A glue-pushing structure for automated testing of a semiconductor module

Abstract

The application provides a glue coating and pushing structure for automatic testing of a semiconductor module, which is used for pushing the semiconductor module to coat a heat-conducting glue layer, and the glue coating and pushing structure comprises: a base, which is provided with a detection area; a push-pull frame body, which is slidably arranged on the base along a width direction; and a bearing frame body, which is arranged on the push-pull frame body through an elastic assembly and is used for bearing the semiconductor module; the bearing frame body drives the semiconductor module to move out of the detection area through the pushing of the push-pull frame body, so as to coat the heat-conducting glue layer on the semiconductor module located outside the detection area. The glue coating and pushing structure solves the problem that the semiconductor module is prone to falling and being damaged in the process of coating the heat-conducting glue by manually picking up the semiconductor module in the prior art, thereby ensuring safety.

Description

Technical Field

[0001] This application relates to the field of semiconductor module testing technology, and more specifically, to a coating and pushing structure for automated testing of semiconductor modules. Background Technology

[0002] A power semiconductor module is a combination of components configured with specific functions and modes. It consists of high-power electronic devices combined and encapsulated into a single unit. Different components within the packaged module can perform different functions, such as semiconductor field-effect transistors (FETs), insulated-gate bipolar transistors (IGBTs), and power integrated circuits. As electronic components, power semiconductor modules undergo power-on testing before leaving the factory to ensure proper circuit functionality. During normal operation, existing semiconductor modules generate heat during testing. Therefore, a heat dissipation structure is needed to dissipate heat during testing. This heat dissipation mechanism involves applying a thermally conductive adhesive layer (such as thermally conductive silicone) to the heat dissipation surface of the semiconductor module before contacting the heat dissipation structure to achieve heat dissipation.

[0003] The current process of applying thermally conductive adhesive to semiconductor modules is typically done manually. Operators pick up each semiconductor module, apply the adhesive to its surface, and then place it onto a heat dissipation structure. This manual process increases the risk of the semiconductor modules falling and being damaged, posing a safety hazard.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] The purpose of this application is to provide an automated testing adhesive application and pushing structure for semiconductor modules, which solves the problem in the prior art where semiconductor modules are easily dropped and damaged during the process of manually picking them up to apply thermally conductive adhesive, resulting in safety issues.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] This application provides an adhesive application pushing structure for automated testing of semiconductor modules, used to push the semiconductor module to apply a thermally conductive adhesive layer, wherein the adhesive application pushing structure includes: a base, on which a detection area is provided;

[0008] A sliding frame is mounted on a base along its width.

[0009] The support frame is mounted on the push-pull frame via elastic components, and the support frame is used to support the semiconductor module.

[0010] The support frame moves the semiconductor module out of the testing area by pushing and pulling the frame, so as to apply a thermally conductive adhesive layer to the semiconductor module located outside the testing area.

[0011] In an optional embodiment, the push-pull frame includes: a push-pull frame that forms a vertically continuous detection window, and the two sides of the push-pull frame in the length direction are slidably mounted on the base.

[0012] The push-pull handle is fixedly installed on the edge of the pull-out side of the push-pull frame.

[0013] In one optional embodiment, push-pull guide rails are respectively provided on both sides of the base in the width direction, and the push-pull guide rails extend along the length direction.

[0014] Push-pull slides are provided on both sides of the bottom width direction of the push-pull frame, and the push-pull slides are fitted onto the push-pull guide rail.

[0015] In an optional embodiment, the push-pull slide is disposed on the push-in side in the width direction of the push-pull frame;

[0016] A limit block is provided at the end of the base facing the pull-out side. The limit block is located on the outside of the push-pull guide rail and below the push-pull frame to support the push-pull frame.

[0017] In an optional embodiment, a limiting block is provided on one end of the push-pull frame facing the push-in side. The limiting block is located outside the push-pull guide rail and is used to abut against the limiting fixing block to limit the pull-out position of the push-pull frame.

[0018] In an optional embodiment, the support frame includes: a support frame that encloses a vertically extending receiving window;

[0019] Adjustable support platforms are spaced apart along the width direction and are located within the accommodating window. The two adjustable support platforms on both sides are used to support the two ends of the semiconductor module.

[0020] In an optional embodiment, a plurality of placement portions are provided at intervals along the length direction on the adjustment support platform;

[0021] The placement part includes: an inner groove, which is formed on the side wall of the adjustment support platform;

[0022] The outer boss is set on the side wall of the adjusting support platform and located on both sides of the opening of the inner groove;

[0023] The upper surface of the outer protrusion is recessed into the upper surface of the adjustment support platform to form a support step, which is used to support and limit the semiconductor module.

