Optical module and optical transmission system

Abstract

The application relates to an optical module and an optical transmission system. The optical module comprises a circuit board, a signal transceiving terminal, a first optical transceiving assembly, a second optical transceiving assembly and a signal processing chip which are arranged on the circuit board; the signal transceiving terminal comprises a first transceiving terminal and a second transceiving terminal; the transmission directions of the assemblies corresponding to the same channel identifier in the first optical transceiving assembly and the second optical transceiving assembly are opposite; the first transceiving terminal is connected with the first optical transceiving assembly to transmit electrical signals between the first transceiving terminal and the first optical transceiving assembly; the second transceiving terminal is connected with the second optical transceiving assembly through the signal processing chip, so that the signal processing chip transmits the electrical signals transmitted by one of the second transceiving terminal and the second optical transceiving assembly to the other after processing. The method can improve the transmission reliability of the optical module when transmitting signals and reduce the power consumption of signal transmission.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module and an optical transmission system. Background Technology

[0002] With the rapid development of modern communication technology, optical modules, as key components for converting optical signals to electrical signals, play a vital role in fiber optic communication systems, data centers, and other fields. Optical modules are responsible for the core functions of converting electrical signals into optical signals for transmission, and converting received optical signals back into electrical signals. Their performance directly affects the transmission reliability of the entire communication system.

[0003] The optical modules used in related technologies are often linear-drive pluggable optical modules (LPOs) or optical modules based on digital signal processing (DSP). However, optical modules in related technologies struggle to simultaneously meet the requirements of high transmission reliability and low power consumption. Utility Model Content

[0004] Based on this, this application provides an optical module and an optical transmission system, which not only improves the transmission reliability of the optical module when transmitting signals, but also reduces the power consumption of signal transmission.

[0005] In a first aspect, this application provides an optical module, which includes: a circuit board and signal transceiver terminals, a first optical transceiver component, a second optical transceiver component, and a signal processing chip, all disposed on the circuit board; the signal transceiver terminals include a first transceiver terminal and a second transceiver terminal; the transmission directions of the components corresponding to the same channel identifier in the first optical transceiver component and the second optical transceiver component are opposite.

[0006] The first transceiver terminal is connected to the first optical transceiver component so that electrical signals can be transmitted between the first transceiver terminal and the first optical transceiver component.

[0007] The second transceiver terminal is connected to the second optical transceiver component via a signal processing chip, so that the signal processing chip processes the electrical signal transmitted from one of the second transceiver terminal and the second optical transceiver component and then transmits it to the other.

[0008] In some embodiments, the first transceiver terminal includes a first transmitting terminal and a first receiving terminal, and the first optical transceiver component includes a first optical transmitting component and a first optical receiving component. The first transmitting terminal is connected to the first optical transmitting component, and the first receiving terminal is connected to the first optical receiving component.

[0009] The second transceiver terminal includes a second transmitting terminal and a second receiving terminal. The second optical transceiver assembly includes a second optical transmitting assembly and a second optical receiving assembly. The second transmitting terminal is connected to the second optical transmitting assembly through a signal processing chip, and the second receiving terminal is connected to the second optical receiving assembly through a signal processing chip.

[0010] The channel identifier corresponding to the first optical transmitting component is the same as the channel identifier corresponding to the second optical receiving component.

[0011] In some embodiments, the optical module further includes an optical transmitting connector and an optical receiving connector;

[0012] Both the first optical transmitting component and the second optical transmitting component are connected to the optical transmitting connector;

[0013] Both the first and second optical receiving components are connected to the optical receiving connector.

[0014] In some embodiments, signal transceiver terminals are disposed on the edge of either side of the circuit board, a first optical transceiver assembly is disposed between the signal transceiver terminals and the signal processing chip, and a second optical transceiver assembly is disposed on the side of the signal processing chip opposite to the first optical transceiver assembly.

[0015] In some embodiments, the signal processing chip and the second optical transceiver component are disposed on a first surface of the circuit board, and the first optical transceiver component is disposed on a second surface of the circuit board, with the first surface of the circuit board opposite to the second surface of the circuit board; or...

[0016] The signal processing chip, the second optical transceiver component, and the first optical transceiver component are all mounted on the first surface of the circuit board.

[0017] In some embodiments, a first optical transmitting component is embedded in a first through-hole in a circuit board, and a second optical transmitting component is embedded in a second through-hole in a circuit board, wherein the size of the first through-hole is smaller than the size of the second through-hole.

[0018] In some embodiments, the first optical transmitting component includes a first heat dissipation structure and a first optical transmitting component. The first heat dissipation structure is embedded in a first through hole, a portion of the components in the first optical transmitting component are disposed on the first heat dissipation structure, and another portion of the components in the first optical transmitting component are disposed on a circuit board.

[0019] The second optical transmission component includes a second heat dissipation structure and a second optical transmission component. The second heat dissipation structure is embedded in a second through hole, and all components in the second optical transmission component are disposed on the second heat dissipation structure.

[0020] In some embodiments, the first heat dissipation structure includes a heat dissipation structure body and a protrusion on the heat dissipation structure body, and a portion of the first light transmitting component is disposed on the surface of the heat dissipation structure body opposite to the protrusion; the protrusion is embedded in a first through hole.

[0021] In some embodiments, a recessed portion is provided on the surface of the circuit board, a first through hole is provided in the recessed portion, and the size of the first through hole is smaller than the size of the recessed portion; another part of the device in the first optical transmitting component is provided on the recessed portion.

[0022] In a second aspect, this application provides an optical transmission system, which includes a first optical fiber, a second optical fiber, and two optical modules, each optical module including the optical module described in any one of the first aspects;

[0023] In this configuration, the first optical transceiver component of one of the two optical modules is connected to the second optical transceiver component of the other optical module via a first optical fiber, and the second optical transceiver component of one of the two optical modules is connected to the first optical transceiver component of the other optical module via a second optical fiber.

