A test handler for automated sorting

Abstract

The utility model relates to automatic equipment technical field discloses a kind of test sorting automation equipment, and the flexible rotation of test box relative to rotating support seat is realized by the rotation drive module of careful design.This design makes that test box can carry out comprehensive and accurate performance test to chip under different angles, effectively solve the limitation of existing test equipment in multi-angle test aspect.Through the cooperation of motor and speed reducer, stable rotary driving force can be provided and output torque is improved, the stability and reliability of test process are ensured.Meanwhile, the setting of electric slip ring and angle encoder realizes stable power and signal transmission in rotation process, and accurately measures rotation angle and speed, further improves the accuracy and efficiency of test.This innovative design not only promotes the progress of chip test technology, but also provides strong support for the sustained and healthy development of semiconductor industry.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to an automated testing and sorting device. Background Technology

[0002] Semiconductor materials are a class of materials with special properties, whose conductivity lies between that of conductors and insulators under normal temperature conditions. Due to their unique electrical properties, semiconductor materials play an indispensable role in many key fields, including but not limited to the manufacturing of integrated circuits, the booming development of the consumer electronics industry, the construction and optimization of communication systems, the innovation and application of photovoltaic power generation technology, the modernization of lighting engineering, and the research and promotion of high-power power conversion technology. Taking chips as an example, these microelectronic devices, which occupy a core position in modern electronic devices, are meticulously manufactured using sophisticated processes and ingenious designs based on semiconductor materials.

[0003] As a highly precise and complex electronic device, a chip, after its manufacturing process is completed, must undergo a series of rigorous and meticulous testing procedures to ensure that its various performance indicators meet predetermined standards, thus enabling it to successfully leave the production line and be released into the market. In today's era, with the rapid development of science and technology, numerous automated testing equipment have emerged and are widely used in all aspects of chip performance testing, aiming to significantly improve the efficiency and accuracy of testing work and ensure the quality and reliability of chip products.

[0004] However, what deserves serious attention from the industry is that, among the mainstream testing equipment currently on the market, how to achieve flexible rotation of the test chamber relative to the rotating support base to comprehensively and accurately test the chip's performance at different angles has become a major technical challenge that urgently needs to be overcome. Solving this problem will not only greatly promote the innovation and progress of chip testing technology, but also inject new vitality and impetus into the continued healthy development of the semiconductor industry.

[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0006] This invention provides an automated testing and sorting device to solve the problems existing in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An automated testing and sorting device includes a testing apparatus;

[0009] The testing device includes a testing mechanism;

[0010] The testing mechanism is used to test the transferred chips and includes a test box, a rotating support base, and a rotating drive module.

[0011] The test chamber is equipped with rotating shafts on both sides;

[0012] The rotating shaft is rotatably mounted on the rotating support base;

[0013] The rotary drive module is disposed on the rotary support base, and the drive rod of the rotary drive module is connected to one of the rotary shafts in a transmission connection.

[0014] The rotary drive module includes a motor, a reducer, an electric slip ring, and an angle encoder;

[0015] The motor is connected to the reducer, and the reducer is connected to one of the rotating shafts via a transmission connection;

[0016] The slip ring and the angle encoder are mounted on another of the rotating shafts;

[0017] The motor is used to output rotational driving force;

[0018] The speed reducer is used to reduce the output of the motor and increase the output torque;

[0019] The slip ring is used to achieve stable power and signal transmission from the stationary part to the rotating part during the rotation of the rotating shaft;

[0020] The angle encoder is used to measure the angular position and rotational speed of the rotating shaft.

[0021] Furthermore, in the automated testing and sorting equipment, the testing device also includes a frame and a fixing mechanism;

[0022] The fixing mechanism is mounted on the frame and is used to fix the rotating support to the frame; the fixing mechanism includes a mounting plate, a second cylinder, a slide rail module, a connecting rod module, and a hook module;

[0023] The mounting plate is mounted on the frame;

[0024] The second cylinder is mounted on the mounting plate;

[0025] The slide rail module includes a sliding block and a slide rail; the slide rail is mounted on the mounting plate; the sliding block is movably mounted on the slide rail and is connected to the telescopic rod of the second cylinder;

[0026] The hook module is rotatably mounted on the sliding block via the connecting rod module;

[0027] The extension and retraction of the telescopic rod of the second cylinder can drive the sliding block to move linearly on the slide rail. The linkage module can convert the linear motion of the sliding block into the rotational motion of the hook module, thereby realizing the fixing or releasing action of the hook module on the rotating support.

[0028] Furthermore, in the automated testing and sorting equipment, the rotating support base is provided with a hook portion;

[0029] The connecting rod module is provided with a mounting slot;

[0030] The hook module includes a hook component and a compression spring;

[0031] The hook is disposed within the mounting slot;

[0032] The compression spring is disposed in the mounting groove, with one end abutting against the bottom of the mounting groove and the other end abutting against the hook, and is used to provide a force to maintain the hook and the hook part in an engaged state.

[0033] Furthermore, in the automated testing and sorting equipment, the hook component is provided with a guide slope to facilitate smooth engagement with the hook portion after contacting the rotating support base.

[0034] Furthermore, the automated testing and sorting equipment also includes a loading and unloading sorting device;

[0035] The loading and unloading sorting device is used to load the trays containing the chips to be tested; and after the test is completed, the tested chips are classified according to the test results and stored in the corresponding trays, and then the trays containing the tested chips are unloaded.

[0036] A first chip transfer robot is provided between the testing device and the loading and unloading sorting device. The first chip transfer robot is used to transfer chips from the loading tray to the testing device.

[0037] Furthermore, in the automated testing and sorting equipment, the testing device also includes a second shuttle mechanism, a third chip transfer robot, and a pressure head mechanism;

[0038] The second shuttle mechanism is used to transport the chips transferred by the first chip transfer robot.

[0039] The third chip transfer robot is used to transfer the chip conveyed by the second shuttle mechanism to the testing mechanism;

[0040] The pressure head mechanism has a pressed state that abuts against the testing mechanism and a separated state that is separated from the testing mechanism, so as to cooperate with the testing mechanism to perform testing.

[0041] Furthermore, in the automated testing and sorting equipment, a test carrier plate is provided on the top of the test box;

[0042] The pressure head mechanism includes a lifting module, a fixing plate, and a pressing module;

[0043] The lifting module is used to output lifting driving force;

[0044] The pressing module is mounted on the lifting module via the fixing plate and is used to press down the chip placed on the test carrier to cooperate with the test mechanism for testing.

