Gluing device for electronic component production

Abstract

This utility model discloses a gluing device for electronic component production, including a frame. A movable gluing head is provided on the top of the frame. An electric telescopic rod is fixedly connected to the front side of the top of the frame via a support plate. A limiting plate is fixedly connected to the telescopic end of the electric telescopic rod. When electronic components need to be glued and bonded, the circuit board is simply placed on the inner surface of the placement rack. The electric telescopic rod drives the limiting plate to slide on the top of the frame, thereby limiting and fixing the longitudinal width of the circuit board. By rotating the positive and negative threaded rods, the positive and negative threaded rods rotate on the inner surface of the limiting plate, thereby driving the threaded sleeve to rotate. Through the limiting sliding of the through groove, the limiting plate moves, thereby causing the adjusting plate to contact the circuit board, thereby limiting and fixing the lateral width. This facilitates adjustment and fixing of the limiting dimensions, thus meeting the purpose of gluing and bonding electronic components to circuit boards of different sizes.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component coating technology, and in particular relates to coating equipment for electronic component production. Background Technology

[0002] Electronic component dispensing is a widely used process in electronic manufacturing. It is used to precisely apply adhesive to the circuit board connector to bond electronic components and achieve a fixed bonding function.

[0003] When connecting some electronic components to circuit boards, the circuit board is first fixed in place at the work station, and then the electronic components are bonded to the circuit board by applying adhesive. Due to the different sizes of the circuit boards, the adhesive application process becomes inconvenient. To address this, we propose an adhesive application device for the production of electronic components that allows for easy adjustment of the fixed position, thus overcoming the shortcomings of existing technologies. Utility Model Content

[0004] The purpose of this invention is to provide a gluing equipment for the production of electronic components, which has the ability to easily adjust the fixed limit size to meet the purpose of gluing and bonding electronic components to circuit boards of different sizes, thereby solving the aforementioned technical problems.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A gluing equipment for electronic component production includes a frame. A movable gluing head is provided on the top of the frame. An electric telescopic rod is fixedly connected to the front side of the top of the frame via a support plate. A limiting plate is fixedly connected to the telescopic end of the electric telescopic rod. The bottom of the limiting plate is slidably disposed between the limiting plate and the frame. A placement frame is fixedly connected to the top of the frame. A positive and negative threaded rod is rotatably connected to the inner surface of the limiting plate via a bearing. A threaded sleeve is threadedly connected to the surface of the positive and negative threaded rod. A through groove is opened on the back of the limiting plate, and a limiting plate is slidably connected to the inner surface of the through groove via a connecting plate. An adjusting plate is slidably disposed on the opposite side of the limiting plate, and the adjusting plate is driven and adjusted by an adjusting structure.

[0006] Preferably, the adjustment structure includes a connecting frame fixedly connected to the outside of the limiting plate two. An adjusting screw is rotatably connected to the inner surface of the connecting frame via a bearing. A threaded sleeve two is threadedly connected to the surface of the adjusting screw. A sliding plate is fixedly connected to the surface of the threaded sleeve two. The opposite side of the sliding plate is fixedly connected to the adjusting plate.

[0007] Preferably, the second limiting plate has a sliding groove inside it, which is adapted to slide at the position corresponding to the sliding plate.

[0008] Preferably, a limiting block is fixedly connected at the middle of the surface of the positive and negative threaded rod.

[0009] Preferably, a guide block is fixedly connected to one side of the limiting plate two, and a guide groove is provided on the side of the adjusting plate opposite to the limiting plate two, and the inner surface of the guide groove is slidably connected to the surface of the guide block.

[0010] Preferably, the placement rack has an L-shaped design, and a protective pad is bonded to the opposite side of the adjustment plate and the inner surface of the placement rack.

[0011] The beneficial effects of this utility model are:

[0012] 1. When electronic components need to be glued and bonded, this utility model only requires placing the circuit board on the inner surface of the placement rack. The electric telescopic rod drives the limiting plate one to slide on the top of the frame, thereby limiting and fixing the longitudinal width of the circuit board. By rotating the positive and negative threaded rods, the positive and negative threaded rods rotate on the inner surface of the limiting plate one, thereby driving the threaded sleeve one to rotate. Through the limiting sliding of the through groove, the limiting plate two moves, thereby making the adjusting plate contact the circuit board, thereby limiting and fixing the lateral width. By setting the above structure, it is convenient to adjust and fix the limiting size, thereby meeting the purpose of gluing and bonding electronic components to circuit boards of different sizes.

