Optical package structure
By using an interposer plate in the optical packaging structure to place the optical element and semiconductor element on the top and bottom sides respectively, and using conductive holes to achieve the shortest transmission path, the problems of signal delay and excessive device size in the prior art are solved, the transmission efficiency and stability are improved, and the production cost is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-19
Smart Images
Figure CN224386039U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure with optical elements. Background Technology
[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading industries to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technologies.
[0003] Please see Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device 1. It mainly consists of an optoelectronic module 11 mounted on a circuit board 10. The optoelectronic module 11 includes a semiconductor chip 112 formed in a packaging structure 111 and an optical chip 113 mounted on the packaging structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to allow optical signals to be transmitted to the optoelectronic module 11 for communication. At the same time, a switching IC 12 needs to be mounted on the circuit board 10 to be used in the terminal product. The switching IC 12 is first mounted on a substrate 13 and then mounted on the circuit board 10 through the substrate 13.
[0004] However, in the aforementioned co-packaged optical devices, the semiconductor chip is embedded in the packaging structure. Electrical connection between the semiconductor chip and the optical chip requires multiple circuit layers, and the optoelectronic module needs to be connected to the conversion chip via a substrate and circuit board. Therefore, for future high-speed computing and data-intensive applications requiring the transmission of large amounts of information, information delays will occur. Furthermore, signal transmission over long lines will generate significant heat due to poor transmission efficiency. In addition, the optical chip and conversion chip must transmit signals through circuits within the circuit board and substrate, resulting in an excessively large and thick overall device size, hindering the miniaturization of electronic products. The excessively long signal transmission path also leads to signal loss, causing problems in end-product applications. Moreover, the suspended support poses a risk of insufficient fiber optic support and breakage.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a substrate; an optical element having an opposing active surface and a non-active surface disposed on the substrate with the non-active surface; an intermediary plate having opposing first and second surfaces and a plurality of conductive holes connecting the first and second surfaces, with the second surface disposed on the active surface of the substrate and the optical element, so that the substrate and the optical element are electrically connected to the plurality of conductive holes; an electronic element disposed on the first surface of the intermediary plate and electrically connected to the plurality of conductive holes; and a semiconductor element disposed on the first surface of the intermediary plate and electrically connected to the plurality of conductive holes.
[0007] This application also provides a method for manufacturing an optical packaging structure, comprising: disposing an optical element having opposing active surfaces and non-active surfaces on a substrate with the non-active surfaces; providing an intermediary plate having opposing first and second surfaces and a plurality of conductive holes communicating with the first and second surfaces; attaching an electronic element and a semiconductor element to the first surface of the intermediary plate and electrically connecting the electronic element and the semiconductor element to the plurality of conductive holes; and attaching the intermediary plate with the second surface to the active surfaces of the substrate and the optical element and electrically connecting the substrate and the optical element to the plurality of conductive holes.
[0008] The aforementioned optical packaging structure and its manufacturing method also include optical components disposed on the working surface of the optical element.
[0009] In the aforementioned optical packaging structure and its manufacturing method, the intermediate plate is connected to the substrate and the working surface of the optical element through multiple conductive components.
[0010] The aforementioned optical packaging structure and its manufacturing method also include a filler layer disposed between the intermediary plate and the substrate.
[0011] The aforementioned optical packaging structure and its manufacturing method also include a packaging layer formed on a substrate to cover the optical element, the intermediate plate, the electronic element and the semiconductor element.
[0012] In the aforementioned optical packaging structure and its manufacturing method, the electronic component is a switching application-specific integrated circuit.
[0013] In the aforementioned optical packaging structure and its manufacturing method, the semiconductor element is an integrated circuit element.
[0014] In the aforementioned optical packaging structure and its manufacturing method, the optical element is a photonic integrated circuit element or an optical module.
[0015] As can be seen from the above, the optical packaging structure of this application mainly places the optical element and the semiconductor element on the upper and lower sides of the interposer, respectively, to achieve the shortest transmission distance through conductive holes. Furthermore, the non-functional surface of the optical element is placed against the upper surface of the substrate. This makes the optical element more stable when connected to optical components, preventing damage when connecting to optical fibers. In addition, the optical element and the semiconductor element can be electrically connected to electronic components through the conductive holes of the interposer, eliminating the need for a substrate and circuit board as in existing structures, thus improving transmission efficiency. Attached Figure Description
[0016] Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device.
[0017] Figures 2A to 2D This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.
