An inverter

Abstract

The embodiment of the application provides an inverter. It relates to the technical field of inverters. The inverter comprises a shell, a circuit assembly, the circuit assembly comprising a first circuit board and a second circuit board, the first circuit board being arranged on the side wall of the shell and being used for conversion between alternating current and direct current, the second circuit board being arranged on the bottom of the shell, and the first circuit board and the second circuit board being electrically connected; and a heat dissipation assembly, the heat dissipation assembly comprising a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece being arranged on the outer side wall of the shell and being connected with the first circuit board to cool the first circuit board, and the second heat dissipation piece being arranged in the shell to drive air flow in the shell. The projected area of the inverter is reduced, so that the inverter can be conveniently transported to a remote installation site or installed in a limited space.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and more particularly to an inverter. Background Technology

[0002] An inverter is a device that can convert direct current (DC) to alternating current (AC) in an environment independent of the power grid. It provides reliable power support for many remote areas, outdoor work sites, and special power consumption scenarios, greatly expanding the scope and flexibility of power applications and meeting people's urgent need for AC power in different environments.

[0003] In related technologies, inverters mainly consist of a housing, electrical components, and a heat dissipation device. The electrical components are located at the bottom of the housing, and the heat dissipation device is also installed at the bottom of the housing to dissipate heat from the electrical components.

[0004] However, the electrical components and heat dissipation devices are all located at the bottom of the casing, resulting in a large projected area for the inverter, which is not conducive to transportation to remote installation sites or installation in limited spaces. Utility Model Content

[0005] This application provides an inverter to reduce the inverter's projected area, making it easier to transport to remote installation sites or install in limited spaces.

[0006] This application provides an inverter, including:

[0007] case;

[0008] A circuit assembly, comprising a first circuit board and a second circuit board, wherein the first circuit board is disposed on the side wall of the housing and is used for converting AC power to DC power, and the second circuit board is disposed on the bottom of the housing and the first circuit board and the second circuit board are electrically connected.

[0009] A heat dissipation assembly includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed on the outer side wall of the housing and is connected to the first circuit board to cool the first circuit board. The second heat dissipation component is disposed inside the housing to drive airflow inside the housing.

[0010] In one possible implementation, the first heat sink includes a first cooling fan, a housing, and cooling fins. The housing is connected to the side wall of the casing. The cooling fins are disposed inside the housing and connected to the first circuit board. The first cooling fan is disposed inside the housing and is used to drive airflow near the cooling fins.

[0011] In one possible implementation, the heat dissipation fins include a connecting plate and a plurality of heat dissipation plates, the plurality of heat dissipation plates being spaced apart on the connecting plate, the side wall of the housing having a connection port, the connecting plate being disposed on the housing to close the connection port, the first circuit board being located within the connection port and connected to the connecting plate.

[0012] In one possible implementation, the connecting plate is provided with a sealing element that abuts against the housing to seal the gap between the connecting plate and the housing; the sealing element is a T-shaped sealing ring.

[0013] In one possible implementation, the connecting plate is provided with a sealing groove, and the sealing element is disposed within the sealing groove.

[0014] In one possible implementation, the first circuit board and the second circuit board are perpendicular to each other.

[0015] In one possible implementation, the second heat sink includes a second cooling fan and a mounting plate, the second cooling fan being disposed on the mounting plate, the mounting plate being connected to the inner sidewall of the housing.

[0016] In one possible implementation, the inverter further includes a top cover connected to the housing to enclose the housing, one side of the top cover extending onto and connected to the first heat sink.

[0017] In one possible implementation, the upper cover is provided with an installation port, and the upper cover is provided with a cover plate for closing the installation port. The cover plate is provided with a sealing strip to seal the gap between the cover plate and the upper cover.

[0018] In one possible implementation, a current transformer is provided on the first circuit board, and the second circuit board includes a main board, a control board, a first relay board and a second relay board. The main board is located at the bottom of the housing, and the first relay board and the second relay board are stacked on the main board. The control board is located on the side of the main board close to the first circuit board and is parallel to the first circuit board.