[0013] 2. This utility model adjusts the rotation of the screw, thereby driving the threaded sleeve two to rotate in a threaded manner, and drives the adjusting plate to move up and down by sliding the sliding plate on the inner surface of the sliding groove. It can be limited and fixed according to the thickness of the circuit board.

[0014] 3. This utility model can limit the movement of the threaded sleeve by setting a limiting block;

[0015] 4. This utility model prevents damage to the circuit board when it is touched by a protective pad. Attached Figure Description

[0016] in:

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the limiting plate structure of this utility model;

[0019] Figure 3 This is a partial enlarged view of point A of this utility model;

[0020] Figure 4 This is a schematic diagram of the limiting plate structure of this utility model from another perspective.

[0021] The attached diagram lists the components represented by each number as follows:

[0022] 1. Frame, 2. Glue applicator head, 3. Support plate, 4. Electric telescopic rod, 5. Limiting plate one, 6. Placement rack, 7. Positive and negative threaded rod, 8. Threaded sleeve one, 9. Limiting plate two, 10. Adjusting plate, 11. Connecting frame, 12. Adjusting screw, 13. Threaded sleeve two, 14. Sliding plate. Detailed Implementation

[0023] In the following description, embodiments of the adhesive coating equipment for the production of electronic components according to the present invention will be described with reference to the accompanying drawings.

[0024] Example 1:

[0025] Figure 1-4 This invention illustrates an embodiment of an adhesive coating device for electronic component production, comprising a frame 1. A movable adhesive coating head 2 is mounted on the top of the frame 1, and this movement is via an X / Y / Z axis machine tool, which is prior art. An electric telescopic rod 4 is fixedly connected to the front of the top of the frame 1 via a support plate 3. A limit plate 5 is fixedly connected to the telescopic end of the electric telescopic rod 4. The bottom of the limit plate 5 is slidably disposed between the limit plate 5 and the frame 1. A placement rack 6 is fixedly connected to the top of the frame 1. A threaded rod 7 with positive and negative threads is rotatably connected to the inner surface of the limit plate 5 via a bearing. A threaded sleeve 8 is threadedly connected to the surface of the threaded rod 7. A through groove is formed on the back of the limit plate 5, and a limit plate 9 is slidably connected to the inner surface of the through groove via a connecting plate. An adjustment plate 10 is slidably disposed on the opposite side of the limit plate 9. The adjustment plate 10 is driven and adjusted by an adjustment structure, which includes a fixed... A connecting frame 11 is fixedly connected to the outside of the limiting plate 2 9. An adjusting screw 12 is rotatably connected to the inner surface of the connecting frame 11 via a bearing. A threaded sleeve 2 13 is threadedly connected to the surface of the adjusting screw 12. A sliding plate 14 is fixedly connected to the surface of the threaded sleeve 2 13. The opposite side of the sliding plate 14 is fixedly connected to the adjusting plate 10. A guide block is fixedly connected to the opposite side of the limiting plate 2 9. A guide groove is opened on the side of the adjusting plate 10 opposite to the limiting plate 2 9. The inner surface of the guide groove is slidably connected to the surface of the guide block. By rotating the adjusting screw 12, the threaded sleeve 2 13 is driven to rotate threadedly. The sliding plate 14 slides on the inner surface of the sliding groove, thereby driving the adjusting plate 10 to move up and down. It can be limited and fixed according to the thickness of the circuit board. A sliding groove that is adapted to slide is opened inside the limiting plate 2 9 at the position corresponding to the sliding plate 14.

[0026] When applying adhesive to bond electronic components, simply place the circuit board on the inner surface of the mounting rack 6. The electric telescopic rod 4 drives the limiting plate 5 to slide on the top of the frame 1, thereby limiting and fixing the longitudinal width of the circuit board. By rotating the positive and negative threaded rod 7, the positive and negative threaded rod 7 rotates on the inner surface of the limiting plate 5, thereby driving the threaded sleeve 8 to rotate. Through the limiting sliding of the through groove, the limiting plate 9 moves, thereby causing the adjusting plate 10 to contact the circuit board, thereby limiting and fixing the lateral width. By setting the above structure, it is convenient to adjust and fix the limiting size, thereby meeting the purpose of applying adhesive to bond electronic components to circuit boards of different sizes.

