risk of impact, so as to achieve targeted design and thus balance cost and buffer protection effect.

[0013] In some possible implementations, the first buffer layer is made of silicone.

[0014] In this implementation, since the first buffer layer can be made of elastic materials such as silicone or plastic, it can further buffer the collision between the first shell and the carrier, thereby reducing the impact buffer and reducing the risk of collision debris and collision deformation.

[0015] In some possible implementations, the first buffer layer is integrally injection molded onto the first surface.

[0016] In this implementation, since the first buffer layer can be integrally injection molded onto the first surface, the connection stability between the first buffer layer and the first surface is high, and the two can be regarded as an integral structure. Thus, when the first buffer layer provides buffering for the collision between the carrier and the first shell, the risk of the first buffer layer loosening and falling off can be reduced, so that the first buffer layer can better provide a stable buffering effect for the collision between the carrier and the first shell.

[0017] In some possible implementations, the sensor module also includes a first dust-collecting layer that covers at least a portion of the first buffer layer and is used to adsorb dust particles and debris.

[0018] In this implementation, while providing a first buffer layer to buffer the impact between the carrier and the first surface, a first dust-catching layer is further provided. This can capture and adsorb dust particles, debris and other particles generated by the impact between the carrier and the first shell, thereby further reducing the risks of POD and POG.

[0019] In some possible implementations, the distance between the first dust-collecting layer and the light-transmitting hole is greater than or equal to the distance between the first buffer layer and the light-transmitting hole. In other words, the inner edge of the first dust-collecting layer does not exceed the inner edge of the first buffer layer. This design ensures that the dust particles and debris adsorbed by the first dust-collecting layer do not exceed the inner edge of the first buffer layer, thereby reducing the risk of the dust particles and debris adsorbed by the first dust-collecting layer falling toward the light-transmitting hole and reducing the risk of POD and POG.

[0020] In some possible implementations, the first dust-collecting layer is a dust-collecting adhesive, so that the first dust-collecting layer can capture dust particles and debris through electrostatic adsorption and adhesion, thereby improving the ability to adsorb dust particles and debris and helping to reduce the risks of POD and POG.

[0021] In some possible implementations, the surface of the first dust-collecting layer facing the carrier is provided with protrusions and / or grooves. In other words, the surface of the first dust-collecting layer facing away from the first buffer layer can be provided with microstructures to form tiny protrusions and grooves. Such a design can further improve the adsorption strength of the first dust-collecting layer for dust particles and debris, thereby reducing the risk of dust particles and debris adsorbed by the first dust-collecting layer falling toward the light-transmitting hole, so as to reduce the risk of POD and POG.

[0022] In some possible implementations, the sensor module further includes a circuit assembly and a second dust-collecting layer; the circuit assembly includes a first circuit board, which is fixedly mounted on the housing and stacked with the image sensor. The first circuit board includes a first outer frame and multiple suspension wires, which are disposed inside the first outer frame and connected to the first outer frame, and are electrically connected to the image sensor; the second dust-collecting layer is disposed on the surface of the first outer frame facing the image sensor, and is used to adsorb dust particles and debris.

[0023] In this implementation, the second dust-collecting layer reduces the risks of POD and POG by mitigating dust particles and debris generated from the movement of the carrier caused by the first support and its collisions or scrapes with other structures. The second dust-collecting layer can be placed on the surface of the first outer frame facing the image sensor, further preventing dust particles and debris from falling towards the image sensor and thus further reducing the risk of POD.

[0024] In some possible implementations, the circuit assembly also includes a second circuit board, one end of which is electrically connected to the first circuit board, and the other end of which extends outward toward the mounting space; a second dust-collecting layer is disposed on the side of the first outer frame close to the second circuit board. This arrangement is beneficial for the second dust-collecting layer to adsorb substrates, debris, etc. generated by collisions and scrapes between the first and second circuit boards.

[0025] The second dust-collecting layer can be a dust-collecting adhesive, so that the second dust-collecting layer can capture dust particles and debris through electrostatic adsorption and adhesion, thereby improving the ability to adsorb dust particles and debris and helping to reduce the risks of POD and POG.

[0026] In some possible implementations, the sensor module also includes a first damping layer that wraps around the suspension wire, which can improve the suspension wire's resistance to deformation and impact, thereby reducing the risk of deformation and improving the service life of the suspension wire.

[0027] In this implementation, by designing a first damping layer to wrap the suspension wire of the first circuit board, it is beneficial to improve the image sensor's anti-shake accuracy at different anti-shake angles and in various motion directions. Especially in large-angle anti-shake motion, the image sensor's anti-shake effect is well improved.

[0028] In some possible implementations, the first damping layer wraps around at least two adjacent suspension wires, thereby improving the deformation resistance and impact resistance of the at least two suspension wires wrapped by the first damping layer, thus reducing the risk of deformation of the at least two suspension wires and improving the service life of the suspension wires.

[0029] In some possible implementations, there are multiple first damping layers, which are set in different areas of the suspension wire. This design can improve the deformation resistance and impact resistance of multiple suspension wires in different areas, which is beneficial to reducing the deformation of multiple suspension wires in multiple areas of the first circuit board and improving the overall service life of the first circuit board.

[0030] In some possible implementations, the first damping layer is a damping adhesive. The first damping layer is elastic, so when the suspension wire is subjected to an external force, the first damping layer can resist the external force through its own elastic restoring force, thereby reducing the risk of the suspension wire deforming due to the external force.

[0031] In some possible implementations, the sensor module further includes a first bracket, a second bracket, a base, and a first rolling element. The first bracket is connected to the carrier and is farther away from the image sensor relative to the carrier. The second bracket is fixedly connected to the first bracket and movably connected to the second housing. The base is located between the first bracket and the second bracket and is fixed to the first housing and / or the second housing. The first rolling element is installed between the base and the first bracket.

[0032] In some possible implementations, the first rolling element includes at least three balls, which are not in a straight line.

[0033] In this implementation, since the first bracket is fixedly connected to the third circuit board and the image sensor is fixed to the third circuit board, the design of multiple ball bearings enables the first bracket to drive the image sensor to move relative to the base, that is, relative to the first shell, thereby achieving optical image stabilization.

[0034] In some possible implementations, the first support has a first groove, a second groove, and a third groove. The first groove, the second groove, and the third groove are all recessed on the surface of the first support facing the base and are not on the same straight line. The first rolling element includes multiple balls. The first groove contains m balls, the second groove contains n balls, and the third groove contains p balls. m, n, and p satisfy: m > n, m > p, |mnp| ≤ 2, m ≥ 2, n ≥ 1, and p ≥ 1.

[0035] In this implementation, the above design facilitates a consistent distribution of frictional force between the first support and the base at various points, ensuring that the coefficient of friction does not vary significantly during rolling, thus improving control stability. Specifically, the first support and the base have a first rolling frictional force at the first groove, and the sum of the rolling frictional forces at the second and third grooves constitutes a second rolling frictional force. The first and second rolling frictional forces can be the same or approximately the same, ensuring that the coefficient of friction between the first support and the base does not vary significantly during image sensor stabilization, thus improving the stability of the first support's movement relative to the base.

[0036] In this implementation, by allocating multiple balls in a specific manner, where m > n, m > p, |mnp| ≤ 2, m ≥ 2, n ≥ 1, and p ≥ 1, it is beneficial to improve the image sensor's anti-shake accuracy at different anti-shake angles and in various motion directions. In particular, the anti-shake effect of the image sensor is significantly improved in large-angle anti-shake motion.

[0037] In some possible implementations, the driving component includes a first driving member and a second driving member. The first driving member is used to drive the carrier to move relative to the base along a first direction, and the second driving member is used to drive the carrier to move relative to the base along a second direction and rotate about a third direction. The first direction intersects the second direction, and both the first and second directions are parallel to the photosensitive surface of the image sensor. The third direction is perpendicular to the photosensitive surface of the image sensor, thereby realizing the movement of the image sensor in three degrees of freedom, so as to achieve image stabilization design in three directions, which is beneficial to improving imaging stability.

[0038] In some possible implementations, the sensor module further includes a second magnetic component and a third magnet. The second magnetic component is mounted on a second bracket, and the third magnet is mounted on a second housing. The third magnet and the second magnetic component are positioned opposite each other, allowing the third magnet to magnetically attract the second magnetic component, thus establishing a connection between the second bracket and the second housing. When the driving force on the second bracket exceeds the magnetic force between the second magnetic component and the third magnet, the second bracket can move relative to the second housing. Simultaneously, the magnetic force between the second magnetic component and the third magnet provides a restoring force to the second bracket, allowing it to return to its original position after the driving force disappears. Therefore, the design of the third magnet and the second magnetic component enables a movable connection between the second bracket and the second housing.

[0039] In some possible implementations, the first shell may include a bottom wall, a first side wall, a second side wall, a third side wall, and a fourth side wall. The first, second, third, and fourth side walls are all connected to the periphery of the bottom wall and protrude from the same side of the bottom wall. The first, second, third, and fourth side walls are connected end to end in sequence. The first and third side walls are arranged opposite each other, and the second and fourth side walls are arranged opposite each other. The fourth side wall is inclined relative to the bottom wall in a direction away from the second side wall. The light-transmitting hole penetrates a portion of the bottom wall and a portion of the fourth side wall. The bottom wall has a C-shaped structure. The bottom wall has a first surface, and a first buffer layer is continuously disposed on the first surface, and the first buffer layer has a C-shaped structure.

[0040] In this implementation, since the bottom wall of the first shell has a C-shaped structure, the first surface also has a C-shaped structure. The first buffer layer can be designed to conform to the shape of the first surface and thus provide better buffer protection between the first surface and the carrier.

[0041] Secondly, this application provides a camera module. The camera module includes a first optical folding element, a lens group, and a sensor module as described in the first aspect. The first optical folding element, the lens group, and the sensor module are arranged sequentially at intervals along the optical path propagation direction. The first optical folding element is used to reflect light to the lens group and through the lens group to the image sensor in the sensor module.