[0019] This application provides an inverter that uses a first circuit board mounted on the side wall of the housing for AC and DC power conversion, while a second circuit board is located at the bottom of the housing. This avoids overlapping circuit boards, fully utilizes the internal space of the housing, and results in a more compact overall layout. A first heat sink is located on the outer wall of the housing and connected to the first circuit board, directly dissipating heat to the external environment. The second heat sink is located inside the housing and dissipates heat by driving internal airflow. This combined internal and external heat dissipation method improves heat dissipation efficiency and avoids additional volume required for heat dissipation. This reduces the inverter's projected area, making it easier to transport to remote areas and install in limited spaces. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] Figure 1 This is a schematic diagram of the inverter provided in this application;

[0022] Figure 2 for Figure 1 Schematic diagram of the internal structure of the middle shell;

[0023] Figure 3 for Figure 1 Exploded view of the structure of the inverter;

[0024] Figure 4 for Figure 1 Cross-sectional view of the inverter structure;

[0025] Figure 5 for Figure 4 Enlarged structural diagram of section A;

[0026] Figure 6 for Figure 1 A schematic diagram of the circuit components.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100. Housing; 110. Connection port; 120. Transformer mounting bracket; 131. Battery interface; 132. First communication interface; 133. Second communication interface; 134. Motor interface; 135. Power grid interface; 136. First photovoltaic panel interface; 137. Second photovoltaic panel interface; 140. Switch; 150. Antenna; 160. Changeover switch;

[0029] 200. Circuit assembly; 210. First circuit board; 211. Current transformer; 220. Second circuit board; 221. Main board; 222. Control board; 223. First relay board; 224. Second relay board; 225. Power inductor; 230. Communication circuit board;

[0030] 300. Heat dissipation assembly; 310. First heat sink; 311. First cooling fan; 312. Housing; 313. Heat dissipation fins; 3131. Connecting plate; 3132. Heat dissipation plate; 314. Seal; 315. Sealing groove; 320. Second heat sink; 321. Second cooling fan; 322. Mounting plate;

[0031] 400. Top cover; 410. Mounting port; 420. Cover plate; 430. Sealing strip; 440. Display screen; 441. Display circuit board.

[0032] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0034] An inverter is a device that can convert direct current (DC) to alternating current (AC) in an environment independent of the power grid. It provides reliable power support for many remote areas, outdoor work sites, and special power consumption scenarios, greatly expanding the scope and flexibility of power applications and meeting people's urgent need for AC power in different environments.

[0035] In related technologies, inverters mainly consist of a housing, electrical components, and a heat dissipation device. The electrical components are located at the bottom of the housing, and the heat dissipation device is also installed at the bottom of the housing to dissipate heat from the electrical components.

[0036] However, the electrical components and heat dissipation devices are all located at the bottom of the casing, resulting in a large projected area for the inverter, which is not conducive to transportation to remote installation sites or installation in limited spaces.

[0037] This application provides an inverter that uses a first circuit board mounted on the side wall of the housing for AC and DC power conversion, while a second circuit board is located at the bottom of the housing. This avoids overlapping circuit boards, fully utilizes the internal space of the housing, and results in a more compact overall layout. A first heat sink is located on the outer wall of the housing and connected to the first circuit board, directly dissipating heat to the external environment. The second heat sink is located inside the housing and dissipates heat by driving internal airflow. This combined internal and external heat dissipation method improves heat dissipation efficiency and avoids additional volume required for heat dissipation. This reduces the inverter's projected area, making it easier to transport to remote areas and install in confined spaces.

[0038] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0039] This application provides an inverter, referring to... Figure 1 and Figure 2 The inverter includes a housing 100, a circuit assembly 200, and a heat dissipation assembly 300.

[0040] The circuit assembly 200 includes a first circuit board 210 and a second circuit board 220. The first circuit board 210 is disposed on the side wall of the housing 100 and is used for the conversion of AC power and DC power. The second circuit board 220 is disposed on the bottom of the housing 100 and the first circuit board 210 and the second circuit board 220 are electrically connected.

[0041] The circuit assembly 200 adopts a layered layout. The first circuit board 210 is set on the inner side wall of the housing 100 and is used for the conversion of AC and DC power, while the second circuit board 220 is placed at the bottom of the housing 100. This layout avoids the stacking of circuit boards, makes full use of the internal space of the housing 100, makes the overall layout more compact, and reduces the projected area of ​​the inverter.

[0042] The heat dissipation assembly 300 includes a first heat dissipation component 310 and a second heat dissipation component 320. The first heat dissipation component 310 is disposed on the outer side wall of the housing 100 and is connected to the first circuit board 210 to cool the first circuit board 210. The second heat dissipation component 320 is disposed inside the housing 100 to drive the airflow inside the housing 100.

