Sealing device for etching, bearing device and etching equipment

Abstract

The utility model relates to the technical field of semiconductor, provide a kind of etching with sealing device, bearing device and etching equipment, the etching with sealing device includes base, sealing element and force unit;The sealing element is annular and can be elastically deformed;The force unit is arranged in the base, the force unit is connected with the sealing element, the force unit is at least used to apply the force of radial outward to the sealing element to make the sealing element elastically expand along radial direction.By etching with sealing device for the outer circumferential surface of silicon wafer is sealed, so that only the upper surface of silicon wafer is exposed in etching environment, to facilitate the removal of the edge of back sealing film, and also can improve the phenomenon that silicon wafer is broken by clamping force.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a sealing device, a support device, and an etching equipment for etching. Background Technology

[0002] In semiconductor manufacturing, especially for heavily doped silicon wafers, a back seal film, such as a low-temperature silicon oxide (LTO) film, is deposited on the back side of the wafer to prevent self-doping during epitaxy. However, due to process limitations, the deposited film can extend from the back side of the wafer to the edge of the front side during LTO deposition. The LTO at the front edge of the wafer can come into contact with and rub against the carrier during transport, causing it to detach and resulting in particle problems.

[0003] Therefore, in order to reduce the self-doping effect of epitaxy without generating particle problems, it is necessary to completely retain the LTO on the back side of the silicon wafer, but it is also necessary to completely remove the back sealing film layer on the edge of the front side of the silicon wafer.

[0004] The back seal film is removed using a back seal film etching device. Existing back seal film etching devices typically include a rigid snap-fit ​​structure that is symmetrically arranged vertically. The two snap-fit ​​structures cover the central part of the silicon wafer, exposing the edges of the front and back sides of the silicon wafer. The exposed back seal film is then removed by introducing etching gas.

[0005] The aforementioned etching equipment, with its rigid clips, struggles to effectively seal the center of the silicon wafer, allowing etching gases to easily leak into the wafer's center and damage the integrity of the back seal film. Exposing the edges of both the front and back sides of the wafer makes it difficult to completely preserve the back seal film layer on the back. Furthermore, the symmetrical clip arrangement creates an uneven clamping force on the substrate, which can easily lead to uneven stress and ultimately substrate breakage when in contact with the substrate.

[0006] Therefore, there is a need for an etching sealing device, a carrier device, and an etching equipment. The etching sealing device seals the outer peripheral surface of the silicon wafer so that only the upper surface of the silicon wafer is exposed to the etching environment, thereby facilitating the removal of the back seal film at the edge of the upper surface of the silicon wafer. Utility Model Content

[0007] This utility model provides an etching sealing device, a carrier device, and an etching equipment. The etching sealing device is used in conjunction with the carrier to seal the outer peripheral surface of the silicon wafer, so that only the upper surface of the silicon wafer is exposed to the etching environment. This facilitates the removal of the back sealing film at the edge of the upper surface of the silicon wafer and can also improve the phenomenon of silicon wafer breakage due to clamping force.

[0008] This utility model provides a sealing device for etching, including: a substrate, a sealing element, and a force-applying unit;

[0009] The sealing element is annular and elastically deformable;

[0010] The force-applying unit is disposed on the substrate and connected to the seal. The force-applying unit is at least used to apply a radially outward force to the seal so that the seal expands elastically in the radial direction.

[0011] Optionally, the force-applying unit includes a plurality of force-applying components, each of which is arranged circumferentially around the seal and connected to the outer peripheral surface of the seal to provide a radially outward force to the seal.

[0012] Optionally, the force-applying component includes a movable member connected to the outer peripheral surface of the seal, the movable member being configured to move radially.

[0013] Optionally, the substrate has an inner cavity, and the inner wall of the inner cavity has an annular groove. The portion of the seal near its outer peripheral surface is sealed and embedded in the groove, while the portion of the seal near its inner peripheral surface is located outside the groove.

[0014] Optionally, the force-applying unit is disposed within the groove.

[0015] Optionally, when the seal is subjected to the force and expands elastically in the radial direction, the portion of the seal near its inner circumferential surface is located within the groove.