[0042] In this application, by designing the sensor module, the risks of POD and POG caused by image sensor stabilization movement or external forces are reduced, thereby reducing imaging interference of the camera module and improving the imaging stability of the camera module.

[0043] Thirdly, this application provides an electronic device. The electronic device includes an image processor and a camera module as described in the second aspect. The image processor is communicatively connected to the camera module and is used to acquire image data from the camera module and process the image data.

[0044] In this application, the design of the sensor module reduces the risks of POD and POG, thereby improving the imaging stability of the camera module and enhancing the shooting experience of electronic devices. Attached Figure Description

[0045] Figure 1A This is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0046] Figure 1B yes Figure 1A A partially exploded structural diagram of the electronic device shown.

[0047] Figure 2 yes Figure 1A A schematic diagram of the structure of the electronic device shown in some embodiments after being cut along line AA;

[0048] Figure 3 yes Figure 2 The diagram shows the structural schematic of the sensor module in some embodiments of the camera module shown.

[0049] Figure 4 yes Figure 3 The diagram shown is a partial structural exploded view of the sensor module in some embodiments.

[0050] Figure 5A yes Figure 4 The diagram shows the structural schematic of the circuit components in the sensor module in some embodiments.

[0051] Figure 5B yes Figure 5A A schematic diagram of the circuit components shown from another perspective;

[0052] Figure 6A yes Figure 4 The diagram shows a structural schematic of an image sensor mounted on a carrier component in a sensor module in some embodiments.

[0053] Figure 6B yes Figure 6A A schematic diagram of the structure shown from another perspective;

[0054] Figure 7 yes Figure 6A The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0055] Figure 8 yes Figure 6A The diagram shows a partial structural schematic in some embodiments after the structure is cut open along line BB.

[0056] Figure 9A yes Figure 4The diagram shows the structure of the first moving part component in the sensor module in some embodiments;

[0057] Figure 9B yes Figure 9A A schematic diagram of the first moving part component shown from another perspective;

[0058] Figure 10 yes Figure 9A The diagram shown is a partial structural exploded view of the first moving part component in some embodiments.

[0059] Figure 11 yes Figure 5A The circuit components shown Figure 6A The structure shown and Figure 9A The diagram shows the assembly structure of the first moving part component in some embodiments;

[0060] Figure 12A yes Figure 11 The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0061] Figure 12B yes Figure 12A A schematic diagram of the structure shown from another perspective;

[0062] Figure 13 yes Figure 11 The diagram shows the structure after being cut along line CC in some embodiments;

[0063] Figure 14A yes Figure 11 The structural diagram shown is a cross-section along line D1-D1 in some embodiments.

[0064] Figure 14B yes Figure 11 The diagram shows the structure in some embodiments after being cut along line D2-D2.

[0065] Figure 15A yes Figure 4 The diagram shows a structural schematic of a sensor module in which a first buffer layer is provided in the first shell in some embodiments.

[0066] Figure 15B yes Figure 15A A schematic diagram of the structure shown from another perspective;

[0067] Figure 16 yes Figure 15A The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0068] Figure 17A yes Figure 4 The diagram shows a structural schematic of the stator assembly in some embodiments of the sensor module shown.

[0069] Figure 17B yes Figure 17A A schematic diagram of the stator assembly shown from another perspective;

[0070] Figure 18 yes Figure 17A The stator assembly shown is a partial structural exploded view in some embodiments.

[0071] Figure 19 yes Figure 11 The structure shown Figure 15A The structure shown and Figure 17A The diagram shows an assembly structure of the stator assembly in some embodiments;

[0072] Figure 20 yes Figure 19 The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0073] Figure 21A yes Figure 19 The diagram shows the structure in some embodiments after being cut along line E1-E1.

[0074] Figure 21B yes Figure 19 The structural diagram shown is a cross-section along line E2-E2 in some embodiments.

[0075] Figure 22 yes Figure 19 A schematic diagram of the structure shown from another perspective;

[0076] Figure 23 yes Figure 15A A schematic diagram of the structure shown from another perspective;

[0077] Figure 24A yes Figure 4 The diagram shows a sensor module in which the first shell has a first buffer layer in some other embodiments.

[0078] Figure 24B yes Figure 24A The diagram shown is a structural schematic of some embodiments after the structure is cut open along line GG.

[0079] Figure 25A yes Figure 23 The diagram shown illustrates a structure in some embodiments where a first dust-collecting layer is provided.

[0080] Figure 25B yes Figure 24A The diagram shown illustrates a structure in some embodiments where a first dust-collecting layer is provided.

[0081] Figure 26A yes Figure 5A A schematic diagram of the circuit components shown from another perspective;

[0082] Figure 26B yes Figure 26A The circuit component shown is a schematic diagram of a first damping layer in some embodiments.

[0083] Figure 27 yes Figure 20 A schematic diagram of the structure shown from another perspective;

[0084] Figure 28 yes Figure 19 The diagram shows the structure in some embodiments after being cut along line FF;

[0085] Figure 29A yes Figure 4 The diagram shows a structural schematic of the second moving part component in some embodiments of the sensor module shown.

[0086] Figure 29B yes Figure 29A The diagram shows the structure of the second moving part component from another perspective;

[0087] Figure 30A yes Figure 29B The diagram shown is a partial structural exploded view of the second moving part component in some embodiments.

[0088] Figure 30B yes Figure 29A The second moving part shown is cut along line HH and is a structural schematic diagram in some embodiments.

[0089] Figure 31 yes Figure 19 The structure shown is Figure 29A The diagram shows the assembly structure of the second moving part component in some embodiments;

[0090] Figure 32 yes Figure 31 The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0091] Figure 33A yes Figure 31 The diagram shows the structure after being cut along line I1-I1 in some embodiments.

[0092] Figure 33B yes Figure 31 The diagram shows the structure in some embodiments after being cut open along line I2-I2;

[0093] Figure 34A yes Figure 32 A schematic diagram of the structure shown from another perspective;

[0094] Figure 34B yes Figure 31 The diagram shows the structure after being cut along line JJ in some embodiments;

[0095] Figure 35 yes Figure 9A A schematic diagram of the first moving part component shown from another perspective;

[0096] Figure 36A yes Figure 4 The diagram shows a schematic representation of the mounting structure of the second housing in some embodiments of the sensor module shown.

[0097] Figure 36B yes Figure 36A A schematic diagram of the structure shown from another perspective;

[0098] Figure 37A yes Figure 36B The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0099] Figure 37B yes Figure 36A The diagram shows the structure after being cut along line KK in some embodiments;

[0100] Figure 38A yes Figure 3 The diagram shows a partial structural exploded view of the sensor module in some other embodiments;

[0101] Figure 38B yes Figure 3 The diagram shows the structure of the sensor module cut along line LL in some embodiments.

[0102] Figure 39 yes Figure 35 The diagram shows the distribution of the number of balls in the first moving part assembly in some other embodiments. Detailed Implementation

[0103] The embodiments of this application are described below with reference to the accompanying drawings.

[0104] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" refers to at least two.

[0105] The directional terms mentioned in the embodiments of this application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0106] In the embodiments of this application, the relative positional relationships mentioned, such as parallel, perpendicular, and aligned, are defined in relation to the current technological level, rather than being absolutely strict. Slight deviations are permissible; approximations of parallelism, perpendicularity, or alignment are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0107] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0108] Please refer to the following: Figure 1A and Figure 1B , Figure 1A This is a schematic diagram of the structure of the electronic device 1000 provided in some embodiments of this application; Figure 1B yes Figure 1A A partial exploded view of the electronic device 1000 shown.

[0109] In some embodiments, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, smart screen, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, or other devices with camera functions. Figure 1A In this embodiment, the electronic device 1000 is a mobile phone as an example for description. Of course, other types of electronic devices 1000 can also adopt a similar structure, which will not be described in detail below.

[0110] Understandable Figure 1A and Figure 1B The electronic device 1000 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1A and Figure 1B Due to limitations, electronic device 1000 may also include, compared to Figure 1A and Figure 1B More or fewer parts.

[0111] In some embodiments, the electronic device 1000 may include a camera module 2000, a screen 3000, and a housing 4000. The screen 3000 is used to display images, videos, etc. The screen 3000 may include a light-transmitting panel 3001 and a display screen 3002. The light-transmitting panel 3001 and the display screen 3002 are stacked and fixedly connected. The light-transmitting panel 3001 mainly serves to protect the display screen 3002 and prevent dust. The material of the light-transmitting panel 3001 includes, but is not limited to, glass. The display screen 3002 may be a flexible display screen or a rigid display screen. For example, the display screen 3002 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD) display screen, etc.

[0112] For example, the housing 4000 is used to protect the internal electronic components of the electronic device 1000. The housing 4000 may include a cover plate 4001, a frame 4002, and a camera trim 4003. The cover plate 4001 is located on the side of the display screen 3002 away from the light-transmitting panel 3001, and is stacked with the light-transmitting panel 3001 and the display screen 3002. The frame 4002 is fixed to the cover plate 4001. For example, the frame 4002 can be fixedly connected to the cover plate 4001 by adhesive. The frame 4002 may also be integrally formed with the cover plate 4001, that is, the frame 4002 and the cover plate 4001 are a single structure. The frame 4002 is located between the cover plate 4001 and the light-transmitting panel 3001. The light-transmitting panel 3001 can be fixed to the frame 4002 by adhesive. The light-transmitting panel 3001, the cover plate 4001, and the frame 4002 form an internal accommodating space for the electronic device 1000. The internal space accommodates the display screen 3002. The cover plate 4001 can be made of materials such as metal, plastic, or glass. The cover plate 4001 can be a single-material panel or a panel structure composed of multiple materials and panels. The cover plate 4001 has a mounting opening 4011, and the camera decorative piece 4003 covers and is fixed to the mounting opening 4011.

