Three-temperature test sorting machine

Abstract

The utility model relates to automatic equipment technical field discloses a three temperature test sorting machine through setting up the heat preservation cover on the work table, forms the test space by the heat preservation cover and work table, can ensure the consistency of temperature in test space, makes the even heating of chip in test space, realizes the automation of chip three temperature test, and still pre -regulation chip's temperature through adding pre -warming device, makes the whole heating of chip more even, also saves the time required for testing because of full use of the time of waiting to carry out the preliminary temperature regulation simultaneously, thereby not only can guarantee the accuracy of chip test result, the stability of test yield, but also test efficiency is promoted, is favorable to wide range popularization and application.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a three-temperature testing and sorting machine. Background Technology

[0002] Currently, in the field of chip testing, most testing tasks can be efficiently completed using advanced automated testing equipment. However, a small number of chips, due to their special testing requirements—namely, needing to undergo performance testing in three temperature environments (high temperature, low temperature, and room temperature)—cannot be directly adapted to existing automated testing equipment.

[0003] The current testing method for these chips primarily utilizes surface-contact heating sources to locally heat the chip. Subsequently, testers manually perform point-by-point testing. However, this method has significant limitations. Due to environmental exposure, it only ensures that the side of the chip in direct contact with the heating source reaches the required test temperature, making it difficult to guarantee that the entire chip reaches the necessary temperature uniformly. Furthermore, human error can occur during each manual test, and this inconsistency can also negatively impact the test results.

[0004] In summary, the current testing method not only fails to guarantee the accuracy and stability of chip test results, leading to large fluctuations in test yield, but also has relatively cumbersome operation steps and low testing efficiency.

[0005] Therefore, in order to improve the accuracy and efficiency of chip testing and ensure the stability of test yield, it is particularly important to improve and optimize existing testing technologies.

[0006] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0007] This invention provides a three-temperature testing and sorting machine to solve the problems existing in the prior art.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A three-temperature testing and sorting machine includes a worktable, a heat insulation cover, a feeding device, a discharging device, a chip handling device, a preheating device, a chip shuttle device, a testing device, and a ventilation pipe; wherein,

[0010] The heat insulation cover is set on the workbench to form a test space with the workbench;

[0011] The feeding device, unloading device, chip handling device, preheating device, chip shuttle device, testing device, and ventilation pipe are respectively installed on the workbench and located within the testing space;

[0012] The ventilation duct is used to deliver refrigerant so that the refrigerant circulates within the test space;

[0013] The feeding device is used to feed the tray containing the chips to be tested.

[0014] The chip handling device is used to transfer chips from the loading tray to the preheating device; and to transfer preheated chips from the preheating device to the chip shuttle device; and to transfer tested chips from the chip shuttle device to the unloading device.

[0015] The preheating device is used to pre-adjust the temperature of the chip located on the preheating device before testing;

[0016] The chip shuttle device is used to transport the chip into the testing device for testing; and to transport the tested chip out of the testing device.

[0017] The testing device is used to further regulate the temperature of the chip and to test the chip.

[0018] The feeding device is used to feed the tray containing the tested chips.

[0019] Furthermore, in the three-temperature testing and sorting machine, the feeding device includes a feeding module and a gripping and waiting module;

[0020] The feeding module is used to store several trays loaded with chips to be tested, and the trays are stacked; and to provide the trays to the gripping and waiting module.

[0021] The gripping and waiting module is used to store the tray provided by the feeding module, so as to wait for the chip handling device to transfer the chips in the tray to the preheating device.

[0022] Furthermore, in the three-temperature testing and sorting machine, the feeding module includes a first conveying mechanism, a lifting mechanism, a storage slot, and a clamping mechanism;

[0023] The storage slot is used to store several stacked trays;

[0024] The lifting mechanism is located at the bottom of the storage tank and is used to move up and down through the storage tank to lift or lower the tray inside the storage tank.

[0025] The clamping mechanism is located on both sides of the storage slot and is used to extend out when the lifting mechanism lifts the material tray in the storage slot to clamp the remaining material trays except for the bottommost material tray.

[0026] The lifting mechanism is also used to lower the bottommost tray and place it onto the first conveying mechanism when the clamping mechanism clamps the other trays except the bottommost tray.

[0027] The first conveying mechanism is used to convey the tray placed thereon to the gripping waiting module.

[0028] Furthermore, in the three-temperature testing and sorting machine, the grasping and waiting module includes a second conveying mechanism, a blocking mechanism, a side pushing mechanism, and a positioning claw mechanism;

[0029] The second conveying mechanism is connected to the first conveying mechanism and is used to continue conveying the tray from the first conveying mechanism;

[0030] The blocking mechanism is located at the end of the second conveying mechanism and is used to prevent the second conveying mechanism from continuing to convey the material tray.

