COB packaging-based LED display screen
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUAMINGXIN PHOTOELECTRIC TECH
- Filing Date
- 2025-06-25
- Publication Date
- 2026-06-19
AI Technical Summary
Existing LED displays are time-consuming and labor-intensive to maintain, have low resolution and clarity, are thick, have poor heat dissipation performance, and poor protection performance.
Utilizing COB packaging technology, a magnetic quick-installation structure, and COB LED modules, combined with flip-chip and vacuum encapsulation design, the module achieves rapid disassembly and efficient heat dissipation, while also enhancing protection performance.
It achieves rapid maintenance, ultra-high resolution, thin and light design, and superior heat dissipation and protection performance, reducing labor costs and failure rate, and is suitable for space-constrained scenarios.
Smart Images

Figure CN224383856U_ABST