[0024] In the technical solution provided in this application embodiment, since the first transceiver terminal is connected to the first optical transceiver component, and the second transceiver terminal is connected to the second optical transceiver component through a signal processing chip, the signal processing chip only processes the signal corresponding to the second optical transceiver component and not the signal corresponding to the first optical transceiver component. Therefore, compared to the signal processing chip needing to process both the signals corresponding to the first and second optical transceiver components, the power consumption of the signal processing chip can be reduced by decreasing the amount of signal processed. Furthermore, since the transmission directions of the components corresponding to the same channel identifier in the first and second optical transceiver components are opposite, the first optical transceiver component can be connected to the second optical transceiver component of another optical module, and the second optical transceiver component can be connected to another optical module. The first optical transceiver component is processed by the signal processing chip of the second optical transceiver component, while the signal processing chip of the other optical module only processes the signal corresponding to the first optical transceiver component and not the signal corresponding to the first optical transceiver component. Therefore, the signal corresponding to the first optical transceiver component in this embodiment is processed by the signal processing chip of the other optical module, while the signal corresponding to the second optical transceiver component is not processed by the signal processing chip of the other optical module. This allows the signal corresponding to each optical transceiver component in the optical module to be processed by the signal processing chip once, thereby improving the reliability of signal transmission. In this way, by ensuring that the signal corresponding to each optical transceiver component in the optical module is processed by the signal processing chip once, the transmission reliability of the optical module when transmitting signals is improved, and the power consumption of signal transmission is reduced. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the structure of an optical module provided in the first embodiment;

[0027] Figure 2 A schematic diagram of the optical module provided in the second embodiment;

[0028] Figure 3 A schematic diagram of the optical module provided in the third embodiment;

[0029] Figure 4 A schematic diagram of the structure of the first surface of the optical module provided in the fourth embodiment;

[0030] Figure 5 A schematic diagram of the structure of the second surface of the optical module provided in the fourth embodiment;

[0031] Figure 6 A schematic diagram of the structure of a first surface of a circuit board and signal transceiver terminals disposed on the circuit board, provided for some embodiments;

[0032] Figure 7 A schematic diagram of the structure of the second surface of a circuit board and signal transceiver terminals disposed on the circuit board, provided for some embodiments;

[0033] Figure 8 A schematic diagram of the structure of a first optical transmitting component provided in some embodiments;

[0034] Figure 9 A schematic diagram of the structure of a second optical transmitting component and a second optical receiving component on a circuit board provided for some embodiments;

[0035] Figure 10 A schematic diagram showing the location of the first through hole in a circuit board provided in some embodiments;

[0036] Figure 11 This is a schematic diagram of the first heat dissipation structure.

[0037] Figure 12 Schematic diagrams of the structure of an optical transmission system provided for some embodiments;

[0038] Figure 13 A schematic diagram of the structure of an optical transmission system provided for other embodiments. Detailed Implementation

[0039] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0041] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined. In the description of the embodiments of this application, "each" means each of the multiple options, unless otherwise explicitly defined.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0044] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0045] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0046] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0047] Linearly driven pluggable optical modules (LPOs) are optical communication modules that forgo digital signal processing (DSP) chips, relying solely on analog circuitry for linear amplification and driving of optical signals. Their core advantages lie in extremely low power consumption and cost, making them suitable for short-distance, low-latency transmission scenarios. Furthermore, LPOs, through their pluggable design, are compatible with Small Form-factor Pluggable (SFP), Quad Small Form-factor Pluggable (QSFP), or Octal Small Form-factor Pluggable (OSFP) interfaces, supporting hot-swapping and adapting to existing network architectures. However, because LPOs eliminate DSP chips—which are used for digital processing of electrical signals to address signal quality issues during optical transmission—they suffer from low signal transmission reliability.

[0048] A digital signal processing (DSP)-based optical module refers to an optical module with a DSP chip installed. The DSP chip digitizes electrical signals to solve signal quality problems during optical transmission. However, the DSP requires a large amount of power during operation, resulting in high power consumption of the optical module.

[0049] Therefore, optical modules in related technologies struggle to simultaneously meet the requirements of high transmission reliability and low power consumption.

[0050] Based on this, the present application provides a new optical module that can simultaneously meet the requirements of high transmission reliability and low power consumption.

[0051] Figure 1 A schematic diagram of the structure of an optical module provided in the first embodiment is shown below. Figure 1 As shown, the optical module 100 includes: a circuit board 110 and signal transceiver terminals 120, a first optical transceiver component 130, a second optical transceiver component 140, and a signal processing chip 150, all disposed on the circuit board 110. The signal transceiver terminal 120 includes a first transceiver terminal 121 and a second transceiver terminal 122; the channel identifier corresponding to the first optical transceiver component 130 is the same as the channel identifier corresponding to the second optical transceiver component 140.

[0052] The first transceiver terminal 121 is connected to the first optical transceiver component 130 so that signals can be transmitted between the first transceiver terminal 121 and the first optical transceiver component 130; the second transceiver terminal 122 is connected to the second optical transceiver component 140 through the signal processing chip 150 so that the signal processing chip 150 processes the signal transmitted from one of the second transceiver terminal 122 and the second optical transceiver component 140 and transmits it to the other.

[0053] In some embodiments, the connection between the transceiver terminal and the transceiver component can be through wires in the circuit board 110, and the connection between the transceiver terminal and the transceiver component through the signal processing chip 150 can be through wires in the circuit board 110.

[0054] The optical module 100 realizes the mutual conversion function between optical signals and electrical signals in the field of optical communication technology. The optical module 100 achieves optical communication with information transmission devices such as optical fibers or optical waveguides through optical transceiver components (e.g., the first optical transceiver component 130 and the second optical transceiver component 140), and achieves electrical connection with a signal terminal through signal transceiver terminals 120. The electrical connection is mainly used for power supply, I2C signal transmission, data information transmission, and grounding. For example, the signal terminal may include a combination of at least two of the following: servers, storage devices, network switches, base stations, routers, optical line terminals, computer equipment, monitoring equipment, industrial control equipment, cloud computing nodes, edge computing nodes, optical network terminals (e.g., optical modems), etc.

[0055] In some embodiments, the circuit board 110 may include a printed circuit board (PCB), a ceramic substrate, a metal substrate, or a flexible circuit board, etc. In this embodiment, the circuit board 110 is a PCB.

[0056] In some embodiments, the signal transceiver terminal 120 is used to connect to a signal terminal. For example, the signal transceiver terminal 120 is connected to the signal terminal via an interface such as a Small Form Factor (SFP), a Quad Small Form Factor (QSFP), or an Eight Small Form Factor (OSFP). Exemplarily, hot-swapping can be supported between the optical module 100 and the signal terminal. In some embodiments, the signal transceiver terminal 120 may include gold fingers.

