Gas etchant preparation and etching system for copper clad laminate

Abstract

The utility model discloses a kind of gas etchant preparation and etching system for copper-clad plate, including copper-clad plate gas etching device, ammonia gas storage device and electrolytic fluorine device;The copper-clad plate gas etching device includes cover shell, main gas pipe, input pipe, nozzle and for carrying copper-clad plate's object table;The main gas pipe is horizontally arranged in cover shell, and the upper portion of main gas pipe forms reaction cavity, and the lower portion of main gas pipe forms etching cavity;By utilizing ammonia gas storage device output ammonia, fluorine gas is electrolytically generated using electrolytic fluorine device, and ammonia and fluorine gas are mixed and sent into input pipe and react to obtain NF3 gas etchant, then NF3 gas etchant is introduced into etching cavity using main gas pipe and nozzle, copper-clad plate on the object table is etched using NF3 gas etchant, replace the etching mode of traditional acid or alkaline liquid, prevent the appearance of pool effect and side etching effect, effectively improve the etching quality of copper-clad plate, satisfy the need of use.

Description

Technical Field

[0001] This utility model relates to the field of copper clad laminate manufacturing technology, and in particular to a gas etchant preparation and etching system for copper clad laminates. Background Technology

[0002] Copper clad laminate (CCL), also known as substrate, is a sheet material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, covering one or both sides with copper foil, and then hot-pressing it. It is a core material for manufacturing printed circuit boards (PCBs), primarily serving to interconnect, insulate, and support the circuit board. CCL plays a crucial role in the electronics industry because it is not only an important component of PCBs but also directly affects their performance, quality, manufacturability during manufacturing, manufacturing costs, manufacturing efficiency, and long-term reliability.

[0003] Etching copper-clad laminates (CCLs) is an essential step in PCB manufacturing. Current technology primarily involves immersing the CCL in acidic or alkaline solutions for etching. However, this method, whether acidic or alkaline, suffers from severe pooling and lateral etching, resulting in poor etching quality that fails to meet application requirements. Therefore, it is necessary to research a solution to address these issues. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a gas etchant preparation and etching system for copper-clad laminates, which can effectively solve the problem of poor etching quality when using acidic or alkaline solutions to etch copper-clad laminates.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A gas etchant preparation and etching system for copper-clad laminates includes a copper-clad laminate gas etching apparatus, an ammonia storage apparatus, and an electrolytic fluorine production apparatus.

[0007] The copper-clad laminate gas etching apparatus includes a housing, a main gas pipe, an input pipe, nozzles, and a stage for supporting the copper-clad laminate. The main gas pipe is horizontally arranged inside the housing, with a reaction chamber formed above the main gas pipe and an etching chamber formed below it. The input pipe is located in the reaction chamber, with its inner end connected to the main gas pipe and its outer end extending out of the top of the housing. There are multiple nozzles, which are spaced apart on the main gas pipe and connected to it, with the nozzles facing downwards and suspended in the etching chamber. The stage is located in the etching chamber and below the multiple nozzles.

[0008] The ammonia gas output end of the ammonia storage device is connected to the outer end of the input pipe; the fluorine gas output port of the electrolytic fluorine production device is connected to the outer end of the input pipe.

[0009] As a preferred embodiment, the bottom of the etching chamber is provided with a recovery port, which is covered with a filter cover. The recovery port is connected to a recovery pipe, which is connected to the main gas pipe, and a pump body is provided on the recovery pipe.

[0010] As a preferred embodiment, the two opposite sides of the housing are respectively provided with an input port for inputting the copper-clad laminate and an output port for outputting the copper-clad laminate, and both the input port and the output port are connected to the etching cavity.

[0011] As a preferred embodiment, a front sliding door is provided for the input port to open or close the input port, and a rear sliding door is provided for the output port to open or close the output port.

[0012] As a preferred embodiment, the stage is movably positioned between the input port and the output port, and the stage is driven by a first drive mechanism to move back and forth between the input port and the output port.

