A circuit board hole in metalization electroplating device

Abstract

The utility model discloses a kind of circuit board hole inner metallization electroplating devices, belong to circuit board electroplating technical field, the electroplating device includes electroplating pool and the fixture for clamping circuit board, further include: lifting mechanism, for driving the fixture moves up and down;Rotary mechanism, for driving the fixture rotates;Blowing mechanism, for blowing to the circuit board, the temperature of the wind includes pre-drying temperature and main drying temperature, the pre-drying temperature is 35-45 ℃, the main drying temperature is 50-65 ℃.The utility model improves drying uniformity and drying efficiency, save time and effort, in addition, temperature gradient switching improves the volatilization rate of residual liquid in hole, avoid the hole mouth scabbing caused by traditional constant temperature drying, and temperature is not too high, not easy to volatilize toxic gas.

Description

Technical Field

[0001] This utility model relates to the field of circuit board electroplating technology, and in particular to a metallization electroplating device for in-hole circuit boards. Background Technology

[0002] Metallization within circuit board holes is mainly achieved by depositing a conductive metal layer (such as copper) on the hole wall through an electrolytic reaction. The deposition of metal ions is driven by a DC or pulse power supply, and the deposition rate is affected by the concentration of the electroplating solution, the current density, and the temperature.

[0003] Because residual electroplating solution can form crystalline salts, the evaporation process, if not dried properly, can easily leave permanent watermarks on the workpiece surface, reducing the smoothness of the plating layer. In complex structures such as spiral holes and thread gaps, residual liquid can slowly evaporate, leading to corrosion and peeling of the plating layer. Therefore, circuit boards need to be dried after electroplating. Current drying technology mainly uses hot air drying, which has the following drawbacks:

[0004] 1. Residual liquid inside the pore is difficult to evaporate.

[0005] High aspect ratio micropores (such as 0.1 mm pore size) are prone to electrolyte residue due to capillary action, and traditional hot air drying is done by blowing air in one direction, which makes it difficult to penetrate the internal structure of the pores.

[0006] 2. Emission of harmful gases

[0007] Residual chemicals after electroplating (such as acidic degreasing agents and cyanide) can easily volatilize into toxic gases during high-temperature drying.

[0008] 3. Low energy efficiency

[0009] Traditional single-sided drying requires repeated operations, which is energy-intensive and time-consuming.

[0010] In view of this, the present invention provides a new solution to the above problems. Utility Model Content

[0011] The purpose of this invention is to provide a metallization electroplating device for circuit board holes to solve the technical problems mentioned in the background art.

[0012] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0013] An in-hole metallization electroplating apparatus for circuit boards includes an electroplating tank and a clamp for holding the circuit board, and further includes:

[0014] A lifting mechanism is used to move the clamp up and down;

[0015] A rotating mechanism is used to drive the clamp to rotate;

[0016] An air blowing mechanism is used to blow air onto the circuit board. The temperature of the air includes a pre-drying temperature and a main drying temperature. The pre-drying temperature is 35-45°C, and the main drying temperature is 50-65°C.

[0017] A further preferred embodiment is that the air blowing mechanism includes a cold air duct, a hot air duct, a conveying duct, an air supply duct, and a drying duct;

[0018] The cold air duct, hot air duct, and delivery duct are connected by a three-way valve. The cold air duct is connected to the cold air system, the hot air duct is connected to the hot air system, the delivery duct is connected to the air supply duct, and the drying duct is connected to the air supply duct. An air outlet is provided on the surface of the drying duct.

[0019] A further preferred embodiment is that the three-way valve is an electric three-way confluence regulating valve or a proportional-integral regulating valve.

[0020] A further preferred embodiment is that the air drying pipe is vertically arranged, the air outlet is located on the side of the air drying pipe near the circuit board, and multiple sets of air outlets are arranged vertically, with each set of air outlets including multiple air hole units.

[0021] A further preferred embodiment is that the air outlets are distributed in a gradient along the vertical direction, and the spacing between adjacent air outlets increases from bottom to top.

