A glue-filling mold for a smart ring
The design of the intelligent ring potting mold solves the problem that existing molds cannot adjust the protrusions, achieving the correspondence and focusing effect between the protrusions and LED beads, and adapting to the potting of intelligent rings with special structures.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GUNUOTAI TECH
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-23
AI Technical Summary
Existing smart ring potting molds cannot meet the requirements for adjusting the protrusions of LED light-emitting beads, and cannot achieve the focusing effect where the protrusions correspond to the light-emitting beads.
A smart ring potting mold was designed, including a mold base, an outer positioning sleeve, and a detachable insert. By adjusting and replacing the position of the insert, protrusions of different sizes or shapes can be formed to ensure that the protrusions correspond to the LED light beads.
The smart ring achieves a system where the raised dots correspond to the LED beads after glue filling, and the size and shape of the raised dots can be adjusted to meet the glue filling requirements of special structures.
Smart Images

Figure CN224391685U_ABST