[0013] As a preferred embodiment, a front sliding plate is provided on the outside of the input port, which is driven by a second drive mechanism to move horizontally toward or away from the input port.

[0014] As a preferred embodiment, a rear sliding plate is provided on the outside of the output port, which is driven by a third drive mechanism to move horizontally toward or away from the output port.

[0015] As a preferred embodiment, the ammonia storage device includes a storage tank and a first gas pipe, which connects the storage tank and the outer end of the input pipe, and a first regulating valve is provided on the first gas pipe.

[0016] As a preferred embodiment, the electrolytic fluorine production apparatus includes an electrolytic cell, a cap, a carbon anode, a gas separation hood, and a cooling jacket. The electrolytic cell serves as a steel cathode and has an upward-facing cavity for containing electrolytes. The cap is disposed on the electrolytic cell and covers the opening of the cavity. The cap has an HF inlet, a fluorine outlet, and a hydrogen outlet. The HF inlet is connected to an inlet pipe that extends into the cavity. The fluorine outlet is connected to the outer end of the inlet pipe via a second gas pipe, which is equipped with a second regulating valve. The carbon anode is fixed to the cap and extends into the cavity, and is separate from the electrolytic cell. The gas separation hood is fixed to the cap and extends into the cavity. The gas separation hood is located around the carbon anode, and the fluorine outlet communicates with the interior of the gas separation hood, while the hydrogen outlet communicates with the exterior of the gas separation hood. The cooling jacket is fitted onto the outer peripheral side of the electrolytic cell.

[0017] As a preferred embodiment, the carbon anode includes a body and a connecting rod, the connecting rod being vertically fixed at the center of the cover, the upper end of the connecting rod extending upward beyond the cover, and the lower end of the connecting rod extending into the receiving cavity and connecting to the upper end of the body.

[0018] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0019] By utilizing an ammonia storage device to output ammonia gas, electrolyzing fluorine gas using an electrolytic fluorine production device, and mixing the ammonia and fluorine gas in the input pipe to react and obtain NF3 gas etchant, the NF3 gas etchant is then introduced into the etching chamber through the main gas pipe and nozzle. The NF3 gas etchant is used to etch the copper-clad laminate located on the stage, replacing the traditional method of etching with acidic or alkaline liquids. This eliminates the pooling effect and side etching effect, effectively improving the etching quality of the copper-clad laminate and meeting the application requirements.

[0020] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a preferred embodiment of the present utility model;

[0022] Figure 2 This is a partially enlarged schematic diagram of a preferred embodiment of the present invention;

[0023] Figure 3 This is another partially enlarged schematic diagram of a preferred embodiment of the present invention.

[0024] Explanation of reference numerals in the attached diagram:

[0025] 10. Copper-clad laminate gas etching equipment 11. Housing

[0026] 111. Front sliding door 112. Rear sliding door

[0027] 113. Filter cover; 114. Recovery pipe

[0028] 115. Pump body 101. Reaction chamber

[0029] 102. Etching cavity; 103. Input port

[0030] 104. Output port 105. Recycle port

[0031] 106. Third drive mechanism; 12. Main air pipe

[0032] 13. Inlet pipe 14. Nozzle

[0033] 15. Platform 16. First drive mechanism

[0034] 17. Front sliding plate; 18. Second drive mechanism

[0035] 19. Rear sliding plate; 20. Ammonia storage device

[0036] 21. Storage tank 22. First gas pipe

[0037] 23. First regulating valve; 30. Electrolytic fluorine production device

[0038] 31. Electrolytic cell; 311. Containing cavity

[0039] 32. Cover 321. HF input port

[0040] 322. Fluorine gas outlet; 323. Hydrogen gas outlet.

[0041] 33. Carbon anode 331. Main body

[0042] 332, Connecting rod; 34, Gas separation hood

[0043] 35. Cooling jacket 36. Inlet pipe

[0044] 37. Second air pipe; 38. Second regulating valve. Detailed Implementation

[0045] Please refer to Figures 1 to 3 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a copper-clad laminate gas etching device 10, an ammonia storage device 20, and an electrolytic fluorine production device 30.