[0016] Optionally, the inner cavity has an opening at one end along the axial direction of the groove, and the opening has an outwardly expanding flared structure.

[0017] This utility model also provides a support device, including a support member and the above-mentioned etching sealing device;

[0018] The carrier has a bearing surface for bearing a silicon wafer, the bearing surface being perpendicular to the axial direction of the seal. When the silicon wafer is supported on the bearing surface, the outer peripheral surface of the silicon wafer is radially aligned with the inner peripheral surface of the seal.

[0019] Optionally, when the substrate has an inner cavity, the carrier is disposed in the inner cavity.

[0020] This invention also provides an etching apparatus, including the aforementioned support device.

[0021] The aforementioned etching sealing device can be used in conjunction with a carrier. When the force-applying unit applies a radially outward force to the sealing device, the sealing device expands radially, its inner diameter being larger than the inner diameter of the silicon wafer. The silicon wafer is then supported on the carrier. Subsequently, the force-applying unit removes the radially outward force, and the sealing device springs back to its original position. The inner circumferential surface of the sealing device naturally conforms to the outer circumferential surface of the silicon wafer, forming a sealing effect. The sealing device can be sealed within the etching process cavity. At this time, the space of the process cavity on both sides of the silicon wafer along the axial direction can be isolated by the sealing device, allowing only the front side of the silicon wafer to be exposed to the etching environment. During this process, the etching gas will not come into contact with the back side of the silicon wafer, ensuring the integrity of the back seal film on the back side of the silicon wafer. Moreover, the elastic force applied to the outer periphery of the silicon wafer during the sealing process of the aforementioned sealing device can improve the phenomenon of silicon wafer breakage caused by uneven clamping force of existing snap-fit ​​structures. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of an existing silicon wafer etching structure;

[0023] Figure 2 This is a partial structural diagram of an etching apparatus according to an embodiment of the present invention. Figure 1 ;

[0024] Figure 3 This is a partial structural diagram of an etching apparatus according to an embodiment of the present invention. Figure 2 ;

[0025] Figure 4 This is a schematic diagram of the force-applying component distribution structure according to an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the force-applying component according to an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the etching process of an etching device according to an embodiment of the present invention.

[0028] In the attached diagram:

[0029] 100 - First snap fastener; 200 - Second snap fastener; 300 - Substrate; 310 - Back sealing film;

[0030] 10-Base; 11-Inner cavity; 12-Groove; 13-Opening;

[0031] 20 - Seals;

[0032] 30 - Force-applying unit; 31 - Force-applying component; 311 - Moving part;

[0033] 40 - Bearing component; 41 - Bearing surface;

[0034] 50 - Cover;

[0035] 60 - Ventilation tube;

[0036] 70-Silicon wafer;

[0037] 80-Robotic arm. Detailed Implementation

[0038] The etching sealing device proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0039] In this invention, "outer diameter" and "inner diameter" refer to the diameter of a circular structure, while for a non-circular structure, the inner diameter refers to the diameter of its inscribed circle and the outer diameter refers to the diameter of its circumscribed circle. "Axial direction" refers to the direction of the central axis of a cylindrical rod, while for a non-cylindrical rod, the axial direction refers to the length direction of the rod.

[0040] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Additionally, as used in this invention, “installed,” “connected,” “joined,” and “set” on one element from another should be interpreted broadly, generally indicating only a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located inside, outside, above, below, or to one side of another element, unless otherwise explicitly stated. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances. Furthermore, directional terms such as above, below, up, down, upward, downward, left, right, etc., are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0041] Combination Figure 1As shown, existing back-sealing film etching equipment typically includes two rigid clips arranged symmetrically, namely a first clip 100 and a second clip 200. The first clip 100 and the second clip 200 clamp the substrate 300 on both axial sides, such as a silicon wafer. Figure 1 As shown, the back side of the substrate 300 has a back sealing film 310, which extends from the back side of the silicon wafer to the edge of the front side of the silicon wafer.

[0042] After the first clip 100 and the second clip 200 clamp the substrate 300, the center portion of the front and back sides are covered, and the edge portion of the front and back sides of the substrate is exposed. Then, etching gas is introduced to remove the exposed back sealing film layer.

