Electroplating bath with circuit cooling device

Abstract

This application provides an electroplating tank with a circuit cooling device, relating to the field of electroplating equipment technology. It includes an electroplating tank body, with conductors installed on both sides along the length of the tank body. A cathode plate and an anode plate are mounted on the corresponding conductors, and the conductors are energized by an external power supply. A cooling channel is formed inside each conductor, extending along its length. An inlet pipe and an outlet pipe are connected to both ends of each conductor, and a water pump is connected to the inlet pipe to circulate coolant within the inlet pipe, conductor, and outlet pipe. This application facilitates cooling of the circuit system and improves electroplating quality.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment, and in particular to an electroplating tank with a circuit cooling device. Background Technology

[0002] In industrial applications of electrolytic cells, especially in fields such as electroplating where high current stability is required, specific conductors are usually installed on both sides of the length of the electrolytic cell to ensure that the cathode and anode plates can obtain a stable and continuous current supply, thereby constructing a complete conductive circuit.

[0003] However, in actual operation, because the conductor needs to continuously carry a large current, it inevitably generates a large amount of heat due to the resistive heating effect. As the electrolysis operation time increases, the temperature of the conductor will continue to rise, leading to excessively high temperatures in the entire conductive system. Excessive temperatures can cause a series of serious problems: Firstly, the increased temperature of the conductor increases its resistivity, resulting in a significant reduction in current transmission efficiency. This not only greatly prolongs the processing time of electroplating and other electrolytic processes, increasing the production cycle, but also causes a sharp increase in energy consumption, significantly raising production costs. Secondly, excessively high temperatures severely affect the connection stability between the conductor and the cathode and anode plates. The metal at the connection points deforms due to thermal expansion, leading to increased contact resistance, and even loosening or poor contact. This causes drastic current fluctuations during electrolysis, severely affecting the quality and uniformity of the electrolytic products. Utility Model Content

[0004] To solve the above-mentioned technical problems, this application provides an electroplating bath with a circuit cooling device.

[0005] The electroplating bath with a circuit cooling device provided in this application adopts the following technical solution:

[0006] An electroplating tank with a circuit cooling device includes an electroplating tank body, with conductors installed on both sides of the electroplating tank body along its length. Several insulating blocks for supporting the conductors are fixed on the electroplating tank. A cathode plate and an anode plate are installed on the corresponding conductors, and the cathode plate and anode plate are energized by an external power supply to the conductors. A cooling channel is formed inside the conductor, which extends along the length of the conductor. An inlet pipe and an outlet pipe are connected to both ends of the conductor, respectively. A water pump is connected to the inlet pipe to circulate the coolant within the inlet pipe, the conductor, and the outlet pipe.

[0007] Furthermore, the conductor is square copper.

[0008] Furthermore, the cooling channel includes a straight cooling channel that runs horizontally through the conductor and a spiral structure that surrounds the outside of the straight cooling channel.

[0009] Furthermore, connecting blocks are fixed at both ends of the conductor, and water inlet channels are opened on the connecting blocks to connect the cooling straight channel and the cooling curved channel respectively. A first flow regulating valve is installed in both water inlet channels.

[0010] Furthermore, the inner wall of the cooling channel is fixed with heat dissipation fins to increase the flow resistance of the coolant.

[0011] Furthermore, the inner wall of the cooling channel is provided with a thermally conductive coating.

[0012] Furthermore, the upper end face of the conductor is fixed with a connecting screw corresponding to the cathode plate or anode plate, and the cathode plate and anode plate are provided with corresponding through holes. The connecting screw passes through the through hole and is threaded with a connecting nut.

[0013] Furthermore, a second flow regulating valve is installed on the water inlet pipe.

[0014] Furthermore, a temperature sensor is installed on the water outlet pipe.

[0015] In summary, this application includes at least one of the following beneficial technical effects: under the action of the water pump, the coolant enters the cooling straight channel and the cooling curved channel to cool the conductor. At the same time, the temperature of the coolant flowing out of the conductor is detected by the temperature sensor. The flow rate of the coolant entering the cooling straight channel and the cooling curved channel is controlled by the first flow regulating valve and the second flow regulating valve to adjust the cooling temperature of the conductor. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0017] Figure 2 This is a cross-sectional view of the conductor in an embodiment of this application.

[0018] Explanation of reference numerals in the attached drawings: 1. Electroplating tank body; 2. Conductor; 3. Insulating block; 4. Cooling straight channel; 5. Cooling curved channel; 6. Connecting block; 7. Inlet pipe; 8. Outlet pipe; 9. Second flow regulating valve; 10. Temperature sensor; 11. First flow regulating valve; 12. Heat dissipation fins; 13. Connecting screw; 14. Connecting nut. Detailed Implementation

[0019] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0020] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0021] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0022] An electroplating tank with a circuit cooling device includes an electroplating tank body 1, with conductors 2 installed on both sides of the electroplating tank body 1 along its length. Several insulating blocks 3 for supporting the conductors 2 are fixed on the electroplating tank at the bottom of the conductors 2. A cathode plate and an anode plate are fixedly installed on the corresponding conductors 2, and the cathode plate and anode plate are energized by an external power supply connected to the conductors 2.