[0024] In an optional embodiment, adjusting threaded holes are provided on both sides of the support frame along its length.

[0025] The two ends of the adjustment support platform are respectively provided with a first oblong hole, and the first oblong hole is connected to the adjustment threaded hole by a screw.

[0026] In an optional embodiment, the elastic component includes: a plurality of guide posts, all of which are arranged on the push-pull frame in the vertical direction;

[0027] Elastic element, the elastic element is sleeved on the guide column;

[0028] The support frame is equipped with a support sliding sleeve, which is slidably fitted onto the guide column;

[0029] The elastic element is located between the push-pull frame and the load-bearing frame.

[0030] In an optional embodiment, a buffer limiting pad is provided on the push-pull frame or the load-bearing frame, and the buffer limiting pad is located between the push-pull frame and the load-bearing frame.

[0031] The beneficial effects of the adhesive application and sliding structure for automated testing of semiconductor modules provided in this application are at least as follows: By setting a detection area on the base and placing a support frame on a push-pull frame, the support frame supports the semiconductor module. The push-pull frame slides along the width direction on the base, allowing the support frame to move synchronously on the base. When applying thermally conductive adhesive to the semiconductor module, pulling the push-pull frame moves the support frame and the semiconductor module on it out of the detection area, allowing the application of the thermally conductive adhesive layer to the semiconductor module located outside the detection area. The thermally conductive adhesive application is completed with the support of the support frame, eliminating the need to remove the semiconductor module from the support frame, thus improving safety. When testing the semiconductor module coated with thermally conductive adhesive, pushing the push-pull frame slides the support frame and semiconductor module into the detection area, allowing the semiconductor module to be electrically tested within the detection area. The support frame is set on top via an elastic component. During testing, pressing down on the support frame allows the semiconductor module on it to move downwards and connect with the connector in the detection area, achieving electrical connection of the semiconductor module. Therefore, during the coating and testing of semiconductor modules, the semiconductor modules are prevented from falling off during the coating process by using the push-pull frame and the support frame. The push-pull method improves the coating efficiency and simplifies the testing process of the semiconductor modules. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A schematic diagram of the adhesive application and pushing structure for automated testing of a semiconductor module provided in this application embodiment during use;

[0034] Figure 2 A schematic diagram of a partial structure of a coating and pushing structure for automated testing of a semiconductor module provided in this application embodiment;

[0035] Figure 3 An exploded view of a coating push structure for automated testing of a semiconductor module provided in this application embodiment;

[0036] Figure 4 An exploded view of a portion of the adhesive spreading structure for automated testing of a semiconductor module provided in this application embodiment.

[0037] The following are the labeling elements in the figure:

[0038] 10. Semiconductor module; 100. Base; 110. Detection area; 200. Push-pull frame; 210. Push-pull frame; 211. Detection window; 220. Push-pull handle; 230. Push-pull guide rail; 240. Push-pull slide; 250. Limiting block; 260. Limiting block; 300. Support frame; 310. Support frame; 311. Reception window; 312. Adjusting threaded hole; 320. Adjusting support platform; 321. First oblong hole; 330. Placement part; 331. Inner groove; 332. Outer boss; 333. Support step; 400. Elastic component; 410. Guide column; 420. Elastic element; 430. Supporting sleeve; 440. Buffer limiting pad. Detailed Implementation

[0039] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0040] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0041] like Figure 1 As shown, this embodiment proposes an adhesive-coating and pushing structure for automated testing of a semiconductor module 10. This structure pushes the semiconductor module 10 to pull it out after the thermally conductive adhesive layer is applied, and then pushes the semiconductor module 10 back in after the thermally conductive adhesive layer is applied. For ease of structural description, the heat dissipation structure for automated testing of the semiconductor module 10 is vertically mounted on a workbench. The length direction is defined by the left-right direction from the operator, the width direction is defined by the direction facing and away from the operator (front-back direction), and the vertical direction of the workbench is the vertical direction of the structural description. All components in this embodiment are described with reference to the above directions.