[0043] The aforementioned etching equipment, with its rigid clips, struggles to effectively seal the center of the substrate, allowing etching gases to easily leak into the substrate's center and compromise the integrity of the back seal film. Furthermore, the exposed edges of the front and back sides of the substrate make it difficult to completely preserve the back seal film layer on the back. Moreover, the symmetrical clip arrangement creates an uneven clamping force on the substrate, which can easily lead to uneven stress upon contact, potentially causing substrate breakage.

[0044] Combination Figure 2 As shown, this embodiment provides an etching apparatus, which includes a support device that can support a silicon wafer and perform the etching process.

[0045] The supporting device includes an etching sealing device and a supporting component 40;

[0046] The etching sealing device includes: a substrate 10, a sealing element 20, and a force application unit 30;

[0047] The substrate 10 serves as the outer shell of the etching equipment, and the substrate 10 has an inner cavity 11 for forming an etching chamber to perform the etching process.

[0048] The force-applying unit 30 is disposed on the substrate 10. The sealing element 20 is annular and elastically deformable. The annular shape can be circular, elliptical, or other circumferentially closed structures. The sealing element 20 is annular, with its hollow portion used to accommodate the silicon wafer 70 and thus seal the outer peripheral surface of the silicon wafer 70. Therefore, the annular shape of the sealing element 20 should match the shape of the silicon wafer 70. Existing silicon wafers 70 are usually disc-shaped, so the sealing element 20 is annular.

[0049] The seal 20 can be made of a material that does not react with the etching gas. For example, when the etching gas is hydrogen fluoride, the seal 20 can be made of fluororubber (FKM / FPM), perfluoroether rubber (FFKM), or other materials. The material of the seal 20 can be flexibly selected based on the actual etching gas.

[0050] The force-applying unit 30 is connected to the sealing member 20, and the force-applying unit 30 is used to apply a radially outward force to the sealing member 20 so that the sealing member 20 expands elastically in the radial direction.

[0051] The outer diameter of the silicon wafer 70 should be smaller than the inner diameter of the seal 20 after elastic expansion, so that the silicon wafer 70 can be accommodated inside the seal 20 after expansion. The outer diameter of the silicon wafer 70 should be equal to or slightly larger than the inner diameter of the seal 20 in its natural state, so that after the force is removed, the seal 20 springs back to its original position, and the inner circumferential surface of the seal 20 naturally seals against the outer circumferential surface of the silicon wafer 70.

[0052] Please continue to refer to this. Figure 2 and Figure 3 As shown, the support member 40 is disposed in the inner cavity 11;

[0053] The carrier 40 has a carrier surface 41 for carrying the silicon wafer 70. The carrier surface 41 is perpendicular to the axial direction of the seal 20, and the position of the carrier surface 41 relative to the seal 20 should ensure that when the silicon wafer 70 is carried on the carrier surface 41, the outer peripheral surface of the silicon wafer 70 is radially aligned with the inner peripheral surface of the seal 20.

[0054] Furthermore, the carrier 40 is vertically movably disposed within the inner cavity 11. After the sealing member 20 is sealed and adhered to the outer peripheral surface of the silicon wafer 70, the carrier 40 can be lowered and retracted. At this time, the bearing surface 41 of the carrier 40 separates from the silicon wafer 70, thus mitigating silicon wafer contamination or surface defects caused by prolonged contact between the silicon wafer 70 and the carrier 40. After etching is completed, the carrier 40 is raised and reset to support the silicon wafer 70 again.

[0055] In other alternative embodiments, the carrier 40 may have a built-in flow channel for drawing air, so that a negative pressure environment is formed at the location of the carrier surface 41, thereby achieving vacuum adsorption and fixation of the silicon wafer carried thereon.

