Control device and heat source unit equipped with the control device

Abstract

The utility model provides control device and the heat source unit who carries this control device, the heating component is cooled via the refrigerant flowing in the refrigerant pipe, this control device is constituted to be able to remove printed wiring board without making refrigerant pipe to lean to the near future. In control device (60), from printed wiring board (51) observation, heating component (53), radiator (55) and mounting plate (57) are sequentially arranged in the thickness direction of printed wiring board (51). The first area (55a) opposite with mounting plate (57) and the second area (55b) not opposite with mounting plate (57) are provided in the different face of radiator (55) to the side towards heating component (53). The second area (55b) is not located on the moving route of printed wiring board (51) when removing the substrate assembly (50) from mounting plate (57). The heat transfer plate (59) is fixed to the second area (55b).

Description

Technical Field

[0001] This utility model relates to a control device for cooling a heat-generating component via a refrigerant flowing in a refrigerant pipe, and a heat source unit equipped with the control device. Background Technology

[0002] Conventionally, a heat transfer plate (here referred to as a refrigerant jacket) equipped with refrigerant piping for refrigerant flow is placed in close contact with a heat-generating component in an electronic component mounted on a printed wiring board of a control device to cool the heat-generating component. For example, in the outdoor unit disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2016-109350), when the refrigerant jacket is viewed from the front, a printed wiring board on which a heat-generating component is mounted is arranged on its rear side.

[0003] Patent document: Japanese Patent Application Publication No. 2016-109350 Utility Model Content

[0004] However, in the above structure, the refrigerant piping needs to be tilted forward when removing the printed circuit board, which may apply stress to the refrigerant piping. Therefore, a structure is required that allows the printed circuit board to be removed without tilting the refrigerant piping forward.

[0005] The control device of the first viewpoint includes: a printed wiring board; a heating element mounted on the printed wiring board; a heat sink fixed to the heating element; a mounting plate on which the printed wiring board is mounted; and a heat transfer plate. The heat transfer plate is fixed to the heat sink when refrigerant piping is installed. Viewed from the printed wiring board, the heating element, the heat sink, and the mounting plate are arranged sequentially along the thickness direction of the printed wiring board. On the side of the heat sink different from the side facing the heating element, there is a first region opposite to the mounting plate and a second region not opposite to the mounting plate. The second region is not located on the path of the printed wiring board when it is removed from the mounting plate. The heat transfer plate is fixed to the second region.

[0006] In this control device, the printed wiring board, heating components, and radiator can be removed from the radiator simply by removing the heat transfer plate, without having to tilt the heat transfer plate and refrigerant piping forward to avoid interference between the heat transfer plate and the printed wiring board, as was done in the past, thus suppressing the stress on the refrigerant piping.

[0007] The control device for the second viewpoint includes a radiator having a first radiator section comprising a first region and a second radiator section comprising a second region. The radiator is configured such that the first radiator section and the second radiator section form a predetermined angle.

[0008] In the control device for the third viewpoint, the first radiator section and the second radiator section form an L-shape.

[0009] In this control device, the first and second radiator sections form an L-shape, thus being approximately orthogonal. The second radiator section extends along the thickness direction of the mounting plate. By simply removing the heat transfer plate from the second region of the second radiator section, the printed wiring board, heating element, and radiator can be removed in the direction of pulling away from the mounting plate. Therefore, unlike in the past, it is not necessary to tilt the heat transfer plate and refrigerant piping to avoid interference between the heat transfer plate and the printed wiring board, thus suppressing the application of stress to the refrigerant piping.

[0010] The control device of the fourth viewpoint, in the control device of the first viewpoint, further includes a third region in the heat sink. The third region is a region that is not opposite to the mounting plate on a surface different from the surface facing the heat-generating component and is different from the second region. The heat sink has a first heat sink section including the first region, a second heat sink section including the second region, and a third heat sink section including the third region. The first heat sink section is located between the second and third heat sink sections. The heat sink is formed such that the second and third heat sink sections form a predetermined angle with the first heat sink section. The third region is not located on the path of the printed wiring board when it is removed from the mounting plate. A heat transfer plate is fixed to either the second or third region.