[0031] The side-pushing mechanism is located on one side of the second conveying mechanism and is used to push the tray laterally from the side of the tray to position the tray in the lateral direction, so as to wait for the chip handling device to transfer the chip in the tray to the preheating device.

[0032] The positioning gripper mechanism is disposed on both sides of the second conveying mechanism and is used to press the material tray positioned in the lateral direction.

[0033] Furthermore, the three-temperature testing and sorting machine also includes a material tray conveying device;

[0034] The feeding device includes an OK feeding module and an NG feeding module;

[0035] The material tray conveying device is set on the workbench and located in the test space. It can move within the gripping waiting module, the OK unloading module and the NG unloading module. It is used to transfer the empty material tray after the transferred chip is transferred from the gripping waiting module to the OK unloading module and the NG unloading module, and then store it in the OK unloading module and the NG unloading module respectively.

[0036] The OK unloading module is used to unload the tray containing chips that have passed the test and are OK.

[0037] The NG unloading module is used to unload the tray containing chips that have been tested and found to be NG.

[0038] Furthermore, the three-temperature testing and sorting machine also includes a barcode scanning device;

[0039] The chip handling device is also used to transfer the preheated chip to the barcode scanning device during the process of transferring the preheated chip from the preheating device to the chip shuttle device;

[0040] The scanning device is mounted on the workbench and located within the test space, and is used to scan the code on the chip.

[0041] Furthermore, the three-temperature testing and sorting machine also includes a camera device;

[0042] The preheating device includes a preheating platform, on which a plurality of preheating slots are provided for placing chips.

[0043] The camera device is mounted on the chip handling device and is used to assist the chip handling device in placing the chip into the preheating tank through visual recognition technology.

[0044] Furthermore, in the three-temperature testing and sorting machine, the chip shuttle device includes a third conveying mechanism and a carrier;

[0045] The carrier is mounted on the third conveying mechanism and is provided with a placement slot for placing the chip;

[0046] The third conveying mechanism is used to convey the carrier and the chip located thereon to the testing device for testing; and to convey the carrier and the chip located thereon out of the testing device after testing.

[0047] Furthermore, the three-temperature testing and sorting machine also includes a sensing device;

[0048] The sensing device is mounted on the workbench and located within the test space;

[0049] The third conveying mechanism is also used to transport the carrier and the chip located thereon to the sensing device after the test;

[0050] The sensing device is used to emit a sensing signal when there is no chip in the placement slot or when the chip is placed crookedly.

[0051] Furthermore, in the three-temperature testing and sorting machine, the testing device includes a lifting mechanism, a pneumatically driven floating module, and a pressure head;

[0052] The pressure head is disposed on the air-driven floating module and is used to contact the chip in the placement slot and perform temperature countermeasures on the chip to facilitate chip testing.

[0053] The air-driven floating module is mounted on the lifting mechanism and can move along the lifting direction under the drive of the lifting mechanism to adjust the insertion angle of the pressure head so that the pressure head can accurately contact the chip in the placement slot.

[0054] Compared with the prior art, the present invention has the following beneficial effects:

[0055] This utility model provides a three-temperature testing and sorting machine. By setting a heat insulation cover on the worktable, the heat insulation cover and the worktable form a testing space. Using a refrigerant as a medium to circulate within the testing space, the temperature consistency within the testing space can be ensured, so that the chip is heated evenly within the testing space. This realizes the automation of chip three-temperature testing. Furthermore, by adding a pre-temperature device to pre-adjust the chip temperature, the overall heating of the chip is more uniform. At the same time, by making full use of the waiting time for pre-temperature adjustment, the testing time required is saved. Thus, not only can the accuracy of chip test results and the stability of test yield be guaranteed, but the testing efficiency is also improved, which is conducive to widespread application.

[0056] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 This is one of the three-dimensional structural schematic diagrams of a three-temperature testing and sorting machine provided in this utility model embodiment;

[0059] Figure 2 This is a top view structural schematic diagram of a three-temperature testing and sorting machine provided in an embodiment of this utility model;

[0060] Figure 3 This is the second (three-dimensional) structural schematic diagram of a three-temperature testing and sorting machine provided in this embodiment of the utility model;

[0061] Figure 4 This is the third (three-dimensional) structural schematic diagram of a three-temperature testing and sorting machine provided in this embodiment of the present invention;

[0062] Figure 5 This is a three-dimensional structural diagram of the feeding device provided in this embodiment of the utility model;

[0063] Figure 6 This is a three-dimensional structural diagram of the feeding module provided in this embodiment of the utility model;

[0064] Figure 7 This is a three-dimensional structural diagram of the grasping and waiting module provided in this embodiment of the utility model;

[0065] Figure 8 This is a three-dimensional structural diagram of the feeding device and the unloading device provided in this embodiment of the utility model;