[0022] A further preferred embodiment is that at least two air drying pipes are provided.

[0023] A further preferred embodiment is that the lifting mechanism includes a first motor, a first fixed plate, a lead screw, a guide rod, and a second fixed plate.

[0024] A support column is fixed to the outside of the electroplating tank. The first fixing plate and the second fixing plate are both fixed on the support column. The first fixing plate is located above the second fixing plate. The first motor is installed on the second fixing plate. The lead screw is vertically arranged and its upper end is fixed to the output shaft of the first motor. Its lower end is inserted into the second fixing plate. The guide rod is arranged parallel to the lead screw and its two ends are respectively fixed to the first fixing plate and the second fixing plate.

[0025] A movable block is provided above the electroplating tank. The guide rod and the lead screw both pass through the movable block vertically. The movable block and the lead screw are threaded together.

[0026] A further preferred embodiment is that the rotating mechanism includes a second motor and a rotating shaft;

[0027] The second motor is mounted on the moving block, the upper end of the rotating shaft is connected to the output shaft of the second motor, and the lower end is fixed to the clamp.

[0028] In summary, this utility model has the following beneficial effects:

[0029] The metallization electroplating device for circuit board holes of this utility model includes an electroplating tank and a clamp for holding the circuit board, and also includes a lifting mechanism for driving the clamp to move up and down; a rotating mechanism for driving the clamp to rotate; and an air blowing mechanism for blowing air onto the circuit board. The temperature of the air includes a pre-drying temperature and a main drying temperature. The pre-drying temperature is 35-45℃ and the main drying temperature is 50-65℃.

[0030] This invention allows for initial air drying at a certain angle, followed by rotation to another angle after a certain time, improving drying uniformity and efficiency while saving time and effort. Furthermore, the temperature gradient switching increases the evaporation rate of residual liquid within the pores, avoiding scabbing at the pore openings caused by traditional constant-temperature drying. Simultaneously, the temperature remains relatively low, minimizing the release of toxic gases. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the circuit board hole metallization electroplating device according to a preferred embodiment of the present invention.

[0032] Figure 2 This is a schematic diagram of the overall structure of the circuit board hole metallization electroplating device according to a preferred embodiment of the present invention.

[0033] Figure 3 This is a schematic diagram of the air blowing mechanism of a preferred embodiment of the present invention.

[0034] In the diagram, 1. Electroplating tank; 2. Support column; 3. Lifting mechanism; 31. First motor; 32. First fixed plate; 33. Lead screw; 34. Guide rod; 35. Second fixed plate; 4. Rotating mechanism; 41. Second motor; 42. Rotating shaft; 5. Clamp; 6. Air blowing mechanism; 61. Conveying pipe; 62. Air supply pipe; 63. Drying pipe; 64. Air outlet; 7. Moving block. Detailed Implementation

[0035] The present invention will be further described in detail below with reference to the accompanying drawings.

[0036] Example: A metallization electroplating apparatus for in-hole circuit boards, such as... Figure 1-3 As shown, the system includes an electroplating tank 1, a clamp 5, a lifting mechanism 3, a rotating mechanism 4, and an air blowing mechanism 6. An inlet pipe and an outlet pipe are provided on the side of the electroplating tank 1, and a support column 2 is fixed to the outside of the electroplating tank 1. The clamp 5, lifting mechanism 3, rotating mechanism 4, and air blowing mechanism 6 are all mounted on the support column 2. The clamp 5 is used to hold the circuit board, thereby driving the circuit board to move.

[0037] Preferably, the lifting mechanism 3 is used to drive the clamp 5, the circuit board and the rotating mechanism 4 to move up and down as a whole.