[0057] In some embodiments, the channel identifier corresponding to the first transceiver terminal 121 in the signal transceiver terminal 120 is the same as the channel identifier corresponding to the first optical transceiver component 130, so that the first transceiver terminal 121 can be connected to the first optical transceiver component 130; the channel identifier corresponding to the second transceiver terminal 122 in the signal transceiver terminal 120 is the same as the channel identifier corresponding to the second optical transceiver component 140, so that the second transceiver terminal 122 can be connected to the second optical transceiver component 140.

[0058] In some embodiments, the optical transceiver components (e.g., the first optical transceiver component 130 and the second optical transceiver component 140) are components for converting electrical signals to optical signals. The optical transmitting component in the optical transceiver component is used to receive electrical signals and convert them into optical signals for transmission (e.g., transmitted via optical fiber to the optical receiving component of another optical module), and the optical receiving component in the optical transceiver component is used to receive optical signals and convert them into electrical signals for transmission (e.g., transmitted via signal transceiver terminal 120 to a signal terminal).

[0059] In some embodiments, the signal processing chip 150 may include a DSP chip. The signal processing chip 150 can digitize electrical signals to solve signal quality problems during optical transmission, thereby improving the reliability of signal transmission. The function of the signal processing chip 150 can be found in descriptions in related technologies, and this application embodiment does not limit it.

[0060] In some embodiments, the connection between the first transceiver terminal 121 and the first optical transceiver assembly 130 in the optical module 100 can be made through lines on the circuit board 110. In some embodiments, the connection between the second transceiver terminal 122, the signal processing chip 150, and the second optical transceiver assembly 140 can be made through lines on the circuit board 110.

[0061] In some embodiments, channel identifiers are used to distinguish and identify different signal transmission paths.

[0062] In some embodiments, the channel identifier corresponding to the first optical transceiver component 130 is the same as the channel identifier corresponding to the second optical transceiver component 140.

[0063] In some embodiments, different components in the first optical transceiver assembly 130 have different channel identifiers, and different components in the second optical transceiver assembly 140 have different channel identifiers.

[0064] In some embodiments, the channel identifier corresponding to the optical transmitting component in the first optical transceiver component 130 is different from the channel identifier corresponding to the optical receiving component, and the channel identifier corresponding to the optical transmitting component in the second optical transceiver component 140 is different from the channel identifier corresponding to the optical receiving component. In some embodiments, the channel identifier corresponding to the optical transmitting component in the first optical transceiver component 130 is the same as the channel identifier corresponding to the optical receiving component in the second optical transceiver component 140, and the channel identifier corresponding to the optical receiving component in the first optical transceiver component 130 is the same as the channel identifier corresponding to the optical transmitting component in the second optical transceiver component 140.

[0065] For example, taking an eight-channel system, the optical transmitting components in the first optical transceiver component 130 are identified by the channel identifiers TX1, TX2, TX3, and TX4, the optical receiving components in the first optical transceiver component 130 are identified by the channel identifiers RX5, RX6, RX7, and RX8, the optical transmitting components in the second optical transceiver component 140 are identified by the channel identifiers TX5, TX6, TX7, and TX8, and the optical receiving components in the second optical transceiver component 140 are identified by the channel identifiers RX1, RX2, RX3, and RX4.

[0066] For example, taking a four-channel system, the optical transmitting component in the first optical transceiver component 130 is identified by channel identifiers TX9 and TX10, the optical receiving component in the first optical transceiver component 130 is identified by channel identifiers RX11 and RX12, the optical transmitting component in the second optical transceiver component 140 is identified by channel identifiers TX11 and TX12, and the optical receiving component in the second optical transceiver component 140 is identified by channel identifiers RX9 and RX10.

[0067] It should be noted that the above examples are merely illustrative of the channel identifiers corresponding to the optical transmitting component and the optical receiving component, and do not constitute a limitation on this application. Those skilled in the art may use other numbers of channels.

[0068] In the technical solution provided in this application embodiment, since the first transceiver terminal 121 is connected to the first optical transceiver component 130, and the second transceiver terminal 122 is connected to the second optical transceiver component 140 through the signal processing chip 150, the signal processing chip 150 only processes the signal corresponding to the second optical transceiver component 140 and does not process the signal corresponding to the first optical transceiver component 130. Therefore, compared to the signal processing chip 150 needing to process the signal corresponding to the first optical transceiver component 130 and the signal corresponding to the second optical transceiver component 140, the power consumption of the signal processing chip 150 can be reduced by reducing the amount of signal processed. Furthermore, since the transmission directions of the components corresponding to the same channel identifier in the first optical transceiver component 130 and the second optical transceiver component 140 are opposite, the first optical transceiver component 130 can be correspondingly connected to the second optical transceiver component 140 of another optical module, and the second optical transceiver component 140 can be correspondingly connected to... The signal is transmitted to the first optical transceiver component 130 of another optical module. Since the signal processing chip 150 of the other optical module only processes the signal corresponding to the second optical transceiver component 140 and not the signal corresponding to the first optical transceiver component 130, the signal corresponding to the first optical transceiver component 130 in this embodiment will be processed by the signal processing chip 150 of the other optical module, while the signal corresponding to the second optical transceiver component 140 will not be processed by the signal processing chip 150 of the other optical module. This allows the signal corresponding to each optical transceiver component in the optical module 100 to be processed once by the signal processing chip 150, thereby improving the reliability of signal transmission. In this way, by ensuring that the signal corresponding to each optical transceiver component in the optical module 100 is processed once by the signal processing chip 150, the transmission reliability of the optical module 100 when transmitting signals is improved, and the power consumption of signal transmission is reduced.

[0069] Figure 2 This is a schematic diagram of the optical module provided in the second embodiment. Figure 2 Compared to the example Figure 1 The difference in the embodiments is as follows: the first transceiver terminal 121 includes a first transmitting terminal 1211 and a first receiving terminal 1212; the first optical transceiver assembly 130 includes a first optical transmitting assembly 131 and a first optical receiving assembly 132; the first transmitting terminal 1211 is connected to the first optical transmitting assembly 131; and the first receiving terminal 1212 is connected to the first optical receiving assembly 132. The second transceiver terminal 122 includes a second transmitting terminal 1221 and a second receiving terminal 1222; the second optical transceiver assembly 140 includes a second optical transmitting assembly 141 and a second optical receiving assembly 142; the second transmitting terminal 1221 is connected to the second optical transmitting assembly 141 through a signal processing chip 150; and the second receiving terminal 1222 is connected to the second optical receiving assembly 142 through a signal processing chip 150.