[0066] Figure 9 This is a three-dimensional structural diagram of the feeding device, unloading device, tray conveying device, and barcode scanning device provided in this embodiment of the utility model;

[0067] Figure 10 This is a three-dimensional structural diagram of the feeding device, unloading device, tray conveying device, and barcode scanning device provided in this embodiment of the utility model;

[0068] Figure 11 This is a three-dimensional structural diagram of the chip handling device, camera device, and chip shuttle device provided in the embodiments of this utility model;

[0069] Figure 12 This is a three-dimensional structural diagram of the testing device and sensing device provided in this embodiment of the utility model;

[0070] Figure 13 This is a three-dimensional structural diagram of the testing device provided in this embodiment of the utility model.

[0071] Figure label:

[0072] Workbench 1, Insulation cover 2, Feeding device 3, Unloading device 4, Chip handling device 5, Preheating device 6, Chip shuttle device 7, Testing device 8, Ventilation pipe 9, Tray handling device 10, Barcode scanning device 11, Camera device 12, Sensing device 13.

[0073] Feeding module 301, grabbing and waiting module 302;

[0074] First conveying mechanism 3011, lifting mechanism 3012, storage slot 3013, clamping mechanism 3014;

[0075] Second conveying mechanism 3021, blocking mechanism 3022, side pushing mechanism 3023, positioning claw mechanism 3024;

[0076] OK blanking module 401, NG blanking module 402;

[0077] Preheating table 601, preheating bath 602;

[0078] Third conveyor 701, vehicle 702, placement slot 703;

[0079] Lifting mechanism 801, air-driven floating module 802, pressure head 803. Detailed Implementation

[0080] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0081] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0082] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0083] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0084] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0085] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0086] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0087] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0088] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0089] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0090] Please refer to Figure 1-4 This utility model embodiment details the structural design and functional characteristics of a three-temperature testing and sorting machine. The main components of this three-temperature testing and sorting machine include a workbench 1, a heat insulation cover 2, a feeding device 3, a discharging device 4, a chip handling device 5, a preheating device 6, a chip shuttle device 7, a testing device 8, and a ventilation pipe 9. The following will provide a detailed description of each component and its function:

[0091] First, the thermal insulation cover 2 is carefully installed on the workbench 1, its main function being to form a closed testing space together with the workbench 1. This design aims to ensure the stability of the testing environment and provide a temperature-controlled closed environment for subsequent chip testing.

[0092] Secondly, key components such as the loading device 3, unloading device 4, chip handling device 5, preheating device 6, chip shuttle device 7, testing device 8, and ventilation pipe 9 are all cleverly arranged on the workbench 1, and all are located within the aforementioned testing space. This layout design not only optimizes the space utilization of the equipment but also ensures efficient and smooth collaboration between the various components.

[0093] Ventilation duct 9 serves as a refrigerant delivery channel, its function being to circulate the refrigerant within the test space. This design effectively regulates and controls the temperature within the test space, providing a uniform and stable temperature environment for chip testing.

[0094] The loading device 3 is responsible for feeding the tray containing the chips to be tested into the testing process. It ensures that the chips can enter the testing system accurately and quickly, preparing them for subsequent testing.

[0095] The chip handling device 5 is responsible for transferring the chips from the loaded tray to the preheating device 6. Simultaneously, it transfers the preheated chips from the preheating device 6 to the chip shuttle device 7, and transfers the tested chips from the chip shuttle device 7 to the unloading device 4. This device design significantly improves the handling efficiency of chips during the testing process.

[0096] The function of the pre-temperature device 6 is to pre-adjust the temperature of the chip before it undergoes formal testing. This step ensures that the chip is in an optimal temperature state during testing, thereby improving the accuracy and reliability of the test.

[0097] The chip shuttle 7 is responsible for transporting the pre-warmed chips to the testing device 8 for testing. At the same time, it also transports the tested chips out of the testing device 8, preparing them for subsequent chip processing.

[0098] Test unit 8 is the core component of chip testing. It not only further regulates the temperature of the chip to ensure the stability of the test environment, but also performs comprehensive tests on the chip to evaluate its performance and quality.

[0099] Finally, the unloading device 4 is responsible for removing the tray containing the tested chips from the testing system. It ensures that the tested chips can leave the testing system accurately and quickly, preparing them for subsequent chip processing or packaging.

[0100] In summary, this embodiment, by setting up a heat insulation cover 2 on the workbench 1, forming a closed testing space together with the workbench 1, and utilizing a refrigerant as a medium to circulate within the testing space, ensures the consistency and stability of the temperature within the testing space. This design not only automates the chip three-temperature testing process but also pre-adjusts the chip temperature by adding a pre-temperature device 6, resulting in more uniform heating of the chip. Furthermore, by fully utilizing the waiting time for pre-temperature adjustment, the total testing time is saved. Therefore, the three-temperature testing and sorting machine of this embodiment not only ensures the accuracy of chip test results and the stability of test yield but also significantly improves testing efficiency, possessing broad application prospects and promotional value.

