Magnetron sputtering target assembly

Abstract

The utility model relates to target material technical field, and disclose magnetron sputtering target material subassembly, including target material, the four corners of target material outside cladding installation has processing cover, the rear end of target material is bonded and installed electrode plate, one side fixed coupling of electrode plate has side clamping plate, one side fixed coupling of side clamping plate has first connecting plate, the upper portion fixed coupling of electrode plate has limit baffle, the inside cross sleeve joint of limit baffle installs condenser pipe. This magnetron sputtering target material subassembly, through the outside installation of target material has processing cover, through telescopic board contraction, control processing cover can be installed in the outside of different size target material, adjust the angle of second screw rod and mounting sleeve simultaneously, second screw rod passes through the inside of mounting sleeve, rotates the nut, and the position of second screw rod is handled tightly by the nut, ensures that the position of processing cover outside target material is handled tightly and fixed, improves its stability when position fixed.

Description

Technical Field

[0001] This utility model relates to the field of target technology, specifically to magnetron sputtering target assemblies. Background Technology

[0002] Magnetron sputtering refers to the process where electrons, under the influence of an electric field, collide with argon atoms as they fly toward the substrate, causing the argon atoms to ionize and produce argon ions and new electrons. The new electrons fly toward the substrate, while the argon ions are accelerated by the electric field and fly toward the target material, which serves as the cathode, and bombard the surface of the target material with high energy, causing the target material to sputter. The target material assembly is a device for controlling the transmission of the equipment.

[0003] In conventional target assembly applications, the electrodes need to be energized to generate a magnetic field. However, this energizing process generates high temperatures. When these high temperatures are transferred to the target assembly through the electrodes, the target assembly deforms due to the high temperature. This deformation affects the direction of the magnetic field, which in turn affects the magnetron sputtering operation. Furthermore, when the sputtering surface of the target develops cracks due to deformation, it disrupts the uniformity of the coating and contaminates the sputtering environment. Therefore, we propose a magnetron sputtering target assembly. Utility Model Content

[0004] To address the shortcomings of existing magnetron sputtering target assemblies, this invention provides a magnetron sputtering target assembly that features heat exchange and absorption with the outside of the electrode plate via a condenser tube and a fan for cooling. Simultaneously, the fan drives gas transport, and the S-shaped condenser tube ensures gas flow, thereby improving heat dissipation efficiency and solving the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a magnetron sputtering target assembly, including a target, with processing sleeves covering the four corners of the target, an electrode plate attached to the rear end of the target, a side clamping plate fixedly connected to one side of the electrode plate, a first connecting plate fixedly connected to one side of the side clamping plate, a limiting baffle fixedly connected to the upper part of the electrode plate, a condenser tube cross-sleeved inside the limiting baffle, a second connecting plate fixedly connected to both sides of the side clamping plate, and a second screw movably installed on one side of the second connecting plate.

[0006] Preferably, the first connecting plate is movably mounted with a first screw, and the outside of the first screw is mounted on a positioning device via a positioning frame.

[0007] Preferably, the rear end of the first connecting plate is installed in the center of the electrode plate via a gas transmission sleeve, and a fan is installed inside the gas transmission sleeve, the interior of which is conical.

[0008] Preferably, the condenser tube is S-shaped, with its lower end fitted to the outside of the electrode plate. Liquid flow pipes are installed on both sides of the condenser tube, one set of which is connected to a water inlet pipe and the other set is connected to a water outlet pipe.

[0009] Preferably, a telescopic plate is installed between the two sets of processing sleeves, and the telescopic plate is fitted to the outside of the target material.

[0010] Preferably, a mounting sleeve is movably sleeved in the middle of the processing sleeve, a nut is installed on the external thread of the second screw, and the second screw penetrates the interior of the mounting sleeve.

[0011] Preferably, the electrode plate is attached to the lower end of the target material, and adhesive is applied between the electrode plate and the target material.