[0113] For example, camera module 2000 is used to capture photos / videos. For example, camera module 2000 is mounted within housing 4000, located within the internal accommodating space of electronic device 1000. Camera module 2000 can be used as a rear-facing camera. For example, the light-incident surface of camera module 2000 faces camera trim 4003. Camera trim 4003 is used to protect camera module 2000.

[0114] In some embodiments, the camera trim 4003 protrudes from the side of the cover plate 4001 away from the light-transmitting panel 3001. This increases the mounting space for the camera module 2000 in the thickness direction of the electronic device 1000. In other embodiments, the camera trim 4003 may be flush with the cover plate 4001 or recessed into the internal accommodating space of the electronic device 1000.

[0115] The camera decorative element 4003 has a light-transmitting area 4031. The light-transmitting area 4031 allows light from objects to enter the light-receiving surface of the camera module 2000. In some other embodiments, the electronic device 1000 may not include the camera decorative element 4003. In this case, the cover plate 4001 no longer has a mounting opening 4011, but the light-transmitting area 4031 is provided on the cover plate 4001, allowing light from objects to enter the light-receiving surface of the camera module 2000.

[0116] In some embodiments, the camera module 2000 can also be used as a front-facing camera. For example, the light-incident surface of the camera module 2000 faces the light-transmitting panel 3001. The display screen 3002 is provided with a light-path obstruction hole. This light-path obstruction hole allows light from the scene to pass through the light-transmitting panel 3001 and then enter the light-incident surface of the camera module 2000. In some embodiments, the electronic device 1000 may also include one or more other camera modules (not shown in the figures), which are not strictly limited in this application.

[0117] In some embodiments, such as Figure 1B As shown, the electronic device 1000 may further include a circuit board assembly 5000 and an image processor 6000. The circuit board assembly 5000 and the image processor 6000 are located within the internal accommodating space of the electronic device 1000. The image processor 6000 is fixed to and electrically connected to the circuit board assembly 5000. The image processor 6000 is communicatively connected to the camera module 2000. The image processor 6000 is used to acquire and process image data from the camera module 2000. The communication connection between the camera module 2000 and the image processor 6000 may include data transmission via electrical connections such as wiring, or data transmission via coupling. It is understood that the camera module 2000 and the image processor 6000 may also be connected via other methods capable of data transmission.

[0118] In some embodiments, the electronic device 1000 may further include an analog-to-digital converter (also known as an A / D converter, not shown in the figure). The analog-to-digital converter is connected between the camera module 2000 and the image processor 6000. The analog-to-digital converter is used to convert the signal generated by the camera module 2000 into a digital image signal and transmit it to the image processor 6000, whereby the image processor 6000 processes the digital image signal and finally displays the image or video on the screen 3000.

[0119] In some embodiments, the electronic device 1000 may further include a memory (not shown in the figure), which is communicatively connected to the image processor 6000. The image processor 6000 processes the digital image signal and then transmits the image to the memory, so that the image can be retrieved from the memory and displayed on the screen 3000 at any time when it is needed to view the image later. In some embodiments, the image processor 6000 may also compress the processed digital image signal before storing it in the memory to save memory space.

[0120] In some other embodiments, the electronic device 1000 may also exclude the screen 3000.

[0121] Understandable, Figure 1A and Figure 1BThe installation position of the camera module 2000 in the illustrated embodiment of the electronic device 1000 is merely illustrative, and this application does not strictly limit the installation position of the camera module 2000. In some other embodiments, the camera module 2000 may also be installed in other locations on the electronic device 1000, such as the upper center or upper right corner of the back of the electronic device 1000. In some other embodiments, the electronic device 1000 may include a terminal body and an auxiliary component that can rotate, move, or be detached relative to the terminal body, and the camera module 2000 may also be disposed on the auxiliary component.

[0122] Please refer to the following: Figures 1A to 2 , Figure 2 yes Figure 1A The diagram shows the structure of the electronic device 1000 after being cut along line AA in some embodiments.

[0123] In some embodiments, the camera module 2000 may include a first optical folding element 200, a lens group 300, a second optical folding element 400, and a sensor module 100. The first optical folding element 200, the lens group 300, the second optical folding element 400, and the sensor module 100 are arranged sequentially at intervals along the optical path propagation direction of the camera module 2000. Specifically, the first optical folding element 200 reflects light incident through the light-transmitting region 4031 to the lens group 300. After passing through the lens group 300, the light is incident on the second optical folding element 400 and reflected by the second optical folding element 400 to the sensor module 100 to achieve optical imaging.

[0124] For example, the first optical folding element 200 can be a prism or a mirror, as long as it can achieve optical path folding. It should be noted that optical path folding can be understood as achieving optical path folding by changing the direction of optical path propagation, thereby increasing the propagation distance of light in the camera module 2000, which is beneficial for achieving telephoto shooting.

[0125] For example, the lens group 300 may include a plurality of lenses, at least some of which may be movable along the optical axis to achieve optical zoom or optical focus, thereby improving the imaging effect.

[0126] For example, the second optical folding element 400 is a prism used to fold the optical path so that light can be incident perpendicularly onto the sensor module 100. This allows the sensor module 100 to be tilted relative to the optical axis of the lens group 300, which helps to reduce the thickness of the camera module 2000 and thus facilitates a thinner and lighter design for the electronic device 1000. The second optical folding element 400 can be a right-angle prism or an obtuse-angle prism.

[0127] For example, the sensor module 100 may include a motor 10 and an image sensor 20. The motor 10 can drive the image sensor 20 to move, thereby achieving optical image stabilization and improving the optical imaging effect.

[0128] In some other embodiments, the camera module 2000 may not include the second optical folding element 400, in which case the sensor module 100 adopts an upright design.

[0129] It should be noted that, Figure 2 The images shown are only schematic representations of some of the components included in the camera module 2000. The actual shape, size, location, and construction of these components are not subject to change. Figure 2 Due to limitations, the camera module 2000 can also include, compared to... Figure 2 More or fewer parts.

[0130] Please refer to the following: Figure 3 and Figure 4 , Figure 3 yes Figure 2 A schematic diagram of the sensor module 100 in some embodiments of the camera module 2000 shown; Figure 4 yes Figure 3 The sensor module 100 shown is partially exploded in some embodiments.

[0131] In some embodiments, the motor 10 may include a housing assembly 1, a carrier assembly 2, a circuit assembly 3, a first mover assembly 4, a stator assembly 5, and a second mover assembly 6. The housing assembly 1 may include a first housing 111 and a second housing 112, which are connected to form a housing 11. The carrier assembly 2 carries the image sensor 20. The circuit assembly 3 is used for external circuitry to provide power and transmit signals to the internal components of the motor 10. The stator assembly 5 drives the first mover assembly 4 and the second mover assembly 6 to move the image sensor 20, thereby achieving optical image stabilization.

[0132] For ease of description, a three-dimensional coordinate system is defined as follows: Figure 3 Taking the structure shown as an example, the length direction of the shell assembly 1 is defined as the first direction X, also known as the X-axis direction; the width direction of the shell assembly 1 is defined as the second direction Y, also known as the Y-axis direction; and the thickness direction of the shell assembly 1 is defined as the third direction Z, also known as the Z-axis direction. It should be noted that the definition of the coordinate system is only used to illustrate the relative orientation and attitude of the sensor module 100 and its internal structure. Understandably, in some other embodiments, other references may be used to define the coordinate system, which is not limited here.

[0133] Please refer to the following: Figures 4 to 5B , Figure 5A yes Figure 4A schematic diagram of the circuit component 3 in some embodiments of the sensor module 100 shown; Figure 5B yes Figure 5A The schematic diagram of circuit component 3 shown is viewed from another angle.

[0134] In some embodiments, circuit component 3 may include a first circuit board 31, a second circuit board 32, a first connector 33, and a second connector 34. The first circuit board 31 is connected to the second circuit board 32, the first connector 33 is mounted on the first circuit board 31, and the second connector 34 is mounted on the second circuit board 32.

[0135] For example, the first circuit board 31 may include a first outer frame 311 and a plurality of suspension wires 312. The plurality of suspension wires 312 are disposed on the inner side of the first outer frame 311 and connected to the first outer frame 311. The first connector 33 is located on the inner side of the first outer frame 311 and is connected to the plurality of suspension wires 312.

[0136] The first connector 33 has a first electrical connection area 331 on one side surface.

[0137] For example, one end of the second circuit board 32 can be electrically connected to the first circuit board 31, and the other end of the second circuit board 32 extends outward. The second connector 34 can be installed at the end of the second circuit board 32 away from the first circuit board 31 for connecting external circuits, thereby enabling external circuits to connect to the first connector 33.

[0138] Please refer to the following: Figures 6A to 8 , Figure 6A yes Figure 4 The image sensor 20 is mounted on the carrier component 2 in the sensor module 100 shown in some embodiments. Figure 6B yes Figure 6A A schematic diagram of the structure shown from another perspective; Figure 7 yes Figure 6A The diagram shown is a partial structural breakdown of the structure in some embodiments. Figure 8 yes Figure 6A The diagram shows a partial structural schematic of the structure shown in some embodiments after being cut along line BB.

[0139] In some embodiments, the carrier component 2 may include a carrier 21 and a third circuit board 22, the image sensor 20 may be fixed to the third circuit board 22, and the third circuit board 22 may be fixed to the carrier 21.

[0140] For example, the carrier 21 may include a first mounting hole 211, the axis of which may be parallel to a third direction Z. The image sensor 20 may be located within the first mounting hole 211 and exposed through it. The photosensitive surface 201 of the image sensor 20 is located within the first mounting hole 211; in other words, the photosensitive surface 201 of the image sensor 20 is lower than that of the carrier 21 compared to the third circuit board 22.

[0141] In this embodiment, light can be incident on the photosensitive surface 201 of the image sensor 20 through the first mounting hole 211, thereby achieving optical imaging. The photosensitive surface 201 of the image sensor 20 is located within the first mounting hole 211, so that the carrier 21 can provide protection for the image sensor 20.

[0142] The third circuit board 22 may have a second electrical connection area 221 on the side opposite to the image sensor 20.

