Impact-resistant composite laminate cover plate structure

Abstract

The utility model discloses an anti -impact composite layer cover plate structure relates to the technical field of electronic fittings, including carbon fiber base plate, memory metal interlayer and outer wear -resisting layer, be provided with connecting structure between carbon fiber base plate, memory metal interlayer and outer wear -resisting layer, the heat conduction structure is provided with in carbon fiber base plate inside, the utility model provides technical scheme in, through setting up carbon fiber base plate, memory metal interlayer, outer wear -resisting layer and connecting structure, specifically, through adopting memory metal as interlayer, can resist greater degree's external force impact, and the heat produced in the mobile phone use process helps memory metal interlayer recovery deformation, and set up first inlay hole and first inlay block, help to improve the connecting strength between each board layer.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, and in particular to an impact-resistant composite layer cover structure. Background Technology

[0002] With the increasing popularity and diverse functions of electronic devices, these devices frequently face the risk of impact such as drops and collisions during daily use.

[0003] Traditional back cover structures are often made of a single material, which has limited impact resistance. Once damaged, it not only affects the appearance but may also damage the internal electronic components, increasing the user's maintenance costs and inconvenience. Therefore, improvements are needed. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an impact-resistant composite layer cover structure, so as to solve the problem that the rear cover structure in the prior art is often made of a single material, with limited impact resistance. Once damaged, it not only affects the appearance, but may also damage the internal electronic components, increasing the user's maintenance costs and inconvenience.

[0005] In view of this, the present invention provides an impact-resistant composite cover plate structure, including a carbon fiber substrate, a memory metal interlayer and an outer wear-resistant layer, wherein a connecting structure is provided between the carbon fiber substrate, the memory metal interlayer and the outer wear-resistant layer, and a heat-conducting structure is provided on the inner side of the carbon fiber substrate.

[0006] The connection structure includes a plurality of first embedded holes and a plurality of first embedded blocks. The plurality of first embedded holes are formed through the shape memory metal interlayer, and the plurality of first embedded blocks are fixedly connected to one side surface of the carbon fiber substrate.

[0007] Optionally, the shape of the first embedded block matches the shape of the first embedded hole, and the first embedded block is fixedly connected to the inside of the first embedded hole.

[0008] Optionally, the carbon fiber substrate is fixedly connected to one side of the memory metal interlayer, and the outer wear-resistant layer is fixedly connected to the other side of the memory metal interlayer.

[0009] Optionally, the outer wear-resistant layer is made of polyurethane material.

[0010] Optionally, the thermally conductive structure includes a second embedded hole, a thermally conductive copper foil, and a thermally conductive copper block. The second embedded hole is opened in the middle of the first embedded block. The thermally conductive copper foil is fixedly connected to one side of the carbon fiber substrate, and the thermally conductive copper block is fixedly connected to one side of the thermally conductive copper foil.

[0011] Optionally, the shape of the thermally conductive copper block matches the shape of the second embedded hole, and the thermally conductive copper block is fixedly connected to the inside of the second embedded hole, and an insulating coating is provided on one side of the thermally conductive copper foil.

[0012] Optionally, an edge protrusion is fixedly connected to one side of the carbon fiber substrate.

[0013] As can be seen from the above technical solutions, the embodiments of this utility model have the following advantages:

[0014] 1. The present invention provides an impact-resistant composite cover structure, which comprises a carbon fiber substrate, a memory metal interlayer, an outer wear-resistant layer, and a connecting structure. Specifically, by using memory metal as the interlayer, it can withstand greater external impacts. At the same time, the heat generated during the use of the mobile phone helps the memory metal interlayer to recover its deformation. In addition, the first embedded hole and the first embedded block are provided to help improve the connection strength between the various layers.

[0015] 2. The impact-resistant composite layer cover structure of this utility model has a heat-conducting structure. Specifically, a heat-conducting copper foil and a heat-conducting copper block are installed on the inner side of the carbon fiber substrate. The large area of ​​heat-conducting copper foil helps to conduct heat of the equipment, and the heat-conducting copper block enhances the connection strength between the copper foil and the carbon fiber substrate.