[0043] The main heat-generating components in the inverter are concentrated on the first circuit board 210, which is used for the conversion between AC and DC power. Therefore, the heat dissipation component 300 is mainly used to dissipate heat from the first circuit board 210.

[0044] The first heat sink 310 is located on the outer wall of the housing 100 and connected to the first circuit board 210, directly dissipating heat to the external environment. The second heat sink 320 is located inside the housing 100, dissipating heat by driving internal airflow. This combined internal and external heat dissipation method improves heat dissipation efficiency and avoids additional volume required for heat dissipation. Furthermore, by focusing heat dissipation on the first circuit board 210 using the first heat sink, the heat dissipation becomes more targeted, improving the overall heat dissipation effect on the inverter.

[0045] Furthermore, the first heat sink 310 is located on the outer wall of the housing 100, which facilitates the disassembly or replacement of the first heat sink 310 without removing the entire inverter from the housing 100. In addition, during maintenance, the first heat sink 310 and the first circuit board 210 on the side wall (wherein the first circuit board 210 can be a driver board, and the first circuit board 210 has a topology circuit that can perform DC-AC bidirectional conversion) can be removed together, which is more convenient for disassembly and maintenance than directly installing it on the bottom of the housing 100.

[0046] In one possible implementation, refer to Figure 2 and Figure 3 The first heat sink 310 includes a first heat sink fan 311, a housing 312 and heat sink fins 313. The housing 312 is connected to the side wall of the housing 100. The heat sink fins 313 are disposed inside the housing 312 and connected to the first circuit board 210. The first heat sink fan 311 is disposed inside the housing 312 and is used to drive the airflow near the heat sink fins 313.

[0047] The outer casing 312 of the first heat sink 310 is connected to the side wall of the housing 100, and internally it is equipped with heat dissipation fins 313 and a first cooling fan 311. The heat dissipation fins 313 are connected to the first circuit board 210, and promote heat transfer by increasing the surface area; the first cooling fan 311 drives the airflow near the heat dissipation fins 313, accelerating heat dissipation. This structural design ensures that the inverter can efficiently dissipate heat while reducing its size, thereby improving the stability and reliability of the equipment.

[0048] In this application, one side of the inverter's wiring port is the bottom of the housing 100, and the opposite end is the top of the housing 100. The side on which the inverter is installed is the bottom surface, and the opposite side is the surface of the housing 100. The other two sides between the bottom surface and the surface of the housing 100 are the sides of the sidewall.

[0049] For example, the outer casing 312 is fixed to the outer side wall of the housing 100 by bolts, screws, or rivets. That is, the outer casing 312 is located on any side of the housing 100, and the height of the outer casing 312 is the same as the height of the housing 100. The first cooling fan 311 is installed at the end of the outer casing 312 and near the bottom of the housing 100. The heat dissipation fins 313 are arranged along the length of the outer casing 312, and the first cooling fan 311 blows air toward the heat dissipation fins 313 to drive the airflow inside the heat dissipation fins 313, so as to remove the heat from the heat dissipation fins 313, so that the heat dissipation fins 313 transfer the heat of the first circuit board 210 connected to them.

[0050] For example, both ends of the housing 312 are provided with vents, and the first cooling fan 311 is located at one of the vents and blows air toward the other vent. For example, a mesh screen is also provided on the vent near the first cooling fan 311 to prevent insects and other debris from entering the first cooling fan 311 and hindering its operation.

[0051] In other examples, the outer casing 312 and the housing 100 can also be welded together.

[0052] In one possible implementation, refer to Figure 3 and Figure 4 The heat dissipation fins 313 include a connecting plate 3131 and a plurality of heat dissipation plates 3132. The plurality of heat dissipation plates 3132 are spaced apart on the connecting plate 3131. The side wall of the housing 100 has a connection port 110. The connecting plate 3131 is disposed on the housing 100 to close the connection port 110. The first circuit board 210 is located inside the connection port 110 and is connected to the connecting plate 3131.

[0053] Multiple heat sinks 3132 are stacked and fixed on the connecting plate 3131 at intervals, and the heat sinks 3132 are arranged along the length of the outer shell 312.

[0054] For example, the heat sink 3132 and the connecting plate 3131 are integrally formed. Both the heat sink 3132 and the connecting plate 3131 are metal parts with good thermal conductivity, so as to quickly transfer the heat on the first circuit board 210 to the connecting plate 3131, and then dissipate the heat through the heat sink 3132.