[0143] The third circuit board 22 may have a first fixing hole 222 and a second fixing hole 223, the axes of which are parallel to the third direction Z. The first fixing hole 222 and the second fixing hole 223 are spaced apart and are also spaced apart from the second electrical connection area 221.

[0144] Please refer to the following: Figures 9A to 10 , Figure 9A yes Figure 4 A schematic diagram of the structure of the first moving part component 4 in some embodiments of the sensor module 100 shown; Figure 9B yes Figure 9A The diagram shows the structure of the first moving part component 4 from another perspective; Figure 10 yes Figure 9A The diagram shown is a partial structural exploded view of the first moving component 4 in some embodiments.

[0145] In some embodiments, the first moving part assembly 4 may include a first support 41, a first magnet 42, a first magnetic element 43, a first rolling element 44, and a detection magnet 45.

[0146] For example, the first bracket 41 may include a base plate 411, a first side plate 412, and a second side plate 413. The first side plate 412 and the second side plate 413 are fixed to opposite sides of the base plate 411 and protrude from the same side of the base plate 411. The end face of the first side plate 412 facing away from the base plate 411 may be provided with a first connecting post 414, and the end face of the second side plate 413 facing away from the base plate 411 may be provided with a second connecting post 415. The base plate 411 may have a first surface 4111 and a second surface 4112 arranged opposite to each other. The first surface 4111 is located on the side of the first side plate 412 and the second side plate 413 that protrudes from the base plate 411.

[0147] The base plate 411 may have a first groove 4113, a second groove 4114, and a third groove 4115. The first groove 4113, the second groove 4114, and the third groove 4115 are not on the same straight line and are all recessed into the first surface 4111. The first rolling element 44 may include a plurality of balls 441, and one or more balls 441 may be provided in each of the first groove 4113, the second groove 4114, and the third groove 4115.

[0148] For example, the base plate 411 may have a fourth groove 4116, which is recessed in the first surface 4111. The first magnet 42 and the first magnetic element 43 may both be installed in the fourth groove 4116, and the first magnetic element 43 is located between the first magnet 42 and the bottom wall of the fourth groove 4116.

[0149] Among them, the first groove 4113, the second groove 4114 and the third groove 4115 can be arranged on both sides of the fourth groove 4116.

[0150] For example, the detection magnet 45 can be mounted on the first surface 4111.

[0151] For example, the base plate 411 may be provided with a first connecting block 416 and a second connecting block 417. The first connecting block 416 and the second connecting block 417 may both protrude from the second surface 4112, and the first connecting block 416 and the second connecting block 417 are spaced apart.

[0152] Please refer to the following: Figures 11 to 12B , Figure 11 yes Figure 5A Circuit component 3 shown Figure 6A The structure shown and Figure 9A The diagram shows the assembly structure of the first moving part component 4 in some embodiments; Figure 12A yes Figure 11 The diagram shown is a partial structural breakdown of the structure in some embodiments. Figure 12B yes Figure 12A The diagram shows the structure from another perspective.

[0153] In some embodiments, the first moving part assembly 4 and the carrier assembly 2 may be located on opposite sides of the circuit assembly 3. The second electrical connection area 221 of the third circuit board 22 in the carrier assembly 2 faces the circuit assembly 3. The first electrical connection area 331 of the first connector 33 in the circuit assembly 3 faces the carrier assembly 2. The second surface 4112 of the first support 41 in the first moving part assembly 4 faces the carrier assembly 2, so that the first connecting block 416 and the second connecting block 417 can face the carrier assembly 2.

[0154] Please refer to the following: Figures 13 to 14B , Figure 13 yes Figure 11The diagram shows the structure in some embodiments after being cut along line CC. Figure 14A yes Figure 11 The diagram shows the structure after being cut along line D1-D1 in some embodiments. Figure 14B yes Figure 11 The diagram shows the structure after being cut along line D2-D2 in some embodiments.

[0155] In some embodiments, the second electrical connection area 221 of the third circuit board 22 in the carrier component 2 can be electrically connected to the first electrical connection area 331 of the first connector 33 in the circuit component 3, so that the image sensor 20 can be connected to the external circuit in sequence through the third circuit board 22, the first connector 33, the first circuit board 31, the second circuit board 32 and the second connector 34, thereby receiving external control signals or transmitting signals to the outside.

[0156] In some embodiments, a portion of the first connecting block 416 of the first bracket 41 can pass through the first circuit board 31 and be connected to the first fixing hole 222, and a portion of the second connecting block 417 of the first bracket 41 can pass through the first circuit board 31 and be connected to the second fixing hole 223, so that the first bracket 41 can be fixedly connected to the third circuit board 22, thereby enabling the first bracket 41 to drive the third circuit board 22, the carrier 21 and the image sensor 20 to move together relative to the circuit assembly 3.

[0157] It should be noted that a gap is provided between the multiple suspension wires 312 in the first circuit board 31, which allows the first connecting block 416 and the second connecting block 417 to pass through the first circuit board 31 and provides space for the first connecting block 416 and the second connecting block 417 to move.

[0158] Please refer to the following: Figures 15A to 16 , Figure 15A yes Figure 4 The diagram shows a schematic of the structure of the first shell 111 of the sensor module 100, in some embodiments of which a first buffer layer 12 is provided; Figure 15B yes Figure 15A A schematic diagram of the structure shown from another perspective; Figure 16 yes Figure 15A The diagram shown is a partial structural breakdown of the structure in some embodiments.

[0159] In some embodiments, the first shell 111 may include a bottom wall 1111, a first side wall 1112, a second side wall 1113, a third side wall 1114, and a fourth side wall 1115. The first side wall 1112, second side wall 1113, third side wall 1114, and fourth side wall 1115 are all connected to the periphery of the bottom wall 1111 and protrude from the same side of the bottom wall 1111. The first side wall 1112, second side wall 1113, third side wall 1114, and fourth side wall 1115 are connected end-to-end in sequence. The first side wall 1112 and third side wall 1114 are arranged opposite each other along a first direction X, and the second side wall 1113 and fourth side wall 1115 are arranged opposite each other along a second direction Y. The first shell 111 may have a light-transmitting hole 1116, which can penetrate the first shell 111 along a third direction Z.

[0160] For example, the fourth sidewall 1115 may be inclined relative to the bottom wall 1111 in a direction away from the second sidewall 1113, and the light-transmitting hole 1116 may penetrate a portion of the bottom wall 1111 and a portion of the fourth sidewall 1115, so that the bottom wall 1111 presents a C-shaped structure.

[0161] The bottom wall 1111 has a first surface 1117 facing the space enclosed by the bottom wall 1111 and the side wall, and the first buffer layer 12 can cover at least a portion of the first surface 1117.

[0162] The first buffer layer 12 can be made of elastic materials such as silicone or plastic.

[0163] The first buffer layer 12 can be integrally injection molded onto the first surface 1117 to improve the connection stability between the first buffer layer 12 and the first surface 1117.

[0164] In some embodiments, the first shell 111 may include a first skeleton 111a and a first injection-molded structure 111b. The first shell 111 can be obtained by integral injection molding based on the first skeleton 111a, wherein the injection-molded structure that encloses at least part of the first skeleton 111a forms the first injection-molded structure 111b. This design is beneficial to the fabrication and structural stability of the first shell 111.

[0165] Please refer to the following: Figures 17A to 18 , Figure 17A yes Figure 4 A schematic diagram of the stator assembly 5 in some embodiments of the sensor module 100 shown; Figure 17B yes Figure 17A A schematic diagram of the stator assembly 5 from another perspective; Figure 18 yes Figure 17A The stator assembly 5 shown is a partial structural exploded view in some embodiments.

[0166] In some embodiments, the stator assembly 5 may include a base 51, a fourth circuit board 52, a first coil 53, a second coil 54, a third coil 55, a fourth coil 56, a first position sensor 57, a second position sensor 58, and a third position sensor 59. The fourth circuit board 52 may be fixed to the base 51, and the first coil 53, second coil 54, third coil 55, fourth coil 56, first position sensor 57, second position sensor 58, and third position sensor 59 may be mounted on the fourth circuit board 52.

[0167] For example, the base 51 may have a second mounting hole 511 that extends through the base 51 in a third direction Z. The fourth circuit board 52 may cover the second mounting hole 511.

[0168] The fourth circuit board 52 may have a first mounting surface 521 and a second mounting surface 522 disposed opposite to each other. The first coil 53 and the first position sensor 57 may be mounted on the first mounting surface 521. The second coil 54, the third coil 55, the fourth coil 56, the second position sensor 58, and the third position sensor 59 may be mounted on the second mounting surface 522.

[0169] The first coil 53 may include one or more first sub-coils. The first coil 53 may include a long side and a short side, and the extension direction of the long side of the first coil 53 may be parallel to the second direction Y. When the first coil 53 includes multiple first sub-coils, the multiple first sub-coils may be arranged in the second direction Y.

[0170] The second coil 54 may include a long side and a short side, and the extension direction of the long side of the second coil 54 may be parallel to the first direction X.

[0171] The third coil 55 and the fourth coil 56 can be located on both sides of the second coil 54, and the third coil 55, the second coil 54 and the fourth coil 56 can be arranged in the first direction X.

[0172] Please refer to the following: Figures 19 to 21B , Figure 19 yes Figure 11 The structure shown Figure 15A The structure shown and Figure 17A The diagram shows the assembly structure of stator assembly 5 in some embodiments; Figure 20 yes Figure 19 The diagram shown is a partial structural breakdown of the structure in some embodiments. Figure 21A yes Figure 19 The diagram shows the structure after being cut along line E1-E1 in some embodiments. Figure 21B yes Figure 19 The diagram shows the structure after being cut along line E2-E2 in some embodiments.

[0173] In some embodiments, the first shell 111 and the base 51 can be fixed to opposite sides of the first circuit board 31, and a first space 1131 can be formed between the first shell 111 and the base 51. The image sensor 20, the carrier component 2 and the first moving component 4 can be located in the first space 1131.

