A photovoltaic module encapsulant

Abstract

This utility model discloses a photovoltaic module packaging device, including: a base plate assembly, a capacitor, an IC chip, and a frame body. The base plate assembly includes an insulating base plate and conductive terminals. The conductive terminals are sheet-shaped, including an upper surface and a lower surface. The conductive terminals are horizontally laid on the insulating base plate, and the lower surface of the conductive terminals contacts and connects with the insulating base plate. The conductive terminals are provided with a first pin, and the conductive terminals are wrapped with a non-conductive material. The IC chip and the insulating base plate are connected by bonding wires. This utility model uses conductive terminals for conductivity through a process of mounting, bonding, molding, and cutting. The second pin on the IC chip is connected to the first pin of the conductive terminal with bonding wires, saving costs. The bonding wire between the first pin and the second pin is attached to the insulating base plate. When the capacitor is too large and there is a large height difference between it and the IC chip, it does not affect the bonding of the circuit, which can reduce the defect rate and is suitable for capacitors of various sizes.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a photovoltaic module packaging device. Background Technology

[0002] The photovoltaic module packaging method consists of a control IC, a power MOSFET, and its auxiliary circuitry, thereby achieving a new technology for low-loss rectification.

[0003] Currently, the common practice is to use a control IC, with capacitors bonded to the frame using non-conductive adhesive, and power MOSFETs soldered to the frame. Then, the control IC, capacitors, power MOSFETs, and frame are bonded together using leads.

[0004] However, using the above bonding method requires plating a layer of metal powder on the surface of the capacitor for conductivity. Since the surface particles of metal powders such as tin and zinc are relatively large, they affect conductivity and adhesion, and are prone to short circuits. Copper powder is easily oxidized, so gold powder is generally used, which is more expensive. In addition, when the capacitor is too large, there will be too large a height difference between it and the control IC, which will affect the bonding of the circuit and the wires are prone to breakage, resulting in a high defect rate. Utility Model Content

[0005] Therefore, it is necessary to propose a photovoltaic module packaging device to address the above problems, reduce the defect rate, and save costs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A photovoltaic module packaging device, comprising:

[0008] The base plate assembly includes an insulating base plate and conductive terminals. The conductive terminals are sheet-shaped and include an upper surface and a lower surface. The conductive terminals are horizontally laid on the insulating base plate. The lower surface of the conductive terminals contacts and connects with the insulating base plate. The conductive terminals are provided with a first pin, and the conductive terminals are wrapped with a non-conductive material. The first pin passes through the non-conductive material.

[0009] A capacitor is disposed on the upper surface of the conductive terminal and attached to the conductive terminal by a conductive material, and is electrically connected to the conductive terminal;

[0010] An IC chip is mounted on the insulating substrate with non-conductive adhesive and spaced apart from the conductive terminals. The IC chip has multiple second pins, and the first pin and the second pins are connected by bonding wires.

[0011] The frame body, wherein the insulating base plate is bonded to the frame body by non-conductive adhesive;

[0012] The IC chip and the insulating substrate are connected by bonding wires.

[0013] In some embodiments, the number of conductive terminals is the same as the number of capacitors and they correspond one-to-one.

[0014] In some embodiments, an electrode is further provided on the upper surface of the conductive terminal, and the electrode is located beside the capacitor.

[0015] In some embodiments, the number of conductive terminals is the same as the number of electrodes and they correspond one-to-one.

[0016] In some embodiments, the IC chip is mounted on the insulating substrate using non-conductive adhesive.

[0017] In some embodiments, a power transistor is also included, which is fixedly disposed on the frame body and spaced apart from the insulating base plate.

[0018] In some embodiments, the power transistor is provided with a third pin, which is electrically connected to the second pin via a bonding wire.

[0019] In some embodiments, a plastic encapsulation housing is also included, wherein the base plate assembly, capacitor, IC chip, frame body and power transistor are disposed within the plastic encapsulation housing.

[0020] In some embodiments, the frame body extends from inside the plastic-encapsulated housing to the outside.