[0101] Please refer to Figure 5-7 In one specific embodiment shown in this example, the feeding device 3 designed in this example has a compact structure and complete functions. It is mainly composed of two core components: the feeding module 301 and the gripping and waiting module 302. These two parts cooperate with each other to ensure the smoothness and efficiency of the feeding process.

[0102] Specifically, the loading module 301 plays a crucial role in this embodiment. It is responsible for storing and managing a certain number of trays, each containing chips to be tested, arranged in an orderly stacked manner. This effectively saves storage space and facilitates tray retrieval and management. More importantly, the loading module 301 also undertakes the critical task of providing trays to the pick-up waiting module 302. When needed, it can quickly and accurately transfer the trays to the pick-up waiting module 302, fully preparing for subsequent chip handling and testing.

[0103] The pick-up and wait module 302 is another indispensable part of the loading device 3. Its main function is to receive the tray from the loading module 301 and store it securely. During this process, the chips in the tray remain stationary, waiting for the arrival of the chip transport device 5. Once the chip transport device 5 is ready, it will quickly and accurately transfer the chips in the tray to the preheating device 6 according to a preset program and path. In this way, the pick-up and wait module 302 not only ensures the safety and stability of the chips during the transfer process, but also improves the efficiency and accuracy of the entire testing process.

[0104] In summary, the feeding device 3 in this embodiment, through the ingenious design of the feeding module 301 and the gripping and waiting module 302, achieves efficient storage, accurate transfer, and reliable waiting of the material tray, providing strong support for chip handling and testing.

[0105] Please refer to this again. Figure 5-7 In one embodiment of this invention, the feeding module 301 is ingeniously designed and fully functional, mainly composed of key components such as a first conveying mechanism 3011, a lifting mechanism 3012, a storage slot 3013, and a clamping mechanism 3014. These components work together to achieve an efficient and orderly feeding process for the material tray.

[0106] The storage slot 3013, as the core storage component of the loading module 301, is designed to accommodate and stack several trays. These trays are filled with chips to be tested. By stacking them, not only is storage space effectively saved, but the management and retrieval efficiency of the trays is also improved.

[0107] The lifting mechanism 3012 is located at the bottom of the storage slot 3013. Its unique design allows it to move up and down through the storage slot 3013. When it is necessary to remove the tray, the lifting mechanism 3012 moves upward to lift the tray in the storage slot 3013. This action provides the necessary preparation for subsequent tray clamping and conveying.

[0108] The clamping mechanism 3014 is cleverly arranged on both sides of the storage tank 3013. When the lifting mechanism 3012 lifts the trays in the storage tank 3013, the clamping mechanism 3014 extends quickly to clamp the trays except for the bottom one. This design ensures that only the bottom tray can be removed smoothly, while the other trays remain stable and will not shift or tip over due to the lifting action.

[0109] While the clamping mechanism 3014 clamps all the trays except the bottom one, the lifting mechanism 3012 continues its descent, smoothly placing the bottom tray onto the first conveying mechanism 3011. During this process, the coordinated operation of the lifting mechanism 3012 and the clamping mechanism 3014 ensures the accurate and safe transfer of the trays.

[0110] Finally, the first conveying mechanism 3011, as the output component of the loading module 301, is designed to transfer the tray placed on it to the gripping waiting module 302. Through the precise conveying of the first conveying mechanism 3011, the tray can smoothly reach the gripping waiting module 302, making full preparations for subsequent chip handling and testing.

[0111] In summary, the feeding module 301 in this embodiment, through the ingenious design of the first conveying mechanism 3011, the lifting mechanism 3012, the storage slot 3013 and the clamping mechanism 3014, achieves efficient storage, accurate clamping, stable transfer and orderly feeding of the material tray, providing a strong guarantee for the efficient operation of the entire testing process.

[0112] Please refer to this again. Figure 5-7 In one embodiment of this invention, the design of the gripping waiting module 302 fully embodies the concept of precise control and stable support. Its main components include a second conveying mechanism 3021, a blocking mechanism 3022, a side pushing mechanism 3023, and a positioning claw mechanism 3024. These components cooperate with each other to ensure the accurate positioning and stable holding of the tray during the gripping waiting process.

[0113] The second conveying mechanism 3021 serves as the input channel for the gripping waiting module 302 and is seamlessly connected to the first conveying mechanism 3011. Its design purpose is to continue conveying the trays transferred from the first conveying mechanism 3011, ensuring that the trays can smoothly enter the gripping waiting module 302, thus paving the way for subsequent positioning and handling operations.