[0046] The copper-clad laminate gas etching apparatus 10 includes a housing 11, a main gas pipe 12, an input pipe 13, a nozzle 14, and a stage 15 for carrying the copper-clad laminate.

[0047] The main air pipe 12 is horizontally disposed inside the casing 11. A reaction chamber 101 is formed above the main air pipe 12, and an etching chamber 102 is formed below the main air pipe 12. In this embodiment, the casing 11 has an input port 103 for inputting copper-clad laminates and an output port 104 for outputting copper-clad laminates on two opposite sides, respectively. Both the input port 103 and the output port 104 are connected to the etching chamber 102. A front sliding door 111 is provided for the input port 103 to open or close the input port 103, and a rear sliding door 112 is provided for the output port 104 to open or close the output port 104.

[0048] The input pipe 13 is located in the reaction chamber 101. The inner end of the input pipe 13 is connected to the main gas pipe 12, and the outer end of the input pipe 13 extends out of the top of the cover 11. The input pipe 13 contains a copper particle reaction bed (not shown in the figure). In this embodiment, the input pipe 13 has a meandering extension structure.

[0049] There are multiple nozzles 14, which are spaced apart on and connected to the main air pipe 12. The multiple nozzles 14 face downward and are suspended in the etching chamber 102. In this embodiment, the multiple nozzles 14 are evenly spaced.

[0050] The stage 15 is disposed in the etching chamber 102 and located below the plurality of nozzles 14. In this embodiment, the stage 15 is movably disposed between the input port 103 and the output port 104. The stage 15 is driven by the first drive mechanism 16 to move back and forth between the input port 103 and the output port 104. The first drive mechanism 16 can be a cylinder, a screw and nut structure driven by a motor, etc., and is not limited thereto.

[0051] Furthermore, a recovery port 105 is provided at the bottom of the etching chamber 102, a filter cover 113 is provided on the recovery port 105, the recovery port 105 is connected to a recovery pipe 114, the recovery pipe 114 is connected to the main gas pipe 12, and a pump body 115 is provided on the recovery pipe 114.

[0052] In addition, a front slide plate 17 is provided on the outside of the input port 103. The front slide plate 17 is driven by the second drive mechanism 18 to move horizontally closer to or away from the input port 103. The second drive mechanism 18 can be a cylinder, a screw and nut structure driven by a motor, etc., and is not limited to this.

[0053] In addition, a rear slide plate 19 is provided on the outside of the output port 104. The rear slide plate 19 is driven by the third drive mechanism 106 to move horizontally closer to or further away from the output port 104. The third drive mechanism 106 can be a cylinder, a screw and nut structure driven by a motor, etc., and is not limited to any other type.

[0054] The ammonia gas output end of the ammonia gas storage device 20 is connected to the outer end of the input pipe 13. Specifically, the ammonia gas storage device 20 includes a storage tank 21 and a first gas pipe 22. The first gas pipe 22 is connected between the storage tank 21 and the outer end of the input pipe 13, and a first regulating valve 23 is provided on the first gas pipe 22.

[0055] The fluorine gas outlet of the electrolytic fluorine production device 30 is connected to the outer end of the input pipe 13. Specifically, the electrolytic fluorine production device 30 includes an electrolytic cell 31, a cover 32, a carbon anode 33, a gas separation hood 34, and a cooling jacket 35. The electrolytic cell 31 serves as a steel cathode and has an upward-facing accommodating cavity 311 for containing electrolytes. The cover 32 is disposed on the electrolytic cell 31 and covers the opening of the accommodating cavity 311. The cover 32 has an HF input port 321, a fluorine gas outlet 322, and a hydrogen gas outlet 323. The HF input port 321 is connected to an inlet pipe 36, which extends into the accommodating cavity 311. The fluorine gas outlet 322... The second gas pipe 37 is connected to the outer end of the input pipe 13, and a second regulating valve 38 is provided on the second gas pipe 37; the carbon anode 33 is fixed on the cover 32 and extends into the accommodating cavity 311, and the carbon anode 33 is separate from the electrolytic cell 31; the gas separation hood 34 is fixed to the cover 32 and extends into the accommodating cavity 311, the gas separation hood 34 is located around the carbon anode 33, and the fluorine gas outlet 322 is connected to the inside of the gas separation hood 34, and the hydrogen gas outlet 323 is connected to the outside of the gas separation hood 34; the cooling jacket 35 is sleeved on the outer peripheral side of the electrolytic cell 31. In this embodiment, the electrolytic cell 31 is made of low-carbon steel, and the carbon anode 33 is supported by a tightly pressed, non-graphitized carbon center rod. The carbon anode 33 includes a main body 331 and a connecting rod 332. The connecting rod 332 is vertically fixed to the center of the cover 32. The upper end of the connecting rod 332 extends upward beyond the cover 32, and the lower end of the connecting rod 332 extends into the accommodating cavity 311 and connects to the upper end of the main body 331.