[0021] This invention proposes a photovoltaic module packaging device. Through a process of mounting, bonding, molding, and cutting, it utilizes conductive terminals to conduct electricity. The second pin on the IC chip is connected to the first pin of the conductive terminal with bonding wires, resulting in good conductivity. It eliminates the need to plate a layer of gold powder on the capacitor surface for conductivity, saving costs. In addition, the bonding wire between the first and second pins is attached to an insulating substrate. When the capacitor is too large and there is a large height difference between it and the IC chip, it does not affect the bonding of the circuit, thereby reducing the defect rate. It is suitable for capacitors of various sizes. Attached Figure Description

[0022] in:

[0023] Figure 1 This is a schematic diagram of the internal structure of a photovoltaic module packaging device according to the present invention;

[0024] Figure 2 This is a schematic diagram of a base plate assembly for a photovoltaic module packaging device according to the present invention;

[0025] Figure 3 This is a three-dimensional structural diagram of a photovoltaic module packaging device according to the present invention;

[0026] Figure 4 This is a schematic diagram of the manufacturing process of a photovoltaic module packaging device according to the present invention.

[0027] The markings in the attached diagram are described below:

[0028] 1. Base plate assembly; 11. Insulating base plate; 12. Conductive terminal; 121. First pin; 2. Capacitor; 3. IC chip; 31. Second pin; 4. Frame body; 5. Power transistor; 51. Third pin; 6. Plastic encapsulation shell. Detailed Implementation

[0029] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "connected" to another element, it can be directly on the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "left," "right," "upper end," "lower end," "top," and "bottom," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.

[0031] To address the problems in existing technologies, such as the tendency for gold powder plating on capacitor surfaces to cause short circuits, high costs, excessive height differences between large capacitors and control ICs affecting circuit bonding and leading to wire breakage and high defect rates, a photovoltaic module packaging device is proposed.

[0032] The following will be combined with the appendix Figures 1 to 4 The present invention provides a detailed description of a photovoltaic module packaging device according to an embodiment of the present invention.

[0033] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the internal structure of a photovoltaic module packaging device according to the present invention; Figure 2 This is a schematic diagram of the base plate assembly of a photovoltaic module packaging device according to the present invention.

[0034] A photovoltaic module packaging device, comprising:

[0035] The base plate assembly 1 includes an insulating base plate 11 and a conductive terminal 12. The conductive terminal 12 is sheet-shaped and includes an upper surface and a lower surface. The conductive terminal 12 is horizontally laid on the insulating base plate 11. The lower surface of the conductive terminal 12 contacts and connects with the insulating base plate 11. The conductive terminal 12 is provided with a first pin 121, and the conductive terminal 12 is wrapped with a non-conductive material. The first pin 121 passes through the non-conductive material.

[0036] Capacitor 2 is disposed on the upper surface of the conductive terminal 12 and attached to the conductive terminal 12 by a conductive material, and is electrically connected to the conductive terminal 12;

[0037] IC chip 3 is mounted on the insulating base plate 11 with non-conductive adhesive and spaced apart from the conductive terminal 12. IC chip 3 is provided with a plurality of second pins 31, and the first pin 121 and the second pins 31 are connected by bonding wires.

[0038] The frame body 4, the insulating base plate 11 is bonded to the frame body 4 by non-conductive adhesive;

[0039] The IC chip 3 and the insulating base plate 11 are connected by bonding wires.

[0040] Specifically, in the existing technology, a layer of gold powder is plated on the surface of capacitor 2 for conductivity, which is costly. When capacitor 2 is too large, there will be an excessive height difference between it and IC chip 3, which will affect the bonding of the circuit and the wire is prone to breakage, resulting in a high defect rate.

[0041] This device uses conductive terminals 12 to replace gold powder plating on the surface of capacitor 2. The conductive terminals 12 are laid and pasted on the insulating base plate 11 to form the base plate assembly 1. The conductive terminals 12 are designed to be used for lead bonding and connection of capacitor 2. The conductive terminals 12 are wrapped with non-conductive material and supported by mold into the required shape.