[0114] The blocking mechanism 3022 is cleverly positioned at the end of the second conveying mechanism 3021. Its function is to prevent the second conveying mechanism 3021 from continuing to convey the material tray when appropriate. This design ensures that the material tray can stop accurately at the predetermined position, providing the necessary conditions for the operation of the side pushing mechanism and the positioning claw mechanism.

[0115] The side-pushing mechanism 3023 is located on one side of the second conveying mechanism 3021. Its unique function is to apply a pushing force from the side of the tray, causing the tray to move laterally until it reaches a predetermined positioning position. This action not only achieves lateral positioning of the tray but also facilitates the chip handling device 5 in accurately grasping the chips in the tray.

[0116] The positioning gripper mechanism 3024 is located on both sides of the second conveying mechanism 3021. Its function is to hold the tray that has been horizontally positioned to ensure that the tray remains stable while waiting for the chip handling device 5 and will not be displaced or tilted due to external factors (such as vibration, wind, etc.).

[0117] In summary, the gripping and waiting module 302 in this embodiment, through the meticulous design of the second conveying mechanism 3021, the blocking mechanism 3022, the side-pushing mechanism 3023, and the positioning gripper mechanism 3024, achieves efficient conveying, accurate blocking, lateral positioning, and stable holding of the material tray. This series of actions not only improves the automation level of the entire feeding process but also ensures the accuracy and reliability of the chip handling process, laying a solid foundation for subsequent chip testing.

[0118] Please refer to Figure 8-10 In one embodiment of this invention, the design of the three-temperature test sorting machine has been further improved and optimized. In particular, a key component, the material tray conveying device 10, has been introduced to improve the automation level and testing efficiency of the entire equipment.

[0119] In this embodiment, the unloading device 4 is carefully designed to include two independent modules: the OK unloading module 401 and the NG unloading module 402. Each of these two modules undertakes a different unloading task, ensuring the orderly classification and storage of the chips after testing.

[0120] The tray handling device 10 is cleverly positioned on the workbench 1 within the testing space. It has the ability to move freely between the gripping waiting module 302, the OK unloading module 401, and the NG unloading module 402. This design allows the tray handling device 10 to accurately grip trays that have become empty after the chips have been transferred away by the chip handling device 5 from the gripping waiting module 302, and transfer them to the OK unloading module 401 or the NG unloading module 402 respectively.

[0121] Specifically, the OK unloading module 401 is responsible for receiving and storing trays containing chips that have passed testing (i.e., are OK). The chips in these trays have passed all testing procedures and have been confirmed to meet quality standards, so they can be safely stored in the OK unloading module 401, awaiting further processing or packaging.

[0122] The NG unloading module 402 is used to receive and store trays containing chips that have been tested and found to be NG (i.e., unqualified). The chips in these trays have been found to have problems or defects during the testing process, so they need to be stored separately for subsequent analysis, repair, or disposal.

[0123] Through the close cooperation between the tray handling device 10 and the OK unloading module 401 and NG unloading module 402, the three-temperature test sorting machine in this embodiment achieves efficient and accurate tray handling and sorting. This design not only improves the automation level of the testing process but also ensures the accuracy and reliability of the test results, providing strong support for chip production and quality control.

[0124] Please refer to this again. Figure 8-10 The functions of the three-temperature testing and sorting machine have been further expanded and improved, with the addition of an important component, a barcode scanning device 11, to achieve accurate tracking and management of chips.

[0125] In this embodiment, the chip handling device 5 not only transfers the preheated chips from the preheating device 6 to the chip shuttle device 7, but also cleverly transfers the chips temporarily to the barcode scanning device 11 during the transfer process. This design allows the chips to undergo a barcode scanning process before entering the formal testing process, ensuring that the identity information of each chip is accurately recorded.

[0126] The barcode scanner 11 is carefully positioned on the workbench 1 within the testing space, its location chosen to ensure seamless integration with the chip handling device 5, the preheating device 6, and the chip shuttle device 7. When the chip handling device 5 transfers a chip to the barcode scanner 11, the scanner 11 quickly and accurately scans the codes on the chip. These codes typically contain key information such as the chip's unique identifier, production date, and batch number, serving as crucial evidence for chip traceability and management.

[0127] With the addition of the barcode scanning device 11, the three-temperature testing and sorting machine in this embodiment achieves full-chain tracking and management of chips. From chip production, pre-temperature control, testing to final unloading, information from each step can be accurately recorded, providing strong data support for chip quality control, problem tracing, and production optimization. At the same time, this design also improves the automation level of the testing process, reduces manual intervention, and ensures the accuracy and reliability of test results.