[0056] The aforementioned etching sealing device can be used in conjunction with the carrier 40. When the force-applying unit 30 applies a radially outward force to the sealing element 20, the sealing element 20 expands radially, its inner diameter being larger than the inner diameter of the silicon wafer 70. The silicon wafer 70 is then supported on the carrier 40. Subsequently, the force-applying unit 30 removes the radially outward force, and the sealing element 20 springs back to its original position. The inner circumferential surface of the sealing element 20 naturally conforms to the outer circumferential surface of the silicon wafer 70, forming a sealing effect. The sealing element 20 can be sealed within the etching process cavity. At this time, the sealing element 20 can isolate the space of the process cavity on both sides of the silicon wafer 70 axially, allowing only the front side of the silicon wafer 70 to be exposed to the etching environment. During this process, the etching gas will not contact the back side of the silicon wafer 70, ensuring the integrity of the back seal film on the back side of the silicon wafer 70. Furthermore, the elastic force applied to the outer periphery of the silicon wafer 70 during the sealing process can improve the phenomenon of silicon wafer 70 cracking caused by uneven clamping force in existing snap-fit ​​structures.

[0057] In this embodiment, the housing of the etching equipment is used as the substrate 10. In other alternative embodiments, the substrate 10 can be a component independent of the etching equipment housing, in which case the substrate 10 can be installed inside the facility equipment housing as an independent component.

[0058] In this embodiment, the force-applying unit 30 applies a radially outward force to the sealing element 20 to ensure its expansion. When the force is removed, the sealing element 20 utilizes its own rebound force to seal against the outer peripheral surface of the silicon wafer 70. In other alternative embodiments, the force-applying unit 30 can also apply a radially inward force. When the radially outward force is removed, a radially inward force can be applied appropriately to ensure that the inner peripheral surface of the sealing element 20 is pressed against the outer peripheral surface of the silicon wafer 70 to form a reliable seal. The radially inward force also makes the sealing force controllable, allowing for flexible adjustment of the pressure between the inner peripheral surface of the sealing element 20 and the outer peripheral surface of the silicon wafer 70 based on actual usage requirements.

[0059] Please continue to refer to this. Figure 2 As shown, in this embodiment, the inner cavity 11 on the base 10 is a cylindrical cavity, and the support member 40 has an annular structure. The outer peripheral surface of the support member 40 conformally fits the inner peripheral surface of the inner cavity 11, and one axial end of the support member 40 ( Figure 2 The upper end of the ring is used as the bearing surface 41, so the bearing surface 41 is circular.

[0060] The inner wall of the inner cavity 11 is provided with an annular groove 12 along its circumference, and the groove 12 is located above the bearing surface 41.

[0061] In its natural state, the portion of the seal 20 near its outer peripheral surface is embedded in the groove 12, while the portion of the seal 20 near its inner peripheral surface is located outside the groove 12.

[0062] Furthermore, the force-applying unit 30 is disposed within the groove 12, and the force-applying unit 30 is located on the side of the groove 12 near the outer peripheral surface of the seal 20.

[0063] When the seal 20 is subjected to the force and expands radially elastically, the portion of the seal 20 near its inner circumferential surface moves radially inward into the groove 12. At this time, the seal 20 will not interfere with the space of the inner cavity 11, facilitating the placement of the silicon wafer 70 on the bearing surface 41.

[0064] like Figure 2 and Figure 3 As shown, the inner cavity 11 is along the axial direction of the groove 12 ( Figure 2 One end of the cavity (in the vertical direction) has an opening 13, wherein the opening 13 is located at the top of the inner cavity 11, and the opening 13 is outward ( Figure 2 The opening 13 is an upwardly expanding conical structure. In this embodiment, the small diameter end (lower end) of the opening 13 is connected to the straight cylindrical section of the inner cavity 11 by an arc transition. On the one hand, it can guide the silicon wafer 70 during placement, and on the other hand, it helps to prevent physical wear on the edge of the silicon wafer when picking up and putting it in.

[0065] The groove 12 is located inside the opening 13 along the axial direction of the groove 12. The support member 40 is located below the groove 12, that is, the support member 40 is located on the side of the groove 12 away from the opening 13. The support member 40 is located at the bottom of the inner cavity 11.

[0066] In addition, the etching apparatus also includes a cover 50 and a vent pipe 60. During the etching process, the cover 50 seals the opening 13, so that the inner cavity 11 forms a sealed etching process chamber. The vent pipe 60 is located on the side of the groove 12 near the opening 13, and the vent pipe 60 communicates with the inner cavity 11 to introduce etching gas into the inner cavity 11.