[0018] Explanation of reference numerals in the attached figures
[0019] 1. Co-packaged optical devices
[0020] 10 Circuit Boards
[0021] 11 Optoelectronic Modules
[0022] 111 Package Structure
[0023] 112 Semiconductor wafers
[0024] 113 Optical Chip
[0025] 12 conversion chips
[0026] 13 substrate
[0027] 14 optical fibers
[0028] 15 brackets
[0029] 2. Optical Packaging Structure
[0030] 20 substrate
[0031] 21 Optical Components
[0032] 21a Working surface
[0033] 21b Non-operating surface
[0034] 22 Optical Components
[0035] 23 Intermediary Board
[0036] 23a First Surface
[0037] 23b Second Surface
[0038] 230 conductive hole
[0039] 231,241,251 Conductive components
[0040] 24 Electronic Components
[0041] 25 Semiconductor Components
[0042] 26 Filler layer
[0043] 27. Encapsulation layer. Detailed Implementation
[0044] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0045] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0046] Please see Figures 2A to 2D This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.
[0047] like Figure 2A As shown, a substrate 20 is provided, and at least one optical element 21 is disposed on the substrate 20. The illustration of this embodiment shows that multiple optical elements 21 are disposed on the substrate 20.
[0048] In this embodiment, the substrate 20 has an insulating layer and a circuit layer bonded to the insulating layer. The insulating layer is made of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.
[0049] The optical element 21 has an opposing active surface 21a and a non-active surface 21b, with the non-active surface 21b disposed on the substrate 20. The optical element 21 is, for example, a photonic integrated circuit (PIC) or an optical module, wherein the optical module may include a photonic integrated circuit (PIC), a total internal reflection glass (TIR glass), or other optical components.
[0050] Optical accessories 22, such as fiber optic modules, fiber optic slots, fiber optic array units, or waveguide arrays, can be disposed on the working surface 21a of the optical element 21. The optical accessories 22 can be supported by the substrate 20 (and the optical element 21).
[0051] In another embodiment, the optical accessory 22 may be integrated into the optical element 21.
[0052] like Figure 2B As shown, an interposer 23 is provided, which has a first surface 23a and a second surface 23b opposite to each other and a plurality of conductive holes 230 (e.g., conductive silicon vias) connecting the first surface 23a and the second surface 23b. At least one electronic component 24 and at least one semiconductor component 25 are disposed on the first surface 23a of the interposer 23. In the illustration of this embodiment, an electronic component 24 and a plurality of semiconductor components 25 are disposed on the first surface 23a of the interposer 23, wherein the plurality of semiconductor components 25 are disposed around the electronic component 24.
[0053] Next, the intermediate plate 23, on which the electronic component 24 and the semiconductor component 25 are disposed, is placed on the working surface 21a of the substrate 20 and the optical component 21 with its second surface 23b, and the intermediate plate 23 is electrically connected to the substrate 20 and the optical component 21.
[0054] The electronic component 24 is, for example, a switch ASIC, and is electrically connected to a plurality of conductive holes 230 of the interposer 23 via a plurality of conductive elements 241, such as solder bumps or copper bumps.
[0055] The semiconductor element 25 is, for example, an electronic integrated circuit (EIC), and the semiconductor element 25 is electrically connected to the multiple conductive holes 230 of the interposer 23 through multiple conductive elements 251, such as solder bumps or copper bumps.
[0056] The intermediate plate 23 is connected to the working surface 21a of the substrate 20 and the optical element 21 by a plurality of conductive elements 231, such as solder bumps or copper bumps, and the substrate 20 and the optical element 21 are electrically connected to a plurality of conductive holes 230 of the intermediate plate 23.
[0057] Compared to traditional optical chips and conversion chips that require signal transmission through circuit boards and substrates with a linewidth requirement of at least 10 micrometers, this application uses the interposer 23 as the main transmission path, which can shorten the linewidth to 5 micrometers, achieving denser transmission lines and reducing the space required for transmission. Furthermore, the optical element 21, the semiconductor element 25, and the electronic element 24 can be electrically connected to each other through multiple conductive holes 230 of the interposer 23, achieving optimized transmission distance. The integration of multiple components enables advantages such as increased transmission rate and improved space utilization.
[0058] In another embodiment, the intermediate plate 23 may be first placed on the substrate 20 and the optical element 21, and then the electronic element 24 and the semiconductor element 25 may be placed on the intermediate plate 23.