[0012] This invention features a processing sleeve mounted on the outside of the target material. A telescopic plate retracts, allowing the processing sleeve to be installed on targets of different sizes. Simultaneously, the angle between the second screw and the mounting sleeve is adjusted. The second screw passes through the interior of the mounting sleeve. Rotating the nut tightens the position of the second screw, ensuring the processing sleeve is securely fixed on the target material and improving its stability. This magnetron sputtering target assembly uses an S-shaped condenser tube, with its lower end fitted against the outside of the electrode plate. When the fan is activated, it transports gas to the outside of the electrode plate via a gas transfer sleeve. This ensures heat exchange between the condenser tube and the outside of the electrode plate, while the fan improves gas flow, ensuring effective cooling and preventing direct contact between the cooling liquid and the electrode plate, thus avoiding damage to the exterior of the electrode plate. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of the present utility model;

[0014] Figure 2 This is a side view of the main body structure of this utility model;

[0015] Figure 3 This is a front view structural diagram of the present invention;

[0016] Figure 4 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 5 This is an enlarged structural diagram of point A in this utility model.

[0018] In the diagram: 1. Target material; 2. Processing sleeve; 3. Telescopic plate; 4. Electrode plate; 5. Side clamping plate; 6. First connecting plate; 7. First screw; 8. Positioning frame; 9. Gas transmission sleeve; 10. Fan; 11. Limiting baffle; 12. Condenser pipe; 13. Liquid flow pipe; 14. Second connecting plate; 15. Second screw; 16. Mounting sleeve; 17. Nut. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The magnetron sputtering target assembly provided by this utility model includes a target 1, with processing sleeves 2 covering the four corners of the target 1 to reinforce the external position of the target 1. An electrode plate 4 is attached to the rear end of the target 1, forming a magnetic field. A side clamping plate 5 is fixedly connected to one side of the electrode plate 4, and a first connecting plate 6 is fixedly connected to one side of the side clamping plate 5. A limiting baffle 11 is fixedly connected to the upper part of the electrode plate 4. A condenser tube 12 is cross-sleeved and installed inside the limiting baffle 11. The condenser tube 12 exchanges heat with the external part of the electrode plate 4, and the condenser tube 12 is S-shaped to improve gas flow efficiency. A second connecting plate 14 is fixedly connected to both sides of the side clamping plate 5. A second screw 15 is movably installed on one side of the second connecting plate 14. By adjusting the angle and position of the second screw 15, the second screw 15 passes through the mounting sleeve 16, controlling the processing sleeve 2 to tighten and fix the four corners of the target 1.

[0021] refer to Figure 1 The first connecting plate 6 is movably mounted with a first screw 7. The outside of the first screw 7 is mounted on the positioning device through a positioning frame 8. When the first screw 7 is rotated, a threaded movement occurs between the first screw 7 and the positioning frame 8. This allows the height and position of the target material 1 to be adjusted, thereby improving the adjustment accuracy and the effect of use.

[0022] refer to Figure 3The rear end of the first connecting plate 6 is installed in the center of the electrode plate 4 through the gas transmission sleeve 9. A fan 10 is installed inside the gas transmission sleeve 9. The inside of the gas transmission sleeve 9 is conical. By setting the gas transmission sleeve 9 in the center of the electrode plate 4, the fan 10 is started, and the fan 10 drives the gas to circulate. At the same time, the gas transmission efficiency is improved by the conical angle of the gas transmission sleeve 9.

[0023] refer to Figure 4 The condenser tube 12 is S-shaped, with its lower end fitted to the outside of the electrode plate 4. Liquid flow pipes 13 are installed on both sides of the condenser tube 12. One set of liquid flow pipes 13 is connected to a water inlet pipe, and the other set is connected to a water outlet pipe. With the assistance of the limiting baffle 11, the lower end of the condenser tube 12 is fitted to the outside of the electrode plate 4. At the same time, the condenser tubes 12 are arranged crosswise on the outside of the electrode plate 4. The liquid flow pipes 13 carry the condensate to the inside of the condenser tubes 12. The condenser tubes 12 perform hot and cold stirring on the electrode plate 4. The outside of the condenser tubes 12 forms a space for movement. When gas flows, the air cooling efficiency can be improved. Then, under the action of water cooling and air cooling, the overall condensation efficiency of the electrode plate 4 is improved, avoiding the problem of cracking and damage to the target material 1 due to high temperature generated during use.

[0024] refer to Figure 1 A telescopic plate 3 is installed between the two sets of processing sleeves 2. The telescopic plate 3 is fitted to the outside of the target material 1. The telescopic plate 3 is installed on the side of the processing sleeve 2. The telescopic plate 3 can be extended and adjusted according to the different shapes and sizes of the target material 1 to ensure that the processing sleeve 2 is fitted to the four corners of the target material 1 and to ensure the stability of the target material 1 when it is positioned as a whole.