[0128] Please refer to Figure 11 In one embodiment of this invention, the technical configuration of the three-temperature test sorting machine has been further upgraded and optimized, with the introduction of a camera device 12 to enhance the intelligence and automation level of the equipment.

[0129] In this embodiment, the pre-temperature device 6 is a crucial part of the testing process, and its design is particularly sophisticated. The pre-temperature device 6 includes a pre-temperature stage 601, on which several pre-temperature slots 602 are carefully arranged. These pre-temperature slots 602 are specifically designed to place the chip to be tested, ensuring that the chip can reach the required temperature state before testing.

[0130] The camera device 12 is cleverly mounted on the chip handling device 5. This design allows the camera device 12 to move along with the chip handling device 5 and perform visual recognition of the preheating tank 602 and the chip when appropriate. Through advanced visual recognition technology, the camera device 12 can accurately capture the position information of the preheating tank 602 and the specific shape of the chip, thereby providing precise placement guidance for the chip handling device 5.

[0131] During chip handling, camera device 12 transmits image data to the control system in real time. The control system analyzes this data to determine the optimal placement position and directs chip handling device 5 to accurately place the chip into the preheating bath 602. This process not only improves the accuracy and efficiency of chip placement but also reduces errors and risks caused by human operation.

[0132] In summary, the three-temperature testing and sorting machine in this embodiment, through the introduction of the camera device 12 and its close cooperation with the pre-temperature device 6 and the chip handling device 5, achieves intelligent and automated chip placement. This design not only improves the smoothness and efficiency of the testing process but also provides strong technical support for chip quality control and production management.

[0133] Please refer to this again. Figure 11 In one specific embodiment described in detail in this example, the design of the chip shuttle device 7 fully demonstrates the concept of efficient and precise material transfer, which makes an important contribution to the overall performance improvement of the three-temperature test sorting machine.

[0134] The chip shuttle device 7 is mainly composed of two parts: the third transmission mechanism 701 and the carrier 702. The close cooperation between the two enables the efficient and stable transmission of chips in the testing process.

[0135] The carrier 702 is carefully positioned on the third transfer mechanism 701, and its design fully considers the chip placement requirements. The carrier 702 is equipped with placement slots 703, which are specifically designed for chip placement, ensuring the stability and safety of the chips during transport. The design of the placement slots 703 not only conforms to the size and shape of the chips but also considers the ease of chip placement and removal, facilitating subsequent testing operations.

[0136] The third conveying mechanism 701 is responsible for transporting the carrier 702 and the chip on it into the testing device 8 for testing. During testing, the third conveying mechanism 701 can precisely control the position and speed of the carrier 702 to ensure that the chip accurately enters the testing area of ​​the testing device 8. Simultaneously, after the test is completed, the third conveying mechanism 701 will also transport the carrier 702 and the chip on it out of the testing device 8, preparing for subsequent chip processing or unloading.

[0137] Through the design of the chip shuttle device 7, the three-temperature testing and sorting machine in this embodiment achieves efficient and accurate chip transfer during the testing process. This design not only improves testing efficiency but also ensures the accuracy of test results, providing strong support for chip production and quality control. At the same time, the flexibility and scalability of the chip shuttle device 7 also leave ample room for future upgrades and modifications to the equipment.

[0138] Please refer to Figure 12 In a specific embodiment described in detail in this example, the functional system of the three-temperature test sorting machine has been further improved, with the addition of a sensing device 13 to enhance the intelligent monitoring capability of the equipment in the chip testing process.

[0139] The sensing device 13 is carefully positioned on the workbench 1 within the test space, with its location chosen to ensure proper coordination and connection with the third conveying mechanism 701 and the carrier 702. After the test process is completed, the third conveying mechanism 701 will transport the carrier 702 and the chip located on it to the sensing device 13 for subsequent monitoring operations.

[0140] The main function of the sensing device 13 is to monitor the status of the chips in the placement slot 703. Specifically, when there are no chips in the placement slot 703 or the chips are placed at an angle, the sensing device 13 can quickly and accurately send a sensing signal. This design ensures the accurate placement and transfer of chips after the testing process is completed, avoiding material handling abnormalities caused by missing or improperly placed chips.

[0141] With the addition of sensing device 13, the three-temperature testing and sorting machine in this embodiment achieves real-time monitoring and feedback of chip status. Once sensing device 13 sends a sensing signal, the control system immediately receives this information and takes corresponding measures, such as stopping equipment operation, issuing an alarm, or prompting operators to check. This design not only improves the operational safety and reliability of the equipment but also reduces errors and risks caused by human operation.

[0142] In summary, the three-temperature testing and sorting machine in this embodiment, through the introduction of the sensing device 13 and its close cooperation with the third conveying mechanism 701 and the carrier 702, achieves intelligent monitoring and management of the chip status. This design not only improves the smoothness and efficiency of the testing process but also provides strong technical support for chip quality control and production management.