[0056] The working principle of this embodiment is described in detail below:

[0057] First, the containment chamber 311 is filled with electrolyte KF·2HF. Then, the electrolytic cell 31, carbon anode 33, and cooling jacket 35 are connected to an external controller. Whether the electrolytic cell 31 is static or running, the cooling jacket 35 maintains its temperature between 80-100°C. Simultaneously, the operating current of the electrolytic cell 31 and carbon anode 33 can be controlled between 10-50A. The electrolyte concentration is controlled by adding anhydrous HF to the containment chamber 311 through the HF inlet 321. During electrolysis, fluorine gas and... The hydrogen-fluorine mixture is separated by a gas separator 34. Fluorine and hydrogen are output from the fluorine outlet 322 and hydrogen outlet 323, respectively. The fluorine is transported to the input pipe 13 via the second gas pipe 37. Simultaneously, the first regulating valve 23 is opened, and ammonia gas from the storage tank 21 is transported to the input pipe 13 via the first gas pipe 22. The ammonia gas has a temperature of 40-60℃ and a pressure of 25 Psi. The high-temperature, high-pressure ammonia gas reacts with the fluorine gas to generate NF3 gas etchant. The reaction equation is as follows: Next, the front sliding door 111 is moved to open the input port 103. Then, the copper-clad laminate to be etched is placed on the front slide plate 17. Driven by the second drive mechanism 18, the front slide plate 17 moves close to the input port 103, quickly delivering the copper-clad laminate to the input port 103 and then stopping. Under the action of inertia, the copper-clad laminate enters the etching chamber 102 from the input port 103 and is moved onto the stage 15. Then, the front sliding door 111 is moved in the opposite direction to close the input port 103. Next, the NF3 gas etchant in the input pipe 13 enters the main gas pipe 12 and is sprayed out from each of the opened nozzles 14. The etchant is applied to the copper-clad laminate to etch it. After 65 seconds, the nozzles 14 are closed to stop the injection of NF3 gas etchant. Then, the exhaust gas is filtered by the filter cover 113 and returned to the main gas pipe 12 through the recovery pipe 114 under the action of the pump body 115. Then, the sliding door 112 is moved to open the output port 104. Then, the first drive mechanism 16 drives the stage 15 to move closer to the output port 104. The etched copper-clad laminate moves with the stage 15. When the stage 15 moves to the output port 104 and stops, the etched copper-clad laminate is output from the output port 104 under the action of inertia and moved to the rear slide plate 19.

[0058] The key design feature of this invention is as follows: Ammonia is output from an ammonia storage device, and fluorine gas is generated by electrolysis using an electrolytic fluorine production device. The ammonia and fluorine gas are mixed and fed into an input pipe to react and obtain NF3 gas etchant. The NF3 gas etchant is then introduced into the etching chamber through a main gas pipe and nozzle. The NF3 gas etchant is used to etch the copper-clad laminate located on the stage, replacing the traditional method of etching with acidic or alkaline liquids. This eliminates the pooling effect and side etching effect, effectively improving the etching quality of the copper-clad laminate and meeting the application requirements.