[0042] like Figure 1 , Figure 2As shown, the adhesive application and moving structure of this embodiment mainly includes: a base 100, a push-pull frame 200, and a support frame 300. The base 100 mainly serves as a support structure and has a detection area 110. A corresponding connector can be provided within the detection area 110, allowing the semiconductor module 10 to connect electrically with the connector within the detection area 110 for power-on testing. The push-pull frame 200 is slidably mounted on the base 100 along its width direction. The push-pull frame 200 can be pulled back and forth on the base 100, allowing it to be pulled out from above and pushed into the detection area 110. The support frame 300 is mounted on the push-pull frame 200 via an elastic component 400 and is used to support the semiconductor module 10. The support frame 300, through the pushing motion of the push-pull frame 200, moves the semiconductor module 10 out of the detection area 110 for applying a thermally conductive adhesive layer to the semiconductor module 10 located outside the detection area 110. By pulling the push-pull frame 200, the support frame 300 and the semiconductor module 10 on it can move back and forth on the base 100, thereby pulling out and pushing the semiconductor module 10 into the test area 110. When the semiconductor module 10 is pulled out of the test area 110 facing forward, the operator can apply adhesive to the surface of the semiconductor module 10. After the adhesive is applied, the semiconductor module 10 is pushed back into the test area 110, so that the semiconductor module 10 after applying adhesive can be tested.

[0043] like Figure 1 , Figure 3As shown, in this embodiment, an automated testing adhesive-coating and pushing structure for a semiconductor module 10 is provided. A detection area 110 is set on a base 100, and a support frame 300 is set on a push-pull frame 200. The support frame 300 is used to support the semiconductor module 10. The push-pull frame 200 is slidably set on the base 100 along the width direction, so that the push-pull frame 200 drives the support frame 300 to move synchronously on the base 100. When applying thermally conductive adhesive to the semiconductor module 10, pulling the push-pull frame 200 moves the support frame 300 and the semiconductor module 10 on it out of the test area 110. This allows for the application of the thermally conductive adhesive layer to the semiconductor module 10 located outside the test area 110. The coating of the thermally conductive adhesive is completed with the support of the support frame 300, eliminating the need to remove the semiconductor module 10 from the support frame 300, thus improving safety. When testing the semiconductor module 10 coated with thermally conductive adhesive, pushing the push-pull frame 200 slides the support frame 300 and the semiconductor module 10 into the test area 110, allowing the semiconductor module 10 to be electrically tested within the test area 110. The support frame 300 is mounted on top via an elastic component 400. During testing, pressing down on the support frame 300 allows the semiconductor module 10 to move downwards and align with the connector in the test area 110, achieving electrical connection of the semiconductor module 10. Therefore, during the application and testing of the semiconductor module 10, the semiconductor module 10 is prevented from falling off during the application process by the support of the push-pull frame 200 and the support frame 300. The push-pull method of the semiconductor module 10 improves the application efficiency and simplifies the testing process of the semiconductor module 10.

[0044] like Figure 1 , Figure 2 , Figure 3 As shown, the push-pull frame 200 of this embodiment further includes a push-pull frame 210 and a push-pull handle 220. The push-pull frame 210 forms a vertically continuous detection window 211, and the two sides of the push-pull frame 210 are slidably mounted on the base 100 along its length. The push-pull handle 220 is fixedly mounted on the edge of the pull-out side of the push-pull frame 210. In the specific structure, the front side of the base 100 is the pull-out side, and the rear side is the push-in side; the push-pull frame 210 can be a four-sided square structure with a hollow center to form the detection window 211, so that the bottom of the detection window 211 can face the detection area 110. Two push-pull handles 220 can be provided, both mounted on the front edge of the push-pull frame 210, and the two push-pull handles 220 are spaced apart in the left and right directions, so as to facilitate the operator to hold and push the push-pull frame 200 with both hands.

[0045] like Figure 1 , Figure 2 , Figure 3As shown, in this embodiment, push-pull guide rails 230 are respectively provided on both sides of the base 100 in the width direction. The push-pull guide rails 230 extend along the length direction and can be dovetail-shaped. Push-pull slides 240 are provided on both sides of the bottom of the push-pull frame 210 in the width direction. The push-pull slides 240 slide on the push-pull guide rails 230. By cooperating with the push-pull slides 240 on both sides and the push-pull guide rails 230 on both sides, the push-pull frame 210 can be pushed back and forth relatively smoothly and stably on the base 100.