[0143] Please refer to Figure 13 In one embodiment of this invention, the design of the testing device 8 fully integrates the technical concepts of precision mechanics and intelligent control, providing efficient and accurate testing capabilities for the three-temperature testing and sorting machine.

[0144] The testing device 8 mainly consists of three parts: a lifting mechanism 801, a pneumatic floating module 802, and a pressure head 803. The coordinated work of these three parts enables accurate testing of the chip.

[0145] The pressure head 803, as one of the core components of the testing device 8, is carefully positioned on the air-driven floating module 802. The design of the pressure head 803 is closely related to the chip's structure and testing requirements. Its surface shape and material have been carefully selected and processed to ensure uniform and stable temperature transfer upon contact with the chip, achieving temperature offset and creating favorable conditions for chip testing. Through the close contact between the pressure head 803 and the chip, the testing device 8 can accurately perform various electrical performance tests on the chip, such as voltage, current, and resistance.

[0146] The pneumatically driven floating module 802 plays a crucial role in supporting and adjusting the position of the pressure head 803. Mounted on the lifting mechanism 801, the pneumatically driven floating module 802 can move along the lifting direction under the drive of the lifting mechanism 801. This design allows the pneumatically driven floating module 802 to flexibly adjust the insertion angle of the pressure head 803 according to the specific position of the chip, ensuring that the pressure head 803 accurately contacts the chip in the placement slot 703 and applies appropriate pressure, thereby improving the accuracy and stability of the test.

[0147] As the power source for the testing device 8, the lifting mechanism 801 directly affects the smoothness and efficiency of the entire testing process. Through a precise transmission mechanism and control system, the lifting mechanism 801 can accurately control the lifting speed and position of the pneumatic floating module 802 and the pressure head 803, ensuring the accuracy and controllability of the testing process.

[0148] Through the design of the testing device 8, the three-temperature testing and sorting machine in this embodiment achieves precise testing and adjustment of the chips. The close contact between the pressure head 803 and the chip, the flexible adjustment of the air-driven floating module 802, and the precise control of the lifting mechanism 801 together ensure the accuracy and stability of the testing process. This design not only improves testing efficiency but also ensures the reliability of the test results.

[0149] Although this application uses terms such as "workbench" and "insulation cover" frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0150] This utility model provides a three-temperature testing and sorting machine. By setting a heat insulation cover on the worktable, the heat insulation cover and the worktable form a testing space, which can ensure the temperature consistency within the testing space, so that the chip is heated evenly within the testing space, realizing the automation of chip three-temperature testing. Moreover, by adding a pre-temperature device to pre-adjust the chip temperature, the overall heating of the chip is more uniform. At the same time, by making full use of the waiting time for pre-temperature adjustment, the testing time required is saved. Thus, not only can the accuracy of chip test results and the stability of test yield be guaranteed, but the testing efficiency is also improved, which is conducive to widespread application.

[0151] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A three-temperature testing and sorting machine, characterized in that, It includes a workbench (1), a heat insulation cover (2), a feeding device (3), a discharging device (4), a chip handling device (5), a preheating device (6), a chip shuttle device (7), a testing device (8), and a ventilation pipe (9); among which, The heat insulation cover (2) is set on the workbench (1) to form a test space with the workbench (1); The loading device (3), unloading device (4), chip handling device (5), preheating device (6), chip shuttle device (7), testing device (8) and ventilation pipe (9) are respectively set on the workbench (1) and located in the testing space; The ventilation duct (9) is used to deliver refrigerant so that the refrigerant circulates within the test space; The feeding device (3) is used to feed the tray containing the chips to be tested; The chip handling device (5) is used to transfer the chips in the loading tray to the preheating device (6); and to transfer the preheated chips from the preheating device (6) to the chip shuttle device (7); and to transfer the tested chips from the chip shuttle device (7) to the unloading device (4). The preheating device (6) is used to pre-adjust the temperature of the chip located on the preheating device (6) before testing; The chip shuttle device (7) is used to transport the chip into the testing device (8) for testing; and to transport the tested chip out of the testing device (8); The testing device (8) is used to further adjust the temperature of the chip and to test the chip; The feeding device (4) is used to feed the tray loaded with the tested chips.

2. The three-temperature testing and sorting machine according to claim 1, characterized in that, The feeding device (3) includes a feeding module (301) and a gripping and waiting module (302); The loading module (301) is used to store a plurality of trays loaded with chips to be tested, the plurality of trays being stacked; and to provide the trays to the gripping waiting module (302); The grabbing and waiting module (302) is used to store the tray provided by the loading module (301) to wait for the chip handling device (5) to transfer the chip in the tray to the preheating device (6).