[0174] For example, multiple balls 441 are installed between the first bracket 41 and the base 51, such that all balls 441 abut against the first bracket 41 and the base 51, thereby enabling the first bracket 41 to move relative to the base 51 via the multiple balls 441. Since the first bracket 41 is fixedly connected to the third circuit board 22, and the image sensor 20 is fixed to the third circuit board 22, the design of multiple balls 441 enables the first bracket 41 to drive the image sensor 20 to move relative to the base 51, that is, relative to the first housing 111, thereby achieving optical image stabilization.

[0175] For example, at least a portion of the periphery of the carrier 21 is directly opposite to and spaced apart from the first surface 1117.

[0176] For example, the first circuit board 31 is fixedly mounted on the housing 11. Specifically, the first circuit board 31 is fixed between the first housing 111 and the base 51. The first circuit board 31 and the image sensor 20 are stacked together. A plurality of suspension wires 312 are electrically connected to the image sensor 20. The other end of the second circuit board 32 extends outward toward the first space 1131 to connect to an external circuit through the second connector 34.

[0177] Please refer to the following: Figures 21A to 22 , Figure 22 yes Figure 19 The diagram shows the structure from another perspective.

[0178] Since the first shell 111 is fixedly connected to the base 51, the circuit assembly 3 is fixedly installed between the first shell 111 and the base 51 via the second circuit board 32. In other words, the first shell 111, the base 51, and the circuit assembly 3 are fixed components.

[0179] The image sensor 20 and the carrier 21 are fixed together to the third circuit board 22. The first bracket 41 is fixedly connected to the third circuit board 22 through the first connecting block 416 and the second connecting block 417, and the first bracket 41 abuts against the base 51 through multiple balls 441 of the first rolling element 44. In other words, the image sensor 20, the carrier 21, the third circuit board 22 and the first bracket 41 are moving parts and can move relative to the first shell 111, the base 51 and the circuit assembly 3.

[0180] Specifically, please refer to Figure 22The motion diagram shows that the image sensor 20 and the carrier 21 can move together relative to the first housing 111 along a first direction X, and / or along a second direction Y, and / or rotate around a third direction Z. The first direction X and the second direction Y intersect and are both parallel to the photosensitive surface 201 of the image sensor 20, while the third direction Z is perpendicular to the photosensitive surface 201 of the image sensor 20. Thus, the image sensor 20 can achieve optical image stabilization by moving relative to the first housing 111.

[0181] Since at least a portion of the periphery of the carrier 21 is directly opposite to and spaced apart from the first surface 1117, and the carrier 21 is able to move relative to the first shell 111, there is a risk of collision with the first surface 1117 of the first shell 111 when the movement of the carrier 21 deviates. The debris generated by the collision leads to an increase in POD risk and POG risk.

[0182] It should be noted that the collision between the carrier 21 and the first surface 1117 may be caused by external forces affecting the sensor module 100, such as falling or being subjected to violent shaking. The collision between the carrier 21 and the first surface 1117 may also be caused by motion deviations during the anti-shake motion, such as problems with the anti-shake drive design or unstable rolling between the moving and stationary parts.

[0183] Since the third circuit board 22 and the first support 41 are located on opposite sides of the first circuit board 31, and the first support 41 is fixedly connected to the third circuit board 22 through the first connecting block 416 and the second connecting block 417, when the carrier 21 and the third circuit board 22 move together, there will be impacts and scrapes between the third circuit board 22 and the first circuit board 31, and between the first support 41 and the first circuit board 31. At the same time, the connection between the first circuit board 31 and the second circuit board 32 will also be impacted and scraped. This will not only generate debris and dust particles at the first circuit board 31, but also cause the suspension wire 312 in the first circuit board 31 to deform.

[0184] Please refer to the following: Figure 8 , Figure 22 and Figure 23 , Figure 23 yes Figure 15A The diagram shows the structure from another perspective.

[0185] In this embodiment, since the first buffer layer 12 covers at least a portion of the first surface 1117, when the carrier 21 moves toward the first shell 111 and collides, the first buffer layer 12 can provide buffer for the collision between the first shell 111 and the carrier 21. This not only reduces the risk of collision debris, thereby reducing the risk of POD and POG, but also reduces the risk of deformation of the first shell 111 and the carrier 21, thereby improving the service life of the carrier 21 and the first shell 111 and improving the overall structural stability.

[0186] In this embodiment, since the first buffer layer 12 can be made of elastic materials such as silicone or plastic, it can further provide buffering for the collision between the first shell 111 and the carrier 21, thereby reducing impact buffering and reducing the risk of collision debris and collision deformation.

[0187] In this embodiment, since the first buffer layer 12 can be integrally injection molded onto the first surface 1117, the connection stability between the first buffer layer 12 and the first surface 1117 is high, and the two can be regarded as an integral structure. Thus, when the first buffer layer 12 provides buffering for the collision between the carrier 21 and the first shell 111, the risk of the first buffer layer 12 loosening and falling off can be reduced, so that the first buffer layer 12 can better provide a stable buffering effect for the collision between the carrier 21 and the first shell 111.

[0188] Please refer to the following: Figures 23 to 24B , Figure 24A yes Figure 4 The schematic diagram of the sensor module 100 shown is provided with a first buffer layer 12 in some other embodiments; Figure 24B yes Figure 24A The diagram shown is a schematic representation of the structure in some embodiments after being cut along line GG.

[0189] In some embodiments, the first buffer layer 12 may be provided to extend circumferentially along the light-transmitting hole 1116, which is beneficial for the first buffer layer 12 to cover the area of ​​the first surface 1117 that is at risk of being impacted by the carrier 21, thereby enabling the first buffer layer 12 to better provide buffering for the impact between the carrier 21 and the first surface 1117, so as to reduce the risk of POG and POD.

[0190] In some examples, the first buffer layer 12 can be continuous as a whole, which is beneficial for injection molding through a one-piece injection molding process, and allows the first buffer layer 12 to cover a larger area on the first surface 1117, providing full-coverage buffer protection.

[0191] Since the bottom wall 1111 of the first shell 111 has a C-shaped structure, the first surface 1117 has a C-shaped structure. The first buffer layer 12 can be designed to be C-shaped according to the first surface 1117, thereby providing better buffer protection between the first surface 1117 and the carrier 21.

[0192] In other examples, the first buffer layer 12 may include multiple sections spaced apart, which can reduce costs.

[0193] The first buffer layer 12 can be distributed in multiple parts in areas of the first surface 1117 that are at high risk of impact, so as to achieve targeted design and thus balance cost and buffer protection effect.

[0194] In some embodiments, please refer to Figure 23 The first buffer layer 12 can be spaced apart from the inner wall of the light-transmitting hole 1116. In other words, there can be a gap between the first buffer layer 12 and the light-transmitting hole 1116, which helps to reduce the process difficulty of injection molding the first buffer layer 12 onto the first surface 1117.

[0195] It should be noted that the gap between the first buffer layer 12 and the light-transmitting hole 1116 is a tiny gap, and its width can be adjusted adaptively according to the process and the buffer protection effect. It is not specifically limited here, as long as the first buffer layer 12 can provide effective buffer protection for the impact between the carrier 21 and the first shell 111, and reduce the risk of POD and POG.

[0196] In other embodiments, please refer to Figure 24A and Figure 24B The first buffer layer 12 can also cover at least a portion of the inner wall of the light-transmitting hole 1116 to achieve an edge-wrapping design for the inner wall of the light-transmitting hole 1116 in the first shell 111. This not only expands the coverage of the first buffer layer 12 and further improves the buffer protection area, but also reduces the injection molding process difficulty of the first buffer layer 12, eliminating the need for precise control of the gap between the first buffer layer 12 and the inner wall of the light-transmitting hole 1116.

[0197] Please refer to the following: Figure 25A and Figure 25B , Figure 25A yes Figure 23 The diagram shown is a schematic diagram of a structure in some embodiments in which a first dust-collecting layer 13 is provided; Figure 25B yes Figure 24A The diagram shown is a schematic diagram of a structure in some embodiments where a first dust-collecting layer 13 is provided.

[0198] In some embodiments, the shell assembly 1 may further include a first dust-collecting layer 13, which may cover at least a portion of the first buffer layer 12, and the first dust-collecting layer 13 is used to adsorb dust particles, debris, etc.

[0199] In this embodiment, while the first buffer layer 12 provides buffer protection for the impact between the carrier 21 and the first surface 1117, a first dust-catching layer 13 is further provided, which can capture and adsorb dust particles, debris and other particles generated by the impact between the carrier 21 and the first shell 111, thereby further reducing the risks of POD and POG.

[0200] For example, the distance between the first dust-collecting layer 13 and the light-transmitting hole 1116 can be greater than or equal to the distance between the first buffer layer 12 and the light-transmitting hole 1116. In other words, the inner edge of the first dust-collecting layer 13 does not exceed the inner edge of the first buffer layer 12. This design ensures that the dust particles and debris adsorbed by the first dust-collecting layer 13 do not exceed the inner edge of the first buffer layer 12, thereby reducing the risk of the dust particles and debris adsorbed by the first dust-collecting layer 13 falling toward the light-transmitting hole 1116 and reducing the risk of POD and POG.

[0201] The surface of the first dust-collecting layer 13 facing the carrier 21 may be provided with protrusions and / or grooves. In other words, the surface of the first dust-collecting layer 13 facing away from the first buffer layer 12 may be provided with microstructures to form tiny protrusions and grooves. This design can further improve the adsorption strength of the first dust-collecting layer 13 for dust particles and debris, thereby reducing the risk of dust particles and debris adsorbed by the first dust-collecting layer 13 falling toward the light-transmitting hole 1116, so as to reduce the risk of POD and POG.

[0202] The first dust-collecting layer 13 can be a dust-collecting adhesive, so that the first dust-collecting layer 13 can capture dust particles and debris through electrostatic adsorption and adhesion, thereby improving the ability to adsorb dust particles and debris and helping to reduce the risks of POD and POG.