[0046] like Figure 1 , Figure 2 , Figure 3 As shown, in this embodiment, the push-pull slide 240 is disposed on the push-in side in the width direction of the push-pull frame 210. Only one push-pull slide 240 may be disposed on one of the left or right sides, positioned at the rear of the bottom of the push-pull frame 210. This ensures that the push-pull slide 240 moves smoothly on the push-pull guide rail 230 as the push-pull frame 210 moves forward. A limiting block 250 is provided at the end of the base 100 facing the pull-out side. The limiting block 250 is located outside the push-pull guide rail 230 and below the push-pull frame 210 to support it. During the sliding process via a push-pull slide 240 on one side, the push-pull frame 210 is supported at the front end of the base 100 by a limiting fixing block 250. When the push-pull frame 210 is pushed into the detection area 110, it is supported on both the front and rear sides, ensuring the stability of the support for the push-pull frame 210. Thus, the push-pull frame 210 can stably support the carrier frame 300 and the semiconductor module 10 on it. When the push-pull frame 210 is pulled out of the detection area 110, it moves on the upper surface of the limiting fixing block 250, ensuring the stability of the support during the movement.

[0047] like Figure 1 , Figure 2 , Figure 3As shown, further, in this embodiment, a limiting movable block 260 is provided on the end of the push-pull frame 210 facing the push-in side. The limiting movable block 260 is located outside the push-pull guide rail 230 and is used to abut against the limiting fixed block 250 to limit the pull-out position of the push-pull frame 210. On one side in the left-right direction, the limiting movable block 260 is provided at the rear end of the push-pull frame 210. The limiting movable block 260 is an L-shaped block. During the movement of the push-pull frame 210, it can move outside the push-pull guide rail 230. When it moves to the front with the push-pull frame 210, it is blocked by the rear end face of the limiting movable block 260, so that the push-pull frame 210 will not continue to move forward. This limits the pull-out limit position of the push-pull frame 210. Therefore, the upper surface of the limiting movable block 260 is used to support the sliding of the push-pull frame 210, and the rear end face of the limiting movable block 260 cooperates with the limiting movable block 260 to achieve limiting. Multiple functions can be achieved with just one limiting movable block 260, thus optimizing the structure.

[0048] like Figure 1 , Figure 2 , Figure 3 As shown, the support frame 300 in this embodiment further includes a support frame 310 and adjustable support platforms 320 spaced apart in the width direction. The support frame 310 forms a vertically through-hole receiving window 311. The support frame 310 adopts a quadrilateral frame structure, making its length in both the length and width directions smaller than that of the push-pull frame 210. The support frame 310 can move up and down above the push-pull frame 210 via an elastic component 400. The adjustable support platforms 320 are disposed within the receiving window 311, and the two sides of the adjustable support platforms 320 are respectively used to support the two ends of the semiconductor module 10. The front and rear adjustable support platforms 320 can be mirror-symmetrically arranged, and the front and rear ends of the semiconductor module 10 can be placed on the two sides of the adjustable support platforms 320 respectively to provide stable support for the semiconductor module 10. Furthermore, the elastic component 400 can press the semiconductor module 10 down, so that the lowered semiconductor module 10 contacts the connector below to achieve electrical connection.

[0049] like Figure 1 , Figure 2 , Figure 3As shown, further, the adjustment support platform 320 of this embodiment is provided with a plurality of placement portions 330 spaced apart along its length. The placement portions 330 on the front and rear sides cooperate to limit the position of a semiconductor module 10. By arranging a plurality of placement portions 330 along the length, multiple semiconductor modules 10 can be tested at once, improving testing efficiency. The placement portion 330 specifically includes: an inner groove 331 and an outer protrusion 332; the inner groove 331 is formed on the side wall of the adjustment support platform 320, and the outer protrusion 332 is disposed on the side wall of the adjustment support platform 320 and located on both sides of the opening of the inner groove 331. The upper surface of the outer protrusion 332 is recessed into the upper surface of the adjustment support platform 320 to form a support step 333, which is used to support and limit the semiconductor module 10. The support steps on both sides not only limit the semiconductor module 10 in the width direction, but also support the semiconductor module 10 in the vertical direction. The inner groove 331 can prevent the contacts on the semiconductor module 10 from being exposed, thus achieving stable fixation of the semiconductor module 10.

[0050] like Figure 1 , Figure 3 As shown, further, the support frame 310 of this embodiment is provided with adjusting threaded holes 312 on both sides along its length. The adjusting support platform 320 is provided with first oblong holes 321 at both ends, and the first oblong holes 321 are connected to the adjusting threaded holes 312 by screws. This makes the front and rear positions of the adjusting support platforms 320 on both sides adjustable to accommodate semiconductor modules 10 of different specifications, improving versatility.