[0070] In this implementation, the channel identifier corresponding to the first optical transmitting component 131 is the same as the channel identifier corresponding to the second optical receiving component 142, and the channel identifier corresponding to the first optical receiving component 132 is the same as the channel identifier corresponding to the second optical transmitting component 141.

[0071] In the technical solution provided in this application embodiment, by configuring the first optical transmitting component 131 and the second optical receiving component 142 with the same channel identifier, and by configuring the first optical receiving component 131 and the second optical transmitting component 141 with the same channel identifier, combined with the differentiated connection methods of the transceiver terminals and optical components, a bidirectional symmetrical channel structure is naturally formed during signal transmission. This structure allows the signal emitted by the first optical transmitting component 131 to be directly received by the second optical receiving component 142, and vice versa, without the need for additional channel allocation or routing conversion. This technology simplifies the hardware architecture of the communication system (reducing the number of channels required) and improves the symmetry and stability of signal transmission, significantly improving data transmission efficiency while reducing system costs.

[0072] Figure 3 This is a schematic diagram of the optical module provided in the third embodiment. Figure 4 This is a schematic diagram of the structure of the first surface of the optical module provided in the fourth embodiment. Figure 5 This is a schematic diagram of the structure of the second surface of the optical module provided in the fourth embodiment. Exemplarily, the first surface and the second surface can be opposite each other. For example, the first surface can be the upper surface, and the second surface can be the lower surface. Or, for another example, the first surface can be the lower surface, and the second surface can be the upper surface.

[0073] like Figures 3 to 5 As shown, Figures 3 to 5 Compared to the example Figure 2 The difference in the embodiments is that the optical module 100 further includes an optical connector 160, which includes an optical transmitting connector 161 and an optical receiving connector 162; the first optical transmitting component 131 and the second optical transmitting component 141 are both connected to the optical transmitting connector 161; the first optical receiving component 132 and the second optical receiving component 142 are both connected to the optical receiving connector 162.

[0074] For example, the first optical transmitting component 131 and the first optical receiving component 132 are both connected to the optical transmitting connector 161 and the optical receiving connector 162 respectively via the third optical fiber 170, and the second optical transmitting component 141 and the second optical receiving component 142 are both connected to the optical transmitting connector 161 and the optical receiving connector 162 respectively via the fourth optical fiber 180.

[0075] In some embodiments, optical connector 160 may include a multi-fiber push-on connector (MPO). A multi-fiber push-on connector is an optical fiber connector composed of multiple optical fibers. In some embodiments, optical transmitter connector 161 may include a multi-fiber push-on transmitter connector, and optical receiver connector 162 may include a multi-fiber push-on receiver connector.

[0076] like Figures 3 to 5 As shown, the optical transmitter connector 161 and the optical receiver connector 162 can be disposed outside the circuit board 110. For example, the optical transmitter connector 161 and the optical receiver connector 162 are spaced apart from the circuit board 110. Figures 3 to 5 In other embodiments, the optical transmitter connector 161 and the optical receiver connector 162 may be disposed on the circuit board 110.

[0077] In the technical solution provided in this application embodiment, by connecting the first optical transmitting component 131 and the second optical transmitting component 141 together to the optical transmitting connector 161, and simultaneously connecting the first optical receiving component 132 and the second optical receiving component 142 together to the optical receiving connector 162, a high degree of integration of the optical signal transmission interface is achieved. This allows external devices to complete signal interaction with multiple optical components through only two connectors (optical transmitting and optical receiving). Compared with the distributed connection method, this significantly reduces the number of external connection ports, lowers wiring complexity, and reduces the probability of connection errors. Furthermore, the unified connector interface facilitates later maintenance and replacement of the optical module 100, making plugging and unplugging operations more convenient. This not only saves installation space but also effectively improves the overall stability and reliability of the optical module 100.

[0078] Signal transceiver terminals 120 are located on either side of the edge of the circuit board 110. Figures 3 to 5 In the embodiment shown, the signal transceiver terminal 120 is disposed on the edge of one side of the circuit board 110, the first optical transceiver component 130 is disposed between the signal transceiver terminal 120 and the signal processing chip 150, and the second optical transceiver component 140 is disposed on the side of the signal processing chip 150 opposite to the first optical transceiver component 130.

[0079] For example, the signal transceiver terminal 120 is disposed on the edge of a short side of the circuit board 110.

[0080] In some instances, the signal transceiver terminal 120, the first optical transceiver assembly 130, the signal processing chip 150, and the second optical transceiver assembly 140 are arranged along a first direction. Exemplarily, the first direction may be a direction parallel to the long side of the circuit board 110.

[0081] In some implementations, the first setting area of ​​the signal transceiver terminal 120 on the circuit board 110 does not overlap with the second setting area of ​​the first optical transceiver component 130 on the circuit board 110. For example, the first setting area may be spaced apart from the second setting area by a first set distance, which is greater than 0, so as to leave space for the wiring between the signal transceiver terminal 120 and the first optical transceiver component 130.

[0082] In some embodiments, the second setting area of ​​the first optical transceiver component 130 on the circuit board 110 does not overlap with the third setting area of ​​the signal processing chip 150 on the circuit board 110. For example, the second setting area may be spaced apart from the third setting area by a second predetermined distance, which is greater than 0, to prevent the first through-hole on the circuit board 110 for embedding the first optical transceiver component 130 from affecting the wiring of the signal processing chip 150.

[0083] In some embodiments, the third setting area of ​​the signal processing chip 150 on the circuit board 110 does not overlap with the fourth setting area of ​​the second optical transceiver component 140 on the circuit board 110. Exemplarily, the third setting area may be spaced apart from the fourth setting area by a third predetermined distance, which is greater than 0, so as to leave space for the wiring of the signal processing chip 150 and the second optical transceiver component 140.

[0084] In the technical solution provided in this application embodiment, the first optical transceiver component 130 is arranged as close as possible to the signal transceiver terminal 120, so that the transmission distance of the electrical signal transmitted between the first optical transceiver component 130 and the signal transceiver terminal 120 is as short as possible, reducing link loss and thereby improving the reliability of electrical signal transmission between the first optical transceiver component 130 and the signal transceiver terminal 120.