[0055] The connecting plate 3131 is connected to the outer side wall of the housing 100, closing the connection port 110 on the side wall of the housing 100. This allows part of the connecting plate 3131 to function as a side wall structure of the housing 100, and the first circuit board 210 is directly mounted on the connecting plate 3131. This brings the first circuit board 210 and the connecting plate 3131 closer together, reducing obstruction and facilitating the transfer of heat from the first circuit board 210 to the connecting plate 3131.

[0056] The width of the connecting plate 3131 is greater than the width of the connecting port 110, so as to fix the connecting plate 3131 to the housing 100.

[0057] In one possible implementation, refer to Figure 4 and Figure 5 A sealing element 314 is provided on the connecting plate 3131. The sealing element 314 abuts against the housing 100 to seal the gap between the connecting plate 3131 and the housing 100. By sealing the gap between the connecting plate 3131 and the housing 100 with the sealing element 314, the connection port 110 is sealed, ensuring the sealing effect inside the housing 100 and preventing rainwater and other substances from entering the housing 100. This protects the electrical components inside the housing 100 and improves the service life of the inverter.

[0058] In one possible implementation, refer to Figure 5 A sealing groove 315 is provided on the connecting plate 3131, and a sealing element 314 is disposed in the sealing groove 315. The sealing element 314 is embedded in the sealing groove 315 and then abuts against the side wall of the housing 100 at the connection port 110, which can provide a more effective sealing effect.

[0059] The sealing groove 315 is circumferentially arranged on the connecting plate 3131 along the edge of the connecting port 110.

[0060] In one possible implementation, the seal 314 is a T-shaped sealing ring.

[0061] One side of the T-shaped sealing ring is installed in the sealing groove 315, and the other side extends out of the sealing groove 315 to abut against the outer wall of the housing 100. This achieves a seal on the connection port 110.

[0062] For example, seal 314 can also be a rubber ring.

[0063] In one possible implementation, the second heat sink 320 includes a second cooling fan 321 and a mounting plate 322, wherein the second cooling fan 321 is disposed on the mounting plate 322 and the mounting plate 322 is connected to the inner sidewall of the housing 100.

[0064] For example, mounting plate 322 is mounted on the side wall where the first circuit board 210 is located, and mounting plate 322 is located on the side of housing 100 near the surface. Second cooling fan 321 blows air towards the bottom surface of housing 100, and second cooling fan 321 is located near the AC / DC conversion point of the first circuit board 210. The AC / DC conversion point of the first circuit board 210 has electrical components that generate a large amount of heat, so the fan is used to specifically cool the components and improve the cooling effect. In addition, second cooling fan 321 can also drive airflow within housing 100 to improve the overall heat dissipation capacity of housing 100.

[0065] In one possible implementation, refer to Figure 1 and Figure 3 The inverter also includes a top cover 400, which is connected to the housing 100 to enclose the housing 100. One side of the top cover 400 extends to and is connected to the first heat sink 310.

[0066] For example, an opening is provided on the surface of the housing 100 for mounting various electrical components inside the housing 100. A cover 400 is provided over the opening of the housing 100 to close the opening.

[0067] The exemplary housing 100 has a connecting frame at its opening, which is provided along the edge of the opening. The upper cover 400 has an arc-shaped cross-section to improve its support capacity and increase the internal space of the housing 100. Furthermore, the side of the upper cover 400 abuts against the connecting frame and extends to the edge of the housing 100 to connect with it. The connecting frame supports the upper cover 400, thereby improving its strength.

[0068] For example, the top cover 400 and the housing 100 can be connected by bolts.

[0069] For example, one side of the top cover 400 extends onto the housing 312 and is fixedly connected to the edge of the housing 312, so that the top cover 400 completely covers the housing 100 and the housing 312, improving the overall aesthetics.

[0070] For example, in order to improve the sealing effect, a limiting part is provided on the top cover 400. The limiting part has an annular groove, and the connecting frame is inserted into the annular groove, thereby improving the sealing effect at the opening of the housing 100.

[0071] Furthermore, a sealing ring can be installed inside the annular groove to further improve the sealing effect.