[0059] like Figure 2C As shown, a filler layer 26 (e.g., primer) may be provided between the intermediary plate 23 and the substrate 20 to cover a plurality of conductive elements 231 used for electrically connecting the intermediary plate 23 and the substrate 20.
[0060] like Figure 2D As shown, an encapsulation layer 27 is formed on the substrate 20 to cover the optical element 21, the interposer 23, the electronic element 24, and the semiconductor element 25, while the optical accessory 22 is exposed outside the encapsulation layer 27 for subsequent connection of optical fibers. Thus, the optical signal transmission path can be from the optical accessory 22 through the optical element 21, the interposer 23 (multiple conductive holes 230) to the semiconductor element 25, and through the optical element 21, the interposer 23 (multiple conductive holes 230) to the electronic element 24 and the substrate 20, thereby effectively improving the transmission rate.
[0061] Through the aforementioned manufacturing method, this application also discloses an optical packaging structure 2, including: a substrate 20, an optical element 21 disposed on the substrate 20, an intermediary plate 23 disposed on the substrate 20 and the optical element 21, and an electronic element 24 and a semiconductor element 25 disposed on the intermediary plate 23.
[0062] The optical element 21 has an active surface 21a and a non-active surface 21b, with the non-active surface 21b disposed on the substrate 20, and an optical accessory 22 disposed on the active surface 21a. The optical element 21 is, for example, a photonic integrated circuit element or an optical module.
[0063] The intermediate plate 23 has a first surface 23a and a second surface 23b opposite to each other and a plurality of conductive holes 230 connecting the first surface 23a and the second surface 23b, so that the intermediate plate 23 is placed on the working surface 21a of the substrate 20 and the optical element 21 with its second surface 23b, and the plurality of conductive holes 230 of the intermediate plate 23 are electrically connected to the substrate 20 and the optical element 21.
[0064] The electronic component 24 is, for example, a switching application-specific integrated circuit, which is disposed on the first surface 23a of the intermediate plate 23 and electrically connected to the plurality of conductive holes 230.
[0065] The semiconductor element 25 is, for example, an integrated circuit element, which is placed on the first surface 23a of the intermediate plate 23 and electrically connected to the plurality of conductive holes 230.
[0066] In summary, the optical packaging structure of this application primarily places the optical element and semiconductor element on the upper and lower sides of the interposer, respectively, to achieve the shortest transmission distance through conductive holes. Furthermore, the non-functional surface of the optical element abuts the upper surface of the substrate, thus ensuring greater stability of the optical element when connected to optical components (fiber optic modules), preventing damage during fiber optic connection. In addition, the optical element and semiconductor element can be electrically connected to electronic components through the conductive holes of the interposer, eliminating the need for a substrate and circuit board as in existing structures, thereby improving transmission efficiency. Moreover, this optical packaging structure technology is highly feasible and can be manufactured using existing semiconductor packaging processes, without the need to develop special processes or purchase specialized equipment, thus reducing product manufacturing costs.
[0067] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An optical packaging structure, characterized in that, include: substrate; An optical element has an opposing active surface and a non-active surface, with the non-active surface disposed on the substrate. An intermediate plate has a first surface and a second surface opposite to each other and a plurality of conductive holes connecting the first surface and the second surface, and the second surface is disposed on the working surface of the substrate and the optical element so that the substrate and the optical element are electrically connected to the plurality of conductive holes. Electronic components are disposed on the first surface of the intermediate plate and electrically connected to the plurality of conductive holes; as well as A semiconductor element is disposed on the first surface of the interposer and electrically connected to the plurality of conductive holes.
2. The optical packaging structure as described in claim 1, characterized in that... The optical packaging structure also includes optical components disposed on the working surface of the optical element.
3. The optical packaging structure as described in claim 1, characterized in that, The interposer is connected to the substrate and the working surface of the optical element through multiple conductive components.
4. The optical packaging structure as described in claim 1, characterized in that... The optical packaging structure also includes a filler layer disposed between the intermediate plate and the substrate.
5. The optical packaging structure as described in claim 1, characterized in that... The optical packaging structure also includes a packaging layer formed on a substrate to encapsulate the optical element, the interposer, the electronic element, and the semiconductor element.
6. The optical packaging structure as described in claim 1, characterized in that, This electronic component is a conversion-type application-specific integrated circuit.
7. The optical packaging structure as described in claim 1, characterized in that, This semiconductor device is an integrated circuit element.
8. The optical packaging structure as described in claim 1, characterized in that, The optical element is a photonic integrated circuit element or an optical module.