[0067] Combination Figure 4 and Figure 5 As shown, the force-applying unit 30 includes a plurality of force-applying components 31, each of the force-applying components 31 being arranged around the circumference of the sealing member 20. The force-applying components 31 are connected to the outer circumferential surface of the sealing member 20 and are used to provide radially outward force to the sealing member 20 in multiple radial directions.

[0068] Combination Figure 5 As shown, the force-applying component 31 includes a movable member 311, which is connected to the outer peripheral surface of the sealing member 20, and the movable member 311 is configured to move radially.

[0069] In this embodiment, the movable member 311 is an elastic member, such as a cylindrical helical spring. One end of the movable member 311 is connected to the outer peripheral surface of the sealing member 20, and the other end of the movable member 311 is connected to a driving component, such as a hydraulic driving component, a pneumatic driving component, or the output end of a motor. The driving component drives the movable member 311 to move radially in the groove 12, thereby applying a radial force to the sealing member 20.

[0070] like Figure 5 As shown, when the moving member 311 is driven to move to the right (moving outward along the radial direction of the seal 20), it pulls the seal 20 to expand radially. Through the cooperation of multiple force-applying components 31, the seal 20 expands uniformly. When the inner diameter of the seal 20 expands to be larger than that of the silicon wafer 70, the silicon wafer 70 can be placed inside the seal 20. When the moving member 311 is driven to move to the left (moving inward along the radial direction of the seal 20), the seal 20 elastically deforms and returns to its original position, and the inner wall of the seal 20 adheres to the outer peripheral surface of the silicon wafer 70 to form a seal. In addition, the moving member 311 can be driven to move further to the left, which can apply an inward force to the seal 20 to assist its contraction, so that the seal 20 is tightly fitted to the outer peripheral surface of the silicon wafer 70.

[0071] In this embodiment, four sets of force-applying components 31 are provided, and each force-applying component 31 is evenly arranged around the circumference of the seal 20. In other alternative embodiments, for example, a set of force-applying components 31 can be provided at 30° central angles to ensure that the seal 20 is subjected to a uniform outward force, achieving uniform expansion. The specific number of force-applying components 31 can be flexibly adjusted based on actual usage requirements.

[0072] In this embodiment, the force-applying unit 30 is disposed on the radial side of the seal 20. In other alternative embodiments, the force-applying unit 30 may be disposed on the axial side of the seal 20, and the force-applying unit 30 may be connected to the axial side of the seal 20. When the force-applying unit 30 moves radially, it will also apply a radial expansion force.

[0073] In this embodiment, a sensor can be provided to sense whether the silicon wafer is in place. For example, the sensor is a position sensor. When the sensor senses that there is a silicon wafer above the seal 20, the sensor sends a signal to the driving component, and the driving component drives the moving part 311 to move radially outward, causing the seal 20 to expand. When the sensor senses that the silicon wafer is placed in a designated position (located in the middle of the seal 20, and the silicon wafer is radially opposite to the seal), the sensor sends a signal to the driving component, and the driving component drives the moving part 311 to move radially inward to remove the force, causing the seal 20 to spring back and reset, and the seal 20 and the silicon wafer are sealed together.

[0074] In this embodiment, the movable component 311 is an elastic structure. In other alternative embodiments, the movable component 311 can be a magnetic attractor connected to the outer peripheral surface of the sealing component 20. An electromagnet can be placed in the groove 12, and the magnetic attraction force generated by switching the electromagnet on and off can attract the movable component 311 to move radially, thereby providing a force for the sealing component 20. Alternatively, the magnetic attraction force can be generated by changing the direction of the current in the electromagnet, thereby driving the magnetic attractor to move radially outward or inward. The specific structure of the movable component 311 can be flexibly adjusted according to actual usage requirements.