[0045] The pressing module includes a pressing cover assembly and a clamping assembly;

[0046] The clamping assembly includes a clamping seat, two jaws, a first cylinder, a gear, and two racks;

[0047] The clamping seat is fixed to the fixing plate;

[0048] The two grippers are arranged facing each other on the gripping seat and can move in directions that bring them closer to each other and away from each other in order to grip the lower cover assembly;

[0049] The first cylinder is fixed on the clamping seat and is used to provide clamping power to the two grippers;

[0050] The gear is rotatably connected to the clamping seat, and the axial direction of the gear is perpendicular to the movement direction of the gripper.

[0051] The two racks are located on both sides of the gear, and when the gear rotates, the sliding direction of the racks is parallel to the movement direction of the gripper;

[0052] Each of the racks is fixedly connected to a corresponding gripper, and one of the racks is fixedly connected to the piston rod of the first cylinder;

[0053] The lower pressure cover assembly includes a lower pressure base, a knob, a locking component, a linkage component, and two buckle hooks;

[0054] The two latch hooks are arranged facing each other on the lower pressure seat and can move in directions that bring them closer together and away from each other in order to latch and fix or separate them from the test carrier plate.

[0055] The knob is rotatably mounted on the lower pressure seat and is connected to the two buckle hooks respectively through the linkage;

[0056] One end of the engaging component is connected to the central shaft of the gear, and the other end can engage with the knob.

[0057] When the pressure seat contacts the test plate, the first cylinder drives the rack to move, causing the gear to rotate in one direction, thereby driving the two grippers to release the pressure seat. At the same time, the gear drives the knob to rotate in one direction through its central shaft and the engaging member, thereby driving the two latch hooks to be locked to the test plate through the linkage member.

[0058] When the pressure seat needs to be separated from the test carrier plate, the first cylinder drives the rack to move in the opposite direction, causing the gear to rotate in another direction, thereby driving the two grippers to clamp the pressure seat. At the same time, the gear drives the knob to rotate in another direction through its central shaft and the locking member, thereby driving the two latch hooks to separate from the test carrier plate through the linkage member.

[0059] Furthermore, in the automated testing and sorting equipment, the pressing module further includes a pressing floating component and a positioning pin;

[0060] The positioning pin is disposed on the side of the clamping seat facing the lower pressure seat;

[0061] The side of the lower pressure seat facing the clamping seat has a positioning hole for the positioning pin to be inserted;

[0062] The orifice of the positioning hole is shaped like a guide surface to facilitate the insertion of the positioning pin;

[0063] The downward floating component passes through the fixed plate and the clamping seat, so that the positioning pin can move relative to the positioning hole in the horizontal direction, so that the positioning pin can be accurately inserted into the positioning hole.

[0064] The downward floating assembly includes a horizontal reset unit and a horizontal rotation unit;

[0065] The horizontal reset unit includes a return bead, a support plate, a reset pin, and a horizontal reset spring.

[0066] The support plate is provided with fixing holes;

[0067] The return bead is disposed in the fixing hole and contacts the clamping seat;

[0068] The reset pin is located on the clamping seat;

[0069] The horizontal return spring is sleeved on the outer periphery of the return pin, with one end abutting against the return pin and the other end abutting against the fixing plate;

[0070] The horizontal rotary unit is a ball bearing.

[0071] Furthermore, in the automated testing and sorting equipment, the number of testing devices is two;

[0072] The two testing devices are symmetrically arranged on both sides of the loading and unloading sorting device, and the two testing devices have the same structure.

[0073] Furthermore, in the automated testing and sorting equipment, the number of loading and unloading sorting modules is two;

[0074] The two loading and unloading sorting modules are arranged symmetrically on the left and right, and each is paired with a corresponding testing device, and the two loading and unloading sorting modules have the same structure.

[0075] Compared with the prior art, the present invention has the following beneficial effects:

[0076] This invention provides an automated testing and sorting device that, through a meticulously designed rotary drive module, enables the test chamber to rotate flexibly relative to a rotating support. This design allows the test chamber to perform comprehensive and accurate performance testing on chips at different angles, effectively overcoming the limitations of existing testing equipment in multi-angle testing. The combination of a motor and a reducer provides stable rotary drive force and increases output torque, ensuring the smoothness and reliability of the testing process. Simultaneously, the inclusion of an electric slip ring and an angle encoder ensures stable power and signal transmission during rotation and accurately measures the rotation angle and speed, further improving testing accuracy and efficiency. This innovative design not only promotes the advancement of chip testing technology but also provides strong support for the continued healthy development of the semiconductor industry.

[0077] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0078] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0079] Figure 1This is a three-dimensional structural diagram of an automated testing and sorting device provided in an embodiment of the present invention;

[0080] Figure 2 This is one of the top view structural schematic diagrams of an automated testing and sorting equipment provided in this embodiment of the present utility model;

[0081] Figure 3 This is a three-dimensional structural diagram of the loading and unloading sorting device provided in this embodiment of the utility model;

[0082] Figure 4 This is a three-dimensional structural diagram of the testing device provided in this embodiment of the utility model;

[0083] Figure 5 This is the second (three-dimensional) structural schematic diagram of the loading and unloading sorting device provided in this embodiment of the utility model;

[0084] Figure 6 This is a top view structural schematic diagram of the loading and unloading sorting device provided in this embodiment of the utility model;

[0085] Figure 7 This is a three-dimensional structural diagram of the feeding mechanism provided in this embodiment of the utility model;

[0086] Figure 8 This is a three-dimensional structural schematic diagram of the first shuttle mechanism provided in this embodiment of the present utility model;

[0087] Figure 9 This is a top view structural schematic diagram of the vehicle provided in this embodiment of the utility model;

[0088] Figure 10 This is a three-dimensional structural diagram of the carrier, carrier base, and photoelectric sensing module provided in this embodiment of the utility model;

[0089] Figure 11 This is a three-dimensional structural diagram of the carrier, carrier base, and striking module provided in this embodiment of the utility model;

[0090] Figure 12 This is a side view structural schematic diagram of the testing device provided in this embodiment of the utility model;

[0091] Figure 13 This is a partial three-dimensional structural diagram of the testing device provided in this embodiment of the utility model;

[0092] Figure 14 This is a three-dimensional structural schematic diagram of the third chip transfer robot provided in this embodiment of the present invention;

[0093] Figure 15 This is one of the three-dimensional structural schematic diagrams of the pressure head mechanism provided in this embodiment of the utility model;

[0094] Figure 16 This is one of the three-dimensional structural schematic diagrams of the pressing module provided in this embodiment of the utility model;

[0095] Figure 17 This is a three-dimensional structural schematic diagram of the clamp assembly provided in this embodiment of the utility model;

[0096] Figure 18 This is one of the (three-dimensional) structural schematic diagrams of the lower pressure cover assembly provided in this utility model embodiment;

