A multilayer circuit board structure

Abstract

The utility model discloses a kind of multilayer circuit board structures, belong to motor control system field, including first circuit board, first circuit board is connected with fifth circuit board by first connecting plate, first circuit board is connected with fourth circuit board by second connecting plate, second circuit board is respectively connected with fifth circuit board and sixth circuit board by first connecting assembly, sixth circuit board is respectively connected with third circuit board and fourth circuit board by second connecting assembly, multilayer circuit board design can accommodate complex circuit, avoid the problem that traditional integrated mainboard is difficult to disassemble, facilitate post-maintenance, upgrade or replace a functional board, multilayer board stacking space superposition, reduce the occupied volume in controller shell, suitable for size limited scene.

Description

Technical Field

[0001] This utility model belongs to the field of motor control systems, specifically a multi-layer circuit board structure. Background Technology

[0002] The controller is the core electrical component of the power generation control system, responsible for controlling the motor and achieving the corresponding voltage output. The controller's internal circuit board is divided into control circuits that process various signals and power circuits that drive the motor and convert voltage. With technological advancements, product functions are becoming increasingly powerful, necessitating miniaturization while maintaining functionality.

[0003] Chinese utility model patent CN210075860U discloses an electric industrial vehicle controller with a heat dissipation device, comprising: a controller body, a controller circuit board disposed within the controller body, and a heat dissipation boss for supporting the circuit board. The heat dissipation boss includes a heat dissipation base disposed at the bottom of the controller body and a vertical part connected to the heat dissipation base. The top of the vertical part is connected to the bottom of the controller circuit board through an insulating and thermally conductive silicone cloth for conducting heat. By setting the heat dissipation boss, the heat concentrated in the power device area of ​​the controller circuit board is transferred to the outside through the aluminum plate via the insulating and thermally conductive silicone cloth, thereby achieving the purpose of conducting heat to the periphery of the controller through the heat dissipation boss, thus achieving the technical effect of high heat dissipation of the controller, and solving the technical problem of poor heat dissipation effect of controllers in related technologies.

[0004] However, the device still uses insulating and thermally conductive silicone cloth to directly connect to the controller circuit board, adopting a single-layer circuit board design. The controller size is still relatively large, and a single-layer circuit board cannot accommodate complex circuits. It is not suitable for implementing more functions in a limited space; it is not suitable for controllers with high integration and complex functions. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer circuit board structure to solve at least one aspect of the problems and defects mentioned in the background art.

[0006] A multilayer circuit board structure is provided, including a first circuit board, a fifth circuit board connected to the first circuit board via a first connecting plate, a fourth circuit board connected to the first circuit board via a second connecting plate, a second circuit board connected to the fifth circuit board and a sixth circuit board via a first connecting component, and a sixth circuit board connected to a third circuit board and a fourth circuit board via a second connecting component.

[0007] Furthermore, wiring channels are provided on both sides of the first circuit board. The wiring channels are used to standardize and guide the laying of cables, ribbon cables or flexible ribbon cables, so that they are laid along a fixed path and avoid messy wiring.

[0008] Furthermore, the first circuit board is provided with mounting holes around its perimeter, and each mounting hole is provided with a support post. The support post can not only support the first circuit board, but also connect other circuit boards, facilitating disassembly and connection with other circuit boards.

[0009] Furthermore, the first circuit board is detachably connected to the fifth circuit board and the sixth circuit board via several support pillars. The fifth circuit board and the sixth circuit board can be repeatedly assembled and disassembled. One end of the support pillar is connected to the first circuit board, and the other end is connected to the fifth circuit board or the sixth circuit board.

[0010] Furthermore, the first connecting component includes a plurality of first copper pillars, which are disposed on both sides of the second circuit board. The second circuit board is detachably connected to the fifth circuit board and the sixth circuit board through the plurality of first copper pillars. The first copper pillars provide a stable support structure, enabling the fifth circuit board and the sixth circuit board to be arranged in a compact stacked manner, saving equipment space and suitable for small-volume controllers. During later maintenance, testing, and module updates, any circuit board can be removed individually without disassembling the entire machine, thus improving maintenance efficiency and flexibility.

[0011] Furthermore, the first circuit board is also provided with a snap-fit ​​plate, which snaps into the second connecting plate. The edge structures of the snap-fit ​​plate and the second connecting plate correspond one-to-one. During assembly, the edge of the second connecting plate is aligned with the slot or guide rail position of the snap-fit ​​plate and inserted in the specified direction to complete the connection.

[0012] Furthermore, a silicone grease layer is provided on the sixth circuit board. The silicone grease layer has good thermal conductivity but no electrical conductivity, which can effectively transfer heat from the chip device to the external heat sink, housing or other thermally conductive structure, thereby avoiding overheating of the device or hot spot accumulation.