[0025] refer to Figure 5 The middle of the processing sleeve 2 is movably fitted with the mounting sleeve 16. The external thread of the second screw 15 is fitted with a nut 17. The second screw 15 passes through the interior of the mounting sleeve 16. After the processing sleeve 2 is fitted onto the outside of the target material 1, the angle between the second screw 15 and the mounting sleeve 16 is adjusted to control the alignment of the second screw 15 with the mounting sleeve 16. At the same time, the second screw 15 passes through the mounting sleeve 16 and the nut 17 is rotated. The nut 17 applies pressure to the mounting sleeve 16, which tightens and fixes the processing sleeve 2 on the outside of the target material 1, ensuring stability when the processing sleeve 2 is installed on the outside of the target material 1.

[0026] refer to Figure 1Electrode plate 4 is attached to the lower end of target material 1, and glue is applied between electrode plate 4 and target material 1. Electrode plate 4 is set at the rear end of target material 1 and fixed with glue to improve the stability of the positional attachment between target material 1 and electrode plate 4. Under high vacuum conditions, by applying the magnetic field, electric field and magnetic field generated by electrode plate 4, electrons collide with argon atoms to generate Ar+ ions and electrons. These incident ions bombard the target material, causing neutral atoms or molecules on the target surface to detach from the target material and deposit on the substrate surface to form a thin film.

[0027] Working principle: During use, the processing sleeve 2 is installed at the four corners of the target material 1 by controlling the size of the target material 1. The telescopic plate 3 is initially tightened to ensure the positioning of the processing sleeve 2. At the same time, the position of the second screw 15 is adjusted. The second screw 15 passes through the inside of the mounting sleeve 16 and the nut 17 is tightened, which drives the processing sleeve 2 to be tightly pressed against the outside of the target material 1, ensuring that the processing sleeve 2 maintains stability when positioned outside the target material 1. At the same time, when the equipment is in use, the liquid flow pipe 13 supplies condensate to the inside of the condenser pipe 12. The condenser pipe 12 improves the cooling and heating efficiency of the side clamp plate 5. The fan 10 is started to drive the gas flow. The shape of the condenser pipe 12 improves the gas flow efficiency, thereby improving the condensation efficiency of the equipment.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A magnetron sputtering target assembly, comprising a target (1), characterized in that: The target material (1) is covered with processing sleeves (2) at its four corners. An electrode plate (4) is attached to the rear end of the target material (1). A side clamp (5) is fixedly connected to one side of the electrode plate (4). A first connecting plate (6) is fixedly connected to one side of the side clamp (5). A limit baffle (11) is fixedly connected to the upper part of the electrode plate (4). A condenser tube (12) is cross-sleeved inside the limit baffle (11). A second connecting plate (14) is fixedly connected to both sides of the side clamp (5). A second screw (15) is movably installed on one side of the second connecting plate (14).

2. The magnetron sputtering target assembly according to claim 1, characterized in that: The first connecting plate (6) is movably mounted with a first screw (7), and the outside of the first screw (7) is mounted on a positioning device through a positioning frame (8).

3. The magnetron sputtering target assembly according to claim 1, characterized in that: The rear end of the first connecting plate (6) is installed in the center of the electrode plate (4) through a gas transmission sleeve (9). A fan (10) is installed inside the gas transmission sleeve (9), and the inside of the gas transmission sleeve (9) is conical.

4. The magnetron sputtering target assembly according to claim 1, characterized in that: The condenser tube (12) is S-shaped. The lower end of the condenser tube (12) is attached to the outside of the electrode plate (4). Liquid flow pipes (13) are installed on both sides of the condenser tube (12). One set of liquid flow pipes (13) is connected to a water inlet pipe, and the other set of liquid flow pipes (13) is connected to a water outlet pipe.

5. The magnetron sputtering target assembly according to claim 1, characterized in that: A telescopic plate (3) is installed between the two sets of processing sleeves (2), and the telescopic plate (3) is fitted to the outside of the target material (1).

6. The magnetron sputtering target assembly according to claim 1, characterized in that: The middle of the processing sleeve (2) is movably fitted with an installation sleeve (16), and the external thread of the second screw (15) is fitted with a nut (17). The second screw (15) passes through the interior of the installation sleeve (16).

7. The magnetron sputtering target assembly according to claim 1, characterized in that: The electrode plate (4) is attached to the lower end of the target material (1), and glue is applied between the electrode plate (4) and the target material (1).

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