[0011] In this control device, the printed wiring board, heating element, and radiator can be removed by simply removing the heat transfer plate from either the second region of the second radiator or the third region of the third radiator. Therefore, unlike in the past, there is no need to tilt the heat transfer plate and refrigerant piping to avoid interference between the heat transfer plate and the printed wiring board, thus suppressing stress on the refrigerant piping.

[0012] The control device of the fifth viewpoint is the same as that of the control device of the third viewpoint, wherein the mounting plate has a hole or notch through which the second heat sink section of the heat sink passes.

[0013] In this control device, when removing the radiator in the thickness direction of the mounting plate, the second radiator section will not become an obstacle.

[0014] The control device of the sixth viewpoint is in the control device of the fourth viewpoint, wherein the mounting plate has a hole or notch through which at least one of the second heat sink section and the third heat sink section is supplied.

[0015] In this control device, when the radiator is removed in the thickness direction of the mounting plate, the second and third radiator sections will not become obstacles.

[0016] In the control device of the seventh viewpoint, in any of the control devices of the first to sixth viewpoints, the first area of ​​the radiator is in close contact with the mounting plate.

[0017] In this control device, the mounting plate diffuses the heat transferred from the radiator, thus improving the radiator's cooling performance.

[0018] The heat source unit of the eighth viewpoint is a heat source unit containing a housing that houses the control device for any of the first to seventh viewpoints. The housing has a maintenance opening on the side opposite the heat transfer plate.

[0019] In this heat source unit, the operator can install and remove the heat transfer plates through the maintenance opening, thus ensuring good operability.

[0020] In the heat source unit described in the eighth viewpoint, the heat transfer plate is fastened to the second region of the radiator by screws. The tightening direction of the screws is the same as the opening direction of the opening.

[0021] In this heat source unit, the operator can easily install or remove the heat transfer plate by inserting a tool (screwdriver) into the opening of the maintenance opening. Attached Figure Description

[0022] Figure 1 This is a refrigerant circuit diagram of a refrigeration device equipped with a control device according to one embodiment of the present invention.

[0023] Figure 2 It is a three-dimensional view of the heat source unit equipped with a control device.

[0024] Figure 3 It is a chart comparing the normal state of the control device, the first state with the heat transfer plate removed, and the second state with the substrate assembly removed from the mounting plate.

[0025] Figure 4 It is Figure 3 The diagram shows the replacement of the heat sink with the heat sink of the first variant.

[0026] Figure 5 It is Figure 3 The diagram shows the replacement of the heat sink with the heat sink of the second variant.

[0027] Figure 6 It is Figure 3 The diagram shows the replacement of the radiator in the first example with the radiator in the third variation.

[0028] Label Explanation

[0029] 3 heat source units

[0030] 51 Printed Wiring Board

[0031] 53 Heating Components

[0032] 55 Radiator

[0033] 55a First Area

[0034] 55b Second Zone

[0035] 55c Third Zone

[0036] 551 First Radiator Division

[0037] 552 Second Radiator Section

[0038] 553 Third Radiator Section

[0039] 57 mounting plate

[0040] 57a hole

[0041] 59 heat transfer plate

[0042] 591 Cooling pipe (refrigerant piping)

[0043] 593 screws

[0044] 60 control devices Detailed Implementation

[0045] (1) Overall structure of refrigeration device 1

[0046] Figure 1 This is a refrigerant circuit diagram of a refrigeration device 1 equipped with a control device 60 according to one embodiment of this utility model. Figure 1 In this system, the refrigeration unit 1 consists of a utilization unit 2 and a heat source unit 3. The refrigeration unit 1 operates by performing a vapor compression refrigeration cycle to provide cooling and heating for the building.

[0047] The utilization unit 2 is equipped with an indoor heat exchanger 20 and an indoor fan 21. Furthermore, the heat source unit 3 is equipped with a compressor 32, a four-way switching valve 33, an outdoor heat exchanger 30, an electric expansion valve 34, a liquid receiver 31, an outdoor fan 38, and a control device 60.