[0038] Specifically, the lifting mechanism 3 includes a first motor 31, a first fixed plate 32, a lead screw 33, a guide rod 34, and a second fixed plate 35. Both the first fixed plate 32 and the second fixed plate 35 are fixed to the same side of the support column 2, with the first fixed plate 32 located above the second fixed plate 35. The first motor 31 is mounted on the second fixed plate 35. The lead screw 33 is vertically arranged with its upper end fixed to the output shaft of the first motor 31 and its lower end inserted into the second fixed plate 35. The guide rod 34 is parallel to the lead screw 33, with both ends fixed to the first fixed plate 32 and the second fixed plate 35, respectively. There are two guide rods 34, located on opposite sides of the lead screw 33. A movable block 7 is provided above the electroplating tank 1. Both the guide rod 34 and the lead screw 33 pass through the movable block 7 vertically, and the movable block 7 is threadedly engaged with the lead screw 33.

[0039] In the above technical solution, the first motor 31 drives the lead screw 33 to rotate. Through the threaded engagement of the moving block 7 with the lead screw 33, the rotational motion is converted into linear lifting motion. The double guide rods 34 are symmetrically distributed on both sides of the lead screw 33, forming a three-point positioning system, which effectively suppresses the swaying caused by off-center load. The moving block 7 integrates a rotating mechanism 4. Therefore, when the first motor 31 is started, the clamp 5, the circuit board, and the rotating mechanism 4 will rise and fall synchronously, so as to immerse the circuit board in the electroplating solution or detach it from the electroplating solution.

[0040] Preferably, the rotating mechanism 4 is used to drive the clamp 5 and the circuit board to rotate so that the blowing mechanism 6 can blow air to different positions on the circuit board.

[0041] Specifically, the rotating mechanism 4 includes a second motor 41 and a rotating shaft 42. The second motor 41 is mounted on the moving block 7, and the rotating shaft 42 is vertically arranged with its upper end passing through the moving block 7 and connected to the output shaft of the second motor 41, and its lower end fixed to the clamp 5.

[0042] In the above technical solution, when the second motor 41 drives the rotating shaft 42 to rotate, the clamp 5 and the circuit board will rotate synchronously. The rotation angle can be 0-360° or -45 to 45°. During drying, a certain angle can be maintained for air drying first, and then rotated to another angle for air drying after a certain time, which improves the drying uniformity and drying efficiency, and saves time and effort.

[0043] Preferably, the air blowing mechanism 6 is used to blow air onto the circuit board. The air temperature includes a pre-drying temperature and a main drying temperature. The pre-drying temperature is 35-45℃, and the main drying temperature is 50-65℃. During air blowing, the pre-drying temperature is used first to remove moisture from the surface of the circuit board, and then the process is switched to the main drying temperature to evaporate any residual liquid in the holes.

[0044] Preferably, the air blowing mechanism 6 includes a cold air duct, a hot air duct, a conveying pipe 61, an air supply duct 62, and a drying pipe 63. The cold air duct, hot air duct, and conveying pipe 61 are connected by a three-way valve. One end of the cold air duct inlet is connected to an external cold air system, and one end of the hot air duct inlet is connected to an external hot air system. The conveying pipe 61 is connected to the air supply duct 62, and the drying pipe 63 is connected to the air supply duct 62. The drying pipe 63 is vertically arranged and has an air outlet 64 on its surface.

[0045] Specifically, the three-way valve is either an electric three-way confluence regulating valve or a proportional-integral regulating valve.

[0046] Specifically, the vents 64 are located on the side of the air drying pipe 63 near the circuit board. The vents 64 are circular holes and there are multiple sets arranged vertically. Each set of vents 64 includes multiple vent units. The vents 64 are distributed in a gradient along the vertical direction, and the spacing between adjacent vents 64 increases from bottom to top.

[0047] Preferably, at least two air drying pipes 63 are provided. Specifically, in this embodiment, two air drying pipes 63 are provided, and the two air drying pipes 63 are respectively fixed at both ends of the air supply pipe 62, and the two air drying pipes 63 are respectively located on both sides of the support column 2.