[0051] like Figure 1 , Figure 3 , Figure 4 As shown, the elastic component 400 in this embodiment further includes: multiple guide posts 410 and multiple elastic elements 420. The multiple guide posts 410 are all arranged vertically on the push-pull frame 200, and the elastic elements 420 are sleeved on the guide posts 410. For example, four guide posts 410 are provided, located at the four corners of the upper surface of the push-pull frame 200, and the elastic elements 420 are springs, corresponding one-to-one with the guide posts 410. A bearing sleeve 430 is provided on the support frame 300, slidingly sleeved on the guide posts 410. The bearing sleeve 430 and the guide posts 410 are correspondingly arranged and fixedly installed at the four corners of the support frame 300, and the elastic elements 420 are located between the push-pull frame 200 and the support frame 300. The elastic component 400 allows the support frame 300 to move downwards under pressure and be lifted up when not under pressure, thereby enabling the semiconductor module 10 on it to move downwards and upwards.

[0052] like Figure 1 , Figure 3 , Figure 4As shown, in this embodiment, a buffer limiting pad 440 is further provided on the push-pull frame 200 or the support frame 300, and the buffer limiting pad 440 is located between the push-pull frame 200 and the support frame 300. The buffer limiting pad 440 can be made of rubber or silicone. The buffer limiting pad 440 can limit the downward movement limit position of the support frame 300 and buffer the pressure on the support frame 300 after compression.

[0053] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A coating and pushing structure for automated testing of a semiconductor module, used to push the semiconductor module to coat a thermally conductive adhesive layer, characterized in that, The adhesive application and pushing structure includes: a base, wherein the base has a detection area; A push-pull frame body, which is slidably mounted on the base along the width direction; A support frame, which is mounted on the push-pull frame via an elastic component, is used to support a semiconductor module; The support frame moves the semiconductor module out of the detection area by being pushed by the push-pull frame, so as to apply a thermally conductive adhesive layer to the semiconductor module located outside the detection area.

2. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 1, characterized in that, The push-pull frame includes: a push-pull frame, which forms a vertically continuous detection window, and the two sides of the push-pull frame are slidably mounted on the base along its length. A push-pull handle is fixedly mounted on the edge of the pull-out side of the push-pull frame.

3. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 2, characterized in that, The base is provided with push-pull guide rails on both sides in the width direction, and the push-pull guide rails extend along the length direction. Push-pull slides are provided on both sides of the bottom width direction of the push-pull frame, and the push-pull slides are fitted onto the push-pull guide rail and slide.

4. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 3, characterized in that, The push-pull slide is located on the push-in side in the width direction of the push-pull frame; The base is provided with a limiting block at one end facing the pull-out side. The limiting block is located outside the push-pull guide rail and below the push-pull frame to support the push-pull frame.

5. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 4, characterized in that, A limiting block is provided on one end of the push-pull frame facing the push-in side. The limiting block is located outside the push-pull guide rail and is used to abut against the limiting block to limit the pull-out position of the push-pull frame.

6. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 2, characterized in that, The supporting frame includes: a supporting frame, which forms a vertically through-hole receiving window; Adjustable support platforms are spaced apart in the width direction and are disposed within the receiving window. The two adjustable support platforms on both sides are used to support the two ends of the semiconductor module.

7. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 6, characterized in that, The adjustment support platform is provided with multiple placement parts spaced apart along its length; The placement part includes: an inner groove, which is formed on the side wall of the adjustment support platform; An external protrusion is provided on the side wall of the adjusting support platform and located on both sides of the opening of the inner groove; The upper surface of the outer protrusion is recessed into the upper surface of the adjusting support platform to form a support step, which is used to support and limit the semiconductor module.

8. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 6, characterized in that, Adjustable threaded holes are provided on both sides of the length direction of the load-bearing frame; The two ends of the adjustment support platform are respectively provided with a first waist-shaped hole, and the first waist-shaped hole is connected to the adjustment threaded hole by a screw.

9. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 1, characterized in that, The elastic component includes: multiple guide columns, all of which are arranged on the push-pull frame in the vertical direction; An elastic element, which is sleeved on the guide column; The support frame is provided with a support sliding sleeve, which is slidably sleeved on the guide column; The elastic element is located between the push-pull frame and the load-bearing frame.

10. The adhesive application and transfer structure for automated testing of semiconductor modules as described in claim 9, characterized in that, A buffer limiting pad is provided on the push-pull frame or the support frame, and the buffer limiting pad is located between the push-pull frame and the support frame.

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