[0042] The base plate assembly 1 is attached to the frame body 4 with non-conductive adhesive, the IC chip 3 is attached to the insulating base plate 11 with non-conductive adhesive, and the capacitor 2 is attached to the conductive terminal 12 with conductive material.

[0043] The conductive materials include, but are not limited to, metallic conductors, carbon-based materials, conductive polymers, and alloys.

[0044] The specific components of the non-conductive adhesive include, but are not limited to, polymers, silicone and fillers, and it has high adhesion and tensile strength, good heat resistance and chemical corrosion resistance.

[0045] Beneficial effects: This device uses conductive terminals to conduct electricity, connecting the second pin 31 on the IC chip 3 to the first pin 121 of the conductive terminal 12 with bonding wires. The conductivity is good, and there is no need to plate a layer of gold powder on the surface of the capacitor 2 for conductivity, saving costs. In addition, the bonding wire between the first pin 121 and the second pin 31 is attached to the insulating ground plane. When the capacitor 2 is too large and there is a large height difference between it and the IC chip 3, it will not affect the bonding of the circuit, avoid short circuits, reduce the defect rate, and is suitable for capacitors 2 of various sizes.

[0046] In one embodiment, the number of conductive terminals 12 is the same as the number of capacitors 2 and they correspond one-to-one.

[0047] Specifically, one or more conductive terminals 12 can be set on the insulating base plate 11, for example, two. The number of capacitors 2 corresponds to the number of conductive terminals 12. The conductive terminals 12 are used to complete the transfer of charge in the capacitors 2.

[0048] Compared to existing technologies that use wires for propagation, this method is not affected by the size of the capacitor 2 and can avoid the use of gold powder, thus saving costs.

[0049] In one embodiment, an electrode 122 is further provided on the upper surface of the conductive terminal 12, and the electrode 122 is located beside the capacitor 2.

[0050] Specifically, the metal plates on both sides of capacitor 2 are usually made of materials with good conductivity, such as aluminum foil. These metal materials have good conductivity and stability.

[0051] The metal plates on both sides of capacitor 2 serve as its two electrodes 122, playing a crucial role. Together with the electrolyte inside capacitor 2, they form a structure capable of storing electrical charge. When capacitor 2 is connected to a circuit, one electrode 122 becomes positively charged and the other electrode 122 becomes negatively charged, thereby creating an electric field inside capacitor 2. This electric field can store electrical energy and release it when needed.

[0052] The metal plates on both sides of capacitor 2 serve as electrodes 122 and play a crucial role in this process. They not only provide a place for charge to accumulate, but also realize the storage and release of charge through interaction with the electrolyte.

[0053] Beneficial effects: In existing technologies, capacitors release charge through metal powder, especially gold powder, and bonding wires on the capacitor surface to achieve conductivity. In this invention, charge transfer in the capacitor is achieved through conductive material in contact with the capacitor and shorted terminals, which can save production costs.

[0054] In one embodiment, the number of conductive terminals 12 is the same as the number of electrodes 122 and they correspond one-to-one.

[0055] Specifically, electrode 122 is used to discharge capacitor 2, and its number corresponds one-to-one with the number of capacitor 2. The number of capacitor 2 also corresponds one-to-one with the number of conductive terminals 12. Therefore, there is a one-to-one correspondence between the number of electrodes 122, capacitor 2, and conductive terminals 12. This facilitates the release or replenishment of charge by capacitor 2.

[0056] Beneficial effects: When the height difference between capacitor 2 and IC chip 3 is too large, it does not affect the bonding of the circuit, making the bonding wire less prone to breakage and reducing the defect rate.

[0057] In one embodiment, the IC chip 3 is mounted on the insulating base plate 11 using non-conductive adhesive.

[0058] Specifically, using non-conductive adhesive can prevent IC chip 3 from directly contacting objects such as metal heat sinks, thus protecting IC chip 3 from factors such as static electricity, humidity, and oxidation, while also reinforcing IC chip.

[0059] Since non-conductive adhesive can also affect the heat dissipation of IC chip 3, a non-conductive adhesive with a high thermal conductivity should be selected to minimize the impact on heat dissipation. The coating thickness of IC chip 3 should be kept uniform to minimize the impact of non-conductive adhesive on heat dissipation.