3. The three-temperature testing and sorting machine according to claim 2, characterized in that, The feeding module (301) includes a first conveying mechanism (3011), a lifting mechanism (3012), a storage slot (3013), and a clamping mechanism (3014). The storage slot (3013) is used to store a plurality of stacked trays; The lifting mechanism (3012) is located at the bottom of the storage tank (3013) and is used to move up and down through the storage tank (3013) to lift or lower the tray in the storage tank (3013); The clamping mechanism (3014) is located on both sides of the storage groove (3013) and is used to extend out when the lifting mechanism (3012) lifts the material tray in the storage groove (3013) to clamp the remaining material trays except for the bottommost material tray. The lifting mechanism (3012) is also used to lower the bottommost tray to place it onto the first conveying mechanism (3011) when the clamping mechanism (3014) clamps the other trays except the bottommost tray. The first conveying mechanism (3011) is used to convey the tray placed thereon to the gripping waiting module (302).

4. The three-temperature testing and sorting machine according to claim 3, characterized in that, The grasping waiting module (302) includes a second conveying mechanism (3021), a blocking mechanism (3022), a side pushing mechanism (3023), and a positioning pressure claw mechanism (3024). The second conveying mechanism (3021) is connected to the first conveying mechanism (3011) and is used to continue conveying the tray from the first conveying mechanism (3011); The blocking mechanism (3022) is disposed at the end of the second conveying mechanism (3021) and is used to block the second conveying mechanism (3021) from continuing to convey the material tray; The side-pushing mechanism (3023) is located on one side of the second conveying mechanism (3021) and is used to push the tray laterally from the side of the tray to position the tray in the lateral direction, so as to wait for the chip handling device (5) to transfer the chip in the tray to the preheating device (6). The positioning gripper mechanism (3024) is disposed on both sides of the second conveying mechanism (3021) and is used to press the material tray positioned in the lateral direction.

5. The three-temperature testing and sorting machine according to claim 2, characterized in that, It also includes a material tray handling device (10); The feeding device (4) includes an OK feeding module (401) and an NG feeding module (402). The material tray transport device (10) is set on the workbench (1) and located in the test space. It can move within the gripping waiting module (302), the OK unloading module (401), and the NG unloading module (402) to transfer the empty material tray after the transferred chip from the gripping waiting module (302) to the OK unloading module (401) and the NG unloading module (402), and is stored by the OK unloading module (401) and the NG unloading module (402) respectively. The OK unloading module (401) is used to unload the tray containing chips that have passed the test and are OK. The NG unloading module (402) is used to unload the tray containing chips that have been tested and found to be NG.

6. The three-temperature testing and sorting machine according to claim 1, characterized in that, It also includes a barcode scanning device (11); The chip handling device (5) is also used to transfer the preheated chip to the barcode scanning device (11) during the process of transferring the preheated chip from the preheating device (6) to the chip shuttle device (7). The scanning device (11) is set on the workbench (1) and located in the test space, and is used to scan the code on the chip.

7. The three-temperature testing and sorting machine according to claim 1, characterized in that, It also includes a camera device (12); The preheating device (6) includes a preheating platform (601), on which a plurality of preheating tanks (602) are provided for placing chips. The camera device (12) is mounted on the chip handling device (5) and is used to assist the chip handling device (5) in placing the chip into the preheating tank (602) through visual recognition technology.

8. The three-temperature testing and sorting machine according to claim 1, characterized in that, The chip shuttle device (7) includes a third transmission mechanism (701) and a carrier (702). The carrier (702) is mounted on the third conveying mechanism (701) and is provided with a placement slot (703) for placing the chip; The third conveying mechanism (701) is used to convey the carrier (702) and the chip thereon to the test device (8) for testing; and to convey the carrier (702) and the chip thereon out of the test device (8) after testing.

9. The three-temperature testing and sorting machine according to claim 8, characterized in that, It also includes a sensing device (13); The sensing device (13) is disposed on the workbench (1) and located within the test space; The third transmission mechanism (701) is also used to transport the carrier (702) and the chip located thereon to the sensing device (13) after the test. The sensing device (13) is used to emit a sensing signal when there is no chip in the placement slot (703) or when the chip is placed crookedly.

10. The three-temperature testing and sorting machine according to claim 8, characterized in that, The testing device (8) includes a lifting mechanism (801), a pneumatic floating module (802), and a pressure head (803). The pressure head (803) is disposed on the air-driven floating module (802) for contacting the chip in the placement slot (703) and performing temperature countermeasures on the chip to facilitate chip testing; The air-driven floating module (802) is disposed on the lifting mechanism (801) and can move along the lifting direction under the drive of the lifting mechanism (801) to adjust the insertion angle of the pressure head (803) so that the pressure head (803) can accurately contact the chip in the placement slot (703).

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