[0085] exist Figures 4 to 5 In the embodiment shown, the signal processing chip 150 and the second optical transceiver component 140 are disposed on the first surface of the circuit board 110, and the first optical transceiver component 130 is disposed on the second surface of the circuit board 110, with the first surface of the circuit board 110 and the second surface of the circuit board 110 facing each other.

[0086] For example, the first surface of the circuit board 110 is the front surface of the circuit board 110, and the second surface of the circuit board 110 is the back surface of the circuit board 110. For example, the first surface of the circuit board 110 is the back surface of the circuit board 110, and the second surface of the circuit board 110 is the front surface of the circuit board 110.

[0087] In the technical solution provided in this application, the first optical transceiver component 130 and the signal processing chip 150 are arranged on opposite sides of the circuit board 110. This avoids the problem of the third optical fiber 170 connected to the output end of the first optical transceiver component 130 needing to cross the signal processing chip 150 when the first optical transceiver component 130 and the signal processing chip 150 are arranged on the same side, which would cause the signal processing chip 150 to be covered by the third optical fiber 170, thereby reducing the heat dissipation area of ​​the signal processing chip 150. Therefore, by arranging the first optical transceiver component 130 and the signal processing chip 150 on opposite sides of the circuit board 110, the third optical fiber 170 connected to the output end of the first optical transceiver component 130 does not need to cross the signal processing chip 150, thus avoiding the problem of the signal processing chip 150 being covered by the third optical fiber 170. The heat dissipation of 0 is affected; and it can also avoid the problem that when the first optical transceiver component 130 and the signal processing chip 150 are laid out on the same side, if the third optical fiber 170 connected to the output end of the first optical transceiver component 130 does not cross the signal processing chip 150, then the size of the circuit board 110 needs to be increased so that the third optical fiber 170 can bypass the signal processing chip 150, resulting in an increase in the size of the optical module 100; in addition, by laying out the signal processing chip 150 and the second optical transceiver component 140 on the same side, the signal transmission path between the two can be significantly shortened, effectively reducing signal loss and delay during transmission, thereby improving the efficiency and stability of signal transmission, and this layout method does not require complex multi-layer wiring or cross-layer connection, simplifying the overall structural design.

[0088] exist Figure 3 In the embodiment shown, the signal processing chip 150, the second optical transceiver component 140, and the first optical transceiver component 130 are all disposed on the first surface of the circuit board 110.

[0089] In the technical solution provided in this application embodiment, the signal processing chip 150, the second optical transceiver component 140, and the first optical transceiver component 130 are all disposed on the first surface of the circuit board 110. When assembling the optical module 100, the installation of these key components can be completed on the same side without repeatedly flipping the circuit board 110, which greatly reduces the assembly steps and improves production efficiency. Furthermore, it eliminates the need for complex multi-layer wiring or cross-layer connections, simplifying the overall structural design. With all components concentrated on one side, the wiring connections are more direct, reducing problems such as loose wiring and poor contact caused by multi-layer wiring or cross-layer connections, and enhancing the stability of the product.

[0090] Figure 6 This is a schematic diagram of the first surface of a circuit board and signal transceiver terminals disposed on the circuit board, provided for some embodiments. Figure 7 This is a schematic diagram illustrating the structure of a second surface of a circuit board and signal transceiver terminals disposed on the circuit board, provided for some embodiments. For example, the first surface is the front side, and the second surface is the back side. Figure 6 and Figure 7 The diagram shows a circuit board 110 and signal transceiver terminals 120 on the circuit board.

[0091] The circuit board 110 has a first through hole 1101 and a second through hole 1102. It can be seen that the size of the first through hole 1101 is smaller than the size of the second through hole 1102.

[0092] In some embodiments, the size of the first through hole 1101 may be less than or equal to half the size of the second through hole 1102.

[0093] See also Figures 4 to 7 The first optical transmitting component 131 is embedded in the first through hole 1101 in the circuit board 110, and the second optical transmitting component 141 is embedded in the second through hole 1102 in the circuit board 110, wherein the size of the first through hole 1101 is smaller than the size of the second through hole 1102.

[0094] In the technical solution provided in this application embodiment, the first through hole 1101 for embedding the first optical transmitting component 131 is smaller than the second through hole 1102 for embedding the second optical transmitting component 141. The size of the first through hole 1101 is smaller than the size of the second through hole 1102, thereby avoiding the problem of a large opening area of ​​the circuit board 110 due to the use of large sizes for both the first through hole 1101 and the second through hole 1102. Thus, this application embodiment can reduce the opening area of ​​the circuit board 110. In addition, the first optical transceiver component 130 is close to the signal transceiver terminal 120 device. For example, the first optical transceiver component 130 is disposed between the signal transceiver terminal 120 and the signal transceiver terminal 141. Between the signal processing chip 150, the first through hole 1101 embedded in the first optical transceiver component 131 is smaller, which avoids the situation where the first through hole 1101 is too large and there is not enough space to connect the signal transceiver terminal 120 and the first optical transceiver component 130. This increases the wiring length between the signal transceiver terminal 120 and the first optical transceiver component 130, so that the wiring between the signal transceiver terminal 120 and the first optical transceiver component 130 is shorter, while the first optical transceiver component 131 can still be set up, reducing link loss and thus improving the reliability of electrical signal transmission between the first optical transceiver component 130 and the signal transceiver terminal 120.

[0095] Figure 8 A schematic diagram of the structure of a first optical transmitting component provided in some embodiments, in conjunction with Figures 4 to 8As shown, the first light transmitting component 131 disposed on the circuit board 110 includes a first heat dissipation structure 1311 and a first light transmitting component 1312. The first heat dissipation structure 1311 is embedded in the first through hole 1101. A portion of the components in the first light transmitting component 1312 are disposed on the first heat dissipation structure 1311, and another portion of the components in the first light transmitting component 1312 are disposed on the circuit board 110.

[0096] In some embodiments, the heat dissipation requirements of a portion of the devices in the first optical transmitting component 1312 are greater than the heat dissipation requirements of another portion of the devices in the first optical transmitting component 1312.

[0097] In some embodiments, the heat dissipation structure may include a tungsten-copper structure. For example, the tungsten-copper structure serves as a heat dissipation base, fixing high-heat devices such as lasers. The tungsten-copper alloy (which has high thermal conductivity and low thermal expansion properties) balances heat dissipation and stress, preventing damage to the devices from thermal expansion and contraction.