[0203] Please refer to the following: Figure 22 , Figure 26A and Figure 26B , Figure 26A yes Figure 5A A schematic diagram of the circuit component 3 shown from another perspective; Figure 26B yes Figure 26A The circuit component 3 shown is a schematic diagram of a first damping layer 36 in some embodiments.

[0204] In some embodiments, the circuit assembly 3 may further include a second dust-collecting layer 35, which may be disposed on the first outer frame 311 and is used to adsorb dust particles, debris, etc.

[0205] In this embodiment, by setting the second dust-collecting layer 35, the dust particles and debris generated by the first support 41 driving the carrier 21 to move and colliding or scraping with other structures are reduced, thereby reducing the risk of POD and POG.

[0206] For example, the second dust-catching layer 35 can be disposed on the surface of the first outer frame 311 facing the image sensor 20, which can further prevent dust particles, debris and the like from falling toward the image sensor 20, thereby further reducing the risk of POD.

[0207] For example, the second dust-collecting layer 35 can be disposed on the side of the first outer frame 311 of the first circuit board 31 near the second circuit board 32. This arrangement is beneficial for the second dust-collecting layer 35 to adsorb substrates, debris, etc. generated by collisions and scrapes between the first circuit board 31 and the second circuit board 32.

[0208] It should be noted that in some other embodiments, the second dust-collecting layer 35 may also be disposed in other areas of the first circuit board 31. For example, the second dust-collecting layer 35 may also be disposed on the surface of the first outer frame 311 facing away from the image sensor 20, or on other sides of the first outer frame 311.

[0209] The second dust-collecting layer 35 can be a dust-collecting adhesive, so that the second dust-collecting layer 35 can capture dust particles and debris through electrostatic adsorption and adhesion, thereby improving the ability to adsorb dust particles and debris and helping to reduce the risks of POD and POG.

[0210] In some embodiments, the circuit component 3 may also include a first damping layer 36, which can wrap the suspension wire 312, thereby improving the suspension wire 312's resistance to deformation and impact, reducing the risk of deformation of the suspension wire 312, and improving the service life of the suspension wire 312.

[0211] For example, the first damping layer 36 can wrap around at least two adjacent suspension wires 312, thereby improving the deformation resistance and impact resistance of the at least two suspension wires 312 wrapped by the first damping layer 36, thereby reducing the deformation risk of the at least two suspension wires 312 and improving the service life of the suspension wires 312.

[0212] The number of first damping layers 36 can be multiple, and multiple first damping layers 36 are disposed in different areas of suspension wire 312. This design can improve the deformation resistance and impact resistance of multiple suspension wires 312 in different areas, which is conducive to reducing the deformation of multiple suspension wires 312 in multiple areas of the first circuit board 31 and improving the overall service life of the first circuit board 31.

[0213] It should be noted that the first damping layer 36 located in different regions can wrap different numbers of suspension wires 312, and the first damping layer 36 located in different regions can wrap different suspension wires 312, so that multiple first damping layers 36 can cooperate to further improve the protection effect on the suspension wires 312. Understandably, Figure 26BThe number and position of the first damping layer 36 shown are for illustrative purposes only. In other embodiments, the number of first damping layers 36 may be different, and the first damping layer 36 may be placed in other positions. This is not limited here.

[0214] The first damping layer 36 is a damping adhesive. The first damping layer 36 is elastic. Therefore, when the suspension wire 312 is subjected to an external force, the first damping layer 36 can resist the external force through its own elastic restoring force, thereby reducing the risk of deformation of the suspension wire 312 due to the external force.

[0215] Please refer to the following: Figure 22 , Figure 27 and Figure 28 , Figure 27 yes Figure 20 A schematic diagram of the structure shown from another perspective; Figure 28 yes Figure 19 The diagram shows the structure after being cut along line FF in some embodiments.

[0216] In some embodiments, the first coil 53 mounted on the base 51 may be arranged opposite to the first magnet 42 mounted on the first bracket 41. The first coil 53 and the first magnet 42 together constitute the first driving member. The first driving member is used to drive the first bracket 41 to move the carrier 21 and the image sensor 20 relative to the first shell 111 along the first direction X.

[0217] It should be noted that the first coil 53 and the first magnet 42 are arranged opposite each other, meaning that along the third direction Z, the orthographic projection of the first coil 53 on the first support 41 at least partially coincides with the first magnet 42.

[0218] For example, the first position sensor 57 mounted on the base 51 is arranged opposite to the detection magnet 45 mounted on the first bracket 41, so that the first position sensor 57 can detect the position change of the first bracket 41 relative to the base 51 by sensing the change in the magnetic field of the detection magnet 45, thereby realizing motion detection of the image sensor 20.

[0219] Please refer to the following: Figures 29A to 30B , Figure 29A yes Figure 4 A schematic diagram of the structure of the second moving part component 6 in some embodiments of the sensor module 100 shown; Figure 29B yes Figure 29A The diagram shows the structure of the second moving part 6 from another perspective; Figure 30A yes Figure 29B The diagram shown is a partial structural exploded view of the second moving part component 6 in some embodiments. Figure 30B yes Figure 29A The second moving component 6 shown is cut open along line HH, and its structure is illustrated in some embodiments.

[0220] In some embodiments, the second moving part assembly 6 may include a second bracket 61, a second magnet 62, and a second magnetic element 63. Both the second magnetic element 63 and the second magnet 62 are mounted on the second bracket 61.

[0221] For example, the second bracket 61 may have a mounting groove 611, and the second magnetic element 63 and the second magnet 62 may both be installed in the mounting groove 611 to improve the installation stability of the second magnetic element 63 and the second magnet 62.

[0222] The second magnetic component 63 can be installed between the second magnet 62 and the bottom wall of the mounting groove 611 to guide the magnetic field of the second magnet 62.

[0223] The second magnet 62 can be a Heilbeck magnet to increase the overall magnetic field strength of the second magnet 62.

[0224] The second support 61 may include a second skeleton 61a and a second injection-molded structure 61b. The second support 61 can be obtained by integral injection molding based on the second skeleton 61a, wherein the injection-molded structure that encloses at least part of the second skeleton 61a forms the second injection-molded structure 61b. This design is beneficial to the fabrication and structural stability of the second support 61.

[0225] Please refer to the following: Figures 31 to 33B , Figure 31 yes Figure 19 The structure shown is Figure 29A The diagram shows the assembly structure of the second moving part component 6 in some embodiments; Figure 32 yes Figure 31 The diagram shown is a partial structural breakdown of the structure in some embodiments. Figure 33A yes Figure 31 The diagram shows the structure in some embodiments after being cut along line I1-I1. Figure 33B yes Figure 31 The diagram shows the structure after being cut along line I2-I2 in some embodiments.

[0226] In some embodiments, the second support 61 may be fixedly connected to the first support 41 so that the second mover assembly 6 and the first mover assembly 4 can move together relative to the stator assembly 5.

[0227] For example, one end of the second bracket 61 can be fixedly connected to the first side plate 412 of the first bracket 41, and the other end of the second bracket 61 can be fixedly connected to the second side plate 413 of the first bracket 41, so as to realize the fixed connection between the first bracket 41 and the second bracket 61.

[0228] The second bracket 61 may have a first connecting hole 612 at one end and a second connecting hole 613 at the other end. The first connecting post 414 on the first side plate 412 of the first bracket 41 can be connected to the first connecting hole 612, and the second connecting post 415 on the second side plate 413 of the first bracket 41 can be connected to the second connecting hole 613, thereby improving the connection stability between the second bracket 61 and the first bracket 41.

[0229] However, it should be noted that the first bracket 41 and the second bracket 61 can also be connected by means of bonding, snap-fitting, magnetic connection, etc. The specific connection method is not limited here, as long as the two can form a fixed connection.

[0230] Please refer to the following: Figure 34A and Figure 34B , Figure 34A yes Figure 32 A schematic diagram of the structure shown from another perspective; Figure 34B yes Figure 31 The diagram shows the structure after being cut along line JJ in some embodiments.

[0231] In some embodiments, the second coil 54, the third coil 55, and the fourth coil 56 mounted on the base 51 can all be arranged opposite to the second magnet 62 mounted on the second bracket 61. The second coil 54, the third coil 55, and the fourth coil 56 can together with the second magnet 62 to form a second driving member. The second driving member is used to drive the second bracket 61 to move the first bracket 41, the carrier 21, and the image sensor 20 relative to the first shell 111 along the second direction Y and rotate around the third direction Z.

[0232] It should be noted that the second coil 54, the third coil 55 and the fourth coil 56 can be arranged opposite to the second magnet 62, which means that along the third direction Z, the orthogonal projections of the second coil 54, the third coil 55 and the fourth coil 56 on the second bracket 61 all at least partially coincide with the second magnet 62.

[0233] It should be noted that the second driving element and the first driving element can form a driving assembly to drive the motion of the image sensor 20, thereby achieving optical image stabilization.

[0234] For example, the second coil 54 and the second magnet 62 work together to drive the second bracket 61 to move the first bracket 41, the carrier 21 and the image sensor 20 relative to the first shell 111 along the second direction Y.

[0235] For example, the third coil 55, the fourth coil 56 and the second magnet 62 work together to drive the second bracket 61 to rotate the first bracket 41, the carrier 21 and the image sensor 20 relative to the first shell 111 around the third direction Z.

[0236] For example, the second position sensor 58 and the third position sensor 59 mounted on the base 51 can both be arranged opposite to the second magnet 62 mounted on the second bracket 61, so that the second position sensor 58 and the third position sensor 59 can detect the position change of the second bracket 61 relative to the base 51 by sensing the change in the magnetic field of the second magnet 62, thereby realizing motion detection of the image sensor 20.

[0237] The second position sensor 58 can be installed inside the annular structure of the third coil 55 to improve space utilization.

[0238] The third position sensor 59 can be installed inside the annular structure of the fourth coil 56 to improve space utilization.