[0048] Unit 2 is connected to the heat source unit via refrigerant pipes 41 and 42, thereby forming a refrigerant circuit 11.

[0049] Refrigerant is sealed in refrigerant circuit 11 to perform a refrigeration cycle in which the refrigerant is compressed, cooled, depressurized, evaporated, and then compressed again.

[0050] During refrigeration operation, the four-way switching valve 33 becomes Figure 1The solid line indicates the state in which the discharge side of the compressor 32 is connected to the gas side of the outdoor heat exchanger 30, and the suction side of the compressor 32 is connected to the gas side of the indoor heat exchanger 20 via the liquid receiver 31. During refrigeration operation, the refrigeration unit 1 uses the outdoor heat exchanger 30 as a heat exchanger and the indoor heat exchanger 20 as an evaporator.

[0051] Furthermore, during cooling operation, the indoor fan 21 causes the air drawn from the room to exchange heat with the indoor heat exchanger 20, and then returns the cooled air to the room. As a result, the room is cooled.

[0052] During heating operation, the four-way switching valve 33 becomes Figure 1 The dashed line indicates the state in which the discharge side of the compressor 32 is connected to the gas side of the indoor heat exchanger 20, and the suction side of the compressor 32 is connected to the gas side of the outdoor heat exchanger 30 via the receiver 31. During heating operation, the refrigeration unit 1 uses the indoor heat exchanger 20 as a heat exchanger and the outdoor heat exchanger 30 as an evaporator.

[0053] Furthermore, during heating operation, the indoor fan 21 causes the air drawn from the room to exchange heat with the indoor heat exchanger 20, and then sends the heated air back into the room. As a result, the room is heated.

[0054] A heat transfer plate 59 is installed in the refrigerant piping 41 between the outdoor heat exchanger 30 and the electric expansion valve 34. The heat transfer plate 59 cools the heat-generating components mounted on the control device 60 by means of the refrigerant flowing in a section of the refrigerant piping 41. The portion of the refrigerant piping 41 in which the heat transfer plate 59 is installed is designated as a cooling pipe 591.

[0055] (2) Structure of heat source unit 3

[0056] Here, the heat source unit 3 will be explained. Figure 2 This is a perspective view of the heat source unit 3 equipped with the control device 60. Figure 2 In the middle, the heat source unit 3 has a roughly rectangular shell 70.

[0057] The interior of the housing 70 contains Figure 1 The compressor 32, four-way switching valve 33, electric expansion valve 34, outdoor heat exchanger 30, outdoor fan 38, and control device 60 are described.

[0058] The housing 70 is connected by a top plate 71, a bottom plate 72, a front plate 73, a rear right side plate 74, and a front right side plate 75. Figure 2 The outer shell of the heat source unit 3 is formed by the back panel (not described in the text) and the left side panel when viewed from the front of the front panel 73.

[0059] An air vent (not shown) is formed on the front panel 73 for air to be blown out from the outdoor fan 38, and a grille 73a is installed to cover the air vent. The rear right side panel 74 forms the inner right corner of the front panel 73 when viewed from the front.

[0060] The front right side panel 75 is an L-shaped side panel that forms the front right corner when viewed from the front of the front panel 73. The front right side panel 75 can be separated into a lower region 75a and an upper region 75b. With the lower region 75a fixed to the base plate 72, only the upper region 75b can be removed.

[0061] The ratio of the lower region 75a to the upper region 75b in the height dimension of the front right side panel 75 is approximately 1:3, and the control device 60 is exposed from the housing 70 from which the upper region 75b has been removed.

[0062] (3) Structure of control device 60

[0063] Figure 3 This is a chart comparing the control device 60 in its normal state, the first state with the heat transfer plate 59 removed, and the second state with the substrate assembly 50 removed from the mounting plate 57. Figure 3 The upper section represents the normal state of the control device 60, the middle section represents the first state after removing the heat transfer plate 59, and the lower section represents the second state after removing the substrate assembly 50 from the mounting plate 57.