[0098] In some embodiments, a portion of the devices in the first optical transmitting component 1312 includes a laser 1312a and a lens 1312b. Exemplarily, the laser 1312a may include a high-power continuous wave (CW) laser. Another portion of the devices in the first optical transmitting component 1312 includes a driver chip 1312c, a photonic integrated circuit (PIC) 1312d, an isolator 1312e, and a fiber array (FA) assembly 1312f.

[0099] For example, laser 1312a is used to generate continuous high-power laser light, which serves as the carrier of optical signals and is the core light source for light emission. For example, lens 1312b is used to focus the light emitted by the laser, enabling it to be efficiently coupled into the optical fiber and reducing light loss.

[0100] For example, the driver chip 1312c is used to receive external electrical signals, convert them into precise current pulses, drive the laser to emit light, and control the light intensity and timing. For example, the photonic integrated circuit 1312d integrates optical devices such as optical modulators and splitters to perform modulation, beam splitting, and other processing on the light generated by the laser.

[0101] For example, isolator 1312e allows light to pass through in only one direction, preventing reflected light from returning to the laser (reflected light may interfere with laser stability or even damage the device). For example, optical output fiber array assembly 1312f includes a substrate and a pressure plate, with a third fiber 170 pressed onto the substrate via the pressure plate to transmit optical signals.

[0102] Figure 9A schematic diagram of the structure of the second optical transmitting component and the second optical receiving component on the circuit board provided in some embodiments, such as... Figure 9 As shown, the circuit board 110 is provided with a second optical transmitting component 141 and a second optical receiving component 142. The second optical transmitting component 141 will be described below:

[0103] The second optical transmitting component 141 includes a second heat dissipation structure 1411 and a second optical transmitting component 1412. The second heat dissipation structure 1411 is embedded in the second through hole 1102, and all the components in the second optical transmitting component 1412 are disposed on the second heat dissipation structure 1411.

[0104] In some embodiments, the second optical transmitting component does not include a driver chip. In other embodiments, the second optical transmitting component may include a driver chip.

[0105] In the technical solution provided in this application embodiment, since the size of the first through hole 1101 is smaller than the size of the second through hole 1102, the size of the first heat dissipation structure 1311 embedded in the first through hole 1101 is small. Therefore, the first heat dissipation structure 1311 cannot support all the devices in the first light-emitting component. Thus, only a portion of the devices are set on the first heat dissipation structure 1311. For example, the first portion of the devices can be core devices or devices with high heat dissipation requirements, while the other portion of the devices are set on the circuit board 110. This avoids the problem of poor heat dissipation and device overheating damage caused by forcibly placing too many devices on the small-sized first heat dissipation structure 1311, and fully utilizes the first heat dissipation structure. The heat dissipation performance of component 1311 ensures stable operation of the device. On the other hand, the reasonable allocation of device installation positions reduces the requirements for the size and load-bearing capacity of the first heat dissipation structure component 1311, simplifying the design and manufacturing of the first heat dissipation structure component 1311. Furthermore, since the size of the second through hole 1102 is large, the size of the second heat dissipation structure component 1411 embedded in the second through hole 1102 is also large. This allows all the devices in the second optical transmission component 1412 to be placed on the second heat dissipation structure component 1411, thereby improving the heat dissipation efficiency of all the devices in the second optical transmission component 1412 and reducing the complex connection process caused by the dispersed installation of devices, which facilitates the production of the second optical transmission component 141.

[0106] Figure 10 A schematic diagram showing the location of the first through hole in a circuit board provided in some embodiments; Figure 11 This is a schematic diagram of the first heat dissipation structure, as shown below. Figures 8 to 11As shown, the first heat dissipation structure 1311 includes a heat dissipation structure body 1311a and a protrusion 1311b on the heat dissipation structure body 1311a. A portion of the device in the first light transmitting component 1312 is disposed on the surface of the heat dissipation structure body 1311a opposite to the protrusion 1311b. The protrusion 1311b is embedded in the first through hole 1101 in the circuit board 110.

[0107] In the technical solution provided in this application embodiment, since the protrusion 1311b of the first heat dissipation structure 1311 is embedded in the first through hole 1101, rather than the first heat dissipation structure 1311 being entirely embedded in the first through hole 1101, the size of the protrusion 1311b is smaller than the size of the first heat dissipation structure 1311. Therefore, the size of the first through hole 1101 can also be adapted to be smaller than the size of the protrusion 1311b, thereby reducing the opening area of ​​the circuit board 110.

[0108] Continue reading Figure 7 , Figure 8 and Figure 10 The surface of the circuit board 110 is provided with a recessed portion 1103, and a first through hole 1101 is provided in the recessed portion 1103, and the size of the first through hole 1101 is smaller than the size of the recessed portion 1103; another part of the device in the first optical transmitting component 1312 is provided on the recessed portion 1103.

[0109] In the technical solution provided in this application embodiment, a specific recessed portion 1103 structure is constructed on the surface of the circuit board 110, and a first through hole 1101 is set in the recessed portion 1103, with the size of the first through hole 1101 being smaller than that of the recessed portion 1103. This forms an efficient device mounting space. The recessed portion 1103 acts as a dedicated mounting cavity customized for the related devices of the first optical transmitting component 1312, allowing some of the devices after installation to be flush with the circuit board 110, such as driver chips. This effectively reduces the overall height, saving space and creating a flat foundation for subsequent component assembly. The edge of the recessed portion 1103 can serve as a fixing base for the devices. Combined with auxiliary fixing structures, this significantly enhances the stability of device installation and avoids the risk of displacement due to vibration or other factors. Furthermore, the circuit board 110 at the recessed portion 1103 is thinner, thereby improving the heat dissipation performance of the circuit board 110. Compared to a solution without a recessed portion 1103, this improves the heat dissipation efficiency of another part of the devices in the first optical transmitting component 1312.

[0110] Figure 12 Schematic diagrams of optical transmission systems provided for some embodiments, such as Figure 12As shown, the optical transmission system 200 includes a first optical fiber 210, a second optical fiber 220, and two optical modules. Each optical module includes an optical module 100 from any of the above embodiments. Specifically, the first optical transceiver component 130 of one of the two optical modules is connected to the second optical transceiver component 140 of the other optical module via the first optical fiber 210, and the second optical transceiver component 140 of one of the two optical modules is connected to the first optical transceiver component 130 of the other optical module via the second optical fiber 220.