[0013] Furthermore, the second circuit board is provided with a slot, which is used to connect the first connecting plate between the first circuit board and the fifth circuit board.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] By compactly stacking multiple functional boards together through a reasonable connection structure, the volume occupied within the controller housing is minimized, making it suitable for size-constrained scenarios. Compared to traditional single-layer PCBs, multi-layer structures allow for vertical stacking of circuit boards, enabling more functions to be implemented in a limited space. The circuit boards are connected by connecting components, avoiding the difficulties in disassembling and assembling traditional integrated motherboards. This facilitates later maintenance, upgrades, or replacement of specific functional boards. The multi-layer board stacking allows for space accumulation and modular isolation, resulting in a compact controller with high functional integration, making it suitable for controllers with high integration and complex functions. Attached Figure Description

[0016] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the overall structure of a multilayer circuit board;

[0018] Figure 2 A schematic diagram of the fourth circuit board structure provided by this utility model;

[0019] Figure 3 A schematic diagram of the first connecting component provided by this utility model.

[0020] In the diagram: 1. First circuit board; 11. Snap-on plate; 111. Mounting hole; 112. Support post; 113. Wiring trough; 100. First connecting plate; 101. Second connecting plate; 2. Second circuit board; 21. Slot; 3. Third circuit board; 4. Fourth circuit board; 5. Fifth circuit board; 6. Sixth circuit board; 7. First connecting assembly; 71. First copper pillar; 8. Second connecting assembly; 81. Second copper pillar. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model; that is, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] Please see Figure 1-3 As shown in the present invention, a multilayer circuit board structure includes a first circuit board 1, a fifth circuit board 5 connected to the first circuit board 1 via a first connecting plate 100, a fourth circuit board 4 connected to the first circuit board 1 via a second connecting plate 101, a second circuit board 2 connected to the fifth circuit board 5 and a sixth circuit board 6 via a first connecting component 7, and a sixth circuit board 6 connected to the third circuit board 3 and the fourth circuit board 4 via a second connecting component 8.

[0028] The first circuit board 1 is connected to the fifth circuit board 5 via the first connecting plate 100, and the sixth circuit board 6 is connected to the fourth circuit board 4 via the second connecting plate 101. The second circuit board 2 is connected to the fifth circuit board 5 and the sixth circuit board 6 via the first connecting component 7, and the sixth circuit board 6 is connected to the third circuit board 3 and the fourth circuit board 4 via the second connecting component 8. This multi-layer board structure, combined with the first connecting component 7 and the second connecting component 8, forms a stable three-dimensional electrical connection network, making the signal and power transmission between circuit boards more reliable. Multiple functional boards are compactly stacked together through a reasonable connection structure, minimizing the volume occupied in the controller housing. It is suitable for size-constrained scenarios. Compared with traditional single-layer PCBs, multi-layer structures can stack circuit boards vertically, achieving more functions in a limited space. Each circuit board is connected by a connecting component, avoiding the problem of difficult disassembly and assembly of traditional integrated motherboards. It is convenient for later maintenance, upgrades, or replacement of a certain functional board. The multi-layer board stacking space is superimposed, the module isolation controller is small in size, and has high functional integration. Each circuit board is connected by the first connecting component 7 and the second connecting component 8, avoiding the problem of difficult disassembly and assembly of traditional integrated motherboards. It is convenient for later maintenance, upgrades, or replacement of a certain functional board, and the disassembly of each circuit board is convenient. The connection is reliable, and disassembly and maintenance are convenient.

[0029] In one embodiment, see Figure 1 , Figure 2 and Figure 3 As shown, wiring channels 113 are provided on both sides of the first circuit board 1. The wiring channels 113 are used to standardize and guide the laying of cables, ribbon cables or flexible ribbon cables, so that they run along a fixed path and avoid messy wiring. After the wiring channels 113 are provided on both sides of the first circuit board 1, the wiring channels can be planned uniformly when stacking multi-layer circuit boards, which is convenient for assembly; the density of wires on the soldering surface is reduced, and the flexibility and reliability of the connection are improved.

[0030] In one embodiment, see Figure 1 and Figure 2 As shown, the first circuit board 1 has mounting holes 111 around its perimeter, and each mounting hole 111 has a support post 112. The support post 112 is used to install the circuit board 1 through the mounting holes 111. The support post 112 can not only support the first circuit board 1, but also connect other circuit boards through the support post 112, which facilitates the disassembly and connection with other circuit boards.

[0031] In one embodiment, see Figure 1 and Figure 2 As shown, the first circuit board 1 is detachably connected to the fifth circuit board 5 and the sixth circuit board 6 via several support columns 112. The support columns 112 have detachable characteristics (such as screw connection, snap-fit, screw type). Without damaging any circuit board, the fifth circuit board 5 and the sixth circuit board 6 can be repeatedly assembled and disassembled. One end of the support column 112 is connected to the first circuit board 1, and the other end is connected to the fifth circuit board 5 or the sixth circuit board 6, forming a reversible mechanical connection between the fifth circuit board 5 or the sixth circuit board 6.