[0064] First of all, Figure 3 In the normal state of the upper section, when viewed from the printed wiring board 51, the heat-generating component 53, the heat sink 55 and the mounting plate 57 are arranged in sequence in the thickness direction of the printed wiring board 51, and a heat transfer plate 59 is fixed on the heat sink 55.

[0065] (3-1) Printed wiring board 51

[0066] The printed wiring board 51 has a first side 51a as the front and a second side 51b as the back. Electrical components are mounted on the first side 51a. When viewing the front panel 73 from the front, the first side 51a becomes the front side when the upper region 75b of the front right side panel 75 is removed from the housing 70. A heating element 53 is mounted on the second side 51b of the printed wiring board 51.

[0067] (3-2) Heating component 53

[0068] The heat-generating component 53 is a power semiconductor component such as a smart power module or diode module that becomes high-temperature during operation.

[0069] (3-3) Radiator 55

[0070] The radiator 55 is made of aluminum or aluminum alloy. The radiator 55 has a first radiator section 551 and a second radiator section 552. The first radiator section 551 is in close contact with the heating surface of the heat-generating component 53.

[0071] The second radiator portion 552 extends substantially vertically from the end of the first radiator portion 551 and through the mounting plate 57 in a direction away from the mounting plate 57. In this embodiment, the first radiator portion 551 and the second radiator portion 552 form an L-shape.

[0072] However, the angle α between the first heat sink 551 and the second heat sink 552 does not have to be strictly a right angle. Considering the manufacturability of the heat sink 55 and its assemblability with other components, an angle α in the range of 85° to 95° is appropriate.

[0073] Furthermore, the first radiator portion 551 is preferably formed to be longer than the second radiator portion 552. This is because, since the second radiator portion 552 is shorter than the first radiator portion 551, the depth of the space where the radiator 55 is installed (from the front to the back of the housing 70) can be reduced.

[0074] A first region 55a, which is opposite to the mounting plate 57, is provided on the surface of the first radiator section 551 that is different from the surface facing the heat-generating component 53.

[0075] Furthermore, a second region 55b is provided on the side of the second heat sink 552 that is different from the side facing the heat-generating component 53, and is not opposite to the mounting plate 57. The second region 55b is not located on the movement path of the printed wiring board 51 when it is removed from the mounting plate 57. A heat transfer plate 59 is fixed to the second region 55b.

[0076] like Figure 3 As shown in the lower paragraph, the moving path of the printed wiring board 51 refers to the path of the printed wiring board 51 when it moves along the disassembly direction of the substrate assembly (the direction of the hollow arrow).

[0077] (3-4) Mounting plate 57

[0078] The printed wiring board 51 is mounted on the mounting plate 57 with the heat sink 55 fixed to the heat-generating component 53 mounted on the second surface 51b. The spacing between the printed wiring board 51 and the mounting plate 57 is stably maintained by the spacer 501.

[0079] The spacing between the printed wiring board 51 and the mounting plate 57 is arbitrary, but in this embodiment, the printed wiring board 51 and the mounting plate 57 are brought close together until the first heat sink portion 551 of the heat sink 55 contacts the mounting plate 57.

[0080] To avoid interference with the second heat sink portion 552 of the heat sink 55, a hole 57a is provided on the mounting plate 57 for the second heat sink portion 552 to pass through. However, it does not necessarily have to be a hole 57a; it can also be a notch.

[0081] However, if the first radiator portion 551 is formed to be longer than the second radiator portion 552, the mounting plate 57 may not have a hole 57a or notch for the second radiator portion 552 to pass through.

[0082] (3-5) Heat transfer plate 59

[0083] The heat transfer plate 59 is a block made of aluminum or aluminum alloy. Cooling pipes 591 are inserted into pre-set holes on the heat transfer plate 59, and are machined so that the cooling pipes 591 are in close contact with the holes.

[0084] like Figure 1 As shown, refrigerant circulating in the refrigerant circuit 11 flows through the cooling pipe 591. The temperature of the refrigerant flowing in the cooling pipe 591 is lower than the temperature at which the heating element 53 operates. Therefore, the heating element 53 exchanges heat with the refrigerant through the heat transfer plate 59 and the radiator 55, and the heating element 53 is cooled.