[0111] Each optical module includes a circuit board 110 and signal transceiver terminals 120, a first optical transceiver component 130, a second optical transceiver component 140, and a signal processing chip 150, all disposed on the circuit board 110. The signal transceiver terminal 120 includes a first transceiver terminal 121 and a second transceiver terminal 122; the channel identifier corresponding to the first optical transceiver component 130 is the same as the channel identifier corresponding to the second optical transceiver component 140.

[0112] This application provides a design scheme for an optical module based on an equivalent hybrid DSP and linear direct drive technology architecture. This optical module combines the advantages of both LPO and DSP solutions, requiring the design to consider both the shortest electrical link principle of the LPO solution and the issues of DSP heat dissipation, device space layout, and PCB trace space in the DSP solution.

[0113] This application provides a design method for optical modules based on an equivalent hybrid DSP and linear direct drive technology architecture to solve the problems of high power consumption and difficulty in guaranteeing signal integrity in traditional optical module architectures, while optimizing device space layout and heat dissipation performance.

[0114] The optical modules in this application embodiment are described below, with the first transceiver component including a first optical transmitting component TX1234 (i.e., the channel identifiers corresponding to the first optical transmitting component are TX1, TX2, TX3, and TX4) and a first optical receiving component RX1234 (i.e., the channel identifiers corresponding to the first optical receiving component are RX5, RX6, RX7, and RX8), and the second transceiver component including a second optical transmitting component TX5678 (i.e., the channel identifiers corresponding to the second optical transmitting component are TX5, TX6, TX7, and TX8) and a second optical receiving component RX1234 (i.e., the channel identifiers corresponding to the second optical receiving component are RX1, RX2, RX3, and RX4). For example, two optical modules can constitute an optical transmission system.

[0115] Figure 13The diagram shows the structure of an optical transmission system provided in some other embodiments. This optical transmission system is a structural diagram of an eight-channel (i.e., channel 1 to channel 8, with 8 channels for receiving and 8 channels for transmitting) optical module communication based on an equivalent hybrid DSP and linear direct drive technology architecture. In the diagram, the design is based on an equivalent hybrid DSP and linear direct drive technology architecture, and each signal end-to-end transmission passes through the DSP chip at least once.

[0116] In optical module 1, the 1234 signals from the transmitter are directly transmitted from the signal terminal to the TX1234 optical transmitter component via the TX1234 terminal of the optical module's gold finger circuit (which can be simply referred to as the gold finger). In the TX1234 optical transmitter component, the electrical signals are converted into optical signals and transmitted through the optical fiber (i.e., the signal transmission fiber) to the RX1234 optical receiver component in optical module 2. The received optical signals are converted into electrical signals and transmitted to the DSP (corresponding to the signal processing chip mentioned above) in optical module 2. After signal processing in the DSP, the signals are transmitted back to the signal terminal where optical module 2 is located via the RX1234 terminal of the gold finger circuit.

[0117] Similarly, in optical module 1, the 5678 signals from the transmitter are transmitted from the signal terminal to the DSP in optical module 1 through the TX5678 terminal of the optical module's gold finger circuit. After signal processing, the signals are transmitted to the TX5678 optical transmitter component, where the electrical signals are converted into optical signals. These signals are then transmitted through optical fiber to the RX5678 optical receiver component in optical module 2, where the received optical signals are converted back into electrical signals. Finally, the received optical signals are transmitted to the signal terminal where optical module 2 is located through the TX5678 terminal of the gold finger circuit.

[0118] Similarly, the eight signals emitted by the signal terminal where optical module 2 is located will also be transmitted to optical module 1 in the same manner as described above and eventually enter the signal terminal where optical module 1 is located.

[0119] In this way, each signal transmission passes through the DSP at least once. Compared with the traditional pluggable module architecture, the optical module in this architecture saves half of the DSP power consumption. Moreover, because the signal must go through the DSP signal processing once in the link, the signal integrity is preserved, reducing the bit error rate of the signal that may occur at the other end that does not go through the DSP.

[0120] In terms of packaging type, the devices in the optical module are Chips on Board (COB) type. The size of the PCB board in the device depends on the type of optical module package in which the device is applied, such as the four-channel small form factor pluggable (QSFP) type or the eight-channel small form factor pluggable (OSFP) type.

[0121] The optical module consists of two 4-channel optical transmitting components, two 4-channel optical receiving components, a 4:4 DSP chip (i.e., a DSP chip with four transmit and four receive channels), and a PCB board as the basic structure and circuitry. The optical transmitting and receiving components are connected to external optical fibers for optical signal transmission via optical fibers and multi-fiber push-in (MPO) optical connectors.

[0122] Among them, the two 4-channel optical transmitting components are the TX1234 optical transmitting component and the TX5678 optical transmitting component, and the two 4-channel optical receiving components are the RX1234 optical receiving component and the RX5678 optical receiving component.

[0123] In some embodiments, the TX1234 optical transmitter and the RX5678 optical receiver are positioned close to the gold finger circuit on the PCB board to ensure that the electrical signal transmission distance is as short as possible and to reduce link loss.

[0124] In some embodiments, the DSP chip is positioned after the TX1234 optical transmitter and the RX5678 optical receiver, which are then positioned immediately after it. The DSP chip is positioned off-plane from the TX1234 and RX5678 optical transmitters and receivers, and on the same plane as them. This layout allows the TX1234 and RX5678 optical transmitters and receivers to easily connect the optical fiber to the MPO optical connector. If they were on the same plane, the fiber would need to pass over the DSP chip, reducing the contact area between the DSP chip and the optical module housing, thus reducing the DSP chip's heat dissipation area.

[0125] In some embodiments, the TX1234 optical emitting assembly comprises a tungsten-copper structure, a driver chip, a photonic integrated circuit (PIC), a high-power continuous wave (CW) laser, a lens, an isolator, and an optical output fiber array (FA) assembly. The high-power CW laser and lens are mounted on the tungsten-copper structure; this design reduces the window area on the PCB, allowing the remaining PCB width to accommodate the 4-in, 4-out high-frequency signal lines leading from the DSP.

[0126] In some embodiments, compared to traditional pluggable module architectures, the optical module in this application saves half the power consumption of the DSP chip, thereby reducing the power consumption of the DSP chip.

[0127] In some embodiments, in terms of signal integrity preservation, since the link must undergo DSP signal processing once, signal integrity is preserved, thus reducing the signal bit error rate compared to a simple LPO design.