[0097] Figure 19 This is the second (three-dimensional) structural schematic diagram of the lower pressure cover assembly provided in this embodiment of the utility model;

[0098] Figure 20 This is the second (three-dimensional) structural schematic diagram of the pressing module provided in this embodiment of the utility model;

[0099] Figure 21 This is the third (three-dimensional) structural schematic diagram of the pressing module provided in this embodiment of the utility model;

[0100] Figure 22 This is one of the (three-dimensional) structural schematic diagrams of the downward floating component provided in this utility model embodiment;

[0101] Figure 23 This is the second (three-dimensional) structural schematic diagram of the downward floating component provided in this embodiment of the utility model;

[0102] Figure 24 This is a three-dimensional structural schematic diagram of the third chip transfer robot provided in this embodiment of the present invention;

[0103] Figure 25 This is one of the three-dimensional structural schematic diagrams of the height adjustment module provided in this utility model embodiment;

[0104] Figure 26 This is the second (three-dimensional) structural schematic diagram of the height adjustment module provided in this embodiment of the utility model;

[0105] Figure 27 This is a three-dimensional structural diagram of the testing device provided in this embodiment of the utility model;

[0106] Figure 28 This is one of the (three-dimensional) structural schematic diagrams of the fixing mechanism provided in this utility model embodiment;

[0107] Figure 29 This is the second (three-dimensional) structural schematic diagram of the fixing mechanism provided in this embodiment of the utility model;

[0108] Figure 30This is one of the (three-dimensional) structural schematic diagrams of the rotary drive module provided in this embodiment of the utility model;

[0109] Figure 31 This is the second (three-dimensional) structural schematic diagram of the rotary drive module provided in this embodiment of the utility model.

[0110] Figure label:

[0111] 1. Loading and unloading sorting device; 2. Testing device; 3. First chip transfer robot.

[0112] Material sorting module 101;

[0113] The feeding mechanism 1012, the first shuttle mechanism 1013, the second chip transfer robot 1014, the material tray handling mechanism 1015, and the empty tray supply mechanism 1016 are all included.

[0114] OK blanking module 10121, NG blanking module 10122;

[0115] Conveying module 10131, vehicle 10132, placement slot 10133, vehicle base 10135, photoelectric sensing module 10136, and striking module 10137.

[0116] Second shuttle mechanism 201, third chip transfer robot 202, pressure head mechanism 203, testing mechanism 204, testing carrier 205, hook part 206, fixing mechanism 207;

[0117] Lifting module 2031, fixing plate 2032, pressing module 2033;

[0118] Lower pressure cover assembly 20331, clamp assembly 20332, lower pressure floating assembly 20333, positioning pin 20334, positioning hole 20335;

[0119] Clamping seat 203321, gripper 203322, cylinder 203323, gear 203324, rack 203325;

[0120] Press base 203311, knob 203312, locking part 203313, linkage part 203314, buckle hook 203315;

[0121] Return bead 203331, support plate 203332, reset pin 203333, horizontal reset spring 203334, ball bearing 203335; movable mechanism 2021, mounting frame 2022, height adjustment module 2023, suction nozzle 2024, calibration plate 2025.

[0122] Fixed block 20231, slider 20232, adjusting screw 20233, slide groove 20234;

[0123] Test box 2041, rotating support 2042, rotating drive module 2043;

[0124] Motor 20431, reducer 20432, slip ring 20433, angle encoder 20434. Detailed Implementation

[0125] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0126] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0127] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0128] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0129] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0130] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0131] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0132] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0133] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0134] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0135] Please refer to Figure 1-4 This utility model provides an automated testing and sorting device, which mainly consists of a loading and unloading sorting device 1 and two testing devices 2. Specifically, the two testing devices 2 are carefully arranged on the left and right sides of the loading and unloading sorting device 1, maintaining a symmetrical layout. At the same time, the two testing devices 2 are completely identical in structure, ensuring the consistency and reliability of the testing process.

[0136] The loading and unloading sorting device 1 plays a crucial role in this invention. It is responsible for loading the trays containing the chips to be tested, ensuring the chips can smoothly enter the testing process. After the testing process is completed, the device further classifies the tested chips according to the test results and properly stores them in the corresponding trays. Subsequently, the loading and unloading sorting device 1 further unloads the trays containing the tested chips, completing the entire testing and sorting process.

[0137] To achieve efficient chip transfer between the loading / unloading sorting device 1 and the testing device 2, this invention includes a first chip transfer robot 3 between each testing device 2 and the loading / unloading sorting device 1. The main function of this robot is to accurately transfer the chips from the loading tray into the testing device 2, thus preparing them for subsequent testing.

[0138] Test unit 2 is responsible for conducting comprehensive testing on the transferred chips. Through a precise testing process, this unit can accurately evaluate the chip's performance and quality, providing strong data support for subsequent chip classification and application.

[0139] The innovation of this embodiment lies in the fact that by setting two testing devices 2 on each side of the loading and unloading sorting device 1, and equipping them with corresponding first chip transfer robots 3, a parallel dual-testing station design is achieved, where the same loading and unloading sorting device 1 works in conjunction with two testing devices 2. This design allows the two testing stations to perform tests simultaneously without interference, greatly improving testing efficiency. Within the same time frame, the sorting machine can complete the testing of more chips, thereby significantly shortening the overall testing cycle.

[0140] Furthermore, since the loading and unloading sorting device 1 is shared by two testing devices 2, this design not only improves equipment utilization but also effectively reduces unit testing costs. At the same time, the footprint of the sorting machine is effectively controlled, providing more possibilities for on-site equipment layout and optimization.

[0141] It is worth mentioning that even if one testing unit malfunctions, the other testing unit can continue to operate normally, ensuring the continuity and stability of production. This design greatly improves the reliability and practicality of the sorting machine.

[0142] In summary, the automated testing and sorting equipment of this invention boasts a high degree of automation, reducing manual intervention and labor costs. Furthermore, it provides significant convenience and possibilities for subsequent production scale expansion and technological upgrades. Therefore, this testing and sorting machine offers substantial advantages and benefits in the semiconductor industry and is worthy of widespread promotion and application.

[0143] Please refer to Figure 5-6 This embodiment details a specific implementation method in which the loading and unloading sorting device 1 is designed to include two loading and unloading sorting modules 101. These two modules 101 are arranged symmetrically from left to right, with each module cooperating with a testing device 2, ensuring the coordination and efficiency of the entire system. It is worth noting that the two loading and unloading sorting modules 101 are structurally identical, which not only simplifies the design and manufacturing process but also facilitates maintenance and replacement.

[0144] Each loading and unloading sorting module 101 integrates multiple key components, including a loading mechanism 1011, an unloading mechanism 1012, a first shuttle mechanism 1013, and a second chip transfer robot 1014. These components work together to achieve the entire process of efficient chip loading, test preparation, post-test processing, and unloading.