[0239] Please refer to the following: Figure 34B and Figure 35 , Figure 35 yes Figure 9A The diagram shows the structure of the first moving component 4 from another perspective.

[0240] In some embodiments, the first rolling element 44 may be installed between the base 51 and the first support 41. The first rolling element 44 may include at least three balls 441, which are not on the same straight line, which is beneficial for the first support 41 to move relative to the base 51 through the first rolling element 44.

[0241] For example, the first slot 4113 of the first bracket 41 can be provided with m balls 441, the second slot 4114 can be provided with n balls 441, and the third slot 4115 can be provided with p balls 441, where m, n, and p satisfy: m > n, m > p. The first bracket 41 and the base 51 have a first rolling friction force at the first slot 4113, and the sum of the rolling friction forces of the first bracket 41 and the base 51 at the second slot 4114 and the third slot 4115 is the second rolling friction force. The first rolling friction force and the second rolling friction force can be the same or approximately the same, so that the coefficient of friction between the first bracket 41 and the base 51 will not change too much during the image sensor 20 stabilization process, which is beneficial to achieving the stability of the movement of the first bracket 41 relative to the base 51.

[0242] Where |mnp|≤2, m≥2, n≥1, p≥1, it is beneficial to achieve a consistent distribution of frictional force between the first support 41 and the base 51 at various points, thereby ensuring that the coefficient of friction will not vary too much during the rolling process, which is beneficial to the stability of control.

[0243] It should be noted that, Figure 35 The relative positions of the first groove 4113, the second groove 4114 and the third groove 4115, and the number of balls 441 contained in the first moving part 4 shown are only illustrative and do not limit the specific number of balls 441 contained in the first groove 4113, the second groove 4114 and the third groove 4115.

[0244] Please refer to the following: Figures 36A to 37B , Figure 36A yes Figure 4 A schematic diagram of the mounting structure of the second shell 112 in some embodiments of the sensor module 100 shown; Figure 36B yes Figure 36A A schematic diagram of the structure shown from another perspective; Figure 37A yes Figure 36B The diagram shown is a partial structural breakdown of the structure in some embodiments. Figure 37B yes Figure 36A The diagram shows the structure after being cut along line KK in some embodiments.

[0245] In some embodiments, the second shell 112 may include a first plate 1121, a second plate 1122, a third plate 1123, a fourth plate 1124, and a fifth plate 1125. The second plate 1122, the third plate 1123, the fourth plate 1124, and the fifth plate 1125 are all connected to the periphery of the first plate 1121 and protrude from the same side of the first plate 1121. The second plate 1122, the third plate 1123, the fourth plate 1124, and the fifth plate 1125 are sequentially connected end-to-end. The second plate 1122 and the fourth plate 1124 may be arranged opposite each other along a first direction X, and the third plate 1123 and the fifth plate 1125 may be arranged opposite each other along a second direction Y.

[0246] For example, the shell assembly 1 may also include a third magnet 14, a first cushioning pad 15 and a second cushioning pad 16. The third magnet 14 may be mounted on the first plate 1121, the first cushioning pad 15 may be mounted on the surface of the second plate 1122 facing the fourth plate 1124, and the second cushioning pad 16 may be mounted on the surface of the fourth plate 1124 facing the second plate 1122.

[0247] Please refer to the following: Figure 31 , Figure 38A and Figure 38B , Figure 38A yes Figure 3The sensor module 100 shown is partially exploded in some other embodiments; Figure 38B yes Figure 3 The sensor module 100 shown is cut along line LL and is a structural schematic diagram in some embodiments.

[0248] In some embodiments, the first housing 111 and the second housing 112 are opposite to each other and together form an installation space 113 to accommodate other devices. The base 51, the first housing 111, and the second housing 112 are fixedly connected, wherein the base 51 can be fixed to the first housing 111 and / or the second housing 112 for fixation. The base 51 divides the installation space 113 into a first space 1131 and a second space 1132. The first space 1131 is used to install the image sensor 20, the carrier assembly 2, and the first moving part assembly 4, and the second space 1132 is used to install the second moving part assembly 6.

[0249] For example, the second bracket 61 can be movably connected to the second housing 112. Specifically, the second magnetic element 63 mounted on the second bracket 61 can be positioned opposite the third magnet 14 mounted on the second housing 112, so that the third magnet 14 can magnetically attract the second magnetic element 63, thus forming a connection between the second bracket 61 and the second housing 112. When the driving force on the second bracket 61 is greater than the magnetic force between the second magnetic element 63 and the third magnet 14, the second bracket 61 can move relative to the second housing 112. At the same time, due to the presence of the magnetic force between the second magnetic element 63 and the third magnet 14, a restoring force can be provided to the second bracket 61, so that the second bracket 61 returns to its original position after the driving force disappears. Therefore, the design of the third magnet 14 and the second magnetic element 63 enables a movable connection between the second bracket 61 and the second housing 112.

[0250] For example, the first buffer pad 15 and the second buffer pad 16 on the second shell 112 can provide cushioning between the second support 61 and the second shell 112 to prevent excessive collisions between the second shell 112 and the second support 61.

[0251] Next, we will compare the image stabilization effects of different implementations.

[0252] Please refer to the following: Figure 26A , Figure 26B , Figure 35 and Figure 39 , Figure 39 yes Figure 35 The diagram shows the distribution of the number of balls 441 in the first moving part 4 in some other embodiments.

[0253] In some embodiments, please refer to Figure 26A The first circuit board 31 does not have a first damping layer 36 to wrap the suspension wire 312.

[0254] In other embodiments, please refer to Figure 26B A first damping layer 36 is provided on the first circuit board 31 to wrap multiple parts of the suspension wire 312.

[0255] In some embodiments, please refer to Figure 35 The number of first balls 441 in the first groove 4113 can be 3, and the number in the second groove 4114 and the third groove 4115 can both be 1.

[0256] In other embodiments, please refer to Figure 39 The number of balls 441 in the first groove 4113, the second groove 4114 and the third groove 4115 can all be 3.

[0257] Example 1, combined with Figure 26A and Figure 39 The first circuit board 31 does not have a first damping layer 36 to wrap the suspension wire 312, and the number of balls 441 in the first groove 4113, the second groove 4114 and the third groove 4115 are all 3.

[0258] Example 2, combined with Figure 26A and Figure 35 The first circuit board 31 does not have a first damping layer 36 to wrap the suspension wire 312. The number of first balls 441 in the first groove 4113 is 3, and the number in the second groove 4114 and the third groove 4115 is 1 each.

[0259] Example 3, combined with Figure 26B and Figure 35 The first circuit board 31 is provided with a first damping layer 36 to wrap multiple parts of the suspension wire 312. The number of first balls 441 in the first groove 4113 is 3, and the number in the second groove 4114 and the third groove 4115 is 1 each.

[0260] Example 4, combined with Figure 26B and Figure 39 The first circuit board 31 is provided with a first damping layer 36 to wrap multiple parts of the suspension wire 312, and the number of balls 441 in the first groove 4113, the second groove 4114 and the third groove 4115 is 3 each.

[0261] Example 5, combined with Figure 26A and Figure 39 The first circuit board 31 does not have a first damping layer 36 to wrap the suspension wire 312, and the number of balls 441 in the first groove 4113, the second groove 4114 and the third groove 4115 are all 3.

[0262] Example 6, combined with Figure 26A and Figure 35The first circuit board 31 does not have a first damping layer 36 to wrap the suspension wire 312. The number of first balls 441 in the first groove 4113 is 3, and the number in the second groove 4114 and the third groove 4115 is 1 each.

[0263] Example 7, combined with Figure 26B and Figure 35 The first circuit board 31 is provided with a first damping layer 36 to wrap multiple parts of the suspension wire 312. The number of first balls 441 in the first groove 4113 is 3, and the number in the second groove 4114 and the third groove 4115 is 1 each.

[0264] Example 8, combined with Figure 26B and Figure 39 The first circuit board 31 is provided with a first damping layer 36 to wrap multiple parts of the suspension wire 312, and the number of balls 441 in the first groove 4113, the second groove 4114 and the third groove 4115 is 3 each.

[0265] By performing anti-shake simulation calculations on the above embodiments, the motion error structure shown in Table 1 can be obtained.

[0266] Table 1. Comparison of motion errors in three directions for different embodiments.

[0267]

[0268] In Table 1 above, 0.7° indicates a stabilization angle of 0.7°. 0.7°X indicates that when the stabilization angle is 0.7°, the image sensor 20 moves along the first direction X. 0.7°Y indicates that when the stabilization angle is 0.7°, the image sensor 20 moves along the second direction Y. 0.7°R indicates that when the stabilization angle is 0.7°, the image sensor 20 rotates around the third direction Z.

[0269] 0.9° indicates that the image stabilization angle is 0.9°. 0.9°X indicates that when the image stabilization angle is 0.9°, the image sensor 20 moves along the first direction X. 0.9°Y indicates that when the image stabilization angle is 0.9°, the image sensor 20 moves along the second direction Y. 0.9°R indicates that when the image stabilization angle is 0.9°, the image sensor 20 rotates around the third direction Z.

[0270] 1.0° indicates that the image stabilization angle is 1.0°. 1.0°X indicates that when the image stabilization angle is 1.0°, the image sensor 20 moves along the first direction X. 1.0°Y indicates that when the image stabilization angle is 1.0°, the image sensor 20 moves along the second direction Y. 1.0°R indicates that when the image stabilization angle is 1.0°, the image sensor 20 rotates around the third direction Z.

[0271] The values ​​in Table 1 for different stabilization angles in each embodiment represent the mean error of the stabilization motion. The smaller the mean error, the better the stabilization effect.

[0272] Table 1 shows the first motion law and the second motion law, which represent different motion modes of the image sensor 20 during the image stabilization process. For example, the first motion law can be a circular following motion, and the second motion law can be a diagonal following motion.