[0048] In the above technical solution, a dynamic mixing of hot and cold air sources is achieved through an electric three-way confluence regulating valve or a proportional-integral regulating valve, realizing two-stage temperature control of pre-drying (35-45℃) and main drying (50-65℃), eliminating water stains caused by differences in surface tension of the circuit board. Gradiently distributed air outlets 64 form an airflow field with denser outlets at the bottom and sparser outlets at the top, prioritizing the removal of surface liquid from the board and enhancing capillary evaporation within the holes. Symmetrically arranged drying pipes 63 can fully cover the surface and channels of the circuit board, improving drying efficiency. Temperature gradient switching increases the evaporation rate of residual liquid within the holes, avoiding crusting at the hole openings caused by traditional constant-temperature drying, while ensuring the temperature is not too high, thus minimizing the release of toxic gases.

[0049] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A metallization electroplating apparatus for in-hole plating of a circuit board, comprising an electroplating tank (1) and a clamp (5) for holding the circuit board, characterized in that: Also includes: The lifting mechanism (3) is used to drive the clamp (5) to move up and down; A rotating mechanism (4) is used to drive the clamp (5) to rotate; An air blowing mechanism (6) is used to blow air onto the circuit board. The temperature of the air includes a pre-drying temperature and a main drying temperature. The pre-drying temperature is 35-45°C, and the main drying temperature is 50-65°C.

2. The circuit board in-hole metallization electroplating apparatus according to claim 1, characterized in that: The blowing mechanism (6) includes a cold air duct, a hot air duct, a conveying duct (61), an air supply duct (62), and a drying duct (63); The cold air duct, hot air duct, and conveying pipe (61) are connected by a three-way valve. The cold air duct is connected to the cold air system, the hot air duct is connected to the hot air system, the conveying pipe (61) is connected to the air supply pipe (62), the air drying pipe (63) is connected to the air supply pipe (62), and the air drying pipe (63) has an air outlet (64) on its surface.

3. The circuit board in-hole metallization electroplating apparatus according to claim 2, characterized in that: The three-way valve is an electric three-way confluence regulating valve or a proportional-integral regulating valve.

4. The circuit board in-hole metallization electroplating apparatus according to claim 2, characterized in that: The air drying pipe (63) is vertically arranged, and the air outlet (64) is located on the side of the air drying pipe (63) near the circuit board. There are multiple sets of air outlets (64) arranged vertically, and each set of air outlets (64) includes multiple air hole units.

5. The circuit board in-hole metallization electroplating apparatus according to claim 4, characterized in that: The air outlets (64) are distributed in a gradient along the vertical direction, and the spacing between adjacent air outlets (64) increases from bottom to top.

6. The circuit board in-hole metallization electroplating apparatus according to claim 4, characterized in that: At least two air drying pipes (63) are provided.

7. The circuit board in-hole metallization electroplating apparatus according to claim 1, characterized in that: The lifting mechanism (3) includes a first motor (31), a first fixed plate (32), a lead screw (33), a guide rod (34), and a second fixed plate (35); The electroplating tank (1) is fixed with a support column (2) on the outside. The first fixing plate (32) and the second fixing plate (35) are both fixed on the support column (2). The first fixing plate (32) is located above the second fixing plate (35). The first motor (31) is installed on the second fixing plate (35). The lead screw (33) is vertically arranged and its upper end is fixed to the output shaft of the first motor (31). Its lower end is inserted into the second fixing plate (35). The guide rod (34) is arranged parallel to the lead screw (33) and its two ends are respectively fixed on the first fixing plate (32) and the second fixing plate (35). A movable block (7) is provided above the electroplating tank (1). The guide rod (34) and the lead screw (33) both pass through the movable block (7) vertically. The movable block (7) and the lead screw (33) are threaded together.

8. The circuit board in-hole metallization electroplating apparatus according to claim 7, characterized in that: The rotating mechanism (4) includes a second motor (41) and a rotating shaft (42); The second motor (41) is mounted on the moving block (7), the upper end of the rotating shaft (42) is connected to the output shaft of the second motor (41), and the lower end is fixed to the clamp (5).

Images