[0145] The loading mechanism 1011 is responsible for accurately feeding the trays containing the chips to be tested into the system, preparing for subsequent testing procedures. This step is fundamental to ensuring the continuity and accuracy of testing.

[0146] The second chip transfer robot 1014 plays a crucial role in transferring chips within the module. It first transfers chips from the tray delivered by the loading mechanism 1011 to the first shuttle mechanism 1013. After testing, the second chip transfer robot 1014 moves again, transferring the tested chips from the first shuttle mechanism 1013 to the unloading mechanism 1012, ready for unloading.

[0147] The first shuttle mechanism 1013 serves as a bridge for chip transport and has a dual function. On one hand, it receives the chip to be tested from the second chip transfer robot 1014 and transports it to a waiting position so that the first chip transfer robot 3 can transfer the chip to the testing device 2 for testing. On the other hand, after testing is completed, the first shuttle mechanism 1013 receives the tested chip returned by the first chip transfer robot 3 and transports it to another waiting position so that the second chip transfer robot 1014 can transfer the chip to the unloading mechanism 1012.

[0148] The unloading mechanism 1012 is the end point of the entire process. It is responsible for unloading the trays containing the tested chips to ensure that the tested chips can leave the system smoothly and enter the next production or storage stage.

[0149] In summary, this embodiment, through the design of two loading / unloading sorting modules 101 in the loading / unloading sorting device 1, achieves an efficient and orderly chip loading, testing, and unloading process. This design not only improves testing efficiency but also ensures testing accuracy and reliability, providing strong support for the automation and intelligence of semiconductor production lines.

[0150] Please refer to this again. Figure 5-6 and in conjunction with references Figure 7-9 This embodiment further describes in detail the structure and function of the loading and unloading sorting device 1 in one embodiment. In this embodiment, the loading and unloading sorting device 1 not only includes the previously mentioned loading and unloading sorting module 101, but also adds a material tray conveying mechanism 1015 to enhance its material handling flexibility and efficiency.

[0151] The unloading mechanism 1012 is divided into two parts: an OK unloading module 10121 and an NG unloading module 10122. The OK unloading module 10121 is specifically responsible for unloading the trays containing chips with acceptable (OK) test results; while the NG unloading module 10122 is responsible for unloading the trays containing chips with unacceptable (NG) test results. This design ensures that the tested chips can be accurately classified and stored according to the test results.

[0152] The tray conveying mechanism 1015 plays a crucial role in the loading / unloading sorting device 1. It can move freely between the loading mechanism 1011, the OK unloading module 10121, and the NG unloading module 10122, performing the task of conveying trays. Specifically, the tray conveying mechanism 1015 removes empty trays from the loading mechanism 1011 after the chips have been transferred out, and delivers them to the OK unloading module 10121 and the NG unloading module 10122 for storage. This process ensures the efficient recycling of the trays.

[0153] In addition, the loading and unloading sorting device 1 is also equipped with an empty tray supply mechanism 1016 to provide new empty trays. The tray conveying mechanism 1015 can also move within the empty tray supply mechanism 1016 to transfer the newly loaded empty trays to the OK unloading module 10121 and the NG unloading module 10122, preparing for subsequent chip testing.

[0154] The design of the first shuttle mechanism 1013 is also quite ingenious. It consists of two parts: a transmission module 10131 and a carrier 10132. The carrier 10132 is mounted on the transmission module 10131 and is equipped with several placement slots 10133 for placing chips. The transmission module 10131 is responsible for driving the carrier 10132 and the chips on it to transport them.

[0155] Vacuum suction holes 10134 are cleverly incorporated into the placement slots 10133 to ensure the stability and accuracy of the chips during transport. These placement slots 10133 are divided into two groups: one group is used to place the chips to be tested, and the other group is used to place the chips after testing. This design not only improves the efficiency of chip processing but also avoids confusion between chips to be tested and chips after testing.

[0156] In summary, the loading and unloading sorting device 1 in this embodiment achieves a high degree of automation and intelligence in the chip testing process by introducing a tray transport mechanism 1015, a subdivided unloading mechanism 1012, an additional empty tray supply mechanism 1016, and optimizing the first shuttle mechanism 1013. These innovative designs not only improve testing efficiency but also ensure the accuracy and reliability of the tests.

[0157] Please refer to Figure 10-11 This embodiment further elaborates on a specific implementation of the first shuttle mechanism 1013, which is more refined in design to ensure the accuracy and stability of the chip during transmission.

[0158] In the first shuttle mechanism 1013, the vehicle 10132 is not directly fixed to the transmission module 10131, but is installed through the vehicle base 10135. This design allows the vehicle 10132 to cooperate more flexibly with the transmission module 10131, and also facilitates the maintenance and replacement of the vehicle 10132.

[0159] The carrier 10135 integrates a photoelectric sensing module 10136 and a tapping module 10137. These two components work together to ensure the accurate position of the chip in the placement slot 10133.

[0160] The photoelectric sensing module 10136 is positioned parallel to the carrier base 10135, directly facing the placement slot 10133 in the horizontal direction. When there is no chip in the placement slot 10133, or when the chip is placed at an angle, the photoelectric sensing module 10136 can quickly emit a sensing signal. This signal can be received by the control system and trigger a corresponding adjustment or alarm mechanism to ensure that the chip is correctly and stably placed in the placement slot 10133.

[0161] The tapping module 10137 is a mechanical adjustment device used to gently tap the carrier 10132. When the photoelectric sensing module 10136 detects that the chip is not placed properly, the tapping module 10137 can be activated to adjust the chip to the correct position by tapping the carrier 10132, ensuring that the chip can accurately enter the placement slot 10133.

[0162] Furthermore, the slot opening of placement slot 10133 is designed with a guiding ramp, the inclination angle of which is 20°. This guiding ramp design allows the chip to be placed into placement slot 10133 more smoothly, reducing the risk of the chip getting stuck or damaged due to improper placement. At the same time, the guiding ramp also serves as a preliminary positioning tool for the chip, providing a foundation for subsequent precise adjustments.

[0163] In summary, the first shuttle mechanism 1013 in this embodiment, through the introduction of a carrier base 10135, a photoelectric sensing module 10136, a tapping module 10137, and a guiding slope for the placement slot 10133, achieves precise control and stable placement of the chip during transmission. These innovative designs not only improve the efficiency of chip processing but also ensure the integrity and accuracy of the chip.

[0164] Please refer to Figure 12-14 This embodiment details a specific implementation of the testing device 2, which is ingeniously designed to efficiently and accurately complete the chip testing process.