[0032] In one embodiment, see Figure 2 and Figure 3 As shown, the first connecting component 7 includes several first copper pillars 71, which are disposed on both sides of the second circuit board 2. The second circuit board 2 is detachably connected to the fifth circuit board 5 and the sixth circuit board 6 via the several first copper pillars 71. The fifth circuit board 5 and the sixth circuit board 6 are respectively provided with corresponding screw holes to engage with the first copper pillars 71. The multiple first copper pillars 71 are vertically fixed on both sides (top and bottom) of the second circuit board 2, respectively connecting the fifth circuit board 5 and the sixth circuit board 6. The first copper pillars 71 are usually provided with threaded holes or through holes, which can be used to achieve a detachable connection between the fifth circuit board 5 and the sixth circuit board 6 by screws. The first copper pillars 71 provide a stable support structure, enabling the fifth circuit board 5 and the sixth circuit board 6 to be arranged in a compact stack, saving equipment space and suitable for small-volume controllers. During later maintenance, testing, and module updates, any circuit board can be removed individually without disassembling the entire machine, improving maintenance efficiency and flexibility.

[0033] In one embodiment, see Figure 2 and Figure 3 As shown, the second connecting component 8 includes several second copper pillars 81, which are disposed on both sides of the upper part of the sixth circuit board 6. The sixth circuit board 6 is detachably connected to the third circuit board 3 and the fourth circuit board 4 through the several second copper pillars 81. The fourth circuit board 4 is connected to the first circuit board 1. The spatial reconstruction and integration of the circuit module is realized through the second copper pillars 81, which cleverly realizes the detachable installation of the third circuit board 3 and the fourth circuit board 4, forming a stacked structure of three or more circuit boards. It has the advantages of convenient installation, stable structure, friendly maintenance and high functional integration, and is particularly suitable for electronic products such as controllers with limited size and high functional integration requirements.

[0034] In one embodiment, see Figure 1 and Figure 2 As shown, the first circuit board 1 is also provided with a snap-fit ​​plate 11, which snaps into the second connecting plate 101. At least one snap-fit ​​plate 11 is installed on the first circuit board 1. The snap-fit ​​plate 11 is made of injection-molded engineering plastic, or it can be made of metal. The snap-fit ​​plate 11 is provided with a slot. The edge structure of the snap-fit ​​plate 11 corresponds one-to-one with that of the second connecting plate 101. During assembly, the edge of the second connecting plate 101 is aligned with the slot or guide rail of the snap-fit ​​plate 11 and inserted in the specified direction to complete the connection.

[0035] In one embodiment, see Figure 1 and Figure 2 As shown, a silicone grease layer is provided on the sixth circuit board 6. The silicone grease layer has good thermal conductivity but no electrical conductivity. It can effectively transfer heat from the chip device to the external heat sink, housing or other heat-conducting structure, thereby avoiding overheating of the device or hot spot accumulation.

[0036] In one embodiment, see Figure 1 and Figure 3 As shown, the second circuit board 2 is provided with a slot 21, which is used to connect the first connecting plate 100 between the first circuit board 1 and the fifth circuit board 5.

[0037] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of this utility model.

Claims

1. A multilayer circuit board structure, comprising a first circuit board (1), characterized in that, The first circuit board (1) is connected to the fifth circuit board (5) via the first connecting plate (100). The first circuit board (1) is connected to the fourth circuit board (4) via the second connecting plate (101). The second circuit board (2) is connected to the fifth circuit board (5) and the sixth circuit board (6) via the first connecting component (7). The sixth circuit board (6) is connected to the third circuit board (3) and the fourth circuit board (4) via the second connecting component (8).

2. The multilayer circuit board structure according to claim 1, characterized in that, The first circuit board (1) has wiring grooves (113) on both sides.

3. The multilayer circuit board structure according to claim 2, characterized in that, The first circuit board (1) has mounting holes (111) around its perimeter, and each mounting hole (111) is provided with a support post (112).

4. A multilayer circuit board structure according to claim 3, characterized in that, The first circuit board (1) is detachably connected to the fifth circuit board (5) and the sixth circuit board (6) via several support pillars (112).

5. A multilayer circuit board structure according to claim 4, characterized in that, The first connecting component (7) includes a plurality of first copper pillars (71), which are disposed on both sides of the second circuit board (2). The second circuit board (2) is detachably connected to the fifth circuit board (5) and the sixth circuit board (6) through the plurality of first copper pillars (71).

6. A multilayer circuit board structure according to claim 1, characterized in that, The second connection component (8) includes a plurality of second copper pillars (81), which are disposed on both sides of the upper part of the sixth circuit board (6). The sixth circuit board (6) is detachably connected to the third circuit board (3) and the fourth circuit board (4) through the plurality of second copper pillars (81).

7. A multilayer circuit board structure according to claim 6, characterized in that, The first circuit board (1) is also provided with a snap-fit ​​plate (11), which snaps into the second connecting plate (101).

8. A multilayer circuit board structure according to claim 1, characterized in that, A silicone grease layer is provided on the sixth circuit board (6).

9. A multilayer circuit board structure according to claim 1, characterized in that, The second circuit board (2) has a slot (21).

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