[0016] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings:

[0018] Figure 1 This is an exploded view of the structure of this utility model;

[0019] Figure 2 This utility model Figure 1 A magnified view of a section at point A in the middle;

[0020] Figure 3 This is a schematic diagram of the carbon fiber substrate structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the thermally conductive copper foil structure of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Carbon fiber substrate; 2. Memory metal interlayer; 3. Outer wear-resistant layer; 401. First embedded hole; 402. First embedded block; 501. Second embedded hole; 502. Thermally conductive copper foil; 503. Thermally conductive copper block; 6. Edge protrusion. Detailed Implementation

[0023] The technical solutions of the present utility model will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of the present utility model.

[0024] The following describes in detail, with reference to the accompanying drawings, an impact-resistant composite layer cover structure of this utility model.

[0025] Example 1

[0026] For easier understanding, please refer to Figures 1 to 4 An embodiment of an impact-resistant composite cover plate structure provided by this utility model includes a carbon fiber substrate 1, a memory metal interlayer 2 and an outer wear-resistant layer 3. A connecting structure is provided between the carbon fiber substrate 1, the memory metal interlayer 2 and the outer wear-resistant layer 3, and a heat-conducting structure is provided on the inner side of the carbon fiber substrate 1.

[0027] The connection structure includes several first embedded holes 401 and several first embedded blocks 402. The several first embedded holes 401 are opened through the shape memory metal interlayer 2. The several first embedded blocks 402 are fixedly connected to one side surface of the carbon fiber substrate 1. The shape of the first embedded block 402 matches the shape of the first embedded hole 401, and the first embedded block 402 is fixedly connected to the inside of the first embedded hole 401. The carbon fiber substrate 1 is fixedly connected to one side of the shape memory metal interlayer 2, and the outer wear-resistant layer 3 is fixedly connected to the other side of the shape memory metal interlayer 2. The outer wear-resistant layer 3 is made of polyurethane material.

[0028] Among them, carbon fiber substrate 1 is made of high-strength, lightweight carbon fiber composite material, which has good mechanical properties and corrosion resistance;

[0029] Memory metal interlayer 2: Uses shape memory alloys, such as nickel-titanium alloys, which can restore their original shape after being subjected to external impact, thus providing excellent impact resistance;

[0030] The principle of shape memory metal sandwich layer 2 in restoring deformation: Under external force, the shape memory metal undergoes deformation. During this deformation, the martensite variants within it absorb deformation energy through twin boundary movement. After deformation, the internal crystal structure of the metal remains fundamentally unchanged; only the orientation of the martensite variants changes. When the temperature rises to a certain critical point (i.e., the transformation temperature or metamorphic temperature), the austenite structure regains dominance. At this point, the material recovers to the unidirectional structure of the high-temperature phase, i.e., the austenite structure, through a reverse phase transformation. Since the austenite structure is the stable state of the metal at high temperatures, the material "remembers" its initial shape and restores its pre-deformation shape. Taking nickel-titanium alloy as an example, the crystal structure of this alloy is different above and below 40℃. When the temperature fluctuates around 40℃, the alloy contracts or expands, causing its shape to change. Therefore, 40℃ is the transformation temperature of nickel-titanium shape memory alloy.

[0031] Outer wear-resistant layer 3: Made of polyurethane material, which has excellent wear resistance and scratch resistance, and can effectively protect the cover plate structure from external wear;

[0032] The carbon fiber substrate 1, the memory metal interlayer 2, and the outer wear-resistant layer 3 are bonded together with adhesive.

[0033] It should be noted that by using shape memory metal as the interlayer, it can withstand a greater degree of external impact. At the same time, the heat generated during the use of the mobile phone helps the shape memory metal interlayer 2 to recover its deformation. In addition, the first embedded hole 401 and the first embedded block 402 are provided to help improve the connection strength between the various plates.

[0034] In some embodiments, such as Figure 3 As shown, an edge protrusion 6 is fixedly connected to one side of the carbon fiber substrate 1.

[0035] It should be noted that the edge protrusion 6 serves to adhere the sealing strip that fits against the inner frame of the equipment. Furthermore, the edge protrusion 6 creates a certain compression space between the carbon fiber substrate 1 and the internal parts of the equipment, which acts as a buffer space during impact.