[0165] The core components of the testing device 2 include a second shuttle mechanism 201, a third chip transfer robot 202, a pressure head mechanism 203, and a testing mechanism 204. These components work together to realize the entire process of chip reception and testing completion.

[0166] The second shuttle mechanism 201 is responsible for receiving the chips transferred from the first chip transfer robot 3. Like a conveyor belt or rail, it smoothly transports the chips to the next processing stage. This design ensures the stability and accuracy of the chips during transport, laying a solid foundation for subsequent testing.

[0167] The third chip transfer robot 202 plays a crucial role in transferring chips from the second shuttle mechanism 201 to the testing mechanism 204. It precisely grasps the chip and places it in the designated position within the testing mechanism 204, preparing it for testing. The design of the third chip transfer robot takes into account the size, shape, and material of the chip to ensure that no damage is caused to the chip during the transfer process.

[0168] The pressure head mechanism 203 is another important component in the testing device 2. It has two states: a pressed state where it abuts against the testing mechanism 204, and a separated state where it is disconnected from the testing mechanism 204. During testing, the pressure head mechanism 203 moves to the pressed state, closely engaging with the testing mechanism 204 to ensure the chip receives uniform pressure during testing, thereby improving the accuracy and reliability of the test. After testing, the pressure head mechanism 203 moves to the separated state, preparing for the testing of the next chip.

[0169] The testing mechanism 204 is the core component of the testing device 2, responsible for testing the transferred chips. The testing mechanism 204 may include various testing instruments and sensors to detect the chip's electrical performance, physical characteristics, or other relevant parameters. Through precise testing and analysis, the testing mechanism 204 can determine whether the chip is qualified and provide strong data support for subsequent production processes.

[0170] In summary, the testing device 2 in this embodiment achieves efficient and accurate chip testing through the coordinated operation of the second shuttle mechanism 201, the third chip transfer robot 202, the pressure head mechanism 203, and the testing mechanism 204. This design not only improves testing efficiency but also ensures testing accuracy and reliability, providing strong support for quality control and product optimization in semiconductor production lines.

[0171] Please refer to this again. Figure 12 and in conjunction with references Figure 15-19 This embodiment describes in detail the specific structure and working principle of the test mechanism 204 and its matching pressure head mechanism 203, especially the fine design of the pressure module 2033, so as to achieve stable clamping and accurate testing of the chip during the testing process.

[0172] The test carrier board 205 is mounted on top of the test unit 204, which serves as the working platform for chip testing. After the chip is transferred onto the test carrier board 205, a series of electrical or physical performance tests will be performed.

[0173] The pressure head mechanism 203 consists of a lifting module 2031, a fixed plate 2032, and a pressing module 2033. The lifting module 2031 is responsible for providing the lifting driving force, enabling the pressing module 2033 to move up and down so as to contact or separate from the chip on the test carrier board 205.

[0174] The pressing module 2033 is mounted on the lifting module 2031 via a fixing plate 2032. Its main function is to press down on the chip on the test carrier board 205 to ensure that the chip remains stable during the test. The pressing module 2033 further includes a pressing cover assembly 20331 and a clamping assembly 20332.

[0175] The clamp assembly 20332 is ingeniously designed, comprising a clamping base 203321, two grippers 203322, a first cylinder 203323, a gear 203324, and two racks 203325. The clamping base 203321 is fixed to the fixing plate 2032, providing support for the entire clamp assembly 20332. The two grippers 203322 are arranged facing each other on the clamping base 203321 and can move towards and away from each other to grip or release the lower pressure cap assembly 20331.

[0176] The first cylinder 203323 is fixed on the clamping seat 203321, providing clamping power to the two grippers 203322. When the piston rod of the first cylinder 203323 extends or retracts, it drives the rack 203325 to move. The gear 203324 is rotatably connected to the clamping seat 203321, and its axis is perpendicular to the direction of movement of the grippers 203322. The two racks 203325 are located on both sides of the gear 203324 and mesh with the gear 203324. When the gear 203324 rotates, it drives the two racks 203325 to slide simultaneously in opposite directions, thereby driving the two grippers 203322 to move closer or further apart.

[0177] The lower pressure cap assembly 20331 includes a lower pressure base 203311, a knob 203312, a locking component 203313, a linkage component 203314, and two latching hooks 203315. The two latching hooks 203315 are arranged facing each other on the lower pressure base 203311 and can move in directions that bring them closer together or further apart, for locking or separating from the test carrier plate 205.

[0178] The knob 203312 is rotatably mounted on the lower pressure seat 203311 and is connected to two latch hooks 203315 via the linkage 203314. When the knob 203312 is rotated, it will drive the two latch hooks 203315 to move simultaneously via the linkage 203314.

[0179] One end of the engaging component 203313 is connected to the central shaft of the gear 203324, and the other end can engage with the knob 203312. In this way, when the gear 203324 rotates, it will drive the knob 203312 to rotate through its central shaft and the engaging component 203313.

[0180] When the lower pressure seat 203311 contacts the test carrier plate 205, the first cylinder 203323 drives the rack 203325 to move, causing the gear 203324 to rotate in one direction. This causes the two grippers 203322 to release the lower pressure seat 203311, and at the same time, the gear 203324 drives the knob 203312 to rotate in one direction through its central shaft and the engaging component 203313. Through the linkage component 203314, the two latches 203315 are engaged and fixed with the test carrier plate 205.

[0181] When the pressure seat 203311 needs to be separated from the test carrier plate 205, the first cylinder 203323 drives the rack 203325 to move in the opposite direction, causing the gear 203324 to rotate in the other direction. This causes the two grippers 203322 to clamp the pressure seat 203311, while the gear 203324 drives the knob 203312 to rotate in the other direction through its central shaft and the engaging part 203313. This, in turn, drives the two latches 203315 to separate from the test carrier plate 205 through the linkage part 203314.

[0182] In summary, the pressure head mechanism 203 in this embodiment, through its ingenious design, achieves stable clamping and accurate testing of the chip during the testing process. This design not only improves the efficiency and accuracy of testing but also ensures the safety and integrity of the chip during the testing process.

[0183] Please refer to Figure 20-23 This embodiment further describes in detail the structure and working principle of the pressure floating component 20333 and the positioning pin 20334 in the pressure module 2033. These designs are intended to ensure accurate alignment and stable connection between the pressure seat 203311 and the clamping seat 203321.

[0184] The locating pin 20334 is located on the side of the clamping seat 203321 facing the pressure seat 203311. It acts as a precise guide and positioning element, ensuring that the pressure seat 203311 can be accurately aligned with the clamping seat 203321 during clamping or releasing.