[0059] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A gas etchant preparation and etching system for copper-clad laminates, characterized in that: It includes a copper-clad laminate gas etching unit, an ammonia storage unit, and an electrolytic fluorine production unit; The copper-clad laminate gas etching apparatus includes a housing, a main gas pipe, an input pipe, a nozzle, and a stage for supporting the copper-clad laminate; the main gas pipe is horizontally arranged inside the housing, with a reaction chamber formed above the main gas pipe and an etching chamber formed below the main gas pipe. The input tube is located in the reaction chamber, with its inner end connected to the main gas pipe and its outer end extending out of the top of the casing; there are multiple nozzles, which are spaced apart on the main gas pipe and connected to it, with the nozzles facing downwards and suspended in the etching chamber; the stage is located in the etching chamber and below the multiple nozzles. The ammonia gas output end of the ammonia storage device is connected to the outer end of the input pipe; the fluorine gas output port of the electrolytic fluorine production device is connected to the outer end of the input pipe.

2. The gas etchant preparation and etching system for copper-clad laminates according to claim 1, characterized in that: The bottom of the etching chamber is provided with a recovery port, which is covered with a filter cover. The recovery port is connected to a recovery pipe, which is connected to the main gas pipe, and a pump body is provided on the recovery pipe.

3. The gas etchant preparation and etching system for copper-clad laminates according to claim 1, characterized in that: The cover has an input port for inputting copper-clad laminate and an output port for outputting copper-clad laminate on its two opposite sides, and both the input port and the output port are connected to the etching cavity.

4. The gas etchant preparation and etching system for copper-clad laminates according to claim 3, characterized in that: The input port is equipped with a front sliding door that can be opened or closed, and the output port is equipped with a rear sliding door that can be opened or closed.

5. The gas etchant preparation and etching system for copper-clad laminates according to claim 3, characterized in that: The stage is movably positioned between the input port and the output port, and is driven by the first drive mechanism to move back and forth between the input port and the output port.

6. The gas etchant preparation and etching system for copper-clad laminates according to claim 3, characterized in that: A front sliding plate is provided on the outside of the input port, which is driven by the second drive mechanism to move horizontally toward or away from the input port.

7. The gas etchant preparation and etching system for copper-clad laminates according to claim 3, characterized in that: A rear sliding plate is provided on the outside of the output port, which is driven by a third drive mechanism to move horizontally toward or away from the output port.

8. The gas etchant preparation and etching system for copper-clad laminates according to claim 1, characterized in that: The ammonia storage device includes a storage tank and a first gas pipe, which connects the storage tank and the outer end of the input pipe, and a first regulating valve is provided on the first gas pipe.

9. The gas etchant preparation and etching system for copper-clad laminates according to claim 1, characterized in that: The electrolytic fluorine production apparatus includes an electrolytic cell, a cap, a carbon anode, a gas separation hood, and a cooling jacket. The electrolytic cell serves as a steel cathode and has an upward-facing cavity for containing electrolytes. The cap is mounted on the electrolytic cell and covers the opening of the cavity. The cap has an HF inlet, a fluorine outlet, and a hydrogen outlet. The HF inlet is connected to an inlet pipe that extends into the cavity. The fluorine outlet is connected to the outer end of the inlet pipe via a second gas pipe, which is equipped with a second regulating valve. The carbon anode is fixed to the cap and extends into the cavity, and is separate from the electrolytic cell. The gas separation hood is fixed to the cap and extends into the cavity. The gas separation hood is located around the carbon anode, and the fluorine outlet communicates with the interior of the gas separation hood, while the hydrogen outlet communicates with the exterior of the gas separation hood. The cooling jacket is fitted onto the outer periphery of the electrolytic cell.

10. The gas etchant preparation and etching system for copper-clad laminates according to claim 9, characterized in that: The carbon anode includes a main body and a connecting rod. The connecting rod is vertically fixed at the center of the cover. The upper end of the connecting rod extends upward outside the cover, and the lower end of the connecting rod extends into the accommodating cavity and connects to the upper end of the main body.

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