[0085] The heat transfer plate 59 is mounted to the second region 55b of the radiator 55 by screws 593.

[0086] (4) Removal of substrate assembly 50

[0087] Here, the assembly of the printed wiring board 51, the heat-generating component 53 and the heat sink 55 is referred to as the substrate assembly 50.

[0088] When service personnel remove the substrate assembly 50 from the heat source unit 3 for maintenance, such as Figure 2 As shown, the upper region 75b of the front right side panel 75 is removed from the housing 70, exposing the control device 60.

[0089] Next, as Figure 3 As shown in the middle section, the service personnel remove screws 593 from the heat transfer plate 59 to separate the heat transfer plate 59 from the second radiator section 552, creating a gap between the second radiator section 552 and the heat transfer plate 59.

[0090] Then, as Figure 3 As shown in the next section, the service personnel pull the substrate assembly 50 forward to separate the substrate assembly 50 from the mounting plate 57.

[0091] Since the second region 55b of the second heat sink 552 is not located on the moving path of the printed wiring board 51 when the substrate assembly 50 is removed from the mounting plate 57, the substrate assembly 50 is easy to remove.

[0092] (5) Characteristics

[0093] (5-1)

[0094] In the control device 60, viewed from the printed circuit board 51, the heat-generating component 53, the heat sink 55, and the mounting plate 57 are arranged sequentially along the thickness direction of the printed circuit board 51. On the side of the heat sink 55 different from the side facing the heat-generating component 53, there is a first region 55a opposite to the mounting plate 57 and a second region 55b not opposite the mounting plate 57. The second region 55b is not located on the path of the printed circuit board 51 when the substrate assembly 50 is removed from the mounting plate 57. The heat transfer plate 59 is fixed to the second region 55b.

[0095] In the control device 60, the substrate assembly 50 can be removed from the mounting plate 57 by simply removing the heat transfer plate 59 from the heat sink 55. As in the past, it is not necessary to tilt the heat transfer plate 59 and the cooling pipe 591 forward in order to avoid interference between the heat transfer plate 59 and the printed wiring board 51, etc., and stress on the cooling pipe 591 can be suppressed.

[0096] (5-2)

[0097] The radiator 55 has a first radiator portion 551 including a first region 55a and a second radiator portion 552 including a second region 55b. The radiator 55 is formed such that the first radiator portion 551 and the second radiator portion 552 form a predetermined angle.

[0098] (5-3)

[0099] The first heat sink portion 551 and the second heat sink portion 552 form an L-shape, and the second heat sink portion 552 is a structure that extends along the thickness direction of the mounting plate 57. By removing the heat transfer plate 59 from the second region 55b of the second heat sink portion 552, the substrate assembly 50 can be removed in the direction of pulling away from the mounting plate 57. Therefore, it is not necessary to tilt the heat transfer plate 59 and the cooling pipe 591 to avoid interference with the printed wiring board 51, as was done previously, and stress on the cooling pipe 591 can be suppressed.

[0100] (5-4)

[0101] Since the mounting plate 57 has a hole 57a through which the second heat sink portion 552 of the heat sink 55 passes, the second heat sink portion 552 will not become an obstacle when the heat sink 55 is removed along the thickness direction of the mounting plate 57.

[0102] (5-5)

[0103] The first region 55a of the radiator 55 is in close contact with the mounting plate 57, which allows the heat transferred from the radiator 55 to diffuse, thus improving the cooling performance of the radiator 55.

[0104] (5-6)

[0105] The housing 70 of the heat source unit 3 has a maintenance opening 74a on the side opposite to the heat transfer plate 59, so the operator can install and remove the heat transfer plate 59 through the maintenance opening 74a, which makes it easy to work.

[0106] (5-7)

[0107] The heat transfer plate 59 is fastened to the second region 55b of the radiator 55 by screws 593. For example... Figure 2 As shown, when viewing the opening of the maintenance opening 74a from the right side of the housing 70, the flat portion of the heat transfer plate 59 is on the front, and the screw 593 passes through the heat transfer plate 59 to fasten the second region 55b of the radiator 55 to the heat transfer plate 59 in a direction perpendicular to the flat portion of the heat transfer plate 59.