[0128] In some embodiments, in terms of heat dissipation performance optimization, the heat dissipation area of ​​the DSP chip is increased and the heat dissipation performance is optimized by a reasonable device layout, namely, the DSP chip and the TX1234 optical transmitter and RX5678 optical receiver are arranged in opposite directions (opposite layout).

[0129] In some embodiments, in terms of improving space utilization, by reducing the window area on the PCB, the heat dissipation requirements of the laser are taken into account, while the space utilization of the PCB is improved, which facilitates the layout of high-frequency signal lines.

[0130] The following describes the manufacturing steps of the optical module: Determine the PCB board size based on the optical module's package type (e.g., QSFP or OSFP) and design the PCB board's circuit layout, including the gold finger circuit, the DSP chip interface circuit, and the interface circuits for the optical transmitter and receiver components. Mount the TX1234 optical transmitter and RX5678 optical receiver components close to the gold finger circuit on the PCB board to ensure the shortest possible electrical signal transmission distance. Install the DSP chip behind the TX1234 and RX5678 optical transmitters and receivers, placing them on the same side. Install the TX5678 and RX1234 optical transmitters and receivers, ensuring smooth connections between them and the DSP chip and MPO optical connectors. Connect the optical transmitter and receiver components to external optical fibers using fiber optic cables and MPO optical connectors.

[0131] During testing, two identical eight-channel optical modules were connected to two signal terminals respectively, linked by an optical fiber. One signal terminal sent 1234 signals, which were converted into optical signals by the TX1234 optical transmitter component of optical module 1, transmitted via optical fiber to the RX1234 optical receiver component of optical module 2, and then processed by a DSP before being transmitted to the signal terminal where optical module 2 is located. Another signal terminal sent 5678 signals, which were processed by the DSP of optical module 1 and transmitted to the TX5678 optical transmitter component, converted into optical signals, and then transmitted via optical fiber to the RX5678 optical receiver component of optical module 2 before being transmitted to the signal terminal where optical module 2 is located. Power consumption, signal integrity, and bit error rate were observed and recorded during signal transmission. Based on the test results, the performance of the optical device design in terms of power consumption reduction, signal integrity preservation, and heat dissipation optimization was analyzed, verifying the effectiveness and superiority of this application.

[0132] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0133] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An optical module, characterized in that, The optical module includes: a circuit board and signal transceiver terminals, a first optical transceiver component, a second optical transceiver component, and a signal processing chip, all disposed on the circuit board; the signal transceiver terminals include a first transceiver terminal and a second transceiver terminal; the transmission directions of the components corresponding to the same channel identifier in the first optical transceiver component and the second optical transceiver component are opposite; The first transceiver terminal is connected to the first optical transceiver component so that electrical signals can be transmitted between the first transceiver terminal and the first optical transceiver component. The second transceiver terminal is connected to the second optical transceiver component through the signal processing chip, so that the signal processing chip processes the electrical signal transmitted by one of the second transceiver terminal and the second optical transceiver component and transmits it to the other.

2. The optical module according to claim 1, characterized in that, The first transceiver terminal includes a first transmitting terminal and a first receiving terminal, and the first optical transceiver component includes a first optical transmitting component and a first optical receiving component. The first transmitting terminal is connected to the first optical transmitting component, and the first receiving terminal is connected to the first optical receiving component. The second transceiver terminal includes a second transmitting terminal and a second receiving terminal, and the second optical transceiver component includes a second optical transmitting component and a second optical receiving component. The second transmitting terminal is connected to the second optical transmitting component through the signal processing chip, and the second receiving terminal is connected to the second optical receiving component through the signal processing chip. The channel identifier corresponding to the first optical transmitting component is the same as the channel identifier corresponding to the second optical receiving component.

3. The optical module according to claim 2, characterized in that, The optical module also includes an optical transmitting connector and an optical receiving connector; Both the first optical transmitting component and the second optical transmitting component are connected to the optical transmitting connector; Both the first optical receiving component and the second optical receiving component are connected to the optical receiving connector.

4. The optical module according to any one of claims 1 to 3, characterized in that, The signal transceiver terminal is disposed on the edge of any side of the circuit board, the first optical transceiver component is disposed between the signal transceiver terminal and the signal processing chip, and the second optical transceiver component is disposed on the side of the signal processing chip opposite to the first optical transceiver component.

5. The optical module according to claim 4, characterized in that, The signal processing chip and the second optical transceiver component are disposed on the first surface of the circuit board, and the first optical transceiver component is disposed on the second surface of the circuit board, with the first surface of the circuit board and the second surface of the circuit board facing each other; or... The signal processing chip, the second optical transceiver component, and the first optical transceiver component are all disposed on the first surface of the circuit board.

6. The optical module according to any one of claims 1 to 3, characterized in that, The first optical transmitting component of the first optical transceiver assembly is embedded in the first through hole of the circuit board, and the second optical transmitting component of the second optical transceiver assembly is embedded in the second through hole of the circuit board, wherein the size of the first through hole is smaller than the size of the second through hole.

7. The optical module according to claim 6, characterized in that, The first optical transmitting component includes a first heat dissipation structure and a first optical transmitting component. The first heat dissipation structure is embedded in the first through hole. A portion of the components in the first optical transmitting component are disposed on the first heat dissipation structure, and another portion of the components in the first optical transmitting component are disposed on the circuit board. The second optical transmitting component includes a second heat dissipation structure and a second optical transmitting component. The second heat dissipation structure is embedded in the second through hole, and all the components in the second optical transmitting component are disposed on the second heat dissipation structure.

8. The optical module according to claim 7, characterized in that, The first heat dissipation structure includes a heat dissipation structure body and a protrusion on the heat dissipation structure body. A portion of the first optical transmitting component is disposed on the surface of the heat dissipation structure body opposite to the protrusion. The protrusion is embedded in the first through hole.

9. The optical module according to claim 7, characterized in that, The circuit board has a recessed portion on its surface, and the first through hole is disposed in the recessed portion, with the size of the first through hole being smaller than the size of the recessed portion; another part of the first optical transmitting component is disposed on the recessed portion.

10. An optical transmission system, characterized in that, The optical transmission system includes a first optical fiber, a second optical fiber, and two optical modules, each optical module including the optical module according to any one of claims 1 to 9; In this configuration, the first optical transceiver component of one of the two optical modules is connected to the second optical transceiver component of the other optical module via the first optical fiber, and the second optical transceiver component of one of the two optical modules is connected to the first optical transceiver component of the other optical module via the second optical fiber.

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