[0036] Example 2

[0037] In some embodiments, such as Figure 1 , Figure 2 , Figure 4As shown, the heat-conducting structure includes a second embedded hole 501, a heat-conducting copper foil 502, and a heat-conducting copper block 503. The second embedded hole 501 is opened in the middle of the first embedded block 402. The heat-conducting copper foil 502 is fixedly connected to one side of the carbon fiber substrate 1. The heat-conducting copper block 503 is fixedly connected to one side of the heat-conducting copper foil 502. The shape of the heat-conducting copper block 503 matches the shape of the second embedded hole 501, and the heat-conducting copper block 503 is fixedly connected to the inside of the second embedded hole 501. An insulating coating is provided on one side of the heat-conducting copper foil 502.

[0038] It should be noted that a thermally conductive copper foil 502 and a thermally conductive copper block 503 are installed on the side of the carbon fiber substrate 1 away from the shape memory metal interlayer 2. The large area of ​​the thermally conductive copper foil 502 helps to conduct heat in the device, and the thermally conductive copper block 503 enhances the connection strength between the thermally conductive copper foil 502 and the carbon fiber substrate 1.

[0039] Working Principle: During use, when the composite cover is impacted, its impact resistance mechanism is quickly activated, and the impact energy is first absorbed by the shape memory metal interlayer 2. Due to the unique shape memory effect of the shape memory metal, it can deform after being impacted by external force, and disperse and absorb the impact energy through the movement of its internal martensite variants. When the external force is removed, as the temperature rises back to the deformation temperature of the shape memory metal, it begins to recover its original shape. This process not only helps to resist external impacts, but also reduces the deformation caused by impact to a certain extent, maintaining the integrity of the cover structure. Furthermore, the large-area thermally conductive copper foil 502 facilitates the conduction of heat in the device, allowing heat to cover the entire back plate, which helps the shape memory metal interlayer 2 recover its original shape.

[0040] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An impact-resistant composite laminate cover structure, characterized by: It includes a carbon fiber substrate (1), a memory metal interlayer (2) and an outer wear-resistant layer (3), wherein a connection structure is provided between the carbon fiber substrate (1), the memory metal interlayer (2) and the outer wear-resistant layer (3), and a heat-conducting structure is provided on the inner side of the carbon fiber substrate (1). The connection structure includes a plurality of first embedded holes (401) and a plurality of first embedded blocks (402). The plurality of first embedded holes (401) are formed through the shape memory metal interlayer (2), and the plurality of first embedded blocks (402) are fixedly connected to one side surface of the carbon fiber substrate (1).

2. The impact-resistant composite overlay panel structure of claim 1, wherein: The shape of the first embedded block (402) matches the shape of the first embedded hole (401), and the first embedded block (402) is fixedly connected to the inside of the first embedded hole (401).

3. The impact-resistant composite overlay panel structure of claim 1, wherein: The carbon fiber substrate (1) is fixedly connected to one side of the memory metal interlayer (2), and the outer wear-resistant layer (3) is fixedly connected to the other side of the memory metal interlayer (2).

4. The impact-resistant composite overlay panel structure of claim 1, wherein: The outer wear-resistant layer (3) is made of polyurethane material.

5. The impact-resistant composite overlay panel structure of claim 1, wherein: The heat-conducting structure includes a second embedded hole (501), a heat-conducting copper foil (502), and a heat-conducting copper block (503). The second embedded hole (501) is opened in the middle of the first embedded block (402). The heat-conducting copper foil (502) is fixedly connected to one side of the carbon fiber substrate (1), and the heat-conducting copper block (503) is fixedly connected to one side of the heat-conducting copper foil (502).

6. The impact-resistant composite overlay panel structure of claim 5, wherein: The shape of the thermally conductive copper block (503) matches the shape of the second embedded hole (501), and the thermally conductive copper block (503) is fixedly connected to the inside of the second embedded hole (501). An insulating coating is provided on one side of the thermally conductive copper foil (502).

7. The impact-resistant composite overlay panel structure of claim 1, wherein: An edge protrusion (6) is fixedly connected to one side of the carbon fiber substrate (1).

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