[0273] By comparing Examples 1 and 2, Examples 3 and 4, Examples 5 and 6, and Examples 7 and 8 respectively, it can be concluded that when the ball 441 is in accordance with... Figure 35 When designing the embodiment shown, compared to ball bearing 441 according to Figure 39 The illustrated embodiment is designed to have smaller stabilization errors in most directions of motion at different stabilization angles, and the larger the stabilization angle, the better. Figure 35 The illustrated embodiment achieves a more significant improvement in image stabilization error. Therefore, according to Figure 35 The embodiment shown has a design that distributes multiple balls 441, which helps to reduce the image stabilization error of the image sensor 20 and facilitates large-angle image stabilization.

[0274] By comparing Embodiments 1 and 4, 2 and 3, 5 and 8, and 6 and 7 respectively, it can be concluded that when the first circuit board 31 is in accordance with... Figure 26B When the first damping layer 36 is provided in the embodiment shown, compared to Figure 26A In the embodiment shown, the first circuit board 31 does not have a first damping layer 36. Under different stabilization angles and in various motion directions, it generally exhibits smaller stabilization errors, and the larger the stabilization angle, the better. Figure 26B The illustrated embodiment achieves a more significant improvement in image stabilization error. Therefore, according to Figure 26B The embodiment shown features a first damping layer 36 wrapping the suspension wire 312, which helps reduce the image stabilization error of the image sensor 20 and facilitates large-angle image stabilization.

[0275] In summary, by allocating multiple balls 441 in this application, specifically m > n, m > p, |mnp| ≤ 2, m ≥ 2, n ≥ 1, p ≥ 1, it is beneficial to improve the anti-shake accuracy of the image sensor 20 under different anti-shake angles and in various motion directions. Especially in large-angle anti-shake motion, the anti-shake effect of the image sensor 20 is well improved.

[0276] In this application, by designing a first damping layer 36 to wrap the suspension wire 312 of the first circuit board 31, it is beneficial to improve the anti-shake accuracy of the image sensor 20 at different anti-shake angles and in various motion directions. Especially in large-angle anti-shake motion, the anti-shake effect of the image sensor 20 is well improved.

[0277] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0278] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0279] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A sensor module (100), characterized in that, It includes a housing (11), a carrier (21), an image sensor (20), a drive assembly, and a first buffer layer (12); The housing (11) includes a first housing (111) and a second housing (112), the first housing (111) and the second housing (112) are opposite to each other and together form an installation space (113), the first housing (111) has a light-transmitting hole (1116) communicating with the installation space (113), and the first housing (111) has a first surface (1117) facing the installation space (113) and surrounding the light-transmitting hole (1116). The carrier (21) is located in the installation space (113), the carrier (21) is movably connected to the second shell (112), at least a portion of the periphery of the carrier (21) is opposite to and spaced apart from the first surface (1117), and the first buffer layer (12) covers at least a portion of the first surface (1117). The image sensor (20) is fixed to the carrier (21), and the driving component drives the carrier (21) to move the image sensor (20) relative to the first shell (111).

2. The sensor module (100) as described in claim 1, characterized in that, The first buffer layer (12) extends circumferentially along the light-transmitting hole (1116).

3. The sensor module (100) as described in claim 1, characterized in that, The first buffer layer (12) is spaced apart from the inner wall of the light-transmitting hole (1116); Alternatively, the first buffer layer (12) may also cover at least a portion of the inner wall of the light-transmitting hole (1116).

4. The sensor module (100) as described in claim 1, characterized in that, The first buffer layer (12) is continuous as a whole, or the first buffer layer (12) comprises multiple parts spaced apart.

5. The sensor module (100) as described in claim 1, characterized in that, The first buffer layer (12) is made of silicone material.

6. The sensor module (100) as described in claim 1, characterized in that, The first buffer layer (12) is integrally injection molded onto the first surface (1117).

7. The sensor module (100) as described in claim 1, characterized in that, The sensor module (100) further includes a first dust-collecting layer (13), which covers at least a portion of the first buffer layer (12) and is used to adsorb dust particles and debris.

8. The sensor module (100) as described in claim 7, characterized in that, The distance between the first dust-collecting layer (13) and the light-transmitting hole (1116) is greater than or equal to the distance between the first buffer layer (12) and the light-transmitting hole (1116).

9. The sensor module (100) as described in claim 7, characterized in that, The first dust-collecting layer (13) is a dust-collecting adhesive.

10. The sensor module (100) as described in claim 7, characterized in that, The first dust-collecting layer (13) has protrusions and / or grooves on the surface facing the carrier (21).

11. The sensor module (100) as described in claim 1, characterized in that, The sensor module (100) further includes a circuit assembly (3) and a second dust collection layer (35); the circuit assembly (3) includes a first circuit board (31), the first circuit board (31) is fixedly installed on the housing (11), the first circuit board (31) and the image sensor (20) are stacked, the first circuit board (31) includes a first outer frame (311) and a plurality of suspension wires (312), the plurality of suspension wires (312) are disposed on the inner side of the first outer frame (311) and connected to the first outer frame (311), the plurality of suspension wires (312) are electrically connected to the image sensor (20); The second dust-collecting layer (35) is disposed on the surface of the first outer frame (311) facing the image sensor (20), and the second dust-collecting layer (35) is used to adsorb dust particles and debris.

12. The sensor module (100) as described in claim 11, characterized in that, The circuit assembly (3) further includes a second circuit board (32), one end of which is electrically connected to the first circuit board (31), and the other end of which extends outward toward the mounting space (113); The second dust-collecting layer (35) is disposed on the side of the first outer frame (311) near the second circuit board (32).

13. The sensor module (100) as described in claim 11, characterized in that, The sensor module (100) further includes a first damping layer (36), which wraps around the suspension wire (312).

14. The sensor module (100) as described in claim 13, characterized in that, The first damping layer (36) wraps around at least two adjacent suspension wires (312).

15. The sensor module (100) as described in claim 13, characterized in that, The number of the first damping layer (36) is multiple, and the multiple first damping layers (36) are disposed in different regions of the suspension wire (312).

16. The sensor module (100) as described in claim 13, characterized in that, The first damping layer (36) is a damping adhesive and has elasticity.

17. The sensor module (100) as described in any one of claims 1 to 16, characterized in that, The sensor module (100) further includes a first bracket (41), a second bracket (61), a base (51), and a first rolling element (44). The first bracket (41) is connected to the carrier (21) and is located away from the image sensor (20) relative to the carrier (21). The second bracket (61) is fixedly connected to the first bracket (41) and is movably connected to the second shell (112). The base (51) is located between the first bracket (41) and the second bracket (61) and is fixed to the first shell (111) and / or the second shell (112). The first rolling element (44) is installed between the base (51) and the first bracket (41).

18. The sensor module (100) as described in claim 17, characterized in that, The first rolling element (44) includes at least three balls (441), and the at least three balls (441) are not on the same straight line.

19. The sensor module (100) as described in claim 17, characterized in that, The first bracket (41) has a first groove (4113), a second groove (4114) and a third groove (4115). The first groove (4113), the second groove (4114) and the third groove (4115) are all recessed on the surface of the first bracket (41) facing the base (51) and are not on the same straight line. The first rolling element (44) includes a plurality of balls (441), m balls (441) are disposed in the first groove (4113), n balls (441) are disposed in the second groove (4114), and p balls (441) are disposed in the third groove (4115), wherein m, n, and p satisfy: m>n, m>p, |mnp|≤2, m≥2, n≥1, p≥1.

20. The sensor module (100) as described in claim 17, characterized in that, The driving assembly includes a first driving member and a second driving member. The first driving member is used to drive the carrier (21) to move relative to the base (51) in a first direction (X). The second driving member is used to drive the carrier (21) to move relative to the base (51) in a second direction (Y) and to rotate about a third direction (Z). Wherein, the first direction (X) intersects with the second direction (Y), and both the first direction (X) and the second direction (Y) are parallel to the photosensitive surface (201) of the image sensor (20), and the third direction (Z) is perpendicular to the photosensitive surface (201) of the image sensor (20).

21. The sensor module (100) as described in any one of claims 18 to 20, characterized in that, The sensor module (100) also includes a second magnetic element (63) and a third magnet (14). The second magnetic component (63) is mounted on the second bracket (61), and the third magnet (14) is mounted on the second shell (112). The third magnet (14) is arranged opposite to the second magnetic component (63).

22. The sensor module (100) as described in claim 1, characterized in that, The first shell (111) may include a bottom wall (1111), a first side wall (1112), a second side wall (1113), a third side wall (1114), and a fourth side wall (1115). The first side wall (1112), the second side wall (1113), the third side wall (1114), and the fourth side wall (1115) are all connected to the periphery of the bottom wall (1111) and protrude from the same side of the bottom wall (1111). The first side wall (1112), the second side wall (1113), the third side wall (1114), and the fourth side wall (1115) are connected end to end in sequence. The first side wall (1112) and the third side wall (1114) are arranged opposite to each other, and the second side wall (1113) and the fourth side wall (1115) are arranged opposite to each other. The fourth sidewall (1115) is inclined away from the second sidewall (1113) relative to the bottom wall (1111), and the light-transmitting hole (1116) penetrates a portion of the bottom wall (1111) and a portion of the fourth sidewall (1115). The bottom wall (1111) has a C-shaped structure. The bottom wall (1111) has the first surface (1117), the first buffer layer (12) is continuously disposed on the first surface (1117), and the first buffer layer (12) has a C-shaped structure.

23. A camera module (2000), characterized in that, It includes a first optical folding element (200), a lens group (300), and a sensor module (100) as described in any one of claims 1 to 22, wherein the first optical folding element (200), the lens group (300), and the sensor module (100) are arranged at intervals along the optical path propagation direction in sequence; The first optical folding element (200) is used to reflect light to the lens group (300) and through the lens group (300) to the image sensor (20) in the sensor module (100).

24. An electronic device (1000), characterized in that, The device includes an image processor (6000) and a camera module (2000) as described in claim 23, wherein the image processor (6000) is communicatively connected to the camera module (2000), and the image processor (6000) is used to acquire image data from the camera module (2000) and process the image data.

Images