[0060] In one embodiment, a power tube 5 is also included, which is fixedly disposed on the frame body 4 and spaced apart from the insulating base plate 11.

[0061] Specifically, the power transistor 5 is a MOS power transistor 5, which controls the current of this device. The power transistor 5 is fixedly welded to the frame body 4 and maintains a distance from the insulating base plate 11.

[0062] The beneficial effects are: providing power output for this device, ensuring the normal operation of electronic components, guaranteeing safe use, and the power transistor 5 and the insulating base plate 11 are spaced apart to avoid contact.

[0063] In one embodiment, the power transistor 5 is provided with a third pin 51, and the third pin 51 and the second pin 31 are electrically connected by a bonding wire.

[0064] Specifically, the third pin 51 of the power transistor 5 and the second pin 31 of the IC chip 3 are electrically connected. The power transistor 5, the IC chip 3, the insulating base plate 11, and the capacitor 2 are connected by bonding wires, which can be copper wire, gold wire, gold wire, or aluminum strip.

[0065] The beneficial effects are: bonding wires need to meet the requirements of high conductivity, heat diffusion resistance and mechanical stability. Copper wire, gold wire, gold-plated wire and aluminum strip have good electrical and thermal conductivity. The bonding wires are connected through wire bonding process.

[0066] In one embodiment, the device further includes a plastic encapsulation housing 6, in which the base plate assembly 1, capacitor 2, IC chip 3, frame body 4, and power transistor 5 are disposed.

[0067] Specifically, the function of the plastic encapsulation housing 6 is to achieve integration and unification. Plastic encapsulation can effectively protect electronic components from dust, moisture, vibration, and mechanical damage, extending the service life of the components and facilitating installation and connection. Plastic encapsulation provides appropriate pins or connectors, making it easier for components to connect to circuit boards or other devices, achieving miniaturization and integration. Appropriate plastic encapsulation design can improve the anti-interference and electromagnetic compatibility of electronic components, reducing the impact of electromagnetic interference on surrounding circuits and equipment. Plastic encapsulation makes electronic components easier to maintain and repair, reducing maintenance difficulty and cost, and improving equipment reliability.

[0068] Please see Figure 3 , Figure 3 This is a three-dimensional structural diagram of a photovoltaic module packaging device according to the present invention.

[0069] In one embodiment, the frame body 4 extends from inside the plastic-encapsulated housing 6 to the outside.

[0070] Specifically, the purpose of extending the frame body 4 to the outside is to achieve electrical connection, with portions of the first pin 121 and the third pin 51 extending out of the plastic-encapsulated housing 6 and located on the left and right sides.

[0071] Please see Figure 4 , Figure 4 This is a schematic diagram of the manufacturing process of a photovoltaic module packaging device according to the present invention.

[0072] A manufacturing method for producing the photovoltaic module packaging device according to any of the above embodiments, comprising:

[0073] S1: Mounting, the IC chip 3 is mounted on the insulating base plate 11 with non-conductive adhesive; the capacitor is mounted on the conductive terminal 12 with conductive material; the power transistor 5 is fixed on the frame body 4.

[0074] S2: Bonding, bonding the power transistor 5 to the IC chip 3, and bonding the conductive terminal 12 to the IC chip;

[0075] S3: Plastic encapsulation, sealing the above components inside the plastic encapsulation shell 6, with the first pin 121 and the second pin 31 extending out of the plastic encapsulation shell 6 and located on the left and right sides, to be cooled and formed;

[0076] S4: Cutting: After cleaning and electroplating, the plastic-encapsulated shell 6 is cut from the positions of the first pin and the second pin on the left and right sides to form a single plastic-encapsulated body, i.e., a photovoltaic module packaging structure.

[0077] Specifically, the entire manufacturing process includes IQC (PCB, BOM), wafer loading, plasma cleaning, wire bonding, plasma cleaning, molding, glue removal and rib removal, order cutting and packaging.