[0108] Therefore, the opening direction of the opening 74a is the same as the tightening direction of the screw 593, so that the screw head of the screw 593 can be viewed directly from the opening 74a.

[0109] When the operator loads or unloads the heat transfer plate 59 through the maintenance opening 74a, the tool (screwdriver) is inserted into the opening direction of the opening 74a, so the operation is good.

[0110] (6) Variations

[0111] Here, we will describe a first, second, and third modification of the control device 60 described in the above embodiments, which alters the shape of the radiator 55.

[0112] The first, second, and third variations all share the following items (a) to (g).

[0113] (a) The printed wiring board 51, the heating element 53 and the heat transfer plate 59 are common.

[0114] (b) As viewed from the printed wiring board 51, the heat-generating component 53, the heat sink 55 and the mounting plate 57 are arranged in sequence along the thickness direction of the printed wiring board 51, and the heat transfer plate 59 is fixed to the heat sink 55.

[0115] (c) The printed wiring board 51 is mounted on the mounting plate 57 with the heat sink 55 fixed to the heat-generating component 53 mounted on the second surface 51b. The spacing between the printed wiring board 51 and the mounting plate 57 is stably maintained by the spacer 501.

[0116] (c) The spacing between the printed wiring board 51 and the mounting plate 57 is arbitrary, but the printed wiring board 51 and the mounting plate 57 are brought close together until the first heat sink portion 551 of the heat sink 55 contacts the mounting plate 57.

[0117] (d) The heat sinks 55 of the first, second and third modifications are different in shape, but are all made of aluminum or aluminum alloy.

[0118] (e) During maintenance, when service personnel remove the substrate assembly 50 from the heat source unit 3, if Figure 2 As shown, the upper region 75b of the front right side panel 75 is removed from the housing 70, exposing the control device 60.

[0119] (f) The service personnel remove screws 593 from the heat transfer plate 59 to separate the heat transfer plate 59 from the second radiator section 552, creating a gap between the second radiator section 552 and the heat transfer plate 59.

[0120] (g) The service personnel pull the substrate assembly 50 forward to separate the substrate assembly 50 from the mounting plate 57.

[0121] (6-1) First variation

[0122] Figure 4 It is Figure 3 The diagram shows the replacement of radiator 55 with the radiator of the first variant. Figure 4 In the middle section, the upper section represents the normal state of the control device 60, the middle section represents the first state with the heat transfer plate 59 removed, and the lower section represents the second state with the substrate assembly 50 removed from the mounting plate 57.

[0123] (6-1-1) Radiator 55

[0124] The radiator 55 has a first radiator section 551, a second radiator section 552, and a third radiator section 553. The first radiator section 551 is in close contact with the heating surface of the heat-generating component 53.

[0125] The first radiator section 551 is located between the second radiator section 552 and the third radiator section 553. The second radiator section 552 extends substantially vertically from one end of the first radiator section 551 and through the mounting plate 57 in a direction away from the mounting plate 57. The third radiator section 553 extends substantially vertically from the other end of the first radiator section 551 and through the mounting plate 57 in a direction away from the mounting plate 57.

[0126] However, the angle α formed by the first heat sink 551 and the second heat sink 552 and the third heat sink 553 does not necessarily have to be a right angle. Considering the assemblability of the heat sink 55 with other components, an angle α in the range of 85° to 95° is appropriate.

[0127] A first region 55a, which is opposite to the mounting plate 57, is provided on the surface of the first radiator section 551 that is different from the surface facing the heat-generating component 53.

[0128] Furthermore, a second region 55b is provided on the surface of the second radiator portion 552 that is different from the surface facing the heat-generating component 53 and is not opposite to the mounting plate 57.

[0129] Furthermore, a third region 55c that is not opposite to the mounting plate 57 is provided on the surface of the third heat sink 553 that is different from the surface facing the heat-generating component 53.

[0130] The second region 55b and the third region 55c are not located on the path of the printed wiring board 51 when it is removed from the mounting plate 57.