[0075] Combination Figure 2 and Figure 6 As shown, the etching equipment also includes components such as a cover 50, a vent pipe 60, and a robotic arm 80. During the etching process, the cover 50 is first opened, causing the opening 13 of the inner cavity 11 to open. The robotic arm 80 transports the silicon wafer into the inner cavity 11. When the sensor detects a silicon wafer at the opening 13, the sensor sends a signal to the force application unit 30. At this time, the force application unit 30 applies a radially outward force to the sealing element 20, causing the sealing element 20 to expand elastically in the radial direction. The inner diameter of the sealing element 20 is larger than the outer diameter of the silicon wafer 70.

[0076] Then, the robotic arm 80 picks up the silicon wafer 70 and places it on the bearing surface 41 of the carrier 40 through the opening 13. The robotic arm 80 retracts, and the silicon wafer 70 is vacuum-adsorbed by the bearing surface 41. At this time, the outer peripheral surface of the silicon wafer 70 is facing the inner peripheral surface of the sealing member 20. The sensor detects that the silicon wafer 70 is located on the bearing surface 41 and sends a signal to the force application unit 30. The force application unit 30 removes the force, the sealing member 20 contracts, and its inner peripheral surface seals against the outer peripheral surface of the silicon wafer 70.

[0077] Covering the opening 13 with the cover 50 seals the inner cavity 11, forming a process cavity. At this point, the sealing between the seal 20 and the groove 12, as well as the sealing between the seal 20 and the silicon wafer 70, isolates the process cavity into two independent chambers, with the front side of the silicon wafer 70 facing the upper chamber. The vent pipe 60 connects to the upper chamber, and etching gas is introduced through the vent pipe 60. The etching gas reacts with the back seal film at the edge of the front side of the silicon wafer to remove the back seal film. After etching is complete, the force application unit 30 applies a radially outward force to the seal 20, causing the seal 20 to elastically expand radially again, opening the cover 50. The bearing surface 41 releases its adsorption on the silicon wafer 70, and the silicon wafer is then removed by the robotic arm 80.

[0078] In addition, the etching equipment also includes structures such as radio frequency power supply, anode, cathode, gas source and vacuum pump. The difference between the etching equipment in this utility model and the existing etching equipment lies in the structure related to the above-mentioned etching sealing device and bearing device. Other structures are consistent with the existing etching equipment and will not be described in detail here.

[0079] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0080] The above description is merely a description of a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A sealing device for etching, characterized in that, include: Substrate, seals, and force application unit; The sealing element is annular and elastically deformable; The force-applying unit is disposed on the substrate and connected to the seal. The force-applying unit is at least used to apply a radially outward force to the seal so that the seal expands elastically in the radial direction.

2. The etching sealing device as claimed in claim 1, characterized in that, The force-applying unit includes several force-applying components, each of which is arranged circumferentially around the seal. The force-applying components are connected to the outer peripheral surface of the seal and are used to provide a radially outward force to the seal.

3. The etching sealing device as described in claim 2, characterized in that, The force-applying component includes a movable element connected to the outer peripheral surface of the seal, and the movable element is configured to move radially.

4. The etching sealing device according to any one of claims 1 to 3, characterized in that, The substrate has an inner cavity, and the inner wall of the inner cavity has an annular groove. The portion of the seal near its outer peripheral surface is embedded in the groove, while the portion of the seal near its inner peripheral surface is located outside the groove.

5. The etching sealing device as described in claim 4, characterized in that, The force-applying unit is disposed within the groove.

6. The etching sealing device as described in claim 4, characterized in that, When the seal is subjected to the force and expands elastically in the radial direction, the portion of the seal near its inner circumferential surface is located within the groove.

7. The etching sealing device as described in claim 4, characterized in that, The inner cavity has an opening at one end along the axial direction of the groove, and the opening has an outwardly expanding flared structure.

8. A supporting device, characterized in that, Includes a carrier and an etching sealing device as described in any one of claims 1 to 7; The carrier has a bearing surface for bearing a silicon wafer, the bearing surface being perpendicular to the axial direction of the seal. When the silicon wafer is supported on the bearing surface, the outer peripheral surface of the silicon wafer is radially aligned with the inner peripheral surface of the seal.

9. The bearing device as described in claim 8, characterized in that, When the substrate has an inner cavity, the carrier is disposed in the inner cavity.

10. An etching apparatus, characterized in that, Includes the support device as described in claim 8 or 9.

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