[0185] The lower pressure seat 203311 has a positioning hole 20335 on the side facing the clamping seat 203321. The opening of this positioning hole is designed as a guide surface to facilitate the smooth insertion of the positioning pin 20334. Even if there is a certain horizontal deviation, the positioning pin 20334 can be accurately inserted into the positioning hole 20335 by the guiding effect of the guide surface.

[0186] The downward floating assembly 20333 is crucial for achieving precise alignment between the positioning pin 20334 and the positioning hole 20335. It passes between the fixed plate 2032 and the clamping seat 203321, allowing the positioning pin 20334 to move horizontally relative to the positioning hole 20335. This floating design ensures that even with slight deviations between the downward pressing seat 203311 and the clamping seat 203321, the positioning pin 20334 can still smoothly insert into the positioning hole 20335.

[0187] The downward floating assembly 20333 includes a horizontal reset unit and a horizontal rotation unit.

[0188] The horizontal reset unit consists of a return bead 203331, a support plate 203332, a reset pin 203333, and a horizontal reset spring 203334. The support plate 203332 has a fixing hole, in which the return bead 203331 is installed and contacts the clamping seat 203321. The reset pin 203333 is located on the clamping seat 203321, and the horizontal reset spring 203334 is sleeved on the outer circumference of the reset pin 203333, with one end abutting against the reset pin 203333 and the other end abutting against the fixing plate 2032. This design allows the clamping seat 203321 to have a certain degree of horizontal floating capability and to automatically reset after external force is applied.

[0189] The horizontal slewing unit is a ball bearing 203335. It allows for minor rotational adjustments of the clamping seat 203321 on the horizontal plane, which further enhances the flexibility of aligning the locating pin 20334 with the locating hole 20335.

[0190] In summary, the design of the pressure floating component 20333 and the positioning pin 20334 in this embodiment ensures precise alignment and stable connection between the pressure seat 203311 and the clamping seat 203321. This design not only improves the working efficiency and accuracy of the pressure module 2033, but also enhances its adaptability and reliability, enabling the entire pressure head mechanism 203 to work more stably and efficiently during chip testing.

[0191] Please refer to Figure 24-26 This embodiment describes in detail the structure and working principle of the third chip transfer robot 202, especially the design of its height adjustment module 2023 and calibration plate 2025, which ensure the accurate positioning and stable pick-up of the chip during the transfer process.

[0192] The third chip transfer robot 202 mainly consists of a moving mechanism 2021, a mounting frame 2022, several height adjustment modules 2023, and several suction nozzles 2024.

[0193] The moving mechanism 2021 provides the third chip transfer robot 202 with multi-directional mobility. This allows the robot to move freely in the X, Y, Z, and other directions to accurately locate the chip for picking up or placing.

[0194] The mounting frame 2022 is mounted on the movable mechanism 2021, providing a mounting base for several height adjustment modules 2023. The mounting frame 2022 has sufficient rigidity and stability to ensure the accuracy and reliability of the height adjustment modules 2023 and the suction nozzle 2024 during operation.

[0195] Each height adjustment module 2023 is equipped with a suction nozzle 2024. The height adjustment module 2023 is used to drive the suction nozzle 2024 to move vertically to adjust the height of the suction nozzle 2024. This design allows the robot to adapt to chips or work platforms of different heights, ensuring that the suction nozzle 2024 can accurately contact the chip surface for pick-up.

[0196] The height adjustment module 2023 includes a fixed block 20231, a slider 20232, and an adjusting screw 20233. The fixed block 20231 is mounted on the mounting frame 2022 and has a groove 20234. The slider 20232 is movably mounted within the groove 20234 and passes through the mounting frame 2022. The adjusting screw 20233 passes through the fixed block 20231, with one end abutting against the slider 20232. When the adjusting screw 20233 is screwed into the fixed block 20231, it causes the slider 20232 to move downwards in the vertical direction; conversely, when the adjusting screw 20233 is screwed out of the fixed block 20231, it causes the slider 20232 to move upwards in the vertical direction. This design allows the height adjustment module 2023 to easily adjust the height of the nozzle 2024 to adapt to different working requirements.

[0197] In addition, the third chip transfer robot 202 also includes a calibration plate 2025. The calibration plate 2025 is used to calibrate the levelness among the various nozzles 2024. During the installation or debugging of the robot, the calibration plate 2025 can be used to ensure that all nozzles 2024 are on the same horizontal plane, thereby ensuring the stability and accuracy of the chip transfer process.

[0198] In summary, the third chip transfer robot 202 in this embodiment, through the design of the height adjustment module 2023 and the calibration plate 2025, achieves precise positioning and stable pick-up of the chip during the transfer process. This design not only improves the efficiency and accuracy of chip transfer but also enhances the adaptability and reliability of the robot, enabling the entire chip testing system to operate more stably and efficiently.

[0199] Please refer to Figure 27-29This embodiment describes in detail the structure and working principle of the testing mechanism 204 and the fixing mechanism 207 in the testing device 2, especially how to fix and release the testing mechanism 204 on the frame.

[0200] The testing device 2 mainly includes a frame (not shown in detail, but it is the supporting structure of the testing device 2), a testing mechanism 204, and a fixing mechanism 207.

[0201] The testing mechanism 204 consists of a test chamber 2041, a rotating support base 2042, and a rotation drive module 2043. A test carrier board 205 is mounted on top of the test chamber 2041 for placing and supporting the chip or component to be tested. Rotating shafts 2044 are provided on both sides of the test chamber 2041, and these shafts 2044 are rotatably mounted on the rotating support base 2042, allowing the test chamber 2041 to rotate relative to the rotating support base 2042. The rotation drive module 2043 is located on the rotating support base 2042, and its drive rod is connected to one of the rotating shafts 2044 for driving the test chamber 2041 to rotate, thereby adjusting the position of the chip or component during testing.

[0202] The fixing mechanism 207 is mounted on the frame and is used to fix the rotating support 2042 to the frame to ensure the stability and accuracy of the testing mechanism 204 during the testing process. The fixing mechanism 207 includes a mounting plate 2071, a second cylinder 2072, a slide rail module 2073, a connecting rod module 2074, and a hook module 2075.

[0203] Mounting plate 2071 is fixed to the frame, serving as a support structure for fixing mechanism 207. Second cylinder 2072 is mounted on mounting plate 2071 to provide power for linear motion. The slide rail of slide rail module 2073 is mounted on mounting plate 2071, and a sliding block is movably mounted on the slide rail and connected to the telescopic rod of second cylinder 2072. When the telescopic rod of second cylinder 2072 extends or retracts, it drives the sliding block to move linearly along the slide rail.

