A display module to improve Bondingpad reliability

Abstract

The utility model discloses a kind of display module for improving the reliability of Bonding pad, comprising: display glass, the display glass includes the binding area for binding with IC, the binding area includes several Bonding pad, the binding area is not set PLN layer and TP PV layer.The utility model can reduce Peeling risk by removing the PLN layer and TP PV layer of the binding area including Bonding pad position on display glass;Single Bonding pad occupied area is reduced, and design allowance is improved;The actual effective binding area of single Bonding pad is improved, process allowance is improved, binding offset risk is reduced, and reliability is improved.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, and in particular to a display module that improves the reliability of bonding pads. Background Technology

[0002] Please refer to the following: Figures 1 to 3 In existing display modules, a bonding area is set on the display glass, and several bonding pads are set on the bonding area. The bonding area includes an ILD layer (protective layer), an M2 layer (Gate layer), an M1 layer (Data layer), a TM2 layer (TP second metal layer), a PLN layer (planarization layer), a TP PV layer (TP protective insulating layer), and a CVD layer (TFT insulating layer, not shown in the schematic diagram, which is present on each metal layer for insulation from other metal layers). When the driver IC 3 is bonded to the display glass, the IC PAD 31 in the driver IC 3 achieves electrical connection with the bonding pads on the display glass through the conductive particles 21 in the ACF (anisotropic conductive film) 2. In order to conduct the Gate and Data on the TFT, the existing design requires drilling holes in the TP protective insulating layer, the PLN layer, and the TFT insulating layer to connect the top metal layer with the Gate and Data layers, ensuring that external electrical signals pass through the IC. After conversion, the signal can be transferred to the Gate and Data layers. In this structure, two failure modes exist during reliability testing: 1. The PLN layer absorbs water (hydrophilicity), causing it to expand and resulting in film peeling during reliability testing; 2. Conductive ions rebound during reliability testing, affecting resistance. When misaligned, less than 1 / 3 of the contact is already present, and the increased rebound resistance leads to insufficient power delivery to the corresponding bonding pad, resulting in missing wires. Therefore, the following problems exist: 1. Low reliability; 2. Uneven bonding pad height, resulting in an ineffective bonding area A, leading to a smaller actual usable area.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a display module that improves the reliability of the bonding pad.

[0005] The technical solution of this utility model is as follows: This utility model provides a display glass that improves the reliability of bonding pads, including: a display glass, the display glass including a bonding area for bonding with an IC, the bonding area including a plurality of bonding pads, and the bonding area not having a PLN layer and a TP PV layer.

[0006] Furthermore, the display glass at the bonding area includes: a glass layer, an ILD layer disposed on the glass layer, an M2 layer disposed on the ILD layer, an M1 layer disposed on the M2 layer, and a TM2 layer disposed on the M1 layer.

[0007] Furthermore, the solution also includes an IC, which is bonded to the display glass via an ACF, and the ICpad of the IC is electrically connected to the bonding pad of the display glass via conductive particles in the ACF.

[0008] Furthermore, the display glass is an LCD display glass or an OLED display glass.

[0009] The beneficial effects of this utility model by adopting the above solution are as follows: by removing the PLN layer and TP PV layer of the bonding area, including the bonding pad position, on the display glass, the peeling risk can be reduced; the area occupied by a single bonding pad is reduced, and the design margin is increased; the actual effective bonding area of ​​a single bonding pad is increased, the process margin is increased, the bonding misalignment risk is reduced, and the reliability is improved. Attached Figure Description

[0010] Figure 1 This is a cross-sectional schematic diagram of the bonding area of ​​a display glass in the prior art.

[0011] Figure 2 This is a cross-sectional view of the display glass and IC after bonding, in the prior art when no bonding misalignment has occurred.

[0012] Figure 3 This is a cross-sectional view of the display glass and IC after bonding in the prior art when bonding misalignment occurs.

[0013] Figure 4 This is a cross-sectional view of the bonding area of ​​the display glass according to an embodiment of the present invention.

[0014] Figure 5 This is a cross-sectional view of the display glass and IC after bonding in a state where no bonding misalignment has occurred, according to an embodiment of the present invention.

[0015] Figure 6 This is a cross-sectional view of the display glass and IC after bonding in a state of bonding misalignment according to an embodiment of the present invention. Detailed Implementation

[0016] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] Please refer to the following: Figures 4 to 6In this embodiment, the present invention provides a display module that improves the reliability of bonding pads, comprising: a display glass, wherein the display glass includes a bonding area for bonding with IC 3, the bonding area includes a plurality of bonding pads, and the bonding area does not have a PLN layer and a TP PV layer, thus avoiding peeling problems caused by water absorption by the PLN layer.

[0018] Furthermore, the display glass at the bonding area includes: a glass layer, an ILD layer disposed on the glass layer, an M2 layer disposed on the ILD layer, an M1 layer disposed on the M2 layer, and a TM2 layer disposed on the M1 layer.

[0019] Furthermore, the solution also includes IC 3, which is bonded to the display glass via ACF 2. The IC pad 31 of IC 3 is electrically connected to the bonding pad of the display glass via conductive particles 21 in ACF 2. Due to the absence of the PLN layer and TP PV layer and the resulting gaps, the effective contact area between the TM2 layer and ACF 2 is larger, regardless of whether the bonding is misaligned or not. Moreover, from a design perspective, the space occupied by the PLN layer and TP PV layer is reduced, allowing for a larger design area for the M2 layer, M1 layer, and TM2 layer, thus providing more margin in the design area of ​​the bonding pad.

[0020] It is worth noting that in some embodiments of this solution, the display glass is an LCD display glass, and the display module is a liquid crystal display module, which also includes a backlight module. In some embodiments of this solution, the display glass is an OLED display glass, and the display module is an OLED display module.

[0021] In summary, this solution reduces peeling risk by removing the PLN layer and TP PV layer in the bonding area, including the bonding pad location, from the display glass; it reduces the area occupied by a single bonding pad, increasing design margin; it increases the actual effective bonding area of ​​a single bonding pad, increasing process margin; it reduces bonding misalignment risk; and it improves reliability.

[0022] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A display module for improving the reliability of a bonding pad, characterized in that, include: The display glass includes a bonding area for bonding with an IC, and the bonding area includes several bonding pads. The bonding area does not have a PLN layer and a TP PV layer.

2. The display module for improving the reliability of the bonding pad according to claim 1, characterized in that, The display glass at the bonding area includes: a glass layer, an ILD layer disposed on the glass layer, an M2 layer disposed on the ILD layer, an M1 layer disposed on the M2 layer, and a TM2 layer disposed on the M1 layer.

3. The display module for improving the reliability of the bonding pad according to claim 1 or 2, characterized in that, It also includes an IC, which is bonded to the display glass via an ACF, and the IC pad of the IC is electrically connected to the bonding pad of the display glass via conductive particles in the ACF.

4. The display module for improving the reliability of the bonding pad according to claim 3, characterized in that, The display glass is either LCD display glass or OLED display glass.

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