[0131] like Figure 4 As shown in the lower paragraph, the moving path of the printed wiring board 51 refers to the path of the printed wiring board 51 when it moves along the removal direction (direction of the hollow arrow) of the substrate assembly.

[0132] In the first variation, the heat transfer plate 59 is fixed to the side of the second region 55b or the third region 55c opposite to the front right side plate 75 of the housing 70.

[0133] (6-1-2) Mounting plate 57

[0134] In the mounting plate 57, to avoid interference with the second heat sink section 552 and the third heat sink section 553 of the heat sink 55, a hole 57a is provided for the second heat sink section 552 and the third heat sink section 553 to pass through. However, it does not necessarily have to be a hole 57a, it can also be a notch.

[0135] In the first variation, the second region 55b of the second heat sink 552 and the third region 55c of the third heat sink 553 are not located on the moving path of the printed wiring board 51 when the substrate assembly 50 is removed from the mounting plate 57, so the substrate assembly 50 is easy to remove.

[0136] (6-2) Second variation

[0137] Figure 5 It is Figure 3 The diagram shows the replacement of radiator 55 with the radiator of the second variant. Figure 5 In the middle section, the upper section represents the normal state of the control device 60, the middle section represents the first state with the heat transfer plate 59 removed, and the lower section represents the second state with the substrate assembly 50 removed from the mounting plate 57.

[0138] (6-2-1) Radiator 55

[0139] The radiator 55 has a first radiator portion 551 and a second radiator portion 552. The first radiator portion 551 is in close contact with the heating surface of the heat-generating component 53.

[0140] The second heat sink section 552 extends substantially vertically from one end of the first heat sink section 551 in a manner that passes through the side of the printed wiring board 51.

[0141] The angle β between the first heat sink 551 and the second heat sink 552 does not necessarily have to be a right angle. Considering the manufacturability of the heat sink 55 and its assemblability with other components, an angle β in the range of 85° to 180° is reasonable.

[0142] A first region 55a, which is opposite to the mounting plate 57, is provided on the surface of the first radiator section 551 that is different from the surface facing the heat-generating component 53.

[0143] Furthermore, a second region 55b is provided on the surface of the second radiator portion 552 that is different from the surface facing the heat-generating component 53 and is not opposite to the mounting plate 57.

[0144] The second heat sink portion 552 extends along the side of the printed wiring board 51, therefore, the second region 55b is not located on the path of the printed wiring board 51 when it is removed from the mounting plate 57. The heat transfer plate 59 is fixed to the second region 55b.

[0145] like Figure 5 As shown in the lower paragraph, the moving path of the printed wiring board 51 refers to the path of the printed wiring board 51 when it moves along the removal direction (direction of the hollow arrow) of the substrate assembly.

[0146] (6-2-2) Mounting plate 57

[0147] The mounting plate 57 and the second heat sink portion 552 of the heat sink 55 do not interfere with each other, therefore, it is not necessary to Figure 3 Such holes are used for the second heat sink section 552 to pass through. However, the same mounting plate as in the above embodiment or the first variation can also be used.

[0148] In the second variation, the second region 55b of the second heat sink 552 is not located on the moving path of the printed wiring board 51 when the substrate assembly 50 is removed from the mounting plate 57, so the substrate assembly 50 is easy to remove.

[0149] (6-3) Third variation

[0150] Figure 6 It is Figure 3 The diagram shows the replacement of radiator 55 with the radiator of the third variant. Figure 6In the middle section, the upper section represents the normal state of the control device 60, the middle section represents the first state with the heat transfer plate 59 removed, and the lower section represents the second state with the substrate assembly 50 removed from the mounting plate 57.

[0151] (6-3-1) Radiator 55

[0152] The radiator 55 is a plate-shaped component having a first radiator section 551 and a second radiator section 552. The first radiator section 551 contacts the mounting plate 57. The second radiator section 552 does not contact the mounting plate 57.

[0153] The first heat sink portion 551 is in close contact with the heating surface of the heating element 53. A first region 55a is provided on the surface of the first heat sink portion 551 that is different from the surface facing the heating element 53, and is opposite to the mounting plate 57.