[0072] In one possible implementation, the upper cover 400 is provided with an installation opening 410, and the upper cover 400 is provided with a cover plate 420 for closing the installation opening 410. The cover plate 420 is provided with a sealing strip 430 to seal the gap between the cover plate 420 and the upper cover 400.

[0073] The mounting opening 410 is located near the bottom of the housing 100 and serves as a window for fixing external cables, communication cables, etc. A cover plate 420 is placed over the mounting opening 410 to close it. A sealing strip 430 is provided on the cover plate 420 and abuts against the upper cover 400 along the circumference of the mounting opening 410, thereby sealing the gap between the cover plate 420 and the upper cover 400 and improving the sealing effect of the device.

[0074] For example, the cover plate 420 and the upper cover 400 are detachably connected by bolts.

[0075] In other examples, the top cover 400 and the cover plate 420 can also be connected by a snap-fit.

[0076] For example, a display screen 440 is also provided on the top cover 400. The display screen 440 is used to be electrically connected to the first circuit board 210 and / or the second circuit board 220, and the display screen 440 is used to display the status of the inverter.

[0077] For example, the display screen 400 is also provided with a display circuit board 441, which is electrically connected to the first circuit board 210 and / or the second circuit board 220. The display circuit board 441 is located on the side wall of the upper cover 400 near the housing 100.

[0078] In one possible implementation, the top cover 400 is a plastic cover. Using a plastic cover reduces the overall weight of the inverter, making it easier to carry and transport.

[0079] For example, housing 100 is a metal part.

[0080] In one possible implementation, refer to Figure 6 The first circuit board 210 is provided with a current transformer 211. The second circuit board 220 includes a main board 221, a control board 222, a first relay board 223, and a second relay board 224. The main board 221 is located at the bottom of the housing 100. The first relay board 223 and the second relay board 224 are stacked on the main board 221. The control board 222 is located on the side of the main board 221 close to the first circuit board 210 and is parallel to the first circuit board 210.

[0081] For example, the first circuit board 210 can be a driver board, which is used to connect to the battery, and the current transformer 211 is disposed on the first circuit board 210 near the battery connection port. The first circuit board 210 is a driver board for realizing bidirectional conversion between AC and DC power (DC / AC bidirectional conversion).

[0082] For example, the main board 221 is used to output AC power for use by the load. The main board 221 is fixed to the bottom of the housing 100, with a certain gap between it and the bottom of the housing 100. The second relay board 224 is disposed above the main board 221 and electrically connected to the main board 221. The second relay board 224 is used to control the connection with the power grid, so that the inverter has the ability to draw power from the power grid. The first relay board 223 is disposed above the second relay board 224 and electrically connected to the main board 221. The first relay board 223 is used to control the connection with the generator.

[0083] For example, the positions of the first relay plate 223 and the second relay plate 224 can be interchanged.

[0084] For example, the control board 222 is equipped with a main control chip. The control board 222 is vertically positioned above the main board 221, that is, the control board 222 is parallel to the first circuit board 210, and the control board 222 is located on the side closer to the first circuit board 210, so that the control board 222 is close to the second heat sink 320, ensuring the heat dissipation effect of the control board 222. The control board 222 is electrically connected to the main board 221.

[0085] For example, the motherboard 221 is also provided with two power inductors 225, which are used to be electrically connected to the first circuit board 210 to act on the topology circuit and the boost circuit respectively.

[0086] For example, a transformer mounting bracket 120 is also provided inside the housing 100 for mounting a transformer, and the transformer mounting bracket 120 is located directly below the second heat sink 320.

[0087] For example, a communication circuit board 230 is also provided inside the housing 100, and in this application, the communication circuit board 230 is a WiFi circuit board.

[0088] For example, refer to Figure 2 The bottom of the housing 100 has multiple interfaces for external connection. To improve the sealing of the interfaces, each interface is provided with a rubber sealing layer.

[0089] For example, the interface includes a battery interface 131 for connecting the first circuit board 210 to a battery. It also includes a first communication interface 132 (COM1) and a second communication interface 133 (COM2) for connecting communication cables; a motor interface 134 (GEN) for connecting a generator; a grid interface 135 (GRID) for connecting to the power grid; and a first photovoltaic panel interface 136 (PV1) and a second photovoltaic panel interface 137 (PV2) for connecting photovoltaic panels.

[0090] For example, the bottom of the housing 100 is also provided with a switch 140 (ON / OFF button), which is electrically connected to the motherboard 221 to control the connection and disconnection of the output circuit.

