Cavity type package structure

By employing a double-sided heat dissipation design in a cavity-type packaging structure, and utilizing the combination of a thermally conductive substrate and a top cover, heat conduction between the upper and lower surfaces of the chip is achieved, solving the problem of insufficient heat dissipation in existing technologies and improving the heat dissipation efficiency of the packaging structure.

CN224368290UActive Publication Date: 2026-06-16JCET GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JCET GROUP CO LTD
Filing Date
2025-06-20
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Existing cavity-type packaging structures have insufficient heat dissipation performance, especially in the case of core heat-generating chips, which leads to a decline in product performance or even failure.

⚗Method used

The chip employs a double-sided heat dissipation design. By combining a thermally conductive substrate and a top cover on the substrate, heat dissipation is achieved on both sides of the chip using thermally conductive components. This includes a first thermally conductive part and a second thermally conductive part, which conduct heat from the upper and lower surfaces of the chip to the top cover for heat dissipation.

🎯Benefits of technology

It significantly improves the heat dissipation performance of cavity-type packaging structures, ensuring that the chip can effectively dissipate heat when operating at high power, and avoiding performance degradation or failure caused by excessive temperature.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a cavity kind of packaging structure, include: substrate, upper cover is set on the substrate upper surface with form sealed cavity with the substrate, the upper cover includes the first heat conduction part of extending to the substrate and second heat conduction part, heat conduction base is located in the cavity with set up the substrate upper surface, the heat conduction base includes heat conduction area and the mounting area, the first heat conduction part lower surface with heat conduction area upper surface is connected, chip is located in the cavity with set up the mounting area upper surface, second heat conduction part lower surface with chip upper surface is connected. The utility model cavity kind of packaging structure through the setting of upper cover and heat conduction base has realized to the chip double -sided direct heat dissipation, has improved the cavity kind of packaging structure heat dissipation performance greatly.
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