[0204] The hook module 2075 is rotatably mounted on the sliding block via the connecting rod module 2074. The connecting rod module 2074 is provided with a mounting groove for mounting the hook module 2075. The hook module 2075 includes a hook member and a compression spring. The hook member is disposed in the mounting groove, and the compression spring is also disposed in the mounting groove, with one end abutting against the bottom of the mounting groove and the other end abutting against the hook member. The compression spring provides a force to maintain the engagement state between the hook member and the hook portion 206 on the rotating support 2042.

[0205] The hook component is equipped with a guide ramp to facilitate smooth engagement with the hook part 206 after contacting the rotating support 2042. When the telescopic rod of the second cylinder 2072 extends, it drives the sliding block to move on the slide rail. The linear motion of the sliding block is converted into the rotational motion of the hook module 2075 through the connecting rod module 2074, causing the hook component to engage with the hook part 206, thereby fixing the rotating support 2042 to the frame. When it is necessary to release the rotating support 2042, the telescopic rod of the second cylinder 2072 retracts, causing the sliding block to move in the opposite direction. The connecting rod module 2074 separates the hook component from the hook part 206, thereby releasing the rotating support 2042.

[0206] In summary, the fixing mechanism 207 in this embodiment achieves the fixing and releasing of the rotating support 2042 through the coordinated operation of the second cylinder 2072, the slide rail module 2073, the connecting rod module 2074, and the hook module 2075. This design not only improves the stability and accuracy of the testing device 2, but also enhances its adaptability and reliability, enabling the entire testing process to proceed more smoothly and efficiently.

[0207] Please refer to Figures 30-31 This embodiment describes in detail the structure of the rotary drive module 2043 and the function of each component. This module is used to drive the test box 2041 in the test mechanism 204 to rotate precisely.

[0208] The rotary drive module 2043 mainly consists of a motor 20431, a reducer 20432, an electric slip ring 20433, and an angle encoder 20434.

[0209] Motor 20431 is the power source for the rotary drive module 2043, used to output rotary drive force. Motor 20431 is typically selected with characteristics such as high speed, low noise, and high efficiency to meet the rotary drive requirements of the test device 2.

[0210] The speed reducer 20432 is connected to the motor 20431 and is used to reduce the output speed of the motor 20431 and increase its output torque. The speed reducer 20432 converts the high-speed, low-torque output of the motor 20431 into a low-speed, high-torque output through gear transmission, planetary transmission, etc., to meet the load requirements when the test box 2041 rotates.

[0211] An electric slip ring 20433 is mounted on another rotating shaft 2044 to ensure stable power and signal transmission from the stationary part to the rotating part during the rotation of the rotating shaft 2044. The electric slip ring 20433, through contact between the slip ring and the brush, ensures continuous power and signal transmission during rotation, avoiding the problem of wire entanglement between the rotating and stationary parts.

[0212] An angle encoder 20434 is also mounted on another rotating shaft 2044 to measure the angular position and rotational speed of the rotating shaft 2044. The angle encoder 20434 converts the rotational motion of the rotating shaft 2044 into electrical signals through photoelectric, magnetoelectric, or mechanical means, providing these signals to the control system for real-time monitoring and feedback. This enables the control system to precisely control the rotation angle and speed of the test chamber 2041, meeting the precise positioning requirements during the testing process.

[0213] In summary, the rotary drive module 2043 in this embodiment achieves precise rotational drive of the test box 2041 through the coordinated operation of the motor 20431, reducer 20432, slip ring 20433, and angle encoder 20434. This design not only improves the rotational accuracy and stability of the test device 2, but also enhances its adaptability and reliability, enabling the entire testing process to be carried out more accurately and efficiently.

[0214] Although this application uses terms such as loading / unloading sorting device and testing device frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0215] This utility model provides an automated testing and sorting device. By setting two testing devices on both sides of the loading and unloading sorting unit, and configuring a first chip transfer robot on each side, it enables the two testing devices to work in parallel using the same loading and unloading sorting unit. This achieves a dual-testing station design, allowing simultaneous testing without interference. This significantly improves testing efficiency, enabling more chips to be tested in the same amount of time and shortening the overall testing cycle. Furthermore, by sharing the loading and unloading sorting unit, it increases equipment utilization, reduces unit testing costs, and effectively reduces the floor space required for on-site equipment. In addition, even if one testing device malfunctions, the other can continue operating, ensuring production continuity. In summary, this testing and sorting machine has a high degree of automation, reduces manual intervention and labor costs, and provides convenience for subsequent production expansion and technological upgrades, demonstrating significant advantages and benefits.

[0216] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An automated testing and sorting device, characterized in that, Including testing equipment (2); The testing device (2) includes a testing mechanism (204); The testing mechanism (204) is used to test the transferred chip and includes a test box (2041), a rotating support base (2042), and a rotating drive module (2043). The test box (2041) is provided with rotating shafts (2044) on both sides. The rotating shaft (2044) is rotatably mounted on the rotating support (2042); The rotary drive module (2043) is disposed on the rotary support base (2042), and the drive rod of the rotary drive module (2043) is connected to one of the rotary shafts (2044) in a transmission connection. The rotary drive module (2043) includes a motor (20431), a reducer (20432), an electric slip ring (20433), and an angle encoder (20434). The motor (20431) is connected to the reducer (20432), and the reducer (20432) is connected to one of the rotating shafts (2044) in a transmission connection. The slip ring (20433) and the angle encoder (20434) are disposed on another of the rotating shafts (2044). The motor (20431) is used to output rotational driving force; The speed reducer (20432) is used to reduce the output of the motor (20431) and increase the output torque; The slip ring (20433) is used to achieve stable power and signal transmission from the stationary part to the rotating part during the rotation of the rotating shaft (2044); The angle encoder (20434) is used to measure the angular position and rotational speed of the rotating shaft (2044).

2. The automated testing and sorting equipment according to claim 1, characterized in that, The testing device (2) also includes a frame and a fixing mechanism (207); The fixing mechanism (207) is mounted on the frame and is used to fix the rotating support (2042) to the frame; the fixing mechanism (207) includes a mounting plate (2071), a second cylinder (2072), a slide rail module (2073), a connecting rod module (2074), and a hook module (2075). The mounting plate (2071) is mounted on the frame; The second cylinder (2072) is mounted on the mounting plate (2071); The slide rail module (2073) includes a sliding block and a slide rail; the slide rail is disposed on the mounting plate (2071); the sliding block is movably disposed on the slide rail and is connected to the telescopic rod of the second cylinder (2072); The hook module (2075) is rotatably mounted on the sliding block via the connecting rod module (2074); The extension and retraction of the telescopic rod of the second cylinder (2072) can drive the sliding block to move linearly on the slide rail. The linear motion of the sliding block can be converted into the rotational motion of the hook module (2075) by the connecting rod module (2074), thereby realizing the fixing or releasing action of the hook module (2075) on the rotating support (2042).