[0154] Furthermore, a second region 55b is provided on the surface of the second radiator portion 552 that is different from the surface facing the heat-generating component 53 and is not opposite to the mounting plate 57.

[0155] (6-3-2) Mounting plate 57

[0156] The mounting plate 57 and the second heat sink portion 552 of the heat sink 55 do not interfere with each other, therefore, it is not necessary to Figure 3 Such holes are used for the second heat sink section 552 to pass through. However, the same mounting plate as in the above embodiment or the first variation can also be used.

[0157] In the third variation, the second region 55b of the second heat sink 552 is not located on the moving path of the printed wiring board 51 when the substrate assembly 50 is removed from the mounting plate 57, so the substrate assembly 50 is easy to remove.

[0158] like Figure 6 As shown in the lower paragraph, the moving path of the printed wiring board 51 refers to the path of the printed wiring board 51 when it moves along the removal direction (direction of the hollow arrow) of the substrate assembly.

[0159] The embodiments of this disclosure have been described above. However, it should be understood that various changes in manner and details can be made without departing from the spirit and scope of this disclosure as set forth in the claims.

Claims

1. A control device (60), characterized in that, The control device (60) includes: Printed wiring board (51); A heating element (53) is mounted on the printed wiring board (51); A radiator (55) is fixed to the heat-generating component (53); Mounting plate (57), on which the printed wiring board (51) is mounted; and A heat transfer plate (59) is fixed to the radiator (55) while it is equipped with refrigerant piping (591). Viewed from the printed wiring board (51), the heat-generating component (53), the heat sink (55), and the mounting plate (57) are arranged sequentially in the thickness direction of the printed wiring board (51). On the side of the radiator (55) that is different from the side facing the heat-generating component (53), there is a first region (55a) opposite to the mounting plate (57) and a second region (55b) that is not opposite to the mounting plate (57). The second region (55b) is not located on the path of the printed wiring board (51) when it is removed from the mounting plate (57). The heat transfer plate (59) is fixed to the second region (55b).

2. The control device (60) according to claim 1, characterized in that, The radiator (55) has: A first radiator section (551) including the first region (55a); and The second heat sink section (552) includes the second region (55b). The radiator (55) is formed such that the first radiator section (551) and the second radiator section (552) form a predetermined angle.

3. The control device (60) according to claim 2, characterized in that, The first heat sink section (551) and the second heat sink section (552) form an L-shape.

4. The control device (60) according to claim 1, characterized in that, On the side of the radiator (55) that is different from the side facing the heat-generating component (53), a third region (55c) is also provided, which is not opposite to the mounting plate (57) and is different from the second region (55b). The radiator (55) has: A first heat sink section (551) including the first region (55a); The second radiator section (552) includes the second region (55b); and The third heat sink section (553) includes the third region (55c). The first radiator section (551) is located between the second radiator section (552) and the third radiator section (553). The radiator (55) is configured such that the second radiator section (552) and the third radiator section (553) form a predetermined angle with the first radiator section (551). The third region (55c) is not located on the path of the printed wiring board (51) when it is removed from the mounting plate (57). The heat transfer plate (59) is fixed to the second region (55b) or the third region (55c).

5. The control device (60) according to claim 3, characterized in that, The mounting plate (57) has a hole or notch through which the second heat sink portion (552) of the heat sink (55) passes.

6. The control device (60) according to claim 4, characterized in that, The mounting plate (57) has a hole or notch through which at least one of the second radiator portion (552) and the third radiator portion (553) of the radiator (55) passes.

7. The control device (60) according to claim 1 or 2, characterized in that, The first region (55a) of the radiator (55) is in close contact with the mounting plate (57).

8. A heat source unit comprising a housing for receiving the control device (60) as claimed in claim 1 or 2, characterized in that, The housing has a maintenance opening on the side opposite to the heat transfer plate (59).

9. The heat source unit according to claim 8, characterized in that, The heat transfer plate (59) is fastened to the second region (55b) of the radiator (55) by screws. The screw is tightened in the same direction as the opening of the opening.

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