[0027] Example 2:

[0028] Figure 1-4 This invention illustrates an embodiment of an adhesive coating device for electronic component manufacturing, comprising a frame 1, a movable coating head 2 mounted on the top of the frame 1, an electric telescopic rod 4 fixedly connected to the front of the top of the frame 1 via a support plate 3, a limit plate 5 fixedly connected to the telescopic end of the electric telescopic rod 4, the bottom of the limit plate 5 being slidably disposed between the limit plate 5 and the frame 1, and a placement rack 6 fixedly connected to the top of the frame 1. The placement rack 6 has an L-shaped design, and a protective pad is bonded to the opposite side of the adjusting plate 10 and the inner surface of the placement rack 6. By setting the protective pad, the circuit board is prevented from being damaged. In the event of damage during limit contact, the inner surface of limit plate 5 is rotatably connected to a threaded rod 7 via a bearing. A limit block is fixedly connected to the middle of the surface of the threaded rod 7. By setting the limit block, the movement of the threaded sleeve 8 can be limited. The surface of the threaded rod 7 is threadedly connected to the threaded sleeve 8. A through groove is opened on the back of limit plate 5, and the inner surface of the through groove is slidably connected to limit plate 9 via a connecting plate. An adjustment plate 10 is slidably arranged on the opposite side of limit plate 9. The adjustment plate 10 is driven and adjusted by an adjustment structure.

[0029] Working Principle: When using this invention, to bond electronic components with adhesive, simply place the circuit board on the inner surface of the mounting frame 6. The electric telescopic rod 4 drives the limiting plate 5 to slide on the top of the frame 1, thereby limiting and fixing the longitudinal width of the circuit board. By rotating the positive and negative threaded rod 7, the positive and negative threaded rod 7 rotates on the inner surface of the limiting plate 5, thereby driving the threaded sleeve 8 to rotate. Through the limiting sliding of the through groove, the limiting plate 9 moves, causing the adjusting plate 10 to contact the circuit board, thereby limiting and fixing the lateral width. By rotating the adjusting screw 12, the threaded sleeve 13 rotates. Through the sliding plate 14 sliding on the inner surface of the sliding groove, the adjusting plate 10 moves up and down. The limiting and fixing can be adjusted according to the thickness of the circuit board, making it convenient to adjust the fixed limiting size, thus meeting the purpose of bonding electronic components with adhesive to circuit boards of different sizes.

Claims

1. A coating equipment for electronic component manufacturing, comprising a frame (1), wherein a movable coating head (2) is provided on the top of the frame (1), characterized in that, An electric telescopic rod (4) is fixedly connected to the front side of the top of the frame (1) via a support plate (3). A limiting plate (5) is fixedly connected to the telescopic end of the electric telescopic rod (4). The bottom of the limiting plate (5) is slidably disposed between the frame (1). A placement rack (6) is fixedly connected to the top of the frame (1). A positive and negative threaded rod (7) is rotatably connected to the inner surface of the limiting plate (5) via a bearing. A threaded sleeve (8) is threadedly connected to the surface of the positive and negative threaded rod (7). A through groove is opened on the back of the limiting plate (5), and a limiting plate (9) is slidably connected to the inner surface of the through groove via a connecting plate. An adjustment plate (10) is slidably disposed on the opposite side of the limiting plate (9). The adjustment plate (10) is driven and adjusted by an adjustment structure.

2. The adhesive coating equipment for electronic component manufacturing according to claim 1, characterized in that, The adjustment structure includes a connecting frame (11) fixedly connected to the outside of the limiting plate (9). The inner surface of the connecting frame (11) is rotatably connected to an adjusting screw (12) via a bearing. The surface of the adjusting screw (12) is threadedly connected to a threaded sleeve (13). The surface of the threaded sleeve (13) is fixedly connected to a sliding plate (14). The opposite side of the sliding plate (14) is fixedly connected to the adjusting plate (10).

3. The adhesive coating equipment for electronic component manufacturing according to claim 2, characterized in that, The limiting plate 2 (9) has a sliding groove inside and at a position corresponding to the sliding plate (14) that is adapted to slide.

4. The adhesive coating equipment for electronic component manufacturing according to claim 1, characterized in that, A limiting block is fixedly connected at the middle of the surface of the positive and negative threaded rod (7).

5. The coating equipment for electronic component manufacturing according to claim 2, characterized in that, A guide block is fixedly connected to the opposite side of the limiting plate 2 (9), and a guide groove is provided on the side of the adjusting plate (10) opposite to the limiting plate 2 (9). The inner surface of the guide groove is slidably connected to the surface of the guide block.

6. The adhesive coating equipment for electronic component manufacturing according to claim 1, characterized in that, The placement rack (6) is L-shaped, and a protective pad is bonded to the opposite side of the adjustment plate (10) and the inner surface of the placement rack (6).

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