[0091] For example, an antenna 150 is also provided at the bottom of the housing 100. The antenna 150 is electrically connected to the communication circuit board 230 for communication of the inverter.

[0092] For example, a switch 160 is also provided on the side of the housing 100 for switching different input and / or output modes of the inverter. The switch 160 is electrically connected to the second circuit board 220.

[0093] The inverter provided in this embodiment uses a first circuit board 210 located on the side wall of the housing 100 for AC and DC power conversion, while a second circuit board 220 is located at the bottom of the housing 100. This avoids overlapping circuit boards, fully utilizes the internal space of the housing 100, and makes the overall layout more compact. A first heat sink 310 is located on the outer wall of the housing 100 and connected to the first circuit board 210, directly dissipating heat to the external environment. The second heat sink 320 is located inside the housing 100, dissipating heat by driving internal airflow. This combined internal and external heat dissipation method improves heat dissipation efficiency and avoids the need for additional projected area due to heat dissipation requirements. This reduces the inverter's projected area, making it easier to transport to remote areas and install in limited spaces.

[0094] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. An inverter, characterized in that, include: Casing (100); A circuit assembly (200) includes a first circuit board (210) and a second circuit board (220). The first circuit board (210) is disposed on the side wall of the housing (100) and is used for the conversion of AC and DC power. The second circuit board (220) is disposed on the bottom of the housing (100) and is electrically connected to the first circuit board (210) and the second circuit board (220). A heat dissipation assembly (300) includes a first heat dissipation component (310) and a second heat dissipation component (320). The first heat dissipation component (310) is disposed on the outer side wall of the housing (100) and is connected to the first circuit board (210) to cool the first circuit board (210). The second heat dissipation component (320) is disposed inside the housing (100) to drive airflow inside the housing (100).

2. The inverter according to claim 1, characterized in that, The first heat sink (310) includes a first cooling fan (311), a housing (312), and heat sink fins (313). The housing (312) is connected to the side wall of the housing (100). The heat sink fins (313) are disposed inside the housing (312) and connected to the first circuit board (210). The first cooling fan (311) is disposed inside the housing (312) and is used to drive airflow near the heat sink fins (313).

3. The inverter according to claim 2, characterized in that, The heat dissipation fins (313) include a connecting plate (3131) and a plurality of heat dissipation plates (3132). The plurality of heat dissipation plates (3132) are spaced apart on the connecting plate (3131). The side wall of the housing (100) has a connection port (110). The connecting plate (3131) is disposed on the housing (100) to close the connection port (110). The first circuit board (210) is located inside the connection port (110) and is connected to the connecting plate (3131).

4. The inverter according to claim 3, characterized in that, A sealing element (314) is provided on the connecting plate (3131), and the sealing element (314) abuts against the housing (100) to seal the gap between the connecting plate (3131) and the housing (100); The sealing element (314) is a T-shaped sealing ring.

5. The inverter according to claim 4, characterized in that, The connecting plate (3131) is provided with a sealing groove (315), and the sealing element (314) is disposed in the sealing groove (315).

6. The inverter according to claim 1, characterized in that, The first circuit board (210) and the second circuit board (220) are perpendicular to each other.

7. The inverter according to any one of claims 1-6, characterized in that, The second heat sink (320) includes a second cooling fan (321) and a mounting plate (322). The second cooling fan (321) is mounted on the mounting plate (322), and the mounting plate (322) is connected to the inner wall of the housing (100).

8. The inverter according to any one of claims 1-6, characterized in that, It also includes a top cover (400) connected to the housing (100) to close the housing (100), one side of the top cover (400) extending to and connected to the first heat sink (310).

9. The inverter according to claim 8, characterized in that, The upper cover (400) is provided with an installation port (410), and the upper cover (400) is provided with a cover plate (420) for closing the installation port (410). The cover plate (420) is provided with a sealing strip (430) to seal the gap between the cover plate (420) and the upper cover (400).

10. The inverter according to claim 8, characterized in that, The first circuit board (210) is provided with a current transformer (211), and the second circuit board (220) includes a main board (221), a control board (222), a first relay board (223) and a second relay board (224). The main board (221) is located at the bottom of the housing (100). The first relay board (223) and the second relay board (224) are stacked on the main board (221). The control board (222) is located on the side of the main board (221) close to the first circuit board (210) and is parallel to the first circuit board (210).

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