[0078] The chips are mounted onto the frame using a wafer mounter; the chips are then bonded together using a wire bonding machine. This process uses heat, pressure, or ultrasonic energy to weld the two ends of the metal wires to the corresponding positions on the chip pads and the insulating substrate 11, respectively; the frame body 4 is encapsulated using a molding machine, and after removing the adhesive, the connecting ribs are cut using a rib cutting mold, and finally, the individual ribs are cut.

[0079] Excellent molding compounds need to meet the following requirements: low dielectric constant and dielectric loss factor to improve operating speed; high heat resistance, thermal conductivity, and insulation; excellent mechanical properties, flame retardancy, and electrical insulation; and excellent chemical stability and mechanical properties. Commonly used molding compounds include epoxy resins, fillers, and other trace additives.

[0080] The advantage of this TMV carrier fabrication process is that it provides an efficient, consistent, and reliable manufacturing method. By manufacturing a photovoltaic module packaging device, it can generate economic value in the field, save production costs, and reduce defect rates.

[0081] This utility model provides a photovoltaic module packaging device and manufacturing method. Through the cooperation of a wafer mounter, wire bonder, molding machine, lead cutting mold, and manual labor, the process of mounting, bonding, molding, and cutting is completed. Conductive terminals are used to connect the second pin 31 on the IC chip 3 to the first pin 121 of the conductive terminal 12 with bonding wires, resulting in good conductivity. It eliminates the need to plate a layer of gold powder on the surface of the capacitor 2 for conductivity, saving costs. Furthermore, the bonding wire between the first pin 121 and the second pin 31 is attached to an insulating ground plane. When the capacitor 2 is too large and there is a significant height difference between it and the IC chip 3, it does not affect the bonding of the circuit, reducing the defect rate. It is suitable for capacitors 2 of various sizes.

[0082] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of this utility model as described above. For the sake of brevity, they are not provided in detail. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A photovoltaic module packaging device, characterized in that, include: The base plate assembly includes an insulating base plate and conductive terminals. The conductive terminals are sheet-shaped and include an upper surface and a lower surface. The conductive terminals are horizontally laid on the insulating base plate. The lower surface of the conductive terminals contacts and connects with the insulating base plate. The conductive terminals are provided with a first pin, and the conductive terminals are wrapped with a non-conductive material. The first pin passes through the non-conductive material. A capacitor is disposed on the upper surface of the conductive terminal and attached to the conductive terminal by a conductive material, and is electrically connected to the conductive terminal; An IC chip is mounted on the insulating substrate with non-conductive adhesive and spaced apart from the conductive terminals. The IC chip has multiple second pins, and the first pin and the second pins are connected by bonding wires. The frame body, wherein the insulating base plate is bonded to the frame body by non-conductive adhesive; The IC chip and the insulating substrate are connected by bonding wires.

2. The photovoltaic module packaging device according to claim 1, characterized in that, The number of conductive terminals is the same as the number of capacitors and they correspond one-to-one.

3. The photovoltaic module packaging device according to claim 1, characterized in that, An electrode is also provided on the upper surface of the conductive terminal, and the electrode is located beside the capacitor.

4. A photovoltaic module packaging device according to claim 3, characterized in that, The number of conductive terminals is the same as the number of electrodes and they correspond one-to-one.

5. A photovoltaic module packaging device according to claim 1, characterized in that, The IC chip is mounted on the insulating substrate using non-conductive adhesive.

6. A photovoltaic module packaging device according to claim 1, characterized in that, It also includes a power transistor, which is fixedly disposed on the frame body and spaced apart from the insulating base plate.

7. A photovoltaic module packaging device according to claim 6, characterized in that, The power transistor is provided with a third pin, which is electrically connected to the second pin via a bonding wire.

8. A photovoltaic module packaging device according to claim 6, characterized in that, It also includes a plastic encapsulated housing, in which the base plate assembly, capacitor, IC chip, frame body and power transistor are disposed.

9. A photovoltaic module packaging device according to claim 8, characterized in that, The frame body extends from inside the plastic-encapsulated shell to the outside.

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