3. The automated testing and sorting equipment according to claim 2, characterized in that, The rotating support base (2042) is provided with a hook (206). The connecting rod module (2074) is provided with a mounting slot; The hook module (2075) includes a hook and a compression spring; The hook is disposed within the mounting slot; The compression spring is disposed in the mounting groove, with one end abutting against the bottom of the mounting groove and the other end abutting against the hook, and is used to provide a force to maintain the hook and the hook part (206) in a hooked state.

4. The automated testing and sorting equipment according to claim 3, characterized in that, The hook is provided with a guide slope that facilitates smooth engagement with the hook part (206) after contacting the rotating support (2042).

5. The automated testing and sorting equipment according to claim 1, characterized in that, It also includes a material sorting and unloading device (1); The loading and unloading sorting device (1) is used to load the tray containing the chip to be tested; and after the test is completed, the tested chip is classified according to the test results and stored in the corresponding tray, and then the tray containing the tested chip is unloaded. A first chip transfer robot (3) is provided between the testing device (2) and the loading and unloading sorting device (1). The first chip transfer robot (3) is used to transfer the chips in the loading tray to the testing device (2).

6. The automated testing and sorting equipment according to claim 5, characterized in that, The testing device (2) also includes a second shuttle mechanism (201), a third chip transfer robot (202), and a pressure head mechanism (203). The second shuttle mechanism (201) is used to transport the chip transferred by the first chip transfer robot (3); The third chip transfer robot (202) is used to transfer the chip conveyed by the second shuttle mechanism (201) to the testing mechanism (204). The pressure head mechanism (203) has a pressed state that abuts against the test mechanism (204) and a separated state that is separated from the test mechanism (204) to cooperate with the test mechanism (204) for testing.

7. The automated testing and sorting equipment according to claim 6, characterized in that, The test box (2041) is provided with a test carrier plate (205) on its top. The pressure head mechanism (203) includes a lifting module (2031), a fixing plate (2032), and a pressing module (2033). The lifting module (2031) is used to output lifting driving force; The pressing module (2033) is mounted on the lifting module (2031) via the fixing plate (2032) and is used to press down the chip placed on the test carrier (205) to cooperate with the test mechanism (204) for testing; The pressing module (2033) includes a pressing cover assembly (20331) and a clamping assembly (20332); The clamp assembly (20332) includes a clamping seat (203321), two jaws (203322), a first cylinder (203323), a gear (203324), and two racks (203325); The clamping seat (203321) is fixed to the fixing plate (2032); The two grippers (203322) are arranged facing each other on the clamping base (203321) and can move in directions that are closer to each other and further away from each other to grip the lower pressure cap assembly (20331); The first cylinder (203323) is fixed on the clamping seat (203321) and is used to provide clamping power to the two grippers (203322); The gear (203324) is rotatably connected to the clamping seat (203321), and the axial direction of the gear (203324) is perpendicular to the movement direction of the jaw (203322). The two racks (203325) are located on both sides of the gear (203324). When the gear (203324) rotates, the sliding direction of the racks (203325) is parallel to the movement direction of the gripper (203322). One of the racks (203325) is fixedly connected to a corresponding gripper (203322), and one of the racks (203325) is fixedly connected to the piston rod of the first cylinder (203323); The lower pressure cover assembly (20331) includes a lower pressure base (203311), a knob (203312), a locking component (203313), a linkage component (203314), and two buckle hooks (203315). The two latch hooks (203315) are arranged facing each other on the lower pressure seat (203311) and can move in directions that are close to each other and far away from each other to be latched and fixed or separated from the test carrier plate (205); The knob (203312) is rotatably mounted on the lower pressure seat (203311) and is connected to the two buckle hooks (203315) respectively through the linkage (203314); One end of the engaging component (203313) is connected to the central shaft of the gear (203324), and the other end can engage with the knob (203312); When the lower pressure seat (203311) contacts the test carrier plate (205), the first cylinder (203323) drives the rack (203325) to move, so that the gear (203324) rotates in one direction, thereby driving the two grippers (203322) to release the lower pressure seat (203311). At the same time, the gear (203324) drives the knob (203312) to rotate in one direction through its central shaft and the engaging member (203313), thereby driving the two latch hooks (203315) to be locked with the test carrier plate (205) through the linkage member (203314). When the lower pressure seat (203311) needs to be separated from the test carrier plate (205), the first cylinder (203323) drives the rack (203325) to move in the opposite direction, so that the gear (203324) rotates in the other direction, thereby driving the two jaws (203322) to clamp the lower pressure seat (203311). At the same time, the gear (203324) drives the knob (203312) to rotate in the other direction through its central shaft and the engaging member (203313), thereby driving the two latch hooks (203315) to separate from the test carrier plate (205) through the linkage member (203314).

8. The automated testing and sorting equipment according to claim 7, characterized in that, The pressing module (2033) also includes a pressing floating component (20333) and a positioning pin (20334). The positioning pin (20334) is disposed on the side of the clamping seat (203321) facing the lower pressure seat (203311); The lower pressure seat (203311) has a positioning hole (20335) on the side facing the clamping seat (203321) for the positioning pin (20334) to be inserted. The opening of the positioning hole (20335) is shaped like a guide surface to facilitate the insertion of the positioning pin (20334); The downward floating assembly (20333) passes through the fixed plate (2032) and the clamping seat (203321) to enable the positioning pin (20334) to move relative to the positioning hole (20335) in the horizontal direction, so that the positioning pin (20334) can be accurately inserted into the positioning hole (20335). The downward floating assembly (20333) includes a horizontal reset unit and a horizontal rotation unit; The horizontal reset unit includes a return bead (203331), a support plate (203332), a reset pin (203333), and a horizontal reset spring (203334). The support plate (203332) is provided with fixing holes; The return bead (203331) is disposed in the fixing hole and contacts the clamping seat (203321); The reset pin (203333) is located on the clamping seat (203321); The horizontal return spring (203334) is sleeved on the outer periphery of the return pin (203333), with one end abutting against the return pin (203333) and the other end abutting against the fixing plate (2032); The horizontal rotary unit is a ball bearing (203335).

9. The automated testing and sorting equipment according to claim 5, characterized in that, The number of test devices (2) is two; The two test devices (2) are symmetrically arranged on both sides of the loading and unloading sorting device (1), and the two test devices (2) have the same structure.

10. The automated testing and sorting equipment according to claim 9, characterized in that, The loading and unloading sorting device (1) includes a loading and unloading sorting module (101). The number of loading and unloading sorting modules (101) is two; The two loading and unloading sorting modules (101) are arranged symmetrically on the left and right, and each is matched with a corresponding test device (2), and the two loading and unloading sorting modules (101) have the same structure.

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