[0023] Reference Figure 1 and Figure 2 The conductor 2 is made of square copper. A cooling channel is formed inside the conductor 2 along its length. The cooling channel includes a straight cooling channel 4 that runs horizontally through the conductor 2 and a curved cooling channel 5 that spirally winds around the straight cooling channel 4. Connecting blocks 6 are fixed at both ends of the conductor 2. Two water inlet channels are formed on the connecting blocks 6, which respectively connect the straight cooling channel 4 and the curved cooling channel 5. The two connecting blocks 6 are respectively connected to a water inlet pipe 7 and a water outlet pipe 8. A water pump is connected to the water inlet pipe 7. A second flow regulating valve 9 is installed on the water inlet pipe 7. A temperature sensor 10 is installed on the water outlet pipe 8.

[0024] Reference Figure 1 and Figure 2 Both water inlet channels are equipped with a first flow regulating valve 11 to control the amount of water entering the cooling straight channel 4 and the cooling curved channel 5. The connection block 6 facilitates the connection with the water inlet pipe 7 and the water outlet pipe 8 and the installation of the first flow regulating valve 11.

[0025] Under the action of the water pump, the coolant enters the cooling channel to cool the conductor 2. The amount of water entering the conductor 2 is controlled by the first flow regulating valve 11, and the amount of coolant entering the cooling straight channel 4 and the cooling curved channel 5 is controlled by the second flow regulating valve 9. The temperature of the coolant flowing out of the conductor 2 is detected by the temperature sensor 10. Based on the detected temperature, the first flow regulating valve 11 and the second flow regulating valve 9 are adjusted, thereby adjusting the temperature by regulating the amount of water and the amount of water entering different channels.

[0026] Reference Figure 1 and Figure 2 The inner wall of the cooling channel is provided with a thermally conductive coating, and the inner wall of the cooling channel 4 is fixed with heat dissipation fins 12 to increase the flow resistance of the coolant.

[0027] Reference Figure 1 The upper end face of the conductor 2 is fixed with a connecting screw 13 corresponding to the cathode plate or anode plate. Corresponding through holes are opened on the cathode plate and the anode plate. The connecting screw 13 passes through the through hole and a connecting nut 14 is threaded onto the connecting screw 13.

[0028] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. Any equivalent modifications or changes made by those skilled in the art based on the content disclosed in this utility model should be included within the protection scope recorded in the claims.

Claims

1. An electroplating bath with a circuit cooling device, comprising an electroplating bath body (1), characterized in that, Conductors (2) are installed on both sides of the electroplating tank body (1) along its length. Several insulating blocks (3) for supporting the conductors (2) are fixed on the electroplating tank body (1). The cathode plate and anode plate are installed on the corresponding conductors (2) and are energized by an external power supply to the conductors (2). A cooling channel is provided inside the conductor (2) and extends along the length of the conductor (2). The two ends of the conductor (2) are connected to an inlet pipe (7) and an outlet pipe (8) respectively. A water pump is connected to the inlet pipe (7) to circulate the coolant in the inlet pipe (7), the conductor (2) and the outlet pipe (8).

2. The electroplating bath with a circuit cooling device according to claim 1, characterized in that, The conductor (2) is square copper.

3. The electroplating bath with a circuit cooling device according to claim 2, characterized in that, The cooling channel includes a straight cooling channel (4) that runs horizontally through the conductor (2) and a spiral cooling channel (5) that surrounds the outside of the straight cooling channel (4).

4. The electroplating bath with a circuit cooling device according to claim 3, characterized in that, The conductor (2) has connecting blocks (6) fixed at both ends. The connecting blocks (6) have water inlet channels that connect the cooling straight channel (4) and the cooling curved channel (5) respectively. A first flow regulating valve (11) is installed in both water inlet channels.

5. The electroplating bath with a circuit cooling device according to claim 4, characterized in that, The inner wall of the cooling channel (4) is fixed with heat dissipation fins (12) to increase the flow resistance of the coolant.

6. The electroplating bath with a circuit cooling device according to claim 4, characterized in that, The inner wall of the cooling channel is provided with a thermally conductive coating.

7. The electroplating bath with a circuit cooling device according to claim 1, characterized in that, The conductor (2) has a connecting screw (13) fixed on its upper end face, which corresponds to the cathode plate or anode plate. Corresponding through holes are provided on the cathode plate and anode plate. The connecting screw (13) passes through the through hole and is threaded with a connecting nut (14).

8. The electroplating bath with a circuit cooling device according to claim 1, characterized in that, A second flow regulating valve (9) is installed on the water inlet pipe (7).

9. The electroplating bath with a circuit cooling device according to claim 1, characterized in that, A temperature sensor